CN106413248A - Treated copper foil for low dielectric resin substrate and copper-clad laminate and printed writing board using the same - Google Patents
Treated copper foil for low dielectric resin substrate and copper-clad laminate and printed writing board using the same Download PDFInfo
- Publication number
- CN106413248A CN106413248A CN201610258241.5A CN201610258241A CN106413248A CN 106413248 A CN106413248 A CN 106413248A CN 201610258241 A CN201610258241 A CN 201610258241A CN 106413248 A CN106413248 A CN 106413248A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- treatment layer
- base material
- copper
- resin base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a treated copper foil for a low dielectric resin substrate and a copper-clad laminate and a printed writing board using the same. The treated copper foil has higher peel strength than a low dielectric resin substrate and is excellent in transfer characteristic. At least one side of an un-treated foil is provided with a roughened layer, and the roughened layer is provided with an antioxidant treatment layer. The dielectric loss angle tangent of a low dielectric resin at a frequency no less than 1 GHz is no more than 0.005. The roughened layer comprises copper particles with the particle size of 300-600 nm, the antioxidant treatment layer includes molybdenum and cobalt, the ten point mean roughness Rz of a treated surface bonding to a resin substrate is 0.6-2.0 mum, and the chromatic aberration [delta]E*ab of the untreated copper foil and the treated surface is 35-55.
Description
Technical field
The present invention relates to a kind of also possess high peel strength and transmission with respect to low-k resin base material
The process Copper Foil of excellent.
Background technology
Printing distributing board for information communication device etc. is formed with resin base material and has joining of electric conductivity
Line pattern.As this resin base material, can enumerate：On the reinforcing material such as glass cloth or paper, impregnation has absolutely
The rigidity of the phenolic resin of edge or epoxy resin, polyphenylene oxide resin, bismaleimide-triazine resin etc.
The flexible printing distribution that printing distributing board is used, is made up of polyimide resin or cyclic olefin polymerization resin etc.
Plate is used.
On the other hand, as the material of the Wiring pattern with electric conductivity, Copper Foil is usually used.
This printing distributing board can make as follows：By carrying out to resin base material and Copper Foil heating, pressurize and
After making copper clad laminate, pass through for forming Wiring pattern to etch to remove the unnecessary portion of Copper Foil.
Copper Foil is roughly divided into electrolytic copper foil and rolled copper foil both according to its preparation method, according to respective spy
Levy and distinguish according to purposes and use.Additionally, any Copper Foil nearly all can not directly use, using being roughened
Based on process layer, the Copper Foil being provided with the various process layers such as resistance to thermal treatment layer, antirust treatment layer (will set below
The Copper Foil having various process layers is referred to as " process Copper Foil ").
Nearest information communication device because of the expansion etc. of multifunction or networking, to communicate for information
Signal high speed, high frequency, the demand of printing distributing board that can be corresponding with high speed, high frequency drastically increases
Plus.
But, reply high speed, the printing distributing board of high frequency, except printing distributing board so far is wanted
Outside the characteristic asked, also require " transmission characteristic " with loss as representative.
Loss represents the degree that the electric current of flowing in printing distributing board waits according to distance and decays, and leads to
The trend often having loss to uprise with frequency and increasing.So-called loss refers to greatly rated current only
Some transmits to load-side, therefore, in order to have no problem in practical using it is necessary to lower
Suppression loss.
The loss of printing distributing board is the damage that dielectric loss is added (summing) with conductor losses
Consumption.Dielectric loss is derived from resin base material, owing to dielectric constant and dielectric loss angle tangent.The opposing party
Face, conductor losses is Copper Foil from electric conductor, owing to conductor resistance.Therefore, loss to be reduced,
The dielectric constant of reduction resin base material or dielectric loss angle tangent are from needless to say in addition it is also necessary to reduce leading of Copper Foil
Bulk resistor.
As described above, loss has the trend that the frequency with electric current raises and increases, this is because
Conductor losses is that conductor resistance uprises, and " Kelvin effect " and " processing the surface configuration of Copper Foil " has relation.
Kelvin effect refers to that the electric current of flowing in electric conductor improves with frequency and flows through the surface of electric conductor
Neighbouring effect.And, it is defined as until become 1/e times of electric current with respect to the electric current on electric conductor surface
The distance of point skin depth δ with formula (1) represent.
δ=(2/ (ω σ μ))1/2(formula 1)
ω is angular frequency, and σ is conductance, and μ is magnetic conductivity.
In a case of copper, according to its conductance and relative permeability, formula (1) becomes as follows.
δ=0.066/f1/2(formula 2)
F is frequency.
Understood according to formula (2), electric current uprises with frequency and the position stream on the surface closer to electric conductor
Dynamic, for example, frequency is that skin depth during 10MHz is about 20 μm, and in contrast, frequency is 40GHz
When skin depth be about 1 μm, almost only in surface flow.
Therefore, it is being provided with roughening in order to improve as prior art with the adaptation of resin base material
In the case of flowing through high frequency electric in the process Copper Foil of reason layer, electric current is along the surface configuration of roughening treatment layer
Flowing, compared with mainly always in the situation of central part flowing, its propagation distance increases, it is taken as that leading
Bulk resistor increases, thus leading to the increase of loss.
Accordingly, as the process Copper Foil of reply high speed, the printing distributing board of high frequency transmission, needs will be led
Bulk resistor be suppressed to relatively low, it is therefore contemplated that preferably reduce constitute roughening treatment layer roughening particle particle diameter,
To reduce surface roughness.
In addition, in resin base material, in order to suppress dielectric loss, it is also preferred that reduce making loss increase
The high functional group of big polarity.
Be commonly referred to as low-k resin base material resin base material comprise liquid crystal polymer, polyvinyl fluoride,
Isocyanate compound etc., makes the high functional group of polarity reduce or disappear.
If being only conceived to transmission characteristic, the untreated Copper Foil not possessing roughening treatment layer is due to surface roughness
Little, so the propagation distance of electric current can be shortened, as a result, it is possible to reduce resistance, result, it is believed that making
The most excellent for conductor, but in the case of being conceived to the adaptation of Copper Foil and resin base material, do not possess roughening
The untreated Copper Foil of process layer is little due to anchor effect, weak with the closing force of resin base material, so can not be true
Protect peel strength it is difficult to be used for printing distributing board.
Particularly low-k resin base material reduced due to the high functional group of the polarity that contributes to adaptation or
Person disappears it is impossible to expect the closing force that chemical bonding brings, so needing by consolidating that roughening particle produces
Effect to guarantee closing force.And, it is high peel strength to obtain high closing force, need to increase
This roughening particle footpath big.
If arranging roughening treatment layer on untreated Copper Foil, make the roughening of composition roughening treatment layer further
The adhesion amount of particle increases or increases particle diameter, then anchor effect improves, therefore, it is possible to improve stripping
Intensity, if but as described above, being provided with roughening treatment layer, the propagation distance of electric current is elongated, conductor
Resistance increases, and loss increases.
So, in the case of reply high speed, the printing distributing board of high-frequency signal, following two can be produced difficult
Inference：If in order to suppress the loss of resin base material to reduce the high functional group of polarity, cannot
With the high adhesion processing Copper Foil；If increased to improve resin base material and process the adaptation of Copper Foil
The particle diameter of roughening particle, then make loss increase because of Kelvin effect.
But, the printing distributing board corresponding with high speed, high frequency transmission needs to meet these institutes in practical
Even there is something special it is desirable to the few low-k resin base material of the high functional group of exploitation polarity it is also possible to
Obtain sufficient peel strength, and become the process Copper Foil of the printing distributing board that can suppress loss.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2013-155415 publication；
Patent document 2：International publication number WO2003/102277.
Content of the invention
There is a kind of cementability in order to improve the insulating resin transmitting with reply high frequency disclosed in patent document 1
And it is provided with the process Copper Foil of roughening treatment layer and resistance to thermal treatment layer.
The disclosed Copper Foil that processes of patent document 1 guarantees by increasing the particle constituting roughening treatment layer to peel off
Intensity.
But, when roughening particle is larger, current spread distance will be elongated, therefore there is loss
Increased problem.
In addition, it is further because of resistance to thermal treatment layer, antirust treatment layer and silane coupling agent layer in loss
Increase, in the case that particularly resistance to thermal treatment layer contains Ni, skin depth shoals, therefore so that electric current
The surface portion concentrating on Copper Foil flows it is easier to be subject to processing the concavo-convex impact of layer surface, there is transmission
The problem that further increase is lost.
There is a kind of process Copper Foil, its resin base in order to improve reply high frequency transmission disclosed in patent document 2
The cementability of material, is provided with roughening treatment layer and the antirust treatment layer containing zinc and nickel, on antirust treatment layer
It is provided with chromate coating, silane coupler adsorption layer is provided with chromate coating, wherein, by by process face
Surface roughness modulation suppress loss in certain scope.
But, because the roughening particle of roughening treatment layer is larger, so current spread, apart from elongated, exists
The problem that loss increases.
Further, since antirust treatment layer contains Ni, so skin depth shoals, current convergence is in Copper Foil
Surface portion flows, and there is a problem of that loss increases further.
The present inventor etc., to solve described problems point as technical task, are repeated tentative mistake
Multiple studies, tests, and result obtains the opinion attracting people's attention it is achieved that described technical task, and this is seen
Xie Wei：Formed by the copper particle of particle diameter 300～600nm if roughening treatment layer, anti-oxidant treatment layer
Containing molybdenum and cobalt, 10 points of mean roughness Rz of the process face bonding with low-k resin base material are
0.6～2.0 μm, and the aberration Δ E*ab of untreated Copper Foil and process face is 35～55 process Copper Foil,
Then in the case of being provided with roughening treatment layer, also it is to send with the loss of degree with untreated Copper Foil
The conductor of excellent, meanwhile, also can obtain high stripping with respect to low-k resin base material strong
Degree.
Described technical task is as follows, can be solved by the present invention.
The present invention provides a kind of low-k resin base material with processing Copper Foil, in untreated Copper Foil at least
Simultaneously possess roughening treatment layer, anti-oxidant treatment layer, described low dielectric are possessed on described roughening treatment layer
The dielectric loss angle tangent of the 1GHz frequencies above of constant resin is less than 0.005, wherein, described thick
Change process layer formed by the copper particle that particle diameter is 300～600nm, described anti-oxidant treatment layer contain molybdenum and
Cobalt, 10 points of mean roughness Rz of the process face bonding with resin base material are 0.6～2.0 μm, and described
The aberration Δ E*ab of untreated Copper Foil and described process face is 35～55 (first aspects).
In addition, the low-k resin base material of the present invention is with processing Copper Foil on the basis of first aspect,
The layer (second aspect) of more than one following a, b is possessed on described anti-oxidant treatment layer：
A. chromate coating
B. silane coupling agent layer.
In addition, the present invention provides a kind of copper clad laminate, by the process Copper Foil described in first or second aspect
The dielectric loss angle tangent fitting in 1GHz frequencies above is less than 0.005 low-k resin base
(third aspect) is formed on material.
In addition, the copper clad laminate of the present invention is on the basis of the third aspect, and containing liquid crystal polymer
The dielectric loss angle tangent of 1GHz frequencies above is the stripping of less than 0.005 low-k resin base material
It is more than 0.6kN/m (fourth aspect) from intensity.
In addition, the present invention provides a kind of processing method processing Copper Foil, for first or second aspect institute
The process Copper Foil stated is processed it is characterised in that adding starch analyte (the 5th side in the electrolytic solution
Face).
In addition, the present invention provides a kind of manufacture method of copper clad laminate, for manufacturing the 3rd or four directions
Copper clad laminate described in face is it is characterised in that damage to the dielectric processing Copper Foil and 1GHz frequencies above
The low-k resin base material that consumption angle is just being cut to less than 0.005 heats and makes it fit (the while pressurizeing
Six aspects).
In addition, the present invention provides a kind of printing distributing board, using the copper clad layers described in the 3rd or fourth aspect
Pressing plate forms (the 7th aspect).
In addition, the present invention provides a kind of manufacture method of printing distributing board, for manufacturing described in the 7th aspect
Printing distributing board (eighth aspect).
In this manual, sometimes the roughening treatment layer in the present invention is specially called resin induction and is impregnated with layer.
In the process Copper Foil of the present invention, constitute the roughening particle of roughening treatment layer (resin induction is impregnated with layer)
For the copper particle of particle diameter 300～600nm, 10 points of mean roughness of the process face bonding with resin base material
Rz is 0.6～2.0 μm, and the aberration Δ E*ab of described untreated Copper Foil and described process face is 35～55,
Therefore, carrying out with resin base material heating, press molding when, this resin is equably impregnated into roughening particle
Between, process copper foil surface and resin large area solid bonding, even if the polarity contributing to peel strength is high
The few low-k resin base material of functional group it is also possible to realize strong peel strength.
Particularly, the dielectric loss angle tangent for the 1GHz frequencies above containing liquid crystal polymer is
Less than 0.005 low-k resin base material, can obtain the peel strength of more than 0.6kN/m.
In addition, 10 points of the process face bonding with low-k resin base material of process Copper Foil of the present invention
Mean roughness Rz is 0.6～2.0 μm, and anti-oxidant treatment layer contains molybdenum and cobalt, and nickeliferous etc. does not make biography
The metal that defeated loss rises, therefore, the process Copper Foil of the present invention that fits on low-k resin base material
Copper clad laminate, even if for example be high frequency it is also possible to by loss suppression and be not provided with
The copper clad laminate equal extent of the untreated Copper Foil laminating of roughening treatment layer.
Particularly, the dielectric loss angle tangent fitting in the 1GHz frequencies above containing liquid crystal polymer is
Copper clad laminate on less than 0.005 low-k resin base material is under the high frequency of frequency 40GHz
Loss is more than -5.5dB/100mm, compared with untreated Copper Foil, can be by possessing resin induction
It is impregnated with layer and loss is suppressed to less than 5%.
Brief description
Fig. 1 is the schematic diagram in the process Copper Foil section of the present invention；
Fig. 2 is the electron scanning micrograph of 15,000 times of the process Copper Foil section of the present invention.
Wherein, description of reference numerals is as follows：
1 Copper Foil；
2 resin inductions are impregnated with layer；
3 anti-oxidant treatment layers.
Specific embodiment
＜ untreated Copper Foil ＞
The Copper Foil (hereinafter referred to as " untreated Copper Foil ") of each before processing that the present invention uses especially does not limit
Fixed, it is possible to use do not have in table point Copper Foil, have in table point Copper Foil any one.
The one side (hereinafter referred to as " process face ") implementing surface treatment is not particularly limited, rolled copper foil
Much less can be arbitrary face, can also be any one in precipitation face or glassy surface in electrolytic copper foil
Face.
Additionally, when using rolled copper foil, preferably impregnated in hydrocarbon organic solvent, remove rolling oil it
After carry out roughening treatment.
The thickness of untreated Copper Foil is not particularly limited, as long as can be used for printed wiring after surface treatment
The thickness of plate, but preferably 6～300 μm, more preferably 9～70 μm.
In addition, the face implementing surface treatment of untreated Copper Foil is preferably measuring defined in JIS Z8781
During color specification system L*a*b*, it is the scope of L*83～88, a*14～17, b*15～19.
The induction of ＜ resin is impregnated with layer (roughening treatment layer) ＞
The particle diameter constituting the copper particle that resin induction is impregnated with layer is preferably 300～600nm, more preferably
380～530nm.
In the present invention, lower limit is set to 300nm, but is not excluded for the particle containing below 300nm.
But, when more less than the particle of 300nm, the situation on fitting in low-k resin base material
Down it is possible to the sufficient peel strength of flexible printed wiring board cannot be can be used in, in addition, when super
When crossing 600nm, surface roughness increases, and loss increases, and therefore, these situations are not preferred.
In addition, the scope being preferably spaced 350～450nm of the protuberance of copper particle.
The thickness that resin induction is impregnated with layer is preferably 370～810nm, more preferably 500～680nm.
When thickness is less than 370nm it is possible to cannot get sufficient peel strength, when more than 810nm
When, loss increases, and these situations are not preferred.
Particle diameter, the interval of the protuberance of copper particle and thickness that resin induction is impregnated with layer for example can be by with sweeping
Retouch electron microscope etc. be amplified under 40 ° of angle of inclination 10,000～30,000 times of multiplying power carry out observing,
Measure and be measured.
Resin induction be impregnated with layer formation in, in preferably cupric sulfate pentahydrate 50～150g/L sulfuric acid be 90～
The electrolyte of 110g/L.
When the concentration of cupric sulfate pentahydrate is below 50g/L, the particle diameter in the copper particle footpath particle less than 300nm
Increase, in addition, when the concentration of cupric sulfate pentahydrate is more than 150g/L, then roughening particle can not be formed,
So it is all preferred.
Various additives can be added in above-mentioned electrolyte.
As the additive that can be properly added, starch analyte and metal sulfate, metal oxygen can be enumerated
Compound.
In above-mentioned electrolyte add starch analyte be not particularly limited, can be completely decompose, part
Any one decomposed.
Mean molecule quantity is preferably 100～100,000, more preferably 100～10,000.
Sulfate as metal or oxide, can enumerate indium sulfate, vanadic anhydride, germanium dioxide etc..
Preferably the insoluble electrode such as immersion platinum group oxide cladding titanium as anode and immerses not in the electrolytic solution
Process Copper Foil as negative electrode, according to current density 10～50A/dm2, electricity 80～100C/dm2, liquid
The electrolytic condition of 35～45 DEG C of temperature is electrolysed, and forms resin induction and is impregnated with layer.
If current density is 10A/dm2And electricity is less than 80C/dm2, then copper particle can not be fully attached
, in addition, if current density is 50A/dm2And electricity is higher than 100C/dm2, then particle diameter exceed
The ratio of the copper particle of 600nm increases, thus not preferred.
＜ anti-oxidant treatment layer ＞
The process Copper Foil of the present invention is impregnated with layer in resin induction and possesses anti-oxidant treatment layer.
The adhesion amount of anti-oxidant treatment layer is preferably 30～300mg/m2, more preferably 50～120mg/m2.
The adhesion amount of anti-oxidant treatment layer is 30mg/m2It is impossible to complete coated with resin induction is impregnated with when following
Layer, in addition, the adhesion amount of anti-oxidant treatment layer is 300mg/m2When above, loss is possible to increase
Plus, in addition, because even comparing 300mg/m2Many above, nor the raising of expectation antioxygenic property.
In addition, contained cobalt in anti-oxidant treatment layer is preferably 20～155mg/m2, molybdenum be preferably 10～
145mg/m2.
Be unsatisfactory for lower limit each concentration when, antioxygenic property is insufficient, in addition, exceeding each of higher limit
During concentration, loss is likely to increase.
The electrolyte forming anti-oxidant treatment layer is preferably in cobalt compound 10～100g/L aqueous solution
The aqueous solution of the molybdate compound containing 1～80g/L is modulated to the electrolyte of pH4～10.
As cobalt compound, for example, can enumerate cobalt sulfate.
As molybdate compound, for example, can enumerate Sodium Molybdate Dihydrate.
The insoluble electrode such as immersion platinum group oxide cladding titanium as anode and immerses formation tree in the electrolytic solution
Fat induction is impregnated with the Copper Foil of layer as negative electrode, according to current density 0.1～10A/dm2, electricity 5～20C
/dm2, the condition of 20～50 DEG C of liquid temperature be electrolysed, anti-oxidant treatment layer can be formed.
＜ chromate coating and silane coupling agent layer ＞
The present invention processes Copper Foil and can arrange more than one layer be selected from as needed on anti-oxidant treatment layer
Layer in chromate coating and silane coupling agent layer.
The electrolyte forming chromate coating preferably will contain the modulation of chromic acid compound 10～100g/L aqueous solution
Electrolyte for pH2～12.
As the compound containing chromic acid, for example, can enumerate sodium dichromate dihydrate.
Chromate coating can be formed：The insoluble electricity such as immersion platinum group oxide cladding titanium in the electrolytic solution
The Copper Foil forming anti-oxidant treatment layer as anode and is immersed as negative electrode in pole, according to 20～50 DEG C of liquid temperature,
Current density 0.1～10A/dm2, electricity 0.5～20C/dm2Condition be electrolysed.
Additionally, chromate coating can also contain zinc.
Silane coupling agent layer can be set on chromate coating or on anti-oxidant treatment layer.
Silane coupler for silane coupling agent layer is not particularly limited, it is possible to use containing vinyl,
Epoxy radicals, styryl, methacrylic, acrylic, amino, urea groups and sulfydryl silane coupled
Agent, but the resistance to hygroscopicity of the silane coupler containing amino, epoxy radicals or vinyl and the effect of rust-preventing characteristic
Very high, can more preferably use.
Silane coupler can be a kind of it is also possible to combine two or more use.
Can be afterwards and with spraying in impregnated in the silane coupler aqueous solution being modulated to 20～50 DEG C of liquid temperature
Formed by washing after spreading etc. method.
＜ resin base material ＞
The low-k resin base material of the laminating process Copper Foil of the present invention is to make to contribute to Copper Foil and resin base
The resin base material that the big functional group of the polarity of the bonding of material reduces or disappears, under the frequency of more than 1GHz,
Dielectric loss angle tangent is less than 0.005.
As low-k resin base material, liquid crystal polymer, polyvinyl fluoride, isocyanide can be contained with example
Ester compound, the resin of Noryl.
Mensure ＞ of ＜ aberration Δ E*ab
Can be in the face of the before processing determining untreated Copper Foil and the JIS Z8781 processing Copper Foil process face
Defined in color specification system L*a*b* after, by ([Δ L*]2+[Δa*]2+[Δb*]2)1/2Shown formula calculates
Aberration Δ E*ab.
Embodiment
Embodiments of the invention described below, but the invention is not restricted to this.
＜ untreated Copper Foil ＞
As the untreated Copper Foil of embodiment and comparative example, using rolled copper foil or the electrolysis of 12 μm of thickness
Copper Foil.
Additionally, rolled copper foil is carried out everywhere after impregnating 60 seconds in hydrocarbon organic solvent and removing rolling oil
Reason.
(embodiment 1～6)
The induction of ＜ resin is impregnated with the formation ＞ of layer
The electrolyte that adjustment table 1 is recorded.Anode is using the titanium being coated to surface by platinum group oxide, negative electrode
Using untreated Copper Foil, two electrodes be impregnated in each electrolyte, entered with each electrolytic condition that table 1 is recorded
Row electrolysis, forms resin induction in the one side of each untreated Copper Foil respectively and is impregnated with layer.
Additionally, as starch analyte, the mixture of the analyte the use of molecular weight being 100～10,000.
＜ contains the anti-oxidant treatment layer ＞ of cobalt-molybdenum
Containing cobalt sulfate 38g/L, Sodium Molybdate Dihydrate 23g/L, citrate trisodium dihydrate 45g/L,
In the pH5.6 of sodium sulphate 80g/L, the aqueous solution of 30 DEG C of liquid temperature, use by platinum group oxide as anode
It has been coated to the titanium on surface, has used as negative electrode and possess the process Copper Foil that resin induction is impregnated with layer, for two electricity
Pole is with current density 7.0A/dm2, electricity 14C/dm2Electrolytic condition be impregnated with layer setting in resin induction
Anti-oxidant treatment layer containing cobalt-molybdenum.
＜ chromate coating ＞
The sodium dichromate dihydrate 40g/L aqueous solution NaOH of 30 DEG C of liquid temperature is being modulated to
In the chromate aqueous solution of pH12.0, use, as anode, the titanium being coated to surface by platinum group oxide, and
And use as negative electrode and to possess resin induction and be impregnated with layer and the process Copper Foil of the anti-oxidant treatment layer containing cobalt-molybdenum,
For two electrodes with current density 2.0A/dm2, electricity 10C/dm2Electrolytic condition in the antioxygen containing cobalt-molybdenum
Change and chromate coating is arranged on process layer.
＜ silane coupling agent layer ＞
The Copper Foil that processes that will be provided with treated layers contains gamma-aminopropyl-triethoxy-silane in 30 DEG C of liquid temperature
Impregnate 10 seconds in the aqueous solution of 5ml/L, silane coupling agent layer is formed on chromate coating.
After forming silane coupling agent layer, spontaneously dry at about 25 DEG C of temperature, make the place of each embodiment
Reason Copper Foil.
Table 1
(comparative example 1)
In addition to being not provided with resin induction and being impregnated with layer, make according to condition same as Example 1.
(comparative example 2)
The immersion of untreated Copper Foil is comprised cupric sulfate pentahydrate 47g/L, in the electrolyte of sulfuric acid 100g/L, with
Current density 50A/dm2, electricity 130C/dm2, the electrolytic condition of 30 DEG C of liquid temperature be electrolysed, formed micro-
After particulate sublayer, immersion comprises cupric sulfate pentahydrate 200g/L, in the electrolyte of sulfuric acid 100g/L, with electricity
Current density 5A/dm2, electricity 400C/dm2, the electrolytic condition of 40 DEG C of liquid temperature be electrolysed, be consequently formed
Resin induction is impregnated with layer, in addition, makes according to condition same as Example 1.
(comparative example 3)
The electrolyte sulphur of cupric sulfate pentahydrate 55g/L, diethylene triamine pentacetic acid (DTPA) five sodium 100g/L will be comprised
After acid is modulated to pH4.5, immerse untreated Copper Foil, with current density 1.4A/dm2, electricity 85C/dm2、
The electrolytic condition that 32 DEG C of liquid temperature is electrolysed, formed resin induction be impregnated with layer, in addition, according to reality
Apply example 1 identical condition to make.
(comparative example 4)
Comprising cupric sulfate pentahydrate 45g/L, sulfuric acid 80g/L, titanyl sulfate 2g/L, sodium tungstate dihydrate
Untreated Copper Foil is immersed, with current density 10A/dm in the electrolyte of 0.045g/L2, electricity 50C/dm2、
The electrolytic condition that 35 DEG C of liquid temperature is electrolysed, and after forming microfine sublayer, immersion contains cupric sulfate pentahydrate
In 200g/L, the electrolyte of sulfuric acid 100g/L, with current density 10A/dm2, electricity 250C/dm2, liquid
The electrolytic condition of 40 DEG C of temperature forms resin induction and is impregnated with layer, in addition, according to same as Example 1
Condition makes.
(comparative example 5)
Will containing cupric sulfate pentahydrate 61g/L, cobalt sulfate 29g/L, nickel sulfate hexahydrate compound 49g/L,
After the electrolyte sulfuric acid of sodium sulphate 80g/L is modulated to pH2.5, immerse untreated Copper Foil, close with electric current
Degree 5A/dm2, electricity 45C/dm2, the electrolytic condition of 30 DEG C of liquid temperature be electrolysed, formed resin induction leaching
Permeable layers, in addition, make according to condition similarly to Example 1.
(comparative example 6)
Immerse untreated Copper Foil in the electrolyte of comparative example 5, with current density 5A/dm2, electricity
105C/dm2, the electrolytic condition of 30 DEG C of liquid temperature be electrolysed, formed resin induction be impregnated with layer, in addition,
Make according to condition same as Example 1.
(comparative example 7)
Will be containing nickel sulfate hexahydrate compound 30g/L, sodium hypophosphite monohydrate 2.0g/L, sodium acetate three water
After the electrolyte sulfuric acid of compound 10g/L is modulated to pH4.5, with current density 5.0A/dm2, electricity
10C/dm2, the electrolytic condition of 30 DEG C of liquid temperature be electrolysed, formed anti-oxidant treatment layer, in addition,
Make according to condition same as Example 1.
(comparative example 8)
Electrolyte sulfuric acid containing nickel sulfate hexahydrate compound 55g/L, cobalt sulfate 22g/L is modulated
For pH3.0, make electrolyte, with current density 5.0A/dm2, electricity 10C/dm2, 40 DEG C of liquid temperature
Electrolytic condition is electrolysed, and forms anti-oxidant treatment layer, in addition, according to same as Example 1
Condition makes.
(comparative example 9)
The Copper Foil that processes of comparative example 3 is fitted with the polyimide resin of non-low-k.
(reference example 1～6)
The Copper Foil that processes of embodiment 1～6 is fitted with the polyimide resin of non-low-k.
＜ copper clad laminate A ＞
Using each process face of embodiment 1～6 and each process Copper Foil of comparative example 1～8 as glued face,
Dielectric loss angle tangent with the 25GHz based on three plate line resonator is 0.002 liquid crystal polymer tree
Aliphatic radical material (Kuraray Co., Ltd. (Kuraray Co., Ltd.) system, the name of an article：50 μm of CT-Z, thickness)
After being combined, using vacuum hotpressing machine (Kitagawaseiki Co., Ltd. (Kitagawa Seiki Co., Ltd.)
KVHC-II processed) at vacuum (7torr), 260 DEG C of temperature preheat 15 minutes, afterwards vacuum (7torr),
Carry out heating, the extrusion forming of 10 minutes under 300 DEG C of temperature, pressure 4MPa, obtain copper clad laminate
A.
Copper clad laminate A is used for the mensure of peel strength.
＜ copper clad laminate B ＞
By each process face of embodiment 1～6 and each process Copper Foil of comparative example 1～8 and liquid crystal polymer tree
Aliphatic radical material (Kuraray Co., Ltd.'s system, the name of an article：50 μm of CT-Z, thickness) it is combined, make ground connection
After being combined with above-mentioned each another side processing Copper Foil with Copper Foil (70 μm), existed using vacuum hotpressing machine
Preheat 15 minutes at vacuum (7torr), 260 DEG C of temperature, afterwards in vacuum (7torr), temperature 260
DEG C, carry out heating, the extrusion forming of 10 minutes under pressure 4MPa, obtain copper clad laminate B.
Copper clad laminate B is used for the mensure of loss.
＜ copper clad laminate C ＞
Using each process face of comparative example 9 and each process Copper Foil of reference example 1～6 as glued face, and poly-
Imide resin base material (Kanegafuchi Chemical Ind (Kaneka Corporation) system, the name of an article：FRS-142、
25 μm of thickness) be combined after, pre- at vacuum (7torr), 260 DEG C of temperature using vacuum hotpressing machine
Heat 15 minutes, carries out 10 minutes afterwards under vacuum (7torr), 300 DEG C of temperature, pressure 4MPa
Heating, extrusion forming, obtain copper clad laminate C.
The evaluation of untreated Copper Foil or process Copper Foil is carried out by method below.
Mensure ＞ of ＜ surface roughness
Untreated Copper Foil or process Copper Foil are provided with to each face of process layer, using suitable JIS
The surface roughness tester of the contact pin type surface roughness meter of B0651-2001 defined
(Surfcorder) SE1700 α (Kosaka Laboratory Ltd. (Kosaka Laboratory Ltd.) system),
Use, as contact pilotage, the contact pilotage that stylus tip radius is 2 μm, if roughness curve cutoff be 0.8mm,
Mensuration distance is 4.0mm, measures 10 points of mean roughness Rz defined in JISB0601-1994.
Mensure ＞ of ＜ particle diameter
Using flying-spot microscope SEM (Jeol Ltd. (JEOL) JSM-6010LA processed),
While making sample bench tilt 40 °, observed for 10,000～30,000 times with multiplying power, to observing
Constitute 10 points of the linear measure longimetry that resin induction is impregnated with the particle of copper particle subgroup of layer, by measured should
10 points of mean value is as the value of particle diameter.
＜ aberration Δ E*ab ＞
Using spectral photometric colour measuring meter (Konica Minolta Opto Inc. (Konica Minolta) CM-600d processed)
Measure each color specification system L*a*b* defined in JIS Z8781 processing Copper Foil, try to achieve and untreated Copper Foil
Aberration Δ E*ab (=([the Δ L*] of L*a*b*2+[Δa*]2+[Δb*]2)1/2).
The evaluation of copper clad laminate is carried out by method below.
＜ peel strength ＞
Using etching machine (Co., Ltd. two palace system (Ninomiya System Co., Ltd.) SPE-40 processed),
Make the copper circuit sample of width 1mm by etching.According to JIS C6481, surveyed using universal testing machine
Determine peel strength.
＜ loss ＞
Using etching machine, single-ended microstripline is formed by etching.In addition, the circuit width with regard to this substrate
For degree, in the case of being copper clad laminate B, width is 110 μm, is the situation of copper clad laminate C
Under, width is 50 μm, so that characteristic impedance becomes 50 Ω.Using Network Analyzer (Japanese Agilent
Science and Technology Ltd. (Agilent Technologies Japan, Ltd.) N5247A processed) to made electricity
Base board measures the S parameter (S21) of frequency 160MHz～40GHz.
Table 2 illustrates each evaluation result.
Table 2
Be can confirm that according to embodiment 1～6：The loss of process Copper Foil of the present invention with do not possess resin and lure
Lead be impregnated with layer process Copper Foil (comparative example 1) be equal extent, and the process Copper Foil of the present invention possess with
The high peel strength of low-k resin base material.
Industrial applicibility
The excellent conductor that the process Copper Foil of the present invention is loss is equal extent with untreated Copper Foil,
Even and if, contribute to the big functional group of the polarity of bonding less it is difficult to obtain high peel strength
Low-k resin base material is it is also possible to realize high peel strength, it is, therefore, possible to provide also can fit
Copper clad laminate for flexible printed wiring board.
Therefore, the process Copper Foil of the present invention is the high invention of industrial applicability.
Claims (8)
1. a kind of low-k resin base material, with processing Copper Foil, possesses at least one side of untreated Copper Foil
Roughening treatment layer, possesses anti-oxidant treatment layer, described low-k resin on described roughening treatment layer
1GHz frequencies above dielectric loss angle tangent be less than 0.005, wherein,
Described roughening treatment layer is formed by the copper particle that particle diameter is 300～600nm, described anti-oxidant treatment
Layer contains molybdenum and cobalt, and 10 points of mean roughness Rz of the process face bonding with resin base material are 0.6～2.0 μm,
And the aberration Δ E*ab of described untreated Copper Foil and described process face is 35～55.
2. low-k resin base material according to claim 1 process Copper Foil, wherein,
More than one following a, b layer is possessed on described anti-oxidant treatment layer：
A. chromate coating
B. silane coupling agent layer.
3. a kind of copper clad laminate, by the process Copper Foil described in claim 1 or 2 fit in 1GHz with
The dielectric loss angle tangent of upper frequency be less than 0.005 low-k resin base material on formed.
4. copper clad laminate according to claim 3, wherein,
Described copper clad laminate and the dielectric loss angle tangent of the 1GHz frequencies above containing liquid crystal polymer
The peel strength of the low-k resin base material for less than 0.005 is more than 0.6kN/m.
5. a kind of processing method processing Copper Foil, for entering to the process Copper Foil described in claim 1 or 2
Row process it is characterised in that
Add starch analyte in the electrolytic solution.
6. a kind of manufacture method of copper clad laminate, for the copper clad layers described in manufacturing claims 3 or 4
Pressing plate it is characterised in that
The low dielectric being less than 0.005 to the dielectric loss angle tangent processing Copper Foil and 1GHz frequencies above is normal
Number resin base material heats makes it fit while pressurizeing.
7. a kind of printing distributing board, usage right requires the copper clad laminate described in 3 or 4 to be formed.
8. a kind of manufacture method of printing distributing board, for the printing distributing board described in manufacturing claims 7.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015149642A JP6083619B2 (en) | 2015-07-29 | 2015-07-29 | Processed copper foil for low dielectric resin substrate, copper-clad laminate and printed wiring board using the treated copper foil |
| JP2015-149642 | 2015-07-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106413248A true CN106413248A (en) | 2017-02-15 |
| CN106413248B CN106413248B (en) | 2019-05-14 |
Family
ID=57985668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610258241.5A Active CN106413248B (en) | 2015-07-29 | 2016-04-22 | Low-k resin base material processing copper foil and copper clad laminate and printing distributing board using the processing copper foil |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6083619B2 (en) |
| KR (1) | KR101998923B1 (en) |
| CN (1) | CN106413248B (en) |
| TW (1) | TWI663268B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108697006A (en) * | 2017-03-31 | 2018-10-23 | Ｊｘ金属株式会社 | The manufacturing method of surface treatment copper foil, Copper foil with carrier, laminate, the manufacturing method of printing distributing board and e-machine |
| CN108963402A (en) * | 2018-08-16 | 2018-12-07 | 北京华镁钛科技有限公司 | It is a kind of for making the transmission structure and production method of frequency microwave device and antenna |
| CN110463363A (en) * | 2017-03-28 | 2019-11-15 | 京瓷株式会社 | Copper foil, copper-clad laminated board and circuit board with bonding agent |
| CN114761622A (en) * | 2019-12-13 | 2022-07-15 | Ｊｘ金属株式会社 | Surface-treated copper foil, copper-clad laminate, and printed wiring board |
| CN116507670A (en) * | 2020-11-24 | 2023-07-28 | 富士胶片株式会社 | Polymer film and laminate |
| CN119013437A (en) * | 2022-11-28 | 2024-11-22 | 福田金属箔粉工业株式会社 | Surface-treated copper foil, and copper-clad laminate and printed wiring board using same |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6697759B2 (en) * | 2016-02-05 | 2020-05-27 | パナソニックＩｐマネジメント株式会社 | Metal-clad laminate, method of manufacturing metal-clad laminate, metal member with resin, method of manufacturing metal member with resin, wiring board, and method of manufacturing wiring board |
| WO2019024973A1 (en) * | 2017-07-31 | 2019-02-07 | Circuit Foil Luxembourg, Sàrl | Surface treated copper foil and copper-clad laminate |
| KR102390417B1 (en) | 2017-12-05 | 2022-04-22 | 후루카와 덴키 고교 가부시키가이샤 | Surface-treated copper foil and copper clad laminate and printed wiring board using the same |
| TWI740515B (en) | 2019-12-23 | 2021-09-21 | 長春人造樹脂廠股份有限公司 | Liquid crystal polymer film and laminate comprising the same |
| TWI697549B (en) | 2019-12-23 | 2020-07-01 | 長春人造樹脂廠股份有限公司 | Liquid crystal polymer film and laminate comprising the same |
| WO2022113973A1 (en) * | 2020-11-24 | 2022-06-02 | 富士フイルム株式会社 | Polymer film and laminate |
| KR102495997B1 (en) * | 2021-03-11 | 2023-02-06 | 일진머티리얼즈 주식회사 | Surface-treated copper foil with low surface roughness and low flexural strain, copper foil laminate comprising the same, and printed wiring board comprising the same |
| LU501394B1 (en) | 2022-02-07 | 2023-08-07 | Circuit Foil Luxembourg | Surface-treated copper foil for high-frequency circuit and method for producing the same |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1386044A (en) * | 2001-05-14 | 2002-12-18 | 日本电解株式会社 | Roughened copper foil and making method thereof |
| JP2005206915A (en) * | 2004-01-26 | 2005-08-04 | Fukuda Metal Foil & Powder Co Ltd | Copper foil for printed circuited board, and its production method |
| CN102196675A (en) * | 2010-03-02 | 2011-09-21 | 福田金属箔粉工业株式会社 | Processed copper foil |
| CN103857833A (en) * | 2011-09-30 | 2014-06-11 | Jx日矿日石金属株式会社 | Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil |
| CN103946426A (en) * | 2012-11-09 | 2014-07-23 | Jx日矿日石金属株式会社 | Surface-treated copper foil and laminate using same, printed circuit board, and copper-clad laminate |
| CN103946425A (en) * | 2012-11-09 | 2014-07-23 | Jx日矿日石金属株式会社 | Surface-treated copper foil and laminate using same |
| CN104120471A (en) * | 2013-04-26 | 2014-10-29 | Jx日矿日石金属株式会社 | High frequency circuit copper foil, copper-clad plate, printing distribution panel, copper foil with carrier, electronic device and making method of the printing distribution panel |
| CN102803576B (en) * | 2010-01-22 | 2015-11-25 | 古河电气工业株式会社 | Roughening treatment Copper Foil and manufacture method, copper clad laminate and printed circuit board (PCB) |
| CN106232679A (en) * | 2014-04-24 | 2016-12-14 | 杰富意化学株式会社 | Polyamic acid composition and polyimide compositions |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6969557B2 (en) | 2002-06-04 | 2005-11-29 | Mitsui Mining & Smelting Co., Ltd. | Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same |
| JPWO2012039285A1 (en) * | 2010-09-24 | 2014-02-03 | Jx日鉱日石金属株式会社 | Method for producing copper foil for printed wiring board and copper foil for printed wiring board |
| JP5654416B2 (en) * | 2011-06-07 | 2015-01-14 | Jx日鉱日石金属株式会社 | Liquid crystal polymer copper clad laminate and copper foil used for the laminate |
| JP5871426B2 (en) | 2012-01-31 | 2016-03-01 | 古河電気工業株式会社 | Surface treated copper foil for high frequency transmission, laminated plate for high frequency transmission and printed wiring board for high frequency transmission |
| JP2014224313A (en) * | 2013-04-26 | 2014-12-04 | Jx日鉱日石金属株式会社 | Copper foil for high-frequency circuit, copper-clad laminate sheet for high-frequency circuit, printed wiring board for high-frequency circuit, carrier-provided copper foil for high-frequency circuit, electronic apparatus and method of producing printed wiring board |
| JP5870148B2 (en) * | 2013-11-27 | 2016-02-24 | Ｊｘ金属株式会社 | Copper foil with carrier, method for producing printed circuit board, copper-clad laminate, method for producing copper-clad laminate, and method for producing printed wiring board |
-
2015
- 2015-07-29 JP JP2015149642A patent/JP6083619B2/en active Active
-
2016
- 2016-04-19 TW TW105112131A patent/TWI663268B/en active
- 2016-04-22 CN CN201610258241.5A patent/CN106413248B/en active Active
- 2016-04-26 KR KR1020160050719A patent/KR101998923B1/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1386044A (en) * | 2001-05-14 | 2002-12-18 | 日本电解株式会社 | Roughened copper foil and making method thereof |
| JP2005206915A (en) * | 2004-01-26 | 2005-08-04 | Fukuda Metal Foil & Powder Co Ltd | Copper foil for printed circuited board, and its production method |
| CN102803576B (en) * | 2010-01-22 | 2015-11-25 | 古河电气工业株式会社 | Roughening treatment Copper Foil and manufacture method, copper clad laminate and printed circuit board (PCB) |
| CN102196675A (en) * | 2010-03-02 | 2011-09-21 | 福田金属箔粉工业株式会社 | Processed copper foil |
| CN103857833A (en) * | 2011-09-30 | 2014-06-11 | Jx日矿日石金属株式会社 | Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil |
| CN103946426A (en) * | 2012-11-09 | 2014-07-23 | Jx日矿日石金属株式会社 | Surface-treated copper foil and laminate using same, printed circuit board, and copper-clad laminate |
| CN103946425A (en) * | 2012-11-09 | 2014-07-23 | Jx日矿日石金属株式会社 | Surface-treated copper foil and laminate using same |
| CN104120471A (en) * | 2013-04-26 | 2014-10-29 | Jx日矿日石金属株式会社 | High frequency circuit copper foil, copper-clad plate, printing distribution panel, copper foil with carrier, electronic device and making method of the printing distribution panel |
| CN106232679A (en) * | 2014-04-24 | 2016-12-14 | 杰富意化学株式会社 | Polyamic acid composition and polyimide compositions |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110463363A (en) * | 2017-03-28 | 2019-11-15 | 京瓷株式会社 | Copper foil, copper-clad laminated board and circuit board with bonding agent |
| CN110463363B (en) * | 2017-03-28 | 2022-11-01 | 京瓷株式会社 | Copper foil with adhesive, copper-clad laminate, and wiring board |
| CN108697006A (en) * | 2017-03-31 | 2018-10-23 | Ｊｘ金属株式会社 | The manufacturing method of surface treatment copper foil, Copper foil with carrier, laminate, the manufacturing method of printing distributing board and e-machine |
| CN108697006B (en) * | 2017-03-31 | 2021-07-16 | Ｊｘ金属株式会社 | Surface-treated copper foil, copper foil with carrier, laminate, manufacturing method of printed wiring board, and manufacturing method of electronic device |
| CN108963402A (en) * | 2018-08-16 | 2018-12-07 | 北京华镁钛科技有限公司 | It is a kind of for making the transmission structure and production method of frequency microwave device and antenna |
| CN108963402B (en) * | 2018-08-16 | 2023-09-26 | 北京华镁钛科技有限公司 | Transmission structure for manufacturing radio frequency microwave device and antenna and manufacturing method |
| CN114761622A (en) * | 2019-12-13 | 2022-07-15 | Ｊｘ金属株式会社 | Surface-treated copper foil, copper-clad laminate, and printed wiring board |
| CN114761622B (en) * | 2019-12-13 | 2024-01-12 | Ｊｘ金属株式会社 | Surface treated copper foil, copper clad laminates and printed wiring boards |
| CN116507670A (en) * | 2020-11-24 | 2023-07-28 | 富士胶片株式会社 | Polymer film and laminate |
| CN116507670B (en) * | 2020-11-24 | 2024-08-13 | 富士胶片株式会社 | Polymer film and laminate |
| CN119013437A (en) * | 2022-11-28 | 2024-11-22 | 福田金属箔粉工业株式会社 | Surface-treated copper foil, and copper-clad laminate and printed wiring board using same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201704484A (en) | 2017-02-01 |
| TWI663268B (en) | 2019-06-21 |
| JP2017031442A (en) | 2017-02-09 |
| CN106413248B (en) | 2019-05-14 |
| KR101998923B1 (en) | 2019-07-10 |
| KR20170015111A (en) | 2017-02-08 |
| JP6083619B2 (en) | 2017-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106413248A (en) | Treated copper foil for low dielectric resin substrate and copper-clad laminate and printed writing board using the same | |
| CN106211567A (en) | Process Copper Foil, the copper-clad laminated board using this process Copper Foil and printed wiring board | |
| TWI745585B (en) | Surface treatment copper foil | |
| JP6294862B2 (en) | Surface-treated copper foil for printed wiring board, copper-clad laminate for printed wiring board, and printed wiring board | |
| TWI479958B (en) | Copper foil for printed wiring board and manufacturing method thereof | |
| JP6893572B2 (en) | Surface-treated copper foil manufacturing method | |
| JP2004244656A (en) | Copper foil which can deal with high-frequency application and method for manufacturing the same | |
| TWI728012B (en) | High-chroma processed copper foil, copper clad laminate using the processed copper foil, and manufacturing method of the processed copper foil | |
| JP7602872B2 (en) | Electromagnetic wave shielding film, its manufacturing method, and printed wiring board with electromagnetic wave shielding film | |
| TW202035791A (en) | Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same | |
| CN116917552B (en) | Surface treated copper foil, copper clad laminate and printed circuit board using the same | |
| WO2016017511A1 (en) | Electronic component and method for producing same | |
| TW200535946A (en) | Process for preparing a non-conductive substrate for electroplating | |
| JP2005064110A (en) | Member for electronic component and electronic component using the same | |
| WO2018004151A1 (en) | Surface-treated copper foil having enhanced visibility and method for manufacturing same | |
| KR20180119061A (en) | Printed circuit board having metal wire layer with improved adhesion to substrate and manufacturing method for the same | |
| JP2019049017A (en) | Surface treated copper foil and copper clad laminate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |