CN106444298B - A kind of DMD structures single shaft fixed light path direct write exposure machine - Google Patents
A kind of DMD structures single shaft fixed light path direct write exposure machine Download PDFInfo
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- CN106444298B CN106444298B CN201611025003.6A CN201611025003A CN106444298B CN 106444298 B CN106444298 B CN 106444298B CN 201611025003 A CN201611025003 A CN 201611025003A CN 106444298 B CN106444298 B CN 106444298B
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- stomata
- light path
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- shaft fixed
- direct write
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
- G03F7/2055—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2057—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using an addressed light valve, e.g. a liquid crystal device
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a kind of DMD structures single shaft fixed light path direct write exposure machine, belong to direct write exposure technique field.The present invention DMD structure single shaft fixed light path direct write exposure machines, mainly vacuum cup structure is improved, solve the problems, such as produce platelet when due to gas leakage and caused by suction deficiency.Further, the gas cell distribution on sucker for it is middle dredge, it is four careful, effectively prevented the problem of board edge tilts, saved stomata quantity, reduce cost.The DMD structure single shaft fixed light path direct write exposure machines of the present invention, 55 inches of super large plate can be produced.Meanwhile subregion contraposition focus method improves and may insure that image exposure position is accurate, image exposure understands.
Description
Technical field
The present invention relates to a kind of DMD structures single shaft fixed light path direct write exposure machine, belong to direct write exposure technique field.
Background technology
PCB (printed circuit board (PCB)) is the supporter of electronic component, while is also the carrier of electronic component electrical connection.
Common PCB production equipments have traditional exposure machine, polygon prism structure laser direct-writing exposure machine, the exposure of DMD structures laser direct-writing
Machine etc..Image directly can be imaged by laser direct-writing exposure machine on pcb board, relative to traditional exposure machine, it is not necessary to use
The film, the image of formation are apparent.
With functional requirement more and more higher of the market to pcb board, pcb board also becomes to become increasingly complex, and system compatibility is got over
It is high, it is sometimes necessary to the very big substrate of size, still, 48 inches of super large plate to be more than for width, is not had also in the prior art
The technology and equipment that can be processed with high quality.Traditional exposure machine can produce super large plate, but its machining accuracy is poor, does not reach
The requirement of high density, thin space；Polygon prism structure laser direct-writing exposure machine can not realize the movement of light path, whole plate necessary one at present
Secondary shaping, when processing is more than 48 inches of super large plates, its equipment complete machine width is up to more than 3m, and equipment size is excessively huge,
It is difficult to the door by general workshop, it is very heavy；Therefore polygon prism structure LDI can not produce the pcb board of more than 48 inches of width.
Conventional DMD structure laser direct-writing exposure machines, because the size Breadth Maximum that its sucker can expose is only 24 inches, therefore also without
Super large plate of the method production more than 48 inches.
If the method for the size that can be exposed by increasing sucker prepares DMD structure laser direct-writing exposure machines, by institute
The vacuum cup size needed is bigger, and sometimes more than 55 inches, there are the following problems for meeting：(1) when the pcb board exposed
When actual size is smaller, and sucker structure supports larger vacuum range, the region for being not covered with plank, can produce Lou
Gas, influence absorption of the sucker to substrate；(2) tilted due to might have corner during substrate transport, if pull of vacuum is inadequate,
Sucker, which can not inhale plank, puts down, and influences whether to expose the quality of pcb board, substrate can be caused to scrap.To solve this problem, at present
Method have three kinds：
Method one：Directly ignore the problem, but can require very high to client factory pcb board, plank not usually, can back and forth
Return and plank is bent manually, have a strong impact on production efficiency.
Method two：For various sizes of plank, different sucker backing plates is designed.The hole covering model of vacuum is inhaled on backing plate
Enclose, it is in the same size with plank.This method is simple, and operation is somewhat troublesome, but when producing 55 inches of plank, it is necessary to change
55 inches of backing plate, difficulty are multiplied, and change the time of backing plate, can increase by 150%~200%, have a strong impact on production efficiency.
Method three：Do not covered for plank and vacuumize region, blocked with article, conventional is to cut the used film.
This method very economical material benefit, but it is pretty troublesome, and different size of pcb board is, it is necessary to the film be cut into different sizes, for a long time
Get off, the film accumulation after the cutting of board producing region can be caused, the size for finding needs also bothers.
As can be seen here, generally use changes the suitable sucker of size in the prior art or searching shape size is suitably useless
The film is abandoned to block the mode of air leakage point, can all substantially reduce production efficiency.
In addition, in PCB factories, large-sized plank such as 52*40 inches is very big, carries trouble, it is possible to cause plank
Generation partial loop variation；When plank is very thin, plank can typically be broken manually flat；Plank is thicker, such as more than 3mm, after deformation
Recover relatively difficult.In addition, when actual exposure produces, substrate is to be positioned over by artificial dragging on sucker, during this not
It may accomplish completely accurately, more or less all can have an anglec of rotation with electronics shelves image, can so be made in actual exposure
The problems such as into image offset；3rd, in conventional exposure, CCD camera crawl sub- 4 hole positions in periphery of pcb board, according to 4 hole positions, lead to
Cross CCD camera and find most clear focal plane, determine optimal focal plane and exposure focal length, complete to focus on, will be burnt with this in exposure process
It is exposed on the basis of face, still, in practical situations both, plank will not be in preferable horizontal plane state, can in some regions
It is able to can produce raised or recessed, whole substrate is in placement process it is possible that tilting, these situations can cause some regions
Focused during exposure inaccurate, have a strong impact on the quality of production.
To sum up, current DMD structure laser direct-writing exposure machine presence can not produce super large plate, vacuum cup gas leakage, exposure
During focusing and the problems such as position inaccurate it is urgently to be resolved hurrily.
The content of the invention
For problem above, the DMD structures single shaft the invention provides vacuum cup and containing the vacuum cup fixes light
Road direct write exposure machine, with solve prior art can not produce in super large plate, vacuum cup gas leakage, exposure process focus and position not
The problems such as accurate.
First purpose of the present invention is to provide a kind of vacuum cup, the vacuum cup, including suction cup main body and vacuum
Generating means；A number of stomata, each each one relay of correspondence in promoting the circulation of qi hole are distributed in suction cup main body in terms of rows and columns
Device, each row stomata also each one relay of correspondence；Air vent switch is each connected between stomata and vacuum generating device；Stomata
The relay and the relay of the stomata column that switch is expert at the stomata simultaneously are connected.
In one embodiment of the invention, the air vent switch is located at the vacuum that stomata is connected with vacuum generating device
On pipeline.
In one embodiment of the invention, the air vent switch is electromagnetic switch.
In one embodiment of the invention, the relay is connected with master control device.
In one embodiment of the invention, the stomata is in middle thin, four careful distribution shapes in suction cup main body
Formula.
In one embodiment of the invention, the line space of the stomata and column pitch are by suction cup main body centre to both sides
In the form of uniformly successively decreasing.
In one embodiment of the invention, positioned at suction cup main body central region stomata line space or column pitch most
Greatly 1-3 inches, positioned at the minimum 5-8mm of line space or column pitch of the stomata of suction cup main body fringe region.
In one embodiment of the invention, positioned at suction cup main body central region stomata line space or column pitch most
Greatly 1.5-2.8 inches, positioned at the minimum 4-9mm of line space or column pitch of the stomata of suction cup main body fringe region.
In one embodiment of the invention, opening shape of the stomata in suction cup main body can be circular, ellipse
The arbitrary shape such as circle, square, rectangle, for example, it is circular.
In one embodiment of the invention, aperture area of the stomata in suction cup main body is 10mm2~
500mm2。
In one embodiment of the invention, the Breadth Maximum of the suction cup main body is 55 inches.
In one embodiment of the invention, the suction cup main body can be divided into chuck support structure and backing plate, also may be used
With the integral structure that to be backing plate be integrated with chuck support structure.When suction cup main body is that chuck support structure and backing plate separate
Structure when, backing plate is arranged on chuck support structure surface, and pad surfaces are designed with equally distributed stomata, be below backing plate with
The vacuum air-channel of stomata connection.
Second object of the present invention is to provide a kind of DMD structures single shaft fixed light path direct write exposure machine, the DMD structures
Single shaft fixed light path direct write exposure machine contains the vacuum cup of the present invention.
In one embodiment of the invention, the DMD structures single shaft fixed light path direct write exposure machine also includes support
Structure, DMD structures, a moving parts；The moving parts include a scanning Y-axis and a lifting Z axis；Vacuum cup position
Above moving parts.
In the present invention, single shaft refers to comprise only a moving parts, it is fixed refer to DMD structures be in a fixed position, can not
It is mobile.
In one embodiment of the invention, the scanning Y-axis is below lifting Z axis.
In one embodiment of the invention, the lifting Z axis connection of the vacuum cup and moving parts.
In one embodiment of the invention, the supporting construction is gantry structure.
In one embodiment of the invention, the DMD structures single shaft fixed light path direct write exposure machine also includes being used for
The camera for focusing on and positioning.
Third object of the present invention is to provide a kind of subregion contraposition focus method of exposure machine, to solve in production process
The problem of inaccurate and focusing is inaccurate is positioned due to putting caused by plate is inaccurate and plank deforms.
The subregion contraposition focus method of the present invention, i.e. 4 subregions focus on automatically and localization method, comprise the following steps：
(1) before exposure, after the coordinate of the positioning hole at four angles of CCD camera crawl pcb board, with electronics shelves graphic file
In corresponding positioning hole coordinate be compared, establish the actual corresponding relation of electronics shelves figure and pcb board；If CCD camera
The positioning hole coordinate of crawl is consistent with corresponding coordinate in electronics shelves graphic file, then carries out step (2)；If CCD camera
The positioning hole coordinate of crawl and corresponding coordinate in electronics shelves graphic file are inconsistent, then are adjusted electronics shelves graphic file
Whole to be allowed to be consistent with the positioning hole coordinate of CCD camera crawl, the original position of light path exposure also determines therewith, continues
Step (2)；
(2) before exposure, it is M × N number of subregion by region division to be exposed；
(3) the optimal focal plane distance per four summits of sub-regions is calculated respectively；If the optimal focal plane on this four summits
The maximum difference of distance is then used as this within the error range of permission using the average value of the optimal focal plane distance on this four summits
The focal plane distance of subregion exposure；If the maximum difference of the optimal focal plane distance on this four summits is not in the error range of permission
Within, then the subregion is further subdivided into A × B two level subregion, calculates the optimal of each four summits of two level subregion
Focal plane distance, repeats this step, until the optimal focal plane distance in per sub-regions is in error range.
In one embodiment of the invention, light path exposes since original position, into different subregions at different levels
When, if optimal focal plane distance is different, the optimum exposure focal plane of the subregion will be arrived by lifting Z axis adjustment height, so as to protect
Demonstrate,prove all exposure areas to expose in optimal focal plane, ensure that the line width uniformity of whole plate, and exposure quality.
In one embodiment of the invention, the determination method of the optimal focal plane is：PCB is identified using CCD camera
The aperture in the hole on plate, if the aperture recognized and the aperture of reality are inconsistent, by changing the height of lifting Z axis, phase up and down
The diameter of machine ceaselessly identifying hole, find out after lifting Z axis moves complete stroke, it is high closest to the lifting shaft corresponding to actual diameter
Degree, this height is exactly optimal focal plane corresponding to the hole.
In one embodiment of the invention, the exposure machine in methods described is tied for the DMD of the vacuum cup of the present invention
Structure single shaft fixed light path direct write exposure machine.
Advantages of the present invention and effect：
(1) DMD structure single shaft fixed light path direct write exposure machines of the invention, are mainly changed to vacuum cup structure
Enter.The vacuum cup of the present invention is the vacuum cup of automation, and chuck surface is distributed with a series of stomata, had above stomata
When pcb board covers, stomata closed-circuit working, when there is no pcb board covering above stomata, stomata closure, it is small to efficiently solve production
During plate, caused by due to gas leakage the problem of suction deficiency.Further, the gas cell distribution on sucker for it is middle dredge, it is four careful,
Both so that different size of pcb board is when placing, there is stomata marginal portion all the time, effectively prevents the problem of board edge tilts,
The place of too many stomata can not be needed to save stomata quantity in centre again, reduce cost, improve efficiency.
(2) DMD structure single shaft fixed light path direct write exposure machines of the invention, exposure machine sucker width can be arranged to 55 English
It is very little, can produce 55 inches of super large plate, while and can ensure high accuracy, high density, fine rule away from etc. demand, exposed lines spacing it is reachable
Less than 30 microns, ill-exposed rate drops to less than 0.1%.
(3) subregion contraposition focus method provided by the invention, before pcb board exposure, 4 subregions is carried out and focuses on and determines
Position, it can be ensured that image exposure position is accurate, can control bit errors below 12 microns, image exposure understands.
(4) designed using DMD structures fixed light path, light path is irremovable, effectively prevent due to light path displacement error band
The problem of exposure come is inaccurate；Single moving parts design, solves and does more physical exercises component at work, due to the fortune of moving parts
There is the influence exposure quality such as distortion, inclination and even results in product in the dynamic substrate position that can not be realized absolute synchronization and may bring
The problem of scrapping.
Brief description of the drawings
Fig. 1 is the vacuum cup structural representation of the present invention；Wherein, 1 suction cup main body, 3 stomatas, 4 relays, 6 master controls
Device；
Fig. 2 is the vacuum generating device and stomata connection diagram of the vacuum cup of the present invention；Wherein, 2 vacuum fill
Put, 5 air vent switch；
Fig. 3 is that traditional vacuum cup places the structural representation after substrate；Wherein, 14 substrate；
Fig. 4 is that the vacuum cup of the present invention places a kind of structural representation after substrate；
Fig. 5 is a kind of structural representation after the substrate position on the vacuum cup of the adjustment present invention；
Fig. 6 is the DMD structure single shaft fixed light path direct write exposure machines of the vacuum cup containing the present invention；Wherein, 7 support knot
Structure, 8DMD structures, 10 vacuum cups；12 scanning Y-axis, 13 lifting Z axis；
Fig. 7 is image corresponding relation schematic diagram before contraposition；
Fig. 8 is image corresponding relation schematic diagram after contraposition；
Fig. 9 is subregion Focus Exposure region division schematic diagram；
Figure 10 is to repartition the schematic diagram behind exposure area.
Specific embodiment
DMD structures：A whole set of complete light path system using DMD as core devices, including LASER Light Source, DMD, optical frames
The parts such as piece form.
PCB：Printed Circuit Board, printed circuit board (PCB), are important electronic units, are electronic components
Supporter, it is the carrier of electronic component electrical connection.
Scan Y-axis：Also scan axis or Y-axis are, for doing the continuous scanning motion of constant speed.
Lift Z axis：Also lifting shaft or Z axis are, for controlling the lifting of sucker.
Sucker：For adsorbing, the objective table of fixed pcb board.
Here is that the present invention is specifically described.
Embodiment 1：Vacuum cup
The vacuum cup structure of the present invention is as shown in Figure 1-2.
Vacuum cup of the present invention, including suction cup main body 1 and vacuum generating device 2；In suction cup main body 1 in terms of rows and columns
It is distributed a number of stomata 3, each each one relay 4 of correspondence in promoting the circulation of qi hole 3, each row stomata also each one relay of correspondence
Device；Air vent switch 5 is each connected between stomata 3 and vacuum generating device 2；What air vent switch 5 was expert at the stomata simultaneously
Relay connects with the relay of the stomata column.
Each relay is connected with master control device 6.Air vent switch is located at the vacuum tube that stomata is connected with vacuum generating device
Lu Shang.The air vent switch can be electromagnetic switch.The stomata, can be uniformly distributed in suction cup main body.
Using such structure and connected mode, when vacuum cup works, a certain size substrate is placed on vacuum suction
On disk, for the stomata row or stomata row for thering is substrate to cover, the relay path corresponding to the row or column；For certain stomata
Speech, only when it is expert at and column corresponding to relay all make for path, the air vent switch of the stomata is just opened, and then
Vacuum generating device and stomata UNICOM, stomata work.In the case of this, the air vent switch for the stomata not covered substantially
For closed mode, so as to solve it is larger produce PCB using vacuum cup when existing leakage problem.
Embodiment 2：Vacuum cup
The vacuum cup of the present embodiment, it is made that and changes on the basis of the vacuum cup as shown in Figure 1-2 of embodiment 1
Enter.
The stomata 3 is in suction cup main body 1 in middle thin, four careful distribution forms.
Traditional vacuum cup, stomata is usually to use equally distributed form, may when producing less pcb board
After substrate 14 is placed in suction cup main body, the lucky position in certain edge where substrate far from both sides stomata farther out (as shown in Figure 3) so that
Cause the marginal portion to be tilted because there is no pull of vacuum, production is impacted.Dredged using this centre of the present invention, four
After careful distribution form, as illustrated in figures 4-5, when smaller substrate is placed on vacuum cup, select substrate close to sucker
Body rim is placed, now if the substrate edges of intermediate region are just from both sides stomata farther out in the suction cup main body, then
It can select the substrate edges being moved in nearest a line or a row stomata and be allowed to cover just；Due to suction cup main body
Surrounding stomata is closeer, and this movement will not cause substrate phenomenon of another lateral edges from stomata farther out occur.
Alternatively, the line space of the stomata and column pitch by among suction cup main body to both sides in the form of uniformly successively decreasing.
Alternatively, positioned at suction cup main body central region stomata line space or column pitch be up to 1-3 inches, positioned at suction
The minimum 5-8mm of line space or column pitch of the stomata of disc main body fringe region.Opening shape of the stomata in suction cup main body can
To be the arbitrary shapes such as circle, ellipse, square, rectangle, for example, it is circular.Opening surface of the stomata in suction cup main body
Product can be arbitrary, such as 10mm2~500mm2。
Alternatively, the card of the suction cup main body is integral card or formed by polylith disk assembled.
Embodiment 3：DMD structure single shaft fixed light path direct write exposure machines
As shown in fig. 6, the DMD structure single shaft fixed light path direct write exposure machines for the vacuum cup containing the present invention.
The DMD structures single shaft fixed light path direct write exposure machine also includes 8, supporting construction 7, DMD structures exercise groups
Part and vacuum cup 10；Moving parts include a scanning Y-axis 12 and a lifting Z axis 13；Vacuum cup 10 is located at exercise group
Above part.
The scanning Y-axis 12 is positioned at the lower section of lifting Z axis 13；The lifting Z axis 13 of the vacuum cup 10 and moving parts connects
Connect.Vacuum cup, with scan Y-axis, drop Z axis 13 movement and corresponding change in location occurs.
Alternatively, the supporting construction is gantry structure.Framework for whole system supports, marble gantry structure
Design feature can be very good to keep the stability of platform motion, and have good isolation property.
In the process of running, pcb board is placed on vacuum cup 10 (objective table), lifting Z axis is used for focusing, i.e. plank phase
It is thickening for standard thickness of slab, then lift Z axis and decline, otherwise lifting Z axis rises, that is, lifts the height that Z axis 13 controls vacuum cup 10
Degree finds light path optimal focal plane；Start exposure process, the scanning of scanning Y-axis 12 uniform speed scanning motion control objective table is until exposure knot
Beam position stops.The equipment of the present invention, can be by changing the height of lifting shaft, corresponding different thickness of slab so that light path is optimal
Focal plane keeps constant.
Embodiment 4：Picture portion aligns and focus method
In traditional exposure process, position is there may be when PCB substrate is placed on vacuum cup and puts not positive ask
Topic, if as shown in fig. 7, directly the actual figure being exposed in PCB substrate on electronics shelves graph exposure to substrate, will be may result in
Shape and electronics shelves figure are inconsistent, so as to cause plank quality bad or scrap.In addition, in traditional exposure process, entirely
Substrate is exposed using same focal plane distance, is adjusted without focusing；But in practical situations both, substrate will not
In preferable horizontal plane state, raised or recessed, whole substrate possibility in placement process may be produced in some regions
Inclination occurs, it is inaccurate that these situations can cause some regions to be focused when exposing, and has a strong impact on the quality of production.
The subregion contraposition focus method of the present invention, i.e. 4 subregions focus on automatically and localization method, as is seen in figs 7-10, bag
Include following steps：
(1) before exposure, after the coordinate of the positioning hole at four angles of CCD camera crawl pcb board, with electronics shelves graphic file
In corresponding positioning hole coordinate be compared, establish the actual corresponding relation of electronics shelves figure and pcb board；If CCD camera
The positioning hole coordinate of crawl is consistent with corresponding coordinate in electronics shelves graphic file, then carries out step (2)；If CCD camera
The positioning hole coordinate of crawl and corresponding coordinate in electronics shelves graphic file are inconsistent, then are adjusted electronics shelves graphic file
Whole to be allowed to be consistent with the positioning hole coordinate of CCD camera crawl, the original position of light path exposure also determines therewith, continues
Step (2)；
(2) before exposure, it is M × N number of subregion (such as Fig. 9) by region division to be exposed；
(3) the optimal focal plane distance per four summits of sub-regions is calculated respectively；If the optimal focal plane on this four summits
The maximum difference of distance is then used as this within the error range of permission using the average value of the optimal focal plane distance on this four summits
The focal plane distance of subregion exposure；If the maximum difference of the optimal focal plane distance on this four summits is not in the error range of permission
Within, then the subregion is further subdivided into A × B two level subregion (such as Figure 10), calculates each four tops of two level subregion
The optimal focal plane distance of point, repeats this step, until the optimal focal plane distance in per sub-regions is in error range.
Light path exposes since original position,, will if optimal focal plane distance is different during into different subregions at different levels
The optimum exposure focal plane of the subregion is arrived by lifting Z axis adjustment height, so as to ensure all exposure areas in optimal focal plane
Exposure, ensure that the line width uniformity of whole plate, and exposure quality.
The determination method of the optimal focal plane is：Using the aperture in the hole on CCD camera identification pcb board, if recognize
Aperture and the aperture of reality are inconsistent, by changing the height of lifting Z axis up and down, the diameter of camera ceaselessly identifying hole, find out
Lift after Z axis moves complete stroke, closest to the lifting shaft height corresponding to actual diameter, this height be exactly corresponding to the hole most
Good focal plane.
Although the present invention is disclosed as above with preferred embodiment, it is not limited to the present invention, any to be familiar with this skill
The people of art, without departing from the spirit and scope of the present invention, it can all do various change and modification, therefore the protection model of the present invention
Enclose being defined of being defined by claims.
Claims (8)
1. a kind of DMD structures single shaft fixed light path direct write exposure machine, it is characterised in that the DMD structures single shaft fixed light path is straight
Writing exposure machine includes supporting construction, DMD structures, moving parts, a vacuum cup；Moving parts include one scanning Y-axis and
One lifting Z axis；Vacuum cup is located above moving parts；
The vacuum cup includes suction cup main body and vacuum generating device；A fixed number is distributed in suction cup main body in terms of rows and columns
The stomata of amount, each each one relay of correspondence in promoting the circulation of qi hole, each row stomata also each one relay of correspondence；Each stomata with it is true
Air vent switch is connected between empty generating means；The relay and the stomata column that air vent switch is expert at the stomata simultaneously
Relay connection；
The stomata is in suction cup main body in middle thin, four careful distribution forms.
2. DMD structures single shaft fixed light path direct write exposure machine according to claim 1, it is characterised in that the stomata is opened
Off-position is on the vacuum line that stomata is connected with vacuum generating device.
3. DMD structures single shaft fixed light path direct write exposure machine according to claim 1, it is characterised in that positioned at sucker master
The line space or column pitch of the stomata of body central region are up to 1.5-2.8 inches, positioned at the stomata of suction cup main body fringe region
Line space or the minimum 4-9mm of column pitch.
4. DMD structures single shaft fixed light path direct write exposure machine according to claim 1, it is characterised in that the vacuum is inhaled
The lifting Z axis of disk and moving parts connects.
5. DMD structures single shaft fixed light path direct write exposure machine according to claim 1, it is characterised in that the support knot
Structure is gantry structure.
6. DMD structures single shaft fixed light path direct write exposure machine according to claim 1, it is characterised in that the stomata exists
Aperture area in suction cup main body is 10mm2~500mm2。
7. the subregion contraposition focus method of a kind of exposure machine, it is characterised in that the described method comprises the following steps：
(1) before exposure, after the coordinate of the positioning hole at four angles of CCD camera crawl pcb board, with phase in electronics shelves graphic file
Corresponding positioning hole coordinate is compared, and establishes the actual corresponding relation of electronics shelves figure and pcb board；If CCD camera captures
Positioning hole coordinate it is consistent with corresponding coordinate in electronics shelves graphic file, then carry out step (2)；If CCD camera captures
Positioning hole coordinate and corresponding coordinate in electronics shelves graphic file it is inconsistent, then being adjusted electronics shelves graphic file makes
With CCD camera crawl positioning hole coordinate be consistent, light path exposure original position also determine therewith, continue step
(2)；
(2) before exposure, it is M × N number of subregion by region division to be exposed；
(3) the optimal focal plane distance per four summits of sub-regions is calculated respectively；If the optimal focal plane distance on this four summits
Maximum difference within the error range of permission, then the sub-district is used as using the average value of the optimal focal plane distance on this four summits
The focal plane distance of domain exposure；If the maximum difference of the optimal focal plane distance on this four summits not permission error range it
It is interior, then the subregion is further subdivided into A × B two level subregion, calculates optimal Jiao on each four summits of two level subregion
Identity distance is from repeating this step, until per the optimal focal plane distance in sub-regions in error range.
8. according to the method for claim 7, it is characterised in that the exposure machine is any described exposures of claim 1-6
Ray machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611025003.6A CN106444298B (en) | 2016-11-22 | 2016-11-22 | A kind of DMD structures single shaft fixed light path direct write exposure machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545174A (en) * | 2012-07-16 | 2014-01-29 | 无锡华润上华科技有限公司 | Photoetching focusing parameter testing method and system |
| CN103869627A (en) * | 2012-12-11 | 2014-06-18 | 上海微电子装备有限公司 | Focusing and leveling method used for projection photoetching machine |
| CN104137247A (en) * | 2012-02-28 | 2014-11-05 | 炭研轴封精工有限公司 | Non-contact suction plate |
| CN105182699A (en) * | 2015-09-30 | 2015-12-23 | 合肥芯碁微电子装备有限公司 | Double-mesa laser direct writing exposure machine and control method therefor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20060032037A1 (en) * | 2004-08-13 | 2006-02-16 | Dar-Wen Lo | [assembling method and device thereof] |
| KR20140127438A (en) * | 2013-04-24 | 2014-11-04 | 삼성디스플레이 주식회사 | Substrate absorption device |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104137247A (en) * | 2012-02-28 | 2014-11-05 | 炭研轴封精工有限公司 | Non-contact suction plate |
| CN103545174A (en) * | 2012-07-16 | 2014-01-29 | 无锡华润上华科技有限公司 | Photoetching focusing parameter testing method and system |
| CN103869627A (en) * | 2012-12-11 | 2014-06-18 | 上海微电子装备有限公司 | Focusing and leveling method used for projection photoetching machine |
| CN105182699A (en) * | 2015-09-30 | 2015-12-23 | 合肥芯碁微电子装备有限公司 | Double-mesa laser direct writing exposure machine and control method therefor |
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Address after: 221000 west side of Hengshan Road, Pizhou City, Xuzhou City, Jiangsu Province Patentee after: Jiangsu Yingsu integrated circuit equipment Co., Ltd Address before: Huashan Road, Pizhou City Economic Development Zone, Xuzhou City, Jiangsu Province Patentee before: JIANGSU YINGSU PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |