CN106413284A - Electronic component welding device and method - Google Patents
Electronic component welding device and method Download PDFInfo
- Publication number
- CN106413284A CN106413284A CN201610955398.3A CN201610955398A CN106413284A CN 106413284 A CN106413284 A CN 106413284A CN 201610955398 A CN201610955398 A CN 201610955398A CN 106413284 A CN106413284 A CN 106413284A
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- CN
- China
- Prior art keywords
- pad
- component body
- paste layer
- electronic component
- tin paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention discloses an electronic component welding device and method and belongs to the electronic product technical field. The electronic component welding device comprises a component body, a solder paste layer, pads and a circuit board; the pads are covered with the solder paste layer from above; the pads include a first pad, a second pad and a third pad which are all are fixed on the upper surface of the circuit board; the pads are welded and fixed to the component body through the solder paste layer; the first pad and the second pad are located at two ends of the bottom surface of the component body; and the third pad is located at the middle of the bottom surface of the component body. According to the electronic component welding device and method of the invention, the pads are arranged in a sectional manner, and therefore, the problem of the deviation or rotation of the component body when the component body is welded onto the circuit board can be solved, and the accuracy of welding points of the component body can be greatly enhanced.
Description
Technical field
The present embodiments relate to electronic technology field, more particularly, to a kind of electronic component welding device and method.
Background technology
, for the requirement more and more thinner of PCB (Printed Circuit Board wiring board), device is increasingly for mobile phone industry
Little, more and more intensive；This quality that SMT (Surface Mount Technology surface mounting technology) is welded and yield
Propose high requirement.
In prior art, the electronic component on printed circuit board (PCB) passes through on surface mount (SMT) technology and printed circuit board (PCB)
Pad be connected, generally using tin cream, electronic component is bonded on the pad of printed circuit board (PCB).
In realizing process of the present invention, inventor finds that in prior art, at least there are the following problems：Existing electronic component
Rectangle or square entire body formula pad during actual welding, because tin cream expanded by heating easily causes electronic component to revolve
Turn, off normal, even weldering etc. undesirable condition, cause the disappearance of electronic component function, have a strong impact on the lifting of SMT yield, thus shadow
Ring production capacity and the payment of product, the maintenance of produced defective products simultaneously also can waste substantial amounts of manpower, time and efforts.
Content of the invention
In order to overcome the shortcomings of Related product in prior art, the embodiment of the present invention proposes a kind of electronic component welding device
And method, solve the pad in existing electronic device and easily cause electronic component rotation, off normal in welding process, connect weldering
Shortcoming.
The embodiment of the present invention solves its technical problem and be employed technical scheme comprise that：
A kind of electronic component welding device that the embodiment of the present invention is provided, including：Component body, tin paste layer, pad with
And wiring board；It is coated with tin paste layer, described pad includes the first pad, the second pad, the 3rd pad, respectively above described pad
It is fixedly installed on above described wiring board；Described pad is welded and is fixed by tin paste layer and described component body, its
In, described first pad, the second pad are located at the two ends of described component body bottom surface, and described 3rd pad is located at described element originally
The centre of body bottom surface.
As the improvement further of the embodiment of the present invention, described first pad, the second pad, the 3rd pad are shape dough-making powder
The identical pad of long-pending size.
As the improvement further of the embodiment of the present invention, the spacing of described first pad and described 3rd pad and described the
Two pads are equal with the spacing of described 3rd pad.
A kind of welding method being applied to described electronic component welding device that the embodiment of the present invention is provided, including：?
Pad is fixedly installed above wiring board, and above described pad cover tin paste layer, described pad include the first pad, second
Pad and the 3rd pad；Described pad is welded and fixed by tin paste layer and component body, wherein, described first weldering
Disk, the second pad are located at the two ends of described component body bottom surface, and described 3rd pad is located at the centre of described component body bottom surface.
As the improvement further of the embodiment of the present invention, described first pad, the second pad, the 3rd pad are shape dough-making powder
The identical pad of long-pending size.
As the improvement further of the embodiment of the present invention, the spacing of described first pad and described 3rd pad and described the
Two pads are equal with the spacing of described 3rd pad.
Compared with prior art, the invention has the advantages that：
The embodiment of the present invention by subsection setup is carried out to described pad, can effectively avoid component body with circuit
The problem shifting during plate weld or rotating, greatly enhances the solder joint accuracy of component body.
Brief description
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, below by use required in embodiment
Accompanying drawing be briefly described it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability
For the those of ordinary skill of domain, on the premise of not paying creative work, can also be obtained other attached according to these accompanying drawings
Figure.
Fig. 1 is the structural representation of electronic component welding device described in the embodiment of the present invention；
Fig. 2 is the schematic flow sheet of electronic component soldering method described in the embodiment of the present invention.
Specific embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.In accompanying drawing
Give presently preferred embodiments of the present invention.But, the present invention can realize in many different forms however it is not limited to this paper institute
The embodiment of description.On the contrary, providing the purpose of these embodiments to be to make the understanding to the disclosure more thorough
Comprehensively.
Unless otherwise defined, all of technology used herein and scientific terminology and the technical field belonging to the present invention
The implication that technical staff is generally understood that is identical.The term being used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body is it is not intended that in limiting the present invention.
Embodiment one
Refering to the structural representation shown in Fig. 1, being electronic component welding device of the present invention, described electronic component welding
Device includes component body 1, pad 2 and wiring board 3, and Fig. 1 only illustrates the position relationship of above-mentioned all parts, does not represent reality
Shape.
Described element is local and wiring board 3 refers respectively to electronic component to be welded and printed substrate (PCB).
Described pad 2 is electrically connected with component body 1 and wiring board 3 respectively, and described pad 2 is used for wiring board 3 and unit
The intermediate medium that part body 1 is electrically connected with, the pad 2 described in the embodiment of the present invention is different from conventional entire body formula pad 2, in institute
It is classified as multiple assemblies independently, collective effect is in described component body 1 on the basis of the entire body formula pad 2 stated；Institute
State pad 2 and include the first pad 21, the second pad 22, the 3rd pad 23, described first pad 21, the second pad the 22, the 3rd weldering
Disk 23 is respectively fixedly disposed above described wiring board 3, above described first pad 21, the second pad 22, the 3rd pad 23
It is all covered with tin paste layer 4.
Described pad 2 passes through tin paste layer 4 and is welded and fixed with described component body 1, wherein, described first pad
21st, the second pad 22 is located at the two ends of described component body 1 bottom surface, and described 3rd pad 23 is located at described component body 1 bottom surface
Centre；Described first pad 21, the second pad 22, the area summation of the 3rd pad 23 are less than the bottom surface of described component body 1
Long-pending, while the function of neither affecting to be electrically connected with, can be cost-effective.
In embodiments of the present invention, described first pad 21, the second pad 22, the 3rd pad 23 are shape and size
Identical pad 2, and the spacing of described first pad 21 and described 3rd pad 23 and described second pad 22 with described
The spacing of the 3rd pad 23 is equal；In the other embodiment of the present invention, according to the size and shape of described component body 1,
The quantity of described pad 2, the adjustment of size, shape and being adapted to property of interval.
Described tin paste layer 4 is used for described pad 2 is glued together with described component body 1, the stannum used by described tin paste layer 4
Cream is the paste mixture being mixed to form by solder powder, scaling powder and other surfactant, thixotropic agent etc., is being subject to
Melt after heat, form solder joint between described pad 2 and described component body 1 after its alloying component cooled and solidified and realize welding
And it is fixing.
Described tin paste layer 4 expands after being heated, and the component body 1 of top can be produced with pulling force and tension force, and tin paste layer 4
Burn-off rate sometimes and uneven, may part fusing is fast and height that part fusing makes tin paste layer 4 expand slowly
Differ, cause the pulling force of the component body 1 to top and tension force uneven, so that rotating and inclined occurs in the welding of component body 1
Move；Pad 2 described in the embodiment of the present invention is not entire body formula but multistage separates setting, and described component body 1 is respectively described the
It is adhesively fixed in the presence of tin paste layer 4 on one pad 21, the second pad 22, the 3rd pad 23, even described first pad
21st, the uneven phenomenon of fusing in the tin paste layer 4 of one or more of the second pad 22, the 3rd pad 23 top, at interval
In the case of bonding, when the arbitrary pad adhesion in described pad 2 is accurate, the skew on the whole of component body 1 can be avoided
Or rotation；And the shape of described first pad 21, the second pad 22, the 3rd pad 23 is identical with size, described
One pad 21 is equal with the spacing of described 3rd pad 23 with the spacing of described 3rd pad 23 and described second pad 22, permissible
Make component body 1 in the stress equalization of tin paste layer 4, the very big solder joint accuracy enhancing component body 1, the error of its welding
Can control within 0.05mm.
In embodiments of the present invention, by subsection setup is carried out to described pad 2, component body 1 can effectively be avoided
The problem shifting or rotating when welding with wiring board 3, greatly enhances the solder joint accuracy of component body 1.
Embodiment two
Refering to the schematic flow sheet of the welding method shown in Fig. 2, being electronic component welding device of the present invention, described side
Method comprises the steps：
S101：Pad is fixedly installed above assist side, and covers tin paste layer, described pad bag above described pad
Include the first pad, the second pad and the 3rd pad.
In the embodiment of the present invention, described pad is different from conventional entire body formula pad, in described entire body formula pad
On the basis of be classified as independently multiple assemblies, collective effect is in described component body；Described pad include the first pad,
Second pad, the 3rd pad, described first pad, the second pad, the 3rd pad are respectively fixedly disposed at the upper of described wiring board
Face, is all covered with tin paste layer above described first pad, the second pad, the 3rd pad.
S102：Described pad is welded and fixed by tin paste layer and component body, wherein, described first pad,
Second pad is located at the two ends of described component body bottom surface, and described 3rd pad is located at the centre of described component body bottom surface.
In embodiments of the present invention, described element is local and wiring board refers respectively to electronic component to be welded and track
Road plate；Described pad is electrically connected with component body and wiring board respectively, and described pad is used for wiring board and component body electricity
Property connect intermediate medium.
Described pad is welded and is fixed by tin paste layer and described component body, wherein, described first pad, second
Pad is located at the two ends of described component body bottom surface, and described 3rd pad is located at the centre of described component body bottom surface；Described
One pad, the second pad, the area summation of the 3rd pad are less than the floor space of described component body, are neither affecting to be electrically connected with
Function while, can be cost-effective.
In embodiments of the present invention, described first pad, the second pad, the 3rd pad are shape and the complete phase of size
Same pad, and the spacing of the spacing of described first pad and described 3rd pad and described second pad and described 3rd pad
Equal；In the other embodiment of the present invention, according to the size and shape of described component body, the quantity of described pad, big
Little, shape and the adjustment of being adapted to property of interval.
Described tin paste layer is used for described pad is glued together with described component body, and the tin cream used by described tin paste layer is
The paste mixture being mixed to form by solder powder, scaling powder and other surfactant, thixotropic agent etc., after being heated
Fusing, and form solder joint after its alloying component cooled and solidified between described pad and described component body and realize welding and solid
Fixed.
Described tin paste layer expands after being heated, and can produce pulling force and tension force to the component body of top, and tin paste layer is molten
Change speed sometimes and uneven, may part fusing is fast and height that part fusing makes tin paste layer expand slowly not
One, cause the pulling force of the component body to top and tension force uneven, so that the welding of component body rotation and offsets；This
Pad described in inventive embodiments be not entire body formula but multistage separate setting, described component body respectively described first pad,
Be adhesively fixed in the presence of tin paste layer on second pad, the 3rd pad, even described first pad, the second pad, the 3rd
The uneven phenomenon of fusing in the tin paste layer of one or more of pad top, in the case of the bonding of interval, described pad
In the adhesion of arbitrary pad accurate when, skew on the whole or the rotation of component body can be avoided；And described first pad,
Two pads, the 3rd pad shape identical with size, the spacing of described first pad and described 3rd pad and institute
State the second pad equal with the spacing of described 3rd pad, component body can be made in the stress equalization of tin paste layer, very big increase
The strong solder joint accuracy of component body, the error of its welding can control within 0.05mm.
In embodiments of the present invention, described electronic component soldering method passes through pad to be fixedly installed above assist side,
And cover tin paste layer above described pad, described pad is welded and fixed by tin paste layer and component body, is passed through
Subsection setup is carried out to described pad, can effectively avoid the component body to shift when with circuit plate weld or rotate
Problem, greatly enhances the solder joint accuracy of component body.
It will be appreciated by those skilled in the art that all or part of step realized in above-described embodiment method can be by
Program to complete come the hardware to instruct correlation, and this program storage, in a storage medium, includes some instructions use so that one
Individual equipment (can be single-chip microcomputer, chip etc.) or processor (processor) execute each embodiment methods described of the application
All or part of step.And aforesaid storage medium includes：USB flash disk, portable hard drive, read only memory (ROM, Read-Only
Memory), random access memory (RAM, Random Access Memory), magnetic disc or CD etc. are various can store journey
The medium of sequence code.
Above-described embodiment is the present invention preferably embodiment, but embodiments of the present invention are not subject to above-described embodiment
Limit, other any spirit without departing from the present invention and the change made under principle, modification, replacement, combine, simplify,
All should be equivalent substitute mode, be included within protection scope of the present invention.
Claims (6)
1. a kind of electronic component welding device is it is characterised in that include：
Component body, tin paste layer, pad and wiring board；
It is coated with tin paste layer, described pad includes the first pad, the second pad, the 3rd pad, fixes respectively above described pad
It is arranged on above described wiring board；
Described pad is welded and is fixed by tin paste layer and described component body, wherein, described first pad, the second pad
Positioned at the two ends of described component body bottom surface, described 3rd pad is located at the centre of described component body bottom surface.
2. electronic component welding device according to claim 1 it is characterised in that：Described first pad, the second pad,
Three pads are shape and the identical pad of size.
3. electronic component welding device according to claim 1 it is characterised in that：Described first pad and described 3rd weldering
The spacing of disk and described second pad are equal with the spacing of described 3rd pad.
4. a kind of welding method being applied to described electronic component welding device is it is characterised in that include：
Pad is fixedly installed above assist side, and covers tin paste layer above described pad, described pad includes the first weldering
Disk, the second pad and the 3rd pad；
Described pad is welded and fixed by tin paste layer and component body, wherein, described first pad, the second pad position
In the two ends of described component body bottom surface, described 3rd pad is located at the centre of described component body bottom surface.
5. welding method according to claim 4 it is characterised in that：Described first pad, the second pad, the 3rd pad are
Shape and the identical pad of size.
6. welding method according to claim 4 it is characterised in that：Described first pad and the spacing of described 3rd pad
Equal with the spacing of described 3rd pad with described second pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610955398.3A CN106413284A (en) | 2016-11-03 | 2016-11-03 | Electronic component welding device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610955398.3A CN106413284A (en) | 2016-11-03 | 2016-11-03 | Electronic component welding device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106413284A true CN106413284A (en) | 2017-02-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610955398.3A Pending CN106413284A (en) | 2016-11-03 | 2016-11-03 | Electronic component welding device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106413284A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022061770A1 (en) * | 2020-09-25 | 2022-03-31 | 京东方科技集团股份有限公司 | Flexible circuit board, light bar, backlight module, and liquid crystal display device |
-
2016
- 2016-11-03 CN CN201610955398.3A patent/CN106413284A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022061770A1 (en) * | 2020-09-25 | 2022-03-31 | 京东方科技集团股份有限公司 | Flexible circuit board, light bar, backlight module, and liquid crystal display device |
| CN114631052A (en) * | 2020-09-25 | 2022-06-14 | 京东方科技集团股份有限公司 | A flexible circuit board, light bar, backlight module and liquid crystal display device |
| CN114631052B (en) * | 2020-09-25 | 2023-10-20 | 京东方科技集团股份有限公司 | Flexible circuit board, lamp strip, backlight module and liquid crystal display device |
| US11899307B2 (en) | 2020-09-25 | 2024-02-13 | Boe Optical Science And Technology Co., Ltd. | Flexible printed circuit, light bar, backlight module and liquid crystal display device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170215 |