CN106430081A - Method for manufacturing cylindrical mould - Google Patents
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- CN106430081A CN106430081A CN201610896868.3A CN201610896868A CN106430081A CN 106430081 A CN106430081 A CN 106430081A CN 201610896868 A CN201610896868 A CN 201610896868A CN 106430081 A CN106430081 A CN 106430081A
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- 229910052751 metal Inorganic materials 0.000 abstract description 47
- 239000002184 metal Substances 0.000 abstract description 47
- 238000000034 method Methods 0.000 abstract description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 11
- 238000005323 electroforming Methods 0.000 abstract description 9
- 239000002861 polymer material Substances 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000004062 sedimentation Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000009415 formwork Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000025 interference lithography Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical group C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004540 pour-on Substances 0.000 description 1
- 230000010076 replication Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0004—Apparatus specially adapted for the manufacture or treatment of nanostructural devices or systems or methods for manufacturing the same
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
技术领域technical field
本发明涉及一种圆柱模具的制造方法,尤其是一种用于连续图形加工圆柱模具的制造方法,属于微纳制造领域。The invention relates to a method for manufacturing a cylindrical mold, in particular to a method for manufacturing a cylindrical mold for continuous graphic processing, and belongs to the field of micro-nano manufacturing.
背景技术Background technique
近年来,伴随着大面积功能性表面微纳米结构能对产品性能和品质的提高,微纳米加工技术逐渐得到了广泛地认同。传统的微纳米加工工艺多为平面加工,图形转移所需模具为平板模具,工艺成熟,在生产中已广泛使用。但对于大面积或批量连续生产中,平板模具极低的生产率、步进式图形转移在相邻图形之间形成的缝隙问题都限制了其广泛应用。In recent years, along with the improvement of product performance and quality with large-area functional surface micro-nano structures, micro-nano processing technology has gradually been widely recognized. The traditional micro-nano processing technology is mostly planar processing, and the mold required for pattern transfer is a flat mold. The technology is mature and has been widely used in production. However, for large-area or batch continuous production, the extremely low productivity of flat-panel molds and the gap formed between adjacent graphics by step-by-step graphics transfer limit its wide application.
圆柱模具进行滚动连续转移图形技术在继承了平面图形转移分辨率高等优点的同时,还具有连续复制的特点,使得生产成本低、生成率更高,具有非常广阔的应用前景。常用的平板模具加工工艺包括传统光刻、电子束光刻、激光干涉光刻以及激光烧蚀加工等,其具有图形转移精度高、工艺成熟、能够制造纳米级和微米级的平面图形阵列的特点,但由于在制造圆柱模具时圆柱面上光刻胶的铺涂和曝光工艺难以实施、激光烧蚀工艺制造大面积模具生产率较低等诸多问题,采用传统生产平板模具的工艺难以实现圆柱模具的制造。The rolling and continuous transfer graphics technology of cylindrical molds not only inherits the advantages of high resolution of plane graphics transfer, but also has the characteristics of continuous replication, which makes the production cost low and the production rate higher, and has a very broad application prospect. Commonly used flat mold processing techniques include traditional lithography, electron beam lithography, laser interference lithography, and laser ablation processing, etc., which have the characteristics of high pattern transfer accuracy, mature technology, and the ability to manufacture nanoscale and micron-scale planar pattern arrays. However, due to many problems such as the difficulty in implementing the coating and exposure process of photoresist on the cylindrical surface when manufacturing cylindrical molds, and the low productivity of large-area molds manufactured by laser ablation technology, it is difficult to achieve the production of cylindrical molds with the traditional production process of flat molds. manufacture.
发明内容Contents of the invention
本发明的目的在于,提供一种工艺易实现、成本低的圆柱模具制造方法,以实现大面积和连续图形转移的生产加工。The object of the present invention is to provide a cylindrical mold manufacturing method with easy process and low cost, so as to realize the production and processing of large area and continuous pattern transfer.
为达到上述目的,本发明通过以下技术方案实现:In order to achieve the above object, the present invention is achieved through the following technical solutions:
(1)取一平整的基板,在该基板上加工微结构,制成平面模板;(1) Take a flat substrate, process the microstructure on the substrate, and make a planar template;
(2)采用常温注塑工艺在平面模板上浇注抗粘附性良好的材料,翻制出柔性母版;(2) Use the normal temperature injection molding process to cast the material with good anti-adhesion on the flat formwork to reproduce the flexible master;
(3)将柔性母版弯曲固定于一圆筒内表面上,形成具有一定弧度的圆柱形柔性母版,对圆柱形柔性母版表面进行导电处理;(3) Bending and fixing the flexible master on the inner surface of a cylinder to form a cylindrical flexible master with a certain radian, and conducting conductive treatment on the surface of the cylindrical flexible master;
(4)以导电的圆柱形柔性母版为阴极,在电沉积槽中电铸,一定时间后,剥离圆柱形柔性母版表面电铸沉积的圆弧状金属层;(4) Use the conductive cylindrical flexible master as the cathode, electroform in the electrodeposition tank, and after a certain period of time, peel off the arc-shaped metal layer electroformed and deposited on the surface of the cylindrical flexible master;
(5)将若干个电铸沉积的圆弧状金属层拼接起来,形成圆环形金属层,采用金属板联接工艺连接相邻金属层之间的接缝,形成一个无缝、完整的圆环形金属层;(5) Splice several arc-shaped metal layers deposited by electroforming to form a circular metal layer, and use the metal plate connection process to connect the seams between adjacent metal layers to form a seamless and complete ring shaped metal layer;
(6)将圆环形金属层装配在一金属圆柱上,保持圆环金属和中心处的金属圆柱之间间隙均匀,将液态高分子材料浇注填充在圆环形金属层和金属圆柱之间的间隙中,凝固后修整、制成圆柱模具。(6) Assemble the ring-shaped metal layer on a metal cylinder, keep the gap between the ring metal and the metal cylinder at the center uniform, pour liquid polymer material into the space between the ring-shaped metal layer and the metal cylinder In the gap, after solidification, it is trimmed and made into a cylindrical mold.
本发明提出的一种圆柱模具制造方法,工艺简单、易实现,加工成本低、图形的复制精度高,可实现图形的连续转移和制造。The manufacturing method of a cylindrical mold proposed by the invention has simple process, easy realization, low processing cost, high precision of pattern reproduction, and can realize continuous transfer and manufacture of patterns.
附图说明Description of drawings
图1为平面模板示意图。Figure 1 is a schematic diagram of a planar template.
图2为在平面模板上翻制柔性母版示意图。Fig. 2 is a schematic diagram of reproducing a flexible master on a planar template.
图3为柔性母版结构示意图。Figure 3 is a schematic diagram of the structure of the flexible master.
图4为柔性母版固定于圆筒内表面示意图。Fig. 4 is a schematic diagram of the flexible master board being fixed on the inner surface of the cylinder.
图5为柔性母版模具进行导电处理示意图。Fig. 5 is a schematic diagram of conducting conductive treatment on the flexible master mold.
图6为电铸沉积示意图。Figure 6 is a schematic diagram of electroforming deposition.
图7为电铸沉积所得的单个圆弧状金属层结构示意图。7 is a schematic diagram of the structure of a single arc-shaped metal layer obtained by electroforming deposition.
图8为圆弧状金属层组装示意图。FIG. 8 is a schematic diagram of the assembly of the arc-shaped metal layer.
图9为圆柱模具的整体结构示意图。Fig. 9 is a schematic diagram of the overall structure of a cylindrical mold.
图10为圆柱模具的整体结构示意图。Fig. 10 is a schematic diagram of the overall structure of the cylindrical mold.
图中的标号分别表示:The labels in the figure represent respectively:
1是平面模板;2是抗粘附性良好的材料;3是柔性母版;4是圆筒;5是圆柱形柔性母版;6是电沉积槽;7是圆弧状金属层;8是圆弧状金属层间的接缝;9是圆环形金属层;10是金属圆柱;11是高分子材料。1 is a flat template; 2 is a material with good anti-adhesion; 3 is a flexible master; 4 is a cylinder; 5 is a cylindrical flexible master; 6 is an electrodeposition tank; 7 is an arc-shaped metal layer; 8 is The seams between arc-shaped metal layers; 9 is a circular metal layer; 10 is a metal cylinder; 11 is a polymer material.
具体实施方式detailed description
(1)取一平整的基板,在该基板上加工出微结构,制成平面模板1,如图1所示;(1) Take a flat substrate, process microstructures on the substrate, and make a planar template 1, as shown in Figure 1;
作为优选,所述的基板具有一定的强硬度和良好的加工性能,材料如为镍板、铜板或铝板。Preferably, the substrate has a certain strength and good processing performance, and the material is, for example, a nickel plate, a copper plate or an aluminum plate.
作为优选,所述的平面模板1的形状可为矩形。Preferably, the shape of the planar formwork 1 may be a rectangle.
(2)采用常温注塑工艺在平面模板1上浇注抗粘附性良好的材料2,翻制出柔性母版3;具体的,如图2所示,将抗粘附性良好的材料2采用常温浇注的方法在真空条件下浇注在平面模板1上,固化后从平面模板1上剥离抗粘附性良好的材料2、翻制出柔性母版3。(2) The material 2 with good adhesion resistance is poured on the flat template 1 by normal temperature injection molding process, and the flexible master plate 3 is produced; specifically, as shown in Figure 2, the material 2 with good adhesion resistance is used at room temperature The pouring method is to pour on the plane template 1 under vacuum condition, peel off the material 2 with good adhesion resistance from the plane template 1 after curing, and reproduce the flexible master 3 .
作为优选,抗粘附性良好的材料2采用PDMS或聚四氟乙烯。Preferably, the material 2 with good anti-adhesion property is PDMS or polytetrafluoroethylene.
(3)将柔性母版3弯曲固定于一圆筒4内表面上,形成具有一定弧度的圆柱形柔性母版5,如图4所示,对圆柱形柔性母版5表面进行导电处理,如图5所示。(3) Bending and fixing the flex master 3 on the inner surface of a cylinder 4 to form a cylindrical flex master 5 with a certain curvature, as shown in Figure 4, conduct conductive treatment on the surface of the cylindrical flex master 5, as Figure 5 shows.
作为优选,圆筒4起固定支撑作用,可为具有一定强硬度的材料,如ABS工程塑料、钢、铝或铜。Preferably, the cylinder 4 acts as a fixed support and can be made of a material with a certain hardness, such as ABS engineering plastics, steel, aluminum or copper.
作为优选,圆柱形柔性母版5具有一定弧度,圆心角为360˚/N,本发明优选N为3。Preferably, the cylindrical flex master 5 has a certain radian, and the central angle is 360°/N, and N is preferably 3 in the present invention.
作为优选,圆柱形柔性母版5表面导电处理可采用制备导电薄膜工艺实现,如化学镀、蒸镀、磁控溅射镀膜、或喷涂铜油、石墨工艺。Preferably, the conductive treatment on the surface of the cylindrical flexible master 5 can be realized by the process of preparing a conductive film, such as electroless plating, evaporation, magnetron sputtering coating, or copper oil or graphite spraying process.
(4)以导电处理后的圆柱形柔性母版5为阴极,在电沉积槽6中电铸,一定时间后,剥离圆柱形柔性母版5表面电铸沉积的圆弧状金属层7,如图6和图7所示。(4) Using the conductively treated cylindrical flexible master 5 as the cathode, electroforming in the electrodeposition tank 6, after a certain period of time, peeling off the arc-shaped metal layer 7 electroformed and deposited on the surface of the cylindrical flexible master 5, as shown in Figure 6 and Figure 7 show.
作为优选,在圆柱形柔性母版5上电铸沉积的圆弧状金属层7在后继加工完成后形成圆柱模具表面,其材料为具有一定强硬度、电沉积性能好的金属材料,如镍或铝。As preferably, the arc-shaped metal layer 7 deposited by electroforming on the cylindrical flexible master plate 5 forms a cylindrical mold surface after the subsequent processing is completed, and its material is a metal material with a certain hardness and good electrodeposition performance, such as nickel or aluminum.
作为优选,电铸沉积的圆弧状金属层7具有一定弧度,圆心角为360˚/N,本发明优选圆心角为120°。Preferably, the arc-shaped metal layer 7 deposited by electroforming has a certain radian, and the central angle is 360°/N. In the present invention, the preferred central angle is 120°.
作为优选,圆弧状金属层7的厚度应使其具有一定的强度和硬度,本发明优选4~5mm。Preferably, the thickness of the arc-shaped metal layer 7 should have a certain strength and hardness, preferably 4-5mm in the present invention.
(5)将若干个电铸沉积的圆弧状金属层7拼接成圆环形金属层,如图8所示;采用金属板联接工艺连接相邻金属层之间的接缝8,形成一个无缝、完整的圆环形金属层9,如图9所示。(5) Several arc-shaped metal layers 7 deposited by electroforming are spliced into circular metal layers, as shown in Figure 8; the joints 8 between adjacent metal layers are connected by a metal plate connection process to form a seamless Seam, a complete circular metal layer 9, as shown in Figure 9.
作为优选,电铸沉积的圆弧状金属层7的个数由其圆心角决定,为N个,本发明优选为3个,可以组成一个圆环形金属层。Preferably, the number of arc-shaped metal layers 7 deposited by electroforming is determined by their central angles, and is N, preferably three in the present invention, which can form a ring-shaped metal layer.
作为优选,相邻圆弧状金属层7之间的接缝8的联接工艺可采用金属板联接工艺进行处理,如电阻焊、激光焊、气焊或钎焊。Preferably, the joining process of the seam 8 between adjacent arc-shaped metal layers 7 can be processed by metal plate joining process, such as resistance welding, laser welding, gas welding or brazing.
(6)将圆环形金属层9装配在一金属圆柱10上,保持圆环金属和中心处的金属圆柱10之间间隙均匀,如图10所示,将液态高分子材料11浇注填充在圆环形金属层9和金属圆柱10之间的间隙中,凝固后修整、制成圆柱模具。(6) Assemble the ring-shaped metal layer 9 on a metal cylinder 10 to keep the gap between the ring metal and the metal cylinder 10 at the center uniform. As shown in Figure 10, pour the liquid polymer material 11 into the circle In the gap between the annular metal layer 9 and the metal cylinder 10, after solidification, trim and make a cylindrical mold.
作为优选,所述的高分子材料11为具有一定弹性和粘性的高分子材料,如丙烯酸酯橡胶和环氧树脂胶。Preferably, the polymer material 11 is a polymer material with certain elasticity and viscosity, such as acrylate rubber and epoxy resin glue.
作为优选,所述的金属圆柱10为具有一定强度和耐腐蚀性的材料,如不锈钢。Preferably, the metal cylinder 10 is made of a material with certain strength and corrosion resistance, such as stainless steel.
Claims (9)
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CN110676195A (en) * | 2019-09-10 | 2020-01-10 | 博宇(天津)半导体材料有限公司 | Heater preparation mold and heater preparation method |
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