CN106445211B - Touch control module - Google Patents

Abstract

The present invention discloses a touch control module, comprising a thick substrate, a first thin substrate, a first electrode layer, a first adhesive layer, a second thin substrate, a second electrode layer and a second adhesive layer. The thick substrate is used to provide a rigid support for the touch control module. The first electrode layer is arranged on the first thin substrate. The first adhesive layer adheres the thick substrate and the first thin substrate provided with the first electrode layer. The second thin substrate comprises a surface for touch operation. The second electrode layer is arranged on the other surface of the second thin substrate relative to the surface for touch operation. The second adhesive layer is adhered to the first thin substrate provided with the first electrode layer and the second electrode layer. The second thin substrate has a first thickness, and the second thickness of the thick substrate is greater than the first thickness. The touch control module of the present invention can be used in fingerprint recognition applications requiring high-precision sensing.

Description

touch module

technical field

The invention relates to a touch module, in particular to a fingerprint identification touch module.

Background technique

With the rapid development of electronic technology, touch modules have been widely used in various electronic devices, such as mobile phones and tablet computers. A typical touch module can be disposed on a display screen and includes a plurality of touch electrodes. When an object (such as a finger or a stylus) approaches or touches the display screen, the corresponding touch electrodes generate electrical signals, thereby achieving touch sensing.

The structure of the existing touch module includes a cover glass, an adhesive layer, an Rx sensor, a glass substrate, and a Tx sensor from top to bottom. The glass cover plate and the glass substrate have a relatively large thickness in order to provide a certain strength, usually 500-700 microns. This existing architecture has no problems for general touch applications (for example, the recognition of touch actions such as clicking and sliding pages), but it is not suitable for special touch applications that require high-precision sensing (for example, fingerprint recognition) ). To be specific, when this existing structure is applied to fingerprint recognition while maintaining the existing strength of the glass cover, it will face the problem of insufficient sensitivity and identification of fingerprint sensing due to the thickness factor.

Contents of the invention

In view of this, the present invention proposes a touch module applicable to fingerprint recognition by improving the structural design of the touch module.

According to one embodiment of the present invention, a touch module is provided, including a thick substrate for providing rigid support for the touch module; a first thin substrate for carrying an electrode layer; a first electrode layer disposed on the first thin substrate On; the first adhesive layer, bonding the thick substrate and the first thin substrate provided with the first electrode layer; the second thin substrate, including the surface for touch operation; the second electrode layer, arranged on the second thin substrate relative to the touch on the other surface of the operating surface; and a second adhesive layer, bonded to the first thin substrate provided with the first electrode layer and the second electrode layer, wherein the second thin substrate has a first thickness, and the thick substrate has a second thickness greater than the first thickness.

In one or more embodiments of the present invention, the above-mentioned first thin substrate has the same thickness as the second thin substrate.

In one or more embodiments of the present invention, the above-mentioned first thickness is 75 to 125 microns.

In one or more embodiments of the present invention, the above-mentioned first thickness is 100 microns.

In one or more embodiments of the present invention, the above-mentioned first electrode layer and the second electrode layer are separated by a distance, and the distance is 100 to 200 microns.

In one or more embodiments of the present invention, the aforementioned distance is 125 microns.

In one or more embodiments of the present invention, each of the above-mentioned first electrode layer and the second electrode layer includes a plurality of electrode lines. The electrode lines are arranged in parallel according to a pitch, and the pitch is 50 to 70 microns.

In one or more embodiments of the present invention, the aforementioned pitch is 60 microns.

In one or more embodiments of the present invention, each of the above-mentioned first electrode layer and the second electrode layer includes a plurality of electrode lines. Each electrode line has a line width, and the line width is 3 to 10 microns.

In one or more embodiments of the present invention, the aforementioned line width is 5 microns.

In one or more embodiments of the present invention, the above-mentioned second thickness is 500-600 micrometers.

In one or more embodiments of the present invention, the above-mentioned first electrode layer is a driving sensing layer, and the second electrode layer is a receiving sensing layer.

In one or more embodiments of the present invention, the aforementioned thick substrate has a first through hole, the first thin substrate has a second through hole, and the first through hole exposes the second through hole.

In one or more implementations of the present invention, the above-mentioned touch module further includes a first touch chip and a second touch chip. The first touch chip is disposed on the first thin substrate and located in the first through hole, and connected to the first electrode layer. The second touch chip is disposed on the second thin substrate and located in the second through hole, and connected to the second electrode layer.

In one or more implementations of the present invention, the above-mentioned touch module further includes a touch chip. The touch chip is bonded to the first electrode layer and the second electrode layer through the first through hole and the second through hole respectively.

In one or more embodiments of the present invention, the above-mentioned touch module further includes a light-shielding layer. The light-shielding layer is disposed between the second thin substrate and part of the second electrode layer, and the orthographic projection of the first through hole to the light-shielding layer overlaps with the light-shielding layer.

In one or more embodiments of the present invention, the above-mentioned second thickness is 4 to 6 times of the first thickness.

To sum up, in the touch module of the present invention, the receiving sensing layer (i.e., the second electrode layer) is disposed on a thin substrate (i.e., the second thin substrate), and the thin substrate is used as the direct contact surface of the finger when the user touches. Therefore, the sensitivity and recognition degree when receiving the sensing layer to sense the fingerprint can be improved. Moreover, the driving sensing layer (i.e. the first electrode layer) of the touch module is also arranged on another thin substrate (i.e. the first thin substrate), and this thin substrate is bonded to the receiving sensing layer, so as to increase the contact between the driving sensing layer and the sensing layer. Receive mutual capacitance value between sensing layers, and can be driven by existing IC. Furthermore, the touch module uses a thicker substrate than the first thin substrate and the second thin substrate to adhere to the driving and sensing layer, so as to make up for the lack of mechanical strength of the above two thin substrates. With the above structural configuration, the touch module of the present invention can be used in fingerprint recognition applications that require high-precision sensing.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

FIG. 1 is a schematic cross-sectional view showing a touch module applied to a touch display device according to an embodiment of the present invention.

FIG. 2A is a three-dimensional assembled view showing a touch module according to an embodiment of the present invention.

FIG. 2B is a three-dimensional exploded view illustrating the touch module in FIG. 2A .

FIG. 3 is a partial top view illustrating a first electrode layer and a second electrode layer according to an embodiment of the present invention.

FIG. 4A is a top view illustrating the thick substrate in FIG. 2A .

FIG. 4B is a top view illustrating a thick substrate according to another embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view showing a touch module applied to a touch display device according to another embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view illustrating the touch module in FIG. 5 along line 6-6'.

Detailed ways

The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments to further understand the purpose, solution and effect of the present invention, but it is not intended to limit the scope of protection of the appended claims of the present invention.

Please refer to FIG. 1 to FIG. 2B . FIG. 1 is a schematic cross-sectional view showing a touch module 12 applied to a touch display device 1 according to an embodiment of the present invention. FIG. 2A is a three-dimensional assembled view illustrating the touch module 12 according to an embodiment of the present invention. FIG. 2B is a three-dimensional exploded view illustrating the touch module 12 in FIG. 2A .

As shown in FIGS. 1 to 2B , in this embodiment, the touch display device 1 at least includes a back cover 10 , a touch module 12 and a display module 14 . The back cover 10 has an assembly opening 100 . The touch module 12 is fixed on the assembly port 100 . The display module 14 is disposed between the back cover 10 and the touch module 12 , and is located in an accommodating space formed by the back cover 10 and the touch module 12 . The touch module 12 is transparent, so the user can watch the picture displayed on the display module 14 through the touch module 12 . In one embodiment, the display module 14 is a liquid crystal display module 14 , but the present invention is not limited thereto.

The touch module 12 includes a thick substrate 120 , a first thin substrate 121 , a first electrode layer 122 , a first adhesive layer 123 a , a second thin substrate 124 , a second electrode layer 125 and a second adhesive layer 123 b. The thick substrate 120 is used to provide rigid support for the touch module 12 ; the thick substrate 120 is engaged with the back cover 10 . The first electrode layer 122 is disposed on the first thin substrate 121. The first electrode layer 122 in this embodiment is, for example, disposed on the lower surface of the first thin substrate 121. In other embodiments, the first electrode layer 122 is also It may be disposed on the upper surface of the first thin substrate 121 . The second thin substrate 124 includes a surface for touch operation, specifically, the upper surface of the second thin substrate 124 is a surface for user touch operation. The second electrode layer 125 is disposed on the second thin substrate 124 , and the second electrode layer 125 in this embodiment is disposed on the lower surface of the second thin substrate 124 .

The first adhesive layer 123a is used to bond the thick substrate 120 and the first thin substrate 121 provided with the first electrode layer 122. The first adhesive layer 123a in this embodiment is specifically bonded between the thick substrate 120 and the first electrode layer 122. . The second adhesive layer 123b is used to bond the first thin substrate 121 provided with the first electrode layer 122 and the second thin substrate 124 provided with the second electrode layer 125. The second adhesive layer 123b of this embodiment is bonded to the first Between the thin substrate 121 and the second electrode layer 125 . From the perspective of the overall structure, the thick substrate 120 is the substrate of the touch module 12 closest to the display module 14, and the second thin substrate 124 is the substrate of the touch module 12 farthest from the display module 14, and is used for touch by the user's finger touch behavior.

To further illustrate, the second thin substrate 124 has a first thickness t1, the thick substrate 120 has a second thickness t2, and the second thickness t2 is 4 to 6 times the first thickness t1. In various embodiments, the first thickness t1 of the second thin substrate 124 is 75 to 125 microns, and preferably 100 microns. Compared with the existing glass cover plate (about 500 to 700 microns), the thickness design of the second thin substrate 124 of the present invention can shorten the distance between the user's finger and the second electrode layer 125, so it can The sensitivity and recognition degree of the second electrode layer 125 for sensing fingers are greatly improved, which is beneficial to related applications of fingerprint identification. In one embodiment, the first thin substrate 121 and the second thin substrate 124 have the same thickness, but the invention is not limited thereto.

In the actual manufacturing process, the first electrode layer 122 and the second electrode layer 125 are respectively disposed on the first thin substrate 121 and the second thin substrate 124 and attached to each other to form a semi-finished product of the touch module 12 . As mentioned above, the thicknesses of the first thin substrate 121 and the second thin substrate 124 are greatly reduced for the application of fingerprint recognition, and the present invention further designs to attach the thick substrate 120 to the semi-finished touch module 12 mentioned above, so as to The overall structural strength of the touch module 12 is enhanced. In one embodiment, the second thickness t2 of the thick substrate 120 is 500-600 microns, but the invention is not limited thereto. Overall, the thicknesses of the first thin substrate 121 and the second thin substrate 124 in this embodiment are smaller than the thickness of the thick substrate 120 .

Please refer to FIG. 3 , which is a partial top view illustrating the first electrode layer 122 and the second electrode layer 125 according to an embodiment of the present invention. As shown in the figure, the first electrode layer 122 (such as the driving sensing layer) and the second electrode layer 125 (such as the receiving sensing layer) each include a plurality of electrode lines 122a, 125a. The extension directions of any electrode line 122a of the first electrode layer 122 and any electrode line 125a of the second electrode layer 125 are perpendicular to each other, so that the first electrode layer 122 and the second electrode layer 125 form a grid (mesh), but this The invention is not limited thereto.

The pitch of the fingerprints of an average adult is about 75 microns. In various embodiments, the electrode lines 122a of the first electrode layer 122 and the electrode lines 125a of the second electrode layer 125 are arranged in parallel according to a pitch P, and the pitch is 50-70 microns, preferably 60 microns. By designing the pitch P between the electrode lines 122a of the first electrode layer 122 and the electrode lines 125a of the second electrode layer 125 to be less than 75 microns, the line width W of each electrode line 122a, 125a is designed to be 3 to 10 microns, preferably 5 microns, can achieve the purpose of detecting the peak and trough of the user's fingerprint, that is, the sensing accuracy of the first electrode layer 122 and the second electrode layer 125 can be improved to the fingerprint recognition level.

In many embodiments, the electrode lines 122a of the first electrode layer 122 and the electrode lines 125a of the second electrode layer 125 are metal wires, and can be printed by ultra-fine wire printing technology (fine line printing) or yellow light. process, but the present invention is not limited thereto.

Under the above-mentioned metal grid structure formed by the first electrode layer 122 and the second electrode layer 125, in order to increase the mutual capacitance value between the first electrode layer 122 and the second electrode layer 125 to the driving capability of the existing IC In the present invention, the distance D between the first electrode layer 122 and the second electrode layer 125 is further designed to be 100 to 200 microns. For example, in one embodiment, the first thickness t1 of the first thin substrate 121 is 100 microns, and the thickness of the second adhesive layer 123b can be 25 microns, so the first electrode layer 122 is separated from the second electrode layer 125 The distance D is 125 µm.

In various embodiments, the first adhesive layer 123a for bonding the thick substrate 120 and the first electrode layer 122 and the second adhesive layer 123b for bonding the first thin substrate 121 and the second electrode layer 125 can be Optically Clear Adhesive (OCA) or water glue, but the present invention is not limited thereto.

As shown in FIG. 1 and FIG. 2B , in this embodiment, the thick substrate 120 has a first through hole 120a, the first thin substrate 121 has a second through hole 121a, and the first through hole 120a exposes the second through hole 121a. Moreover, the touch module 12 further includes a first touch chip 126a and a second touch chip 126b. The first touch chip 126 a is disposed on the first thin substrate 121 , located in the first through hole 120 a of the thick substrate 120 , and connected to the first electrode layer 122 . For example, the conductive bumps (not shown) on the first touch chip 126 a are bonded to the bonding pads (not shown) on the first electrode layer 122 . The second touch chip 126 b is disposed on the second thin substrate 124 , located in the second through hole 121 a of the first thin substrate 121 , and connected to the second electrode layer 125 . For example, the conductive bumps (not shown) on the second touch chip 126 b are bonded to the bonding pads (not shown) on the second electrode layer 125 . In addition, the display module 14 further includes a timing control board (Timing-Control board) 140 and a flexible circuit board 142 . The flexible circuit board 142 is connected to the timing control board 140 , and is bonded to the first electrode layer 122 and the second electrode layer 125 through the first through hole 120 a of the thick substrate 120 and the second through hole 121 a of the first thin substrate 121 .

It should be noted that, generally speaking, the distance between the bonding pads (not shown) of the first electrode layer 122 and the second electrode layer 125 is about 12 microns. In this embodiment, the first touch chip 126a and the second touch chip 126b are respectively bonded to the first electrode layer 122 and the second electrode layer 125. Therefore, the first thin substrate 121 and the second thin substrate 124 The lamination tolerance tolerance can be relaxed, which is conducive to the improvement of the pass rate of the lamination process. Furthermore, since the number of electrode lines 122a of the first electrode layer 122 and the number of electrode lines 125a of the second electrode layer 125 are approximately several thousands, the first touch chip 126a and the second touch chip 126b are used to independently drive the first With the structure of the electrode layer 122 and the second electrode layer 125, the size of the first touch chip 126a and the second touch chip 126b will not be too large, so there will be more space for the two to design some circuits such as amplifiers to increase Drive capability. In addition, disposing the first touch chip 126a and the second touch chip 126b in the first through hole 120a and the second through hole 121a, respectively, can also prevent the second touch in the subsequent drop test (Drop Test) or push test (Push Test). A touch chip 126a and a second touch chip 126b are damaged.

As shown in FIG. 1 , in this embodiment, the touch module 12 further includes a light shielding layer 127 . The light shielding layer 127 is disposed between the second thin substrate 124 and part of the second electrode layer 125 . Generally speaking, the area of the touch display device 1 corresponding to the light shielding layer 127 is defined as a non-visible area, while the area of the touch display device 1 corresponding to the light shielding layer 127 is defined as a visible area. The metal grid formed by the first electrode layer 122 and the second electrode layer 125 covers the entire visible area and at least partially extends to the non-visible area. According to the structure and configuration of the touch module 12 mentioned above, a touch application that allows the user to perform fingerprint recognition in the visible area can be realized. Moreover, in this embodiment, the orthographic projection from the first through hole 120 a of the thick substrate 120 to the light shielding layer 127 is designed to overlap with the light shielding layer 127 . That is to say, both the first through hole 120a of the thick substrate 120 and the second through hole 121a of the first thin substrate 121 are located in the non-visible area, so it will not affect the first electrode layer 122 and the second electrode layer 125 to sense the user's movement. The touch behavior performed in the visible area.

In one embodiment, the light-shielding layer 127 is an ink layer, but the invention is not limited thereto.

Please refer to FIG. 4A , which is a top view illustrating the thick substrate 120 in FIG. 2A . In this embodiment, the first through hole 120 a of the thick substrate 120 is a closed through hole. The closed first through hole 120a can make the thick substrate 120 have better structural strength. However, the present invention is not limited thereto. Please refer to FIG. 4B , which is a top view illustrating a thick substrate 120 according to another embodiment of the present invention. In this embodiment, the first through hole 120 a of the thick substrate 120 is an open through hole. That is to say, the first through hole 120 a extends to the edge of the thick substrate 120 , in other words, from the perspective of a plan view, the edge of the thick substrate 120 forms an edge concave state through the arrangement of the first through hole 120 a. The open first through hole 120 a is beneficial to the processing and manufacturing of the thick substrate 120 .

Please refer to FIG. 5 , which is a schematic cross-sectional view showing a touch module 32 applied to a touch display device 3 according to another embodiment of the present invention. As shown in the figure, the touch display device 3 includes a back cover 10 , a touch module 32 and a display module 14 . The touch module 32 includes a thick substrate 120 , a first thin substrate 121 , a first electrode layer 122 , a first adhesive layer 123 a , a second thin substrate 124 , a second electrode layer 125 and a second adhesive layer 123 b. For the structure, function, and connection relationship with other components in FIG. 5 that are the same as those in FIG. 1 , reference may be made to the relevant description above, and details will not be repeated here. It should be noted here that the difference between this embodiment and the embodiment shown in FIG. 1 lies in that the touch module 32 of this embodiment only includes a single touch chip 326 . The touch chip 326 is bonded to the first electrode layer 122 and the second electrode layer 125 through opening the first through hole 120 a of the thick substrate 120 and the second through hole 121 a of the first thin substrate 121 respectively.

For details, please refer to FIG. 6 , which is a schematic cross-sectional view of the touch module 32 in FIG. 5 along the line 6-6'. As shown in the figure, the first electrode layer 122 has bonding pads 122b on the first thin substrate 121 , and the second electrode layer 125 has bonding pads 125b on the first thin substrate 121 and in the second through hole 121a. In contrast, the touch chip 326 has conductive bumps 326a, 326b. For example, the conductive bumps 326a, 326b are golden bumps, but the invention is not limited thereto. The touch chip 326 is bonded to the bonding pads 122b, 125b by conductive bumps 326a, 326b, respectively. In practical applications, as long as the bonding tolerance between the first thin substrate 121 and the second thin substrate 124 can be controlled to be smaller than the distance between the bonding pads 122b of the first electrode layer 122 and the bonding pads 125b of the second electrode layer 125 When bonding the touch chip 326, the conductive bumps 326a, 326b can be accurately bonded to the bonding pads 122b, 125b respectively.

From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the touch module of the present invention arranges the receiving sensing layer (ie, the second electrode layer) on a thin substrate (ie, the second thin substrate), And the thin substrate is used as a component that the user's finger directly contacts when touching, so the sensitivity and recognition degree when the receiving sensing layer senses the fingerprint can be improved. Moreover, the driving sensing layer (i.e. the first electrode layer) of the touch module is also arranged on another thin substrate (i.e. the first thin substrate), and this thin substrate is bonded to the receiving sensing layer, so as to increase the contact between the driving sensing layer and the sensing layer. Receive mutual capacitance value between sensing layers, and can be driven by existing IC. Furthermore, the touch module uses a thicker substrate than the first thin substrate and the second thin substrate to adhere to the driving and sensing layer, so as to make up for the lack of mechanical strength of the above two thin substrates. With the above structural configuration, the touch module of the present invention can be used in fingerprint recognition applications that require high-precision sensing.

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (16)

1. a kind of touch-control module, characterized by comprising:

One thick substrate, to provide rigid support for the touch-control module；

One first thin substrate；

One first electrode layer is set in first thin substrate；

One first bonding coat binds the thick substrate and first thin substrate for being equipped with the first electrode layer；

One second thin substrate, the surface comprising an operation for touch；

One the second electrode lay is set on another surface of second thin substrate relative to the surface of the operation for touch；And

One second bonding coat is bonding on first thin substrate equipped with the first electrode layer and between the second electrode lay；

Wherein second thin substrate has a first thickness, and the second thickness which has is greater than the first thickness, and The second thickness is 4 to 6 times of the first thickness.

2. touch-control module as described in claim 1, which is characterized in that the thickness of first thin substrate and second thin substrate Thickness is identical.

3. touch-control module as described in claim 1, which is characterized in that the first thickness is 75 to 125 microns.

4. touch-control module as claimed in claim 3, which is characterized in that the first thickness is 100 microns.

5. touch-control module as described in claim 1, which is characterized in that the first electrode layer and the second electrode lay separate one away from From, and the distance is 100 to 200 microns.

6. touch-control module as claimed in claim 5, which is characterized in that the distance is 125 microns.

7. touch-control module as described in claim 1, which is characterized in that the first electrode layer and the second electrode lay respectively include more A electrode wires, those electrode wires are arranged in parallel according to a spacing, and the spacing is 50 to 70 microns.

8. touch-control module as claimed in claim 7, which is characterized in that the spacing is 60 microns.

9. touch-control module as described in claim 1, which is characterized in that the first electrode layer and the second electrode lay respectively include more A electrode wires, each of electrode wires have a line width, and the line width is 3 to 10 microns.

10. touch-control module as claimed in claim 9, which is characterized in that the line width is 5 microns.

11. touch-control module as described in claim 1, which is characterized in that the second thickness is 500 to 600 micromillimetres.

12. touch-control module as described in claim 1, which is characterized in that the first electrode layer be driving inductive layer, and this second Electrode layer is to receive inductive layer.

13. touch-control module as described in claim 1, which is characterized in that the thick substrate has one first perforation, the first thin base Plate has one second perforation, and first perforation exposes second perforation.

14. touch-control module as claimed in claim 13, which is characterized in that also include:

One first touch chip is set in first thin substrate and is located in first perforation, and is bonded to first electricity Pole layer；And

One second touch chip is set in second thin substrate and is located in second perforation, and is bonded to second electricity Pole layer.

15. touch-control module as claimed in claim 13, which is characterized in that also include a touch chip, touch chip difference The first electrode layer and the second electrode lay are bonded to via first perforation and second perforation.

16. touch-control module as claimed in claim 13, which is characterized in that also include a light shield layer, which is set to this Between second thin substrate and the part the second electrode lay, and an orthographic projection and the light shield layer of first perforation to the light shield layer Overlapping.

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