CN106455410B - Heat-insulating middle frame structure and electronic equipment - Google Patents
Heat-insulating middle frame structure and electronic equipment Download PDFInfo
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- CN106455410B CN106455410B CN201510489820.6A CN201510489820A CN106455410B CN 106455410 B CN106455410 B CN 106455410B CN 201510489820 A CN201510489820 A CN 201510489820A CN 106455410 B CN106455410 B CN 106455410B
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Abstract
本发明提供一种具绝热之中框结构及电子设备。该中框结构包括一本体及一框单元，一绝热层形成在该本体与该框单元之间，且至少位于该本体的相对两侧边设置，该绝热层具有一第一侧连接该本体，及一第二侧连接该框单元，藉由该绝热层阻隔本体的热传递到框单元。
The present invention provides a middle frame structure with heat insulation and an electronic device. The middle frame structure includes a body and a frame unit, a heat insulation layer is formed between the body and the frame unit, and is at least arranged on two opposite sides of the body, the heat insulation layer has a first side connected to the body, and a second side connected to the frame unit, and the heat insulation layer blocks the heat transfer of the body to the frame unit.
Description
[technical field]
The present invention is about portable electronic device field, the espespecially a kind of middle frame structure and electronic equipment of tool insulation.
[background technique]
Its size of the intelligent personal electronic equipments such as mobile phone, tablet computer or portable reader becomes big and thick at present
Degree the more becomes the more thin, causes the heat dissipation performance of electronic equipment worse and worse, however most of the calorific value in electronic equipment is each
Produced by functional unit work running, such as central processing unit (especially configures multi-core fortune to stress the promotion of execution speed
Calculate unit, even more make the matter worse to the heat dissipation problem of terminal device), the fortune of battery, power converter, all units such as display screens
The calorific value that will lead to electronic equipment increases or aggravation.The heat source of majority electronic equipment is all to be fixed on electronic equipment at present
Middle frame structure on, therefore center absorbs the heat that generates when each functional unit executes first, therefore is switched in electronic equipment
After running, center temperature is easy to increase, and leads to the ontology and outer rim extreme temperatures of center, when user's hand-hold electronic equipments
When, since the size of current electronic equipment is larger (mainstream of such as touch-control mobile phone is all 5 cun or more), user almost can not be complete
Grasp, be mostly only grasped using the grasping between finger electronic device contact point or position multidigit in center outer rim or
Longer two sides, causing high temperature to conduct to center outer rim will affect or cause user in the puzzlement and inconvenience that use.
[summary of the invention]
Above-mentioned effectively to solve the problems, such as, one of present invention purpose is providing a kind of middle frame structure with heat insulation layer, with
Barrier heat is transmitted to the frame unit of center.
Another object of the present invention has effects that be insulated providing a kind of middle frame structure using in the electronic device, to
The heat that the internal electron part of barrier electronic equipment generates is transmitted to the side of electronic device.
In order to achieve the above object, the present invention provides a kind of middle frame structure of tool insulation, including an ontology and a frame unit, one absolutely
Thermosphere is formed between the ontology and the frame unit and is located at least in the opposite sides side of the ontology, which has one first
Side connects the ontology and a second side connects the frame unit.
The ontology and the frame unit can be made of metal material or non-metallic material.
The ontology is flat plate heat tube or hot plate or temperature-uniforming plate, in there is an airtight chamber, be equipped in the airtight chamber
Capillary structure and working fluid.
A thickness is defined between first side of the heat insulation layer and second side.
In order to achieve the above object, the present invention separately provides a kind of electronic equipment, comprising:
One display module has a front；One front housing connects the display module, which is equipped with a fenestra, the display mould
The front of group appears in the fenestra；One center connects the front housing, which includes an ontology and a frame unit, a heat insulation layer shape
At between the ontology and the frame unit, and it is located at least in the opposite sides side of the ontology, which connects with one first side
It connects the ontology and a second side connects the frame unit, and plural internal electron part is arranged on the ontology.
The center connects or is formed with a dorsal shield.
The ontology and the frame unit are made of metal material or non-metallic material.
The ontology is flat plate heat tube or hot plate, in there is an airtight chamber, equipped with capillary structure in the airtight chamber
And working fluid.
The display module is touch-control display module.
First side of the heat insulation layer and second side define a thickness.
[Detailed description of the invention]
The purpose of following schema is to enable the invention to be more easily understood, and can encyclopaedize those schemas in this article,
And it is made to constitute some of specific embodiment.Through specific embodiment herein and corresponding schema is referred to, in order to detailed
The thin specific embodiment for explaining the present invention, and the action principle to illustrate invention.
Figure 1A is the center schematic diagram of the present invention；
Figure 1B is another substitution implementation diagram of center of the present invention；
Fig. 2A is the center section view partial schematic diagram of the present invention；
Fig. 2 B is the section view partial schematic diagram that another substitution of the ontology of the center of the present invention is implemented；
Fig. 3 is the section view partial schematic diagram of another center of the present invention；
Fig. 4 is the perspective exploded view that the present invention is applied to electronic equipment:
Fig. 5 is the section view partial schematic diagram that the present invention is applied to electronic equipment.
Component representated by each serial number in attached drawing are as follows:
10 centers
11 ontologies
111 first side surfaces
112 second side surfaces
1111,1121 groove
116 airtight chamber
117 capillary structures
118 working fluids
12 frame units
121 insides
122 outsides
13 heat insulation layers
131 first sides
132 second side
A thickness
20 front housings
21 fenestras
30 display modules
31 fronts
32 back sides
40 dorsal shields
41 mainboards
42 batteries
43,44 forward and backward lens module
[specific embodiment]
The above-mentioned purpose and its structure of the present invention and characteristic functionally, will be said according to the embodiment of institute's accompanying drawings
It is bright.
The present invention provides a kind of middle frame structure of tool insulation, including an ontology and the frame unit for being set to ontology side one by one,
One heat insulation layer is formed in at least opposite sides side between the ontology and the frame unit and being located at the ontology, which has one
First side connects the ontology periphery and a second side connects the frame unit.
It will be detailed below the various implementations of the present invention, please refer to each schema and its component symbol and explanation.
It please join the center schematic diagram that Figure 1A is the present invention；Figure 1B is another substitution implementation diagram of center of the present invention；Figure
2A is the center schematic cross-sectional view of the present invention；Fig. 2 B is another center schematic cross-sectional view of the present invention.As shown, center 10 is answered
For other than as the purposes of the various part in support protection electronic equipment, and being related to electronic equipment in an electronic equipment
Structural strength, a kind of direct protection can be generated to electronic equipment when electronic equipment faces extrusion or force.In
At least some of frame 10 is made of metal, however, the center 10 can also be all made of metal material.Due to metal material
Intensity it is preferable, and then keep the intensity of the entirety of center 10 preferable.Metal material above-mentioned is for example: stainless steel, aluminium, almag,
Aluminum titanium alloy etc..
The center 10, as shown in Figure 1A, including an ontology 11 and a frame unit 12, the skirt section 12 are located at the outer of ontology 11
Side, a heat insulation layer 13 are formed between the ontology 11 and skirt section 12, and the heat insulation layer 13 is located at the opposite sides side of the ontology 11,
Indicate the heat insulation layer 13 in the left side and right side of the ontology 11 in detail in this figure.Implement in another substitution, as shown in Figure 1B, the insulation
Layer 13 is located at four side of the ontology 11.
It is for example recessed that there is the ontology 11 first side surface 111 and one second side surface 112 to be respectively equipped with plural combined structure
Slot or open-work or cramp or column or combinations thereof indicate groove 1111,1121, the plural internal electron zero of electronic equipment in this implementation
Part is mounted on first side surface 111 and/or the second side surface 112 by the equal combined structures.The frame unit 12 has in one
Side 121 is in face of 122 opposite insides 121 of the periphery of the ontology 11 and an outside.
Furthermore ontology 11 and frame unit 12 are implemented to be respectively that metal material and/or non-metallic material are made one.
As shown in Figure 2 B, implement in another substitution, which is flat plate heat tube or hot plate or temperature-uniforming plate, is inside had
One airtight chamber 116, the airtight chamber 116 is interior to be equipped with capillary structure 117 and working fluid 118.By working fluid 118 close
Steam-condensate circulating is generated in closed chamber room 111, is uniformly distributed the heat on ontology 11.
Join Figure 1A, Figure 1B and Fig. 2A, the periphery and one the which there is one first side 131 to connect the ontology 11 again
The inside 121 of the two sides 132 connection frame unit 12.And one is defined between the first side 131 and the second side 132 of the heat insulation layer 13
Thickness A.Implement one, as shown in Figure 2 A and 2 B, second side 132 of heat insulation layer 13 connects the inside 121 of covering frame unit 12
Local surfaces.But in another alternative implementation, as shown in figure 3, second side 132 of heat insulation layer 13 connects covering frame unit
The whole surface of 12 inside 121.
The heat insulation layer 13 is formed by heat-insulating material (thermal insulation material), and heat-insulating material is also known as
Heat insulator.The heat-insulating material is, for example, polyurethane foam, glass fibre, asbestos, ethylene propylene rubber (EPDM) or virtue
Fragrant polyamide fiber.Preferably, the heat insulation layer 13 forming by ethylene propylene rubber (EPDM) and aromatic polyamide fibre,
Or it is made of ethylene propylene rubber (EPDM) and asbestos.Since heat insulation layer 13 is formed by heat-insulating material, so ontology 11 is from interior
The heat that portion's electronic component absorbs is not transferred to frame unit 12.
The application implementation of aforementioned center will be illustrated below.
Please join Fig. 4 is the perspective exploded view that the present invention is applied to electronic equipment: Fig. 5 is that the present invention is set applied to electronics
Standby section view partial schematic diagram.Electronic equipment as shown in the figure includes a center 10, a front housing 20 and a display module 30.
The center 10 as elucidated before Figure 1A, shown in Figure 1B, Fig. 2A, Fig. 2 B, Fig. 3, please also refer to front
Diagram and narration, do not repeat to repeat herein.The center 10 connects the front housing 20, shows that the front housing 20 is located at the center in the example shown
10 first side 111 is formed an accommodating space (not indicating in figure) between front housing 20 and center 10, and front housing 20 is equipped with fenestra
(window) 21.
Display module 30 is fixedly installed on accommodating space.Display module 30 includes a front 31 and opposite with the front 31
A back side 32, which is the display portion of display module 30, as shown in figure 5, when to be installed on accommodating empty for display module 30
Between after, the front 31 of display module 30 is appeared by the fenestra 21.The display module 30 can be liquid crystal display (LCD) or touching
Control display or other alternative elements.When the display module 30 is touch-control display panel, the front 31 is in addition to as display
Outside image, more as the surface of touch-control, touch control type operation is provided.
Center 10 above-mentioned more connects a dorsal shield 40, shows that the dorsal shield 40 is located at the second side 112 of the center 10 in figure,
Front housing 20 and dorsal shield 40 form the external form shape of electronic equipment entirety.The frame unit 12 of center 10, which is then set, to be formed in electronics and sets
Four standby sides are revealed in the extraneous contact area held as offer hand.
The plural internal electron part of electronic equipment is arranged on the ontology 11 of the center 10, the equal internal electrons part packet
Include mainboard 41 and battery 42 and forward and backward lens module 43,44.The mainboard 41 is equipped with processor, and power wafers, audio and video are brilliant
The various elements such as piece.Indicate that the mainboard 41 and battery 42 are separately positioned on the first side of the ontology 11 of center 10 in detail in this figure
111 and second side 112 on groove 1111,1121.Display module 30 and battery 42 and forward and backward lens module 43,44 with should
Mainboard 41 is electrically connected.Implement in another substitution, which is integrally formed with the center 10, then the plural number electronic component is set
Set the first side 111 in the ontology 11 of center 10.
When electronic equipment running, internal electron part, such as mainboard 41 and battery 42 and forward and backward lens module 43,44
It generates in heat transfer to the ontology 11 of center 10, and by heat insulation layer 13 between ontology 11 and frame unit 12, barrier
The heat of ontology 11 is transmitted to the opposite sides side of ontology 11 or the frame unit 12 of four sides, the heat for enabling internal electron part generate
It is distributed on the ontology 11 of center 10.Furthermore since the heat of ontology 11 can not be transmitted to frame unit 12, so that as electronic equipment
The frame unit 12 of side can provide hand and comfortably hold, will not scald one's hand and cause using upper inconvenience and puzzlement.
When it is implemented, electronic equipment described in this case can be mobile phone or tablet computer etc., those skilled in the art
It should be appreciated that mobile phone or tablet computer are merely illustrative, it is not used to limit the technical solution of the present embodiment, other types
Electronic equipment be also all suitable for.
According to the above embodiments, the present invention at least has lower example advantage:
The present invention is arranged between the ontology 11 of center 10 and frame unit 12 by heat insulation layer 13, and is located at the ontology 11
At least opposite sides side, to obstruct the frame unit 12 that the heat of ontology 11 is transmitted at least opposite sides side, and due to the frame unit
Four sides of 12 formation electronic equipments are revealed in the external world, and the contact zone that at least with respect to two sides are held as offer hand
Domain, and then hand is provided and comfortably holds electronic equipment.
Only as described above, the only preferably feasible embodiment of the present invention, such as using the above-mentioned method of the present invention,
Shape, construction, device change for it, should all be contained in the interest field of this case.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510489820.6A CN106455410B (en) | 2015-08-11 | 2015-08-11 | Heat-insulating middle frame structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510489820.6A CN106455410B (en) | 2015-08-11 | 2015-08-11 | Heat-insulating middle frame structure and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN106455410A CN106455410A (en) | 2017-02-22 |
| CN106455410B true CN106455410B (en) | 2019-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510489820.6A Active CN106455410B (en) | 2015-08-11 | 2015-08-11 | Heat-insulating middle frame structure and electronic equipment |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208143688U (en) * | 2018-04-17 | 2018-11-23 | 南昌黑鲨科技有限公司 | A kind of radiating component and the intelligent terminal with the radiating component |
| CN108770295A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | Electronic equipment and heat dissipation assembly |
| CN108770292B (en) * | 2018-06-11 | 2020-09-04 | Oppo广东移动通信有限公司 | An electronic device and heat dissipation component |
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| US6418017B1 (en) * | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
| CN1759643A (en) * | 2003-03-12 | 2006-04-12 | 富士通株式会社 | The cooling structure of electronic equipment |
| CN201550395U (en) * | 2009-12-10 | 2010-08-11 | 华为终端有限公司 | Wireless terminal and housing |
| TWM469730U (en) * | 2013-07-23 | 2014-01-01 | Asia Vital Components Co Ltd | Heat dissipation structure and heat dissipation structure having the same |
| CN104737634A (en) * | 2013-06-19 | 2015-06-24 | 阿莫绿色技术有限公司 | Hybrid insulation sheet and electronic equipment comprising same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9274568B2 (en) * | 2013-08-08 | 2016-03-01 | Blackberry Limited | Mobile electronic device and methods of manufacture thereof |
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|---|---|---|---|---|
| US6418017B1 (en) * | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
| CN1759643A (en) * | 2003-03-12 | 2006-04-12 | 富士通株式会社 | The cooling structure of electronic equipment |
| CN201550395U (en) * | 2009-12-10 | 2010-08-11 | 华为终端有限公司 | Wireless terminal and housing |
| CN104737634A (en) * | 2013-06-19 | 2015-06-24 | 阿莫绿色技术有限公司 | Hybrid insulation sheet and electronic equipment comprising same |
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| Publication number | Publication date |
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| CN106455410A (en) | 2017-02-22 |
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