CN106435676B - The surface treatment method of electronic equipment metal shell - Google Patents
The surface treatment method of electronic equipment metal shell Download PDFInfo
- Publication number
- CN106435676B CN106435676B CN201611051326.2A CN201611051326A CN106435676B CN 106435676 B CN106435676 B CN 106435676B CN 201611051326 A CN201611051326 A CN 201611051326A CN 106435676 B CN106435676 B CN 106435676B
- Authority
- CN
- China
- Prior art keywords
- plating
- treatment method
- surface treatment
- metal shell
- partalloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
- C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention belongs to electronic equipment casing technical fields, in particular disclose the surface treatment method of a kind of electronic equipment metal shell, comprising steps of carrying out the plating of Cu/Sn/Zn water to the metal shell after pre- plating metal, Pd/Co water plates.In this way, the metal shell for the electronic equipment that final process can be made to complete can be achieved at the same time bright mute effect, the appearance of electronic equipment is promoted, which is suitable for the metal shell of zinc alloy diecasting and the metal shell of aluminium alloy compression casting simultaneously.Surface treatment method according to the present invention is easier to meet the environmental requirements such as market is required about Rohs and Reach is required.The surface treatment method further preferably carries out vapor deposition fluorosilicone compound after the plating of Pd/Co water, keeps people's sweat test performance of the metal housing surface of the electronic equipment obtained more excellent.In addition, by plating different non-ferrous metals, moreover it is possible to make the surface of shell of the electronic equipment obtained that different colors be presented, further improve the appearance of the electronic equipment.
Description
Technical field
The invention belongs to electronic equipment casing technical fields, in particular, being related to the table of a kind of electronic equipment metal shell
Surface treatment method.
Background technique
Currently, in the electronic equipments such as the mobile phone that common metal center is combined with battery cover on the market, metal center
And battery cover is generally used aluminium alloy punching press/forging and stamping/crowded shape combination CNC technique (computer digital control machine tool) and anode work
The method of skill, the appearance of the metal housing surface of acquisition are usually positive sandblasting combination side C high bright border.In above-mentioned technique
In, because the CNC process time is longer, the processing unit price for thereby resulting in each electronic equipment is general at 70~100 yuan, processing cost
It is higher.Under huge cost pressure, seem very urgent using completely new method.Currently, generally being combined using die casting a small amount of
CNC technique come replace punching press/forging and stamping/squeeze shape combination CNC technique part；But since in new method, aftertreatment technology is not
Maturation, so that the new method does not obtain large-scale promotion.
For die cast metal, being studied in industry on appearance member at present more deep is that aluminium alloy compression casting and zinc close
Golden die casting.
By taking aluminium alloy compression casting as an example, the mainstream research direction of aftertreatment technology is CNC technique combination anode in industry at present
Electrolysis.But since the compactness of Al-alloy parts is poor, there are the sightless sand holes of more naked eyes, serious shadows in the embryo material after die casting
The yield of anode electrolysis processing is rung, process costs are not effectively reduced.
And for zinc alloy diecasting, the mainstream research direction of aftertreatment technology is CNC technique combinative prevention-decoration
Property water plating；Typical protection-dicoration water is coated with Cu-Ni-Cr system, and process flow is generally copper pre-plating-plating alkali copper-plating half
Light nickel-plating bright chromium process.
Above-mentioned zinc alloy diecasting water plates product, that is, generally existing two problems as a result: (1) sandblasting face and the angle C can only be presented one
Kind gloss is bright or mute, and appearance is more single；(2) performance test of people's sweat fails, be easy to appear in use process Staining or
Person's foaming phenomena.
Summary of the invention
To solve the above-mentioned problems of the prior art, the present invention provides at the surface of a kind of electronic equipment metal shell
Reason method, the surface treatment method is more environmentally-friendly, can not only be suitable for zinc alloy diecasting, apply also for aluminium alloy compression casting
Part；Appearance is more beautiful, while people's sweat performance test is good.
In order to achieve the above object of the invention, present invention employs the following technical solutions:
The surface treatment method of a kind of electronic equipment metal shell, comprising steps of to the metal shell after pre- plating metal into
The plating of row Cu/Sn/Zn water, the plating of Pd/Co water.
Further, the Cu/Sn/Zn water plating is plating light Cu/Sn/Zn ternary alloy three-partalloy and/or plating dumb light Cu/Sn/Zn
Ternary alloy three-partalloy.
Further, when plating Pd/Co bianry alloy, the mass ratio of Pd, Co are 15~17:3~5 in electroplate liquid.
Further, the step of surface treatment method specifically includes: plating light to the metal shell after pre- plating metal
Cu/Sn/Zn ternary alloy three-partalloy；To the metal shell plating alkali copper or sour copper after plating light Cu/Sn/Zn ternary alloy three-partalloy；To plating alkali copper or
Metal shell after sour copper plates dumb light Cu/Sn/Zn ternary alloy three-partalloy；To the metal shell plating after plating dumb light Cu/Sn/Zn ternary alloy three-partalloy
Pd/Co bianry alloy.
Further, when plating light Cu/Sn/Zn ternary alloy three-partalloy, the mass ratio of Cu, Sn, Zn are 5~6:3 in electroplate liquid
~4:0.5~1, the electroplate liquid further include photo etching；The photo etching includes wetting agent, light-modulating agent, the wetting agent and the tune
The total concentration of photo etching is 0.5mL/L~2.5mL/L；When plating dumb light Cu/Sn/Zn ternary alloy three-partalloy, the matter of Cu, Sn, Zn in electroplate liquid
The ratio between amount is 3~4:5~6:0.5~1.
Further, the photo etching further includes open cylinder agent；Wherein, the concentration of the open cylinder agent is no more than 20mL/L.
Further, the surface treatment method, which is further comprised the steps of:, is coated with coloured gold to the metal shell after the plating of Pd/Co water
Belong to.
Further, the non-ferrous metal includes Sn/Co alloy, black Cr, 18K gold of trivalent, in 23K gold, Ti, the white Cr of trivalent
Any one.
Further, the surface treatment method, which further comprises the steps of:, successively carries out the metal shell after plating non-ferrous metal
Plasma cleaning, sputter coupling layer, sputter SiO2, vapor deposition fluorosilicone compound；Wherein, the coupling layer is Co2O3、Al2O3Or
TiO2In any one.
Further, the thickness of coating of pre- plating metal is 0.1 μm~2.0 μm；Plate the plating of light Cu/Sn/Zn ternary alloy three-partalloy
Layer is with a thickness of 1 μm~6 μm；The thickness of coating for plating alkali copper or sour copper is 5 μm~15 μm；Plate the plating of dumb light Cu/Sn/Zn ternary alloy three-partalloy
Layer is with a thickness of 1 μm~6 μm；The thickness of coating for plating Pd/Co bianry alloy is 0.05 μm~0.5 μm；Plate the plating thickness of non-ferrous metal
Degree is 0.05 μm~0.5 μm；Sputter Al2O3Thickness of coating be 5nm~15nm；Sputter SiO2Thickness of coating be 5nm~
15nm；The thickness of coating that fluorosilicone compound is deposited is 15nm~30nm.
The present invention replaces semi-gloss Ni water plating in the prior art and bright Cr water with the plating of Cu/Sn/Zn water and the plating of Pd/Co water respectively
Plating is easier to meet market about Rohs requirement and Reach requirement；Meanwhile in conjunction with vapor deposition fluorosilicone compound, so that finally obtain
The surface of the metal shell of electronic equipment can not only realize bright mute effect simultaneously, promote the appearance of electronic equipment, and obtain
The metal housing surface of the electronic equipment obtained the also sweat of resistance to people is tested.In addition, by plating different non-ferrous metals, moreover it is possible to so that obtain
Different colors is presented in the metal housing surface of electronic equipment, further improves the appearance of the electronic equipment.
Detailed description of the invention
What is carried out in conjunction with the accompanying drawings is described below, above and other aspect, features and advantages of the embodiment of the present invention
It will become clearer, in attached drawing:
Fig. 1 is the process flow chart of the surface treatment method of the electronic equipment metal shell of embodiment according to the present invention 1.
Specific embodiment
Hereinafter, with reference to the accompanying drawings to detailed description of the present invention embodiment.However, it is possible to come in many different forms real
The present invention is applied, and the present invention should not be construed as limited to the specific embodiment illustrated here.On the contrary, providing these implementations
Example is in order to explain the principle of the present invention and its practical application, to make others skilled in the art it will be appreciated that the present invention
Various embodiments and be suitable for the various modifications of specific intended application.In the accompanying drawings, for the sake of clarity, element can be exaggerated
Shape and size, and identical label will be used to indicate the same or similar element always.
Embodiment 1
Fig. 1 is the process flow chart according to the surface treatment method of the electronic equipment metal shell of the present embodiment.
In the present embodiment, which is specially zinc alloy diecasting.
Referring in particular to Fig. 1, included the following steps: according to the surface treatment method of the electronic equipment metal shell of the present embodiment
S1, the metal shell copper pre-plating to electronic equipment.
Preferably, before the metal housing surface copper pre-plating to the electronic equipment, oil removal treatment, catholyte are first carried out
And acid-wash activation.Specifically, electrolytic degreasing is successively carried out, alkali cleaning oil removing, pickling degreasing three steps carry out oil removal treatment；
Then the oxide layer of catholyte removal metal housing surface is carried out；It is that subsequent copper pre-plating forms transition finally by acid-wash activation
Layer.
S2, the plating of Cu/Sn/Zn water, the plating of Pd/Co water are carried out to the metal shell after copper pre-plating.
In the present embodiment, in order to obtain better appearance, the plating of Cu/Sn/Zn water refers specifically to plate light Cu/ respectively
Sn/Zn ternary alloy three-partalloy and plating dumb light Cu/Sn/Zn ternary alloy three-partalloy；Certainly, the present invention is not restricted to this, when without considering product
When appearance, light Cu/Sn/Zn ternary alloy three-partalloy or plating dumb light Cu/Sn/Zn ternary alloy three-partalloy can be only plated.
Specifically, this step specifically includes following technique:
(1) light Cu/Sn/Zn ternary alloy three-partalloy is plated to the metal shell after copper pre-plating.
When plating light Cu/Sn/Zn ternary alloy three-partalloy, in electroplate liquid the mass ratio of Cu, Sn, Zn be 5~6:3~4:0.5~
1；That is, Cu accounts for the ternary alloy three-partalloy in the Cu/Sn/Zn ternary alloy three-partalloy needed for plating light Cu/Sn/Zn ternary alloy three-partalloy
30%~40%, the Zn that 50%~60%, Sn of quality accounts for the quality of the ternary alloy three-partalloy account for the quality of the ternary alloy three-partalloy 5%~
10%.
It also needs to add photo etching in electroplate liquid simultaneously.Photo etching includes wetting agent, light-modulating agent, wetting agent and light-modulating agent it is total dense
Degree is 0.5mL/L~2.5mL/L.Include further preferably open cylinder agent in photo etching, is a kind of complex compound；Wherein, open cylinder agent is controlled
Concentration is no more than 20mL/L.
(2) alkali copper is plated to the metal shell after plating light Cu/Sn/Zn ternary alloy three-partalloy.
(3) dumb light Cu/Sn/Zn ternary alloy three-partalloy is plated to the metal shell after plating alkali copper.
When plating dumb light Cu/Sn/Zn ternary alloy three-partalloy, in electroplate liquid the mass ratio of Cu, Sn, Zn be 3~4:5~6:0.5~
1；That is, Cu accounts for the ternary alloy three-partalloy in the Cu/Sn/Zn ternary alloy three-partalloy needed for plating dumb light Cu/Sn/Zn ternary alloy three-partalloy
50%~60%, the Zn that 30%~40%, Sn of quality accounts for the quality of the ternary alloy three-partalloy account for the quality of the ternary alloy three-partalloy 5%~
10%.
In this way, ensuring that metal housing surface is filled and led up uniformly, and appearance is made by first plating light Cu/Sn/Zn ternary alloy three-partalloy
Highlight effect is presented；Then the sand face gloss that metal housing surface is reduced by plating dumb light Cu/Sn/Zn ternary alloy three-partalloy, carries out
When the process, the angle C of the metal housing surface of the electronic equipment has showed extraordinary flatness, dumb light Cu/Sn/Zn tri-
First alloy layer is to the angle C bright border influential effect and little, it is thus achieved that light sand consubstantiality effect, improves the electronics finally obtained
The appearance of the metal housing surface of equipment.
(4) Pd/Co bianry alloy is plated to the metal shell after plating dumb light Cu/Sn/Zn ternary alloy three-partalloy.
When plating Pd/Co bianry alloy, the mass ratio of Pd, Co are 15~17:3~5 in electroplate liquid；That is, plating
In Pd/Co bianry alloy needed for Pd/Co bianry alloy, 75%~85%, the Co that Pd accounts for the quality of the bianry alloy account for this two
The 15%~25% of the quality of first alloy.
Plating Pd/Co bianry alloy can effectively promote the hardness of the metal shell of electronic equipment.
At this point, can be obtained the electronic equipment that light gold is presented in metal housing surface, in order to set the electronics finally obtained
Different colors is presented in standby metal housing surface, preferably progress following step S3.
S3, non-ferrous metal is plated to the metal shell after the plating of Pd/Co water.
Specifically, non-ferrous metal include Sn/Co alloy, it is black Cr, 18K gold of trivalent, any in 23K gold, Ti, the white Cr of trivalent
It is a kind of.
The color that the metal housing surface of the electronic equipment finally obtained the is showed i.e. color of the non-ferrous metal.Such as
Silver color is presented when the material for plating non-ferrous metal is Sn/Co alloy in this；As the material for plating non-ferrous metal Cr black for trivalent,
Tarnish is presented；When the material for plating non-ferrous metal is 18K gold or 23K gold, that is, present golden；When the material of plating non-ferrous metal is
When Ti, that is, silvery white is presented；As the white Cr of plating trivalent, that is, white is presented.
In this way, being the water plating operation completed to the metal housing surface of electronic equipment by above-mentioned steps S1-S3.Into
During the above-mentioned water plating of row, the gap between plastic cement, metal housing surface can remain all kinds of electroplate liquids, can carry out after water plating
Then ultrasonic cleaning carries out drying and manual wipping to remove remaining electroplate liquid.
In order to make the metal housing surface of the electronic equipment finally obtained show good property in people's sweat performance test
Can, preferably carry out following step.
S4, plasma cleaning, sputter Al are successively carried out to the metal shell after plating non-ferrous metal2O3, sputter SiO2, vapor deposition
Fluorosilicone compound.
In this step, the fluorosilicone compound of vapor deposition can be in people's sweat performance test to the metal shell of the electronic equipment
Surface plays a good protective effect, but weaker in view of binding force between fluorosilicone compound and non-ferrous metal, therefore is being deposited
Before fluorosilicone compound, the successively sputter Al on non-ferrous metal coating in advance2O3And SiO2, with enhance different materials coating it
Between binding force.
It is of course possible to be used as coupling layer material be not limited to the present embodiment in Al2O3, can also be Co2O3Or TiO2。
In this way, completing whole coating film treatments to the metal housing surface of the electronic equipment, the gold of the electronic equipment
The color for belonging to surface of shell is determined by the color of Pd/Co water coated coating or the color of non-ferrous metal coating；And its thickness then by
Plate the plating of the thickness of coating of alkali copper, the thickness of coating of Cu/Sn/Zn water plating, the thickness of coating of Pd/Co water plating and fluorosilicone compound
Thickness degree determines jointly.
In the present embodiment, the thickness of coating of copper pre-plating is 0.1 μm~2.0 μm；Plate light Cu/Sn/Zn ternary alloy three-partalloy
Thickness of coating is 1 μm~6 μm；The thickness of coating for plating alkali copper is 5 μm~15 μm；Plate the plating thickness of dumb light Cu/Sn/Zn ternary alloy three-partalloy
Degree is 1 μm~6 μm；The thickness of coating for plating Pd/Co bianry alloy is 0.05 μm~0.5 μm；Plating non-ferrous metal thickness of coating be
0.05 μm~0.5 μm；Sputter Al2O3Thickness of coating be 5nm~15nm；Sputter SiO2Thickness of coating be 5nm~15nm；It steams
The thickness of coating for plating fluorosilicone compound is 15nm~30nm.
Embodiment 2
In the description of embodiment 2, details are not described herein with the something in common of embodiment 1, only describes with embodiment 1 not
Same place.Embodiment 2 difference from example 1 is that, in embodiment 2 metal shell of electronic equipment be aluminium alloy compression casting
Part；The copper pre-plating correspondence in 1 step S1 of embodiment is changed to pre- zinc-plated as a result, and the plating alkali copper in 1 step S2 of embodiment is corresponding
It is changed to acid coppering.
That is, the surface treatment method of electronic equipment metal shell according to the present invention, according to electronic equipment metal
The material of shell determines the type of pre- plating metal and the type of plating alkali copper or sour copper.
The surface treatment method of the electronic equipment metal shell of embodiment according to the present invention, is on the one hand easier to meet Rohs
It is required that and Reach requirement, technique is more environmentally-friendly；On the other hand good barrier can be played to people's sweat, effectively inhibit the corruption of people's sweat
Erosion.In addition, the effect of light and dumb light can also be presented simultaneously in the different zones on identical product surface in the surface treatment method,
And the electronic equipment of different colours can be prepared, effectively improve the appearance of electronic equipment.
Although the present invention has shown and described referring to specific embodiment, it should be appreciated by those skilled in the art that:
In the case where not departing from the spirit and scope of the present invention being defined by the claims and their equivalents, can carry out herein form and
Various change in details.
Claims (9)
1. the surface treatment method of a kind of electronic equipment metal shell, which is characterized in that comprising steps of
The plating of Cu/Sn/Zn water, the plating of Pd/Co water are carried out to the metal shell after pre- plating metal；Wherein, the Cu/Sn/Zn water, which plates, is
Plate light Cu/Sn/Zn ternary alloy three-partalloy and plating dumb light Cu/Sn/Zn ternary alloy three-partalloy.
2. surface treatment method according to claim 1, which is characterized in that when plating Pd/Co bianry alloy, in electroplate liquid
The mass ratio of Pd, Co are 15~17:3~5.
3. surface treatment method according to claim 1 or 2, which is characterized in that the step of surface treatment method has
Body includes:
Light Cu/Sn/Zn ternary alloy three-partalloy is plated to the metal shell after pre- plating metal；
To the metal shell plating alkali copper or sour copper after plating light Cu/Sn/Zn ternary alloy three-partalloy；
Dumb light Cu/Sn/Zn ternary alloy three-partalloy is plated to the metal shell after plating alkali copper or sour copper；
Pd/Co bianry alloy is plated to the metal shell after plating dumb light Cu/Sn/Zn ternary alloy three-partalloy.
4. surface treatment method according to claim 3, which is characterized in that when plating light Cu/Sn/Zn ternary alloy three-partalloy, electricity
The mass ratio of Cu, Sn, Zn are 5~6:3~4:0.5~1 in plating solution, and the electroplate liquid further includes photo etching；The photo etching includes
The total concentration of wetting agent, light-modulating agent, the wetting agent and the light-modulating agent is 0.5mL/L~2.5mL/L；
When plating dumb light Cu/Sn/Zn ternary alloy three-partalloy, the mass ratio of Cu, Sn, Zn are 3~4:5~6:0.5~1 in electroplate liquid.
5. surface treatment method according to claim 4, which is characterized in that the photo etching further includes open cylinder agent；Wherein, institute
The concentration for stating open cylinder agent is no more than 20mL/L.
6. surface treatment method according to claim 3, which is characterized in that the surface treatment method further comprises the steps of:
Non-ferrous metal is plated to the metal shell after the plating of Pd/Co water.
7. surface treatment method according to claim 6, which is characterized in that the non-ferrous metal includes Sn/Co alloy, three
Any one in black Cr, 18K gold of valence, 23K gold, Ti, the white Cr of trivalent.
8. surface treatment method according to claim 6, which is characterized in that the surface treatment method further comprises the steps of:
Plasma cleaning, sputter coupling layer, sputter SiO are successively carried out to the metal shell after plating non-ferrous metal2, vapor deposition fluorine silication close
Object；Wherein, the coupling layer is Co2O3、Al2O3Or TiO2In any one.
9. surface treatment method according to claim 8, which is characterized in that the thickness of coating of pre- plating metal be 0.1 μm~
2.0μm；The thickness of coating for plating light Cu/Sn/Zn ternary alloy three-partalloy is 1 μm~6 μm；The thickness of coating for plating alkali copper or sour copper is 5 μm
~15 μm；The thickness of coating for plating dumb light Cu/Sn/Zn ternary alloy three-partalloy is 1 μm~6 μm；Plating Pd/Co bianry alloy thickness of coating be
0.05 μm~0.5 μm；The thickness of coating for plating non-ferrous metal is 0.05 μm~0.5 μm；Sputter Al2O3Thickness of coating be 5nm~
15nm；Sputter SiO2Thickness of coating be 5nm~15nm；The thickness of coating that fluorosilicone compound is deposited is 15nm~30nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611051326.2A CN106435676B (en) | 2016-11-25 | 2016-11-25 | The surface treatment method of electronic equipment metal shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611051326.2A CN106435676B (en) | 2016-11-25 | 2016-11-25 | The surface treatment method of electronic equipment metal shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106435676A CN106435676A (en) | 2017-02-22 |
| CN106435676B true CN106435676B (en) | 2019-02-26 |
Family
ID=58219567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611051326.2A Active CN106435676B (en) | 2016-11-25 | 2016-11-25 | The surface treatment method of electronic equipment metal shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106435676B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109576705A (en) * | 2018-12-15 | 2019-04-05 | 惠州Tcl移动通信有限公司 | Processing method, metal shell and the mobile terminal of metal shell |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101613862A (en) * | 2008-06-27 | 2009-12-30 | 深圳富泰宏精密工业有限公司 | Method for processing plastic surface |
| CN104480512A (en) * | 2014-12-26 | 2015-04-01 | 广东欧珀移动通信有限公司 | Product housing, mobile terminal and production method for product housing |
| CN104972283A (en) * | 2015-07-16 | 2015-10-14 | 广东欧珀移动通信有限公司 | Method for improving appearance expressive force of metal frame of mobile terminal |
| CN105344567A (en) * | 2015-12-08 | 2016-02-24 | 唐仕波 | NCVM (Non Conductive Vacuum Metallization) spraying surface treatment process and NCVM product |
| CN105369322A (en) * | 2015-11-26 | 2016-03-02 | 深圳市金立通信设备有限公司 | Method for integrating smooth surface and rough surface on surface of aluminum alloy and aluminum alloy surface |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5332346B2 (en) * | 1972-07-10 | 1978-09-07 | ||
| JP2002161393A (en) * | 2000-11-22 | 2002-06-04 | Bikutoria:Kk | Method for plating noble metal having corrosion resistance and noble metal plate accessories |
| CN100580142C (en) * | 2006-09-28 | 2010-01-13 | 熊猫电子集团有限公司 | Method for electrically plating Ti-Cu-Zn ternary alloy meeting three-prevention demand |
| CN104651892A (en) * | 2013-11-26 | 2015-05-27 | 何汉中 | Technological process for electroplating red bronze imitations on ABS plastics |
| CN105109260B (en) * | 2015-07-31 | 2018-01-19 | 广东欧珀移动通信有限公司 | Pack alloy appearance surfaces processing method and phone housing |
| CN105671377B (en) * | 2016-01-25 | 2018-05-04 | 佛山市三水瑞晟通金属制品有限公司 | A kind of electro-plating method of high strength alumin ium alloy for die casting |
| CN105970217A (en) * | 2016-06-22 | 2016-09-28 | 惠州Tcl移动通信有限公司 | Zinc alloy pressure casting with high corrosion resistance and preparation method thereof |
-
2016
- 2016-11-25 CN CN201611051326.2A patent/CN106435676B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101613862A (en) * | 2008-06-27 | 2009-12-30 | 深圳富泰宏精密工业有限公司 | Method for processing plastic surface |
| CN104480512A (en) * | 2014-12-26 | 2015-04-01 | 广东欧珀移动通信有限公司 | Product housing, mobile terminal and production method for product housing |
| CN104972283A (en) * | 2015-07-16 | 2015-10-14 | 广东欧珀移动通信有限公司 | Method for improving appearance expressive force of metal frame of mobile terminal |
| CN105369322A (en) * | 2015-11-26 | 2016-03-02 | 深圳市金立通信设备有限公司 | Method for integrating smooth surface and rough surface on surface of aluminum alloy and aluminum alloy surface |
| CN105344567A (en) * | 2015-12-08 | 2016-02-24 | 唐仕波 | NCVM (Non Conductive Vacuum Metallization) spraying surface treatment process and NCVM product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106435676A (en) | 2017-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2481499A2 (en) | Method and device for manufacturing cover including multiple metal layers | |
| KR20140048327A (en) | Anodization and plating surface treatments | |
| CN101203098A (en) | A kind of electronic product casing and preparation method thereof | |
| CN110359045B (en) | Aluminum alloy member with plating layer and surface treatment method | |
| CN104726911B (en) | The surface treatment method of stainless steel | |
| CN107245745A (en) | Die casting surface treatment method and die casting | |
| JP2014095097A (en) | Method for producing trivalent chromium plated-molded article and trivalent chromium-plated molded article | |
| CN106435676B (en) | The surface treatment method of electronic equipment metal shell | |
| CN105109260A (en) | Die-casting aluminum alloy appearance surface processing method and mobile telephone shell | |
| CN109576705A (en) | Processing method, metal shell and the mobile terminal of metal shell | |
| CN104711649A (en) | Stainless steel surface copper-plating technology | |
| CN106048681A (en) | Electronic part, manufacturing method of electronic part and mobile terminal | |
| CN105970217A (en) | Zinc alloy pressure casting with high corrosion resistance and preparation method thereof | |
| CN109423646A (en) | A kind of preparation method and electronic product product of composite coating | |
| US20180305822A1 (en) | Electroplating and Electrophoretic Deposition over Surfaces of Metal Substrate | |
| CN102021635A (en) | Electroplate liquid, color coating formation method and metal part | |
| US20160236445A1 (en) | Composite Layer, Metal Layer and Anodized Layer | |
| CN208980815U (en) | A kind of coating structure of aluminum alloy die casting | |
| CN205576281U (en) | Plating layer structure of high weldbility | |
| CN102899695B (en) | Electroplating method of nickel-free alloy coating | |
| CN102189880A (en) | Aluminum three-dimensional electroformed name plate and processing method thereof | |
| CN102320107A (en) | Coating process based on IML and NCVM | |
| CN106400011A (en) | Dark grey zinc alloy surface treatment method combining AF coating | |
| KR101584293B1 (en) | Product of color developing surface and Method of manufacturing the same | |
| CN207918993U (en) | A kind of imitative golden composite plating layer structure of bright Zn-Ni alloy, high tin copper-tin alloy, ormolu |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230721 Address after: 361000 room 4101, No. 131, xinjingdongli, Haicang District, Xiamen City, Fujian Province Patentee after: Xiamen Jiupin sesame Information Technology Co.,Ltd. Address before: 518057 16th floor, block B, TCL building, South 1st Road, Gaoxin, Nanshan District, Shenzhen City, Guangdong Province Patentee before: JRD COMMUNICATION (SHENZHEN) Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240313 Address after: No. 7, Xianxing Road, Qindu District, Xianyang City, Shaanxi Province 712000 Patentee after: Shaanxi Hengyu Hongye Environmental Protection Technology Co.,Ltd. Country or region after: China Address before: 361000 room 4101, No. 131, xinjingdongli, Haicang District, Xiamen City, Fujian Province Patentee before: Xiamen Jiupin sesame Information Technology Co.,Ltd. Country or region before: China |