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CN106398579B - Adhesive tape for process protection - Google Patents

Adhesive tape for process protection Download PDF

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Publication number
CN106398579B
CN106398579B CN201610984698.4A CN201610984698A CN106398579B CN 106398579 B CN106398579 B CN 106398579B CN 201610984698 A CN201610984698 A CN 201610984698A CN 106398579 B CN106398579 B CN 106398579B
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sensitive adhesive
adhesive layer
heat
layer
parts
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CN106398579A (en
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邵新萍
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Ningbo Qihe New Material Technology Co ltd
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Ningbo Qihe New Material Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/16—Homopolymers or copolymers of alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J145/00—Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09J157/02—Copolymers of mineral oil hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
    • C09J193/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C09J2423/106—Presence of homo or copolymers of propene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2453/00—Presence of block copolymer
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2493/00—Presence of natural resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention provides a manufacturing protection adhesive tape which is characterized by comprising a release film layer, a pressure-sensitive adhesive layer, a heat-sensitive adhesive layer and a substrate layer which are sequentially attached. This sticky tape is at laminating initial stage heat-sensitive adhesive layer inviscid, and heat-sensitive adhesive layer peel strength improves after the heating, reaches the effect of fixing and protection, and the bubble or the seal of production when can reducing adhesive material parcel shell improves the processing procedure protection effect.

Description

Adhesive tape for process protection
[ technical field ] A method for producing a semiconductor device
The invention relates to the field of adhesives, in particular to an adhesive tape for process protection.
[ background of the invention ]
With the rapid development of electronic products, the all-metal integrated body is one of the most popular elements at present. The all-metal integrated machine body is subjected to a series of surface treatments in the processing process, such as a series of complex processes of polishing, electroplating, spraying, etching, laser and the like. These processes require a material to protect them from scratching and damage at other non-processing locations.
At present, the non-processing part is generally protected by using protective films such as a PET protective film, a PE protective film, a PVC protective film, and an OPP protective film. However, the PET protective film cannot be well adhered to corners and radian parts due to the hardness of the base material PET, and cannot achieve effective process protection; although the base materials of the PE protective film, the PVC protective film and the OPP protective film are soft, due to the fact that the adhesive layer has pressure sensitivity, corners and radian parts cannot be perfectly attached in the attaching process, air bubbles are remained, and air bubble marks are remained after the protective films are peeled through a series of processes, so that the appearance and the yield of products are affected. Taking the shell of the apple phone as an example, the general protective film cannot be completely wrapped due to excessive corners and radians in the processing process of the inner side of the shell, so that the product yield is low.
In order to solve the problems, a glue material capable of well wrapping corners and radians of the shell is urgently needed in the market.
[ summary of the invention ]
The invention aims to provide an adhesive tape for process protection, which can wrap corners and radians of a shell and improve the process protection effect. The technical scheme of the invention is as follows:
the adhesive tape for the process protection comprises a release film layer, a thermosensitive adhesive layer, a pressure-sensitive adhesive layer and a base material layer which are sequentially attached. The adhesive tape has no viscosity in the initial stage of bonding, and the peel strength of the heat-sensitive adhesive layer is improved after heating, so that the adhesive tape achieves the effects of fixation and protection.
Further, the heat-sensitive adhesive layer is a rubber heat-sensitive adhesive. Because only the thermal sensitization temperature of the rubber heat-sensitive adhesive is suitable for the process protection, other temperatures are too high or the viscosity is too high, and the reworkability is inferior to that of the rubber product.
Furthermore, the coating thickness of the thermosensitive adhesive layer is 5-20 μm, the adhesive force is low after the temperature is less than 5 μm, the thermosensitive adhesive layer is easy to be separated, and the adhesive force is too high after the temperature is more than 20 μm, so that the residual adhesive is polluted after the thermosensitive adhesive layer is stripped, and even the thermosensitive adhesive layer is difficult to strip.
Further, the substrate layer is a polyurethane film, a polyethylene film, a polyvinyl chloride film, a polyester urethane film, a polypropylene film, or a polybutylene terephthalate film. The films are softer and have better following performance, so that a better pasting effect can be met, and the risk of edge warping is reduced.
Further, the thermosensitive adhesive layer is prepared from the following raw materials in parts by weight: 40-50 parts of rubber elastomer, 50-60 parts of tackifying resin, 0-5 parts of softener and 0-10 parts of antioxidant. The thermosensitive adhesive prepared by the formula is sensitive to temperature, can achieve the fixing and protecting effect under certain heat, can be easily peeled off after being cooled, and is convenient to use and operate.
Furthermore, the thermosensitive adhesive layer also comprises 0-5 parts of plasticizer, the softening temperature of the adhesive layer is reduced, and the Tg value of the adhesive is properly controlled.
Still further, the rubber elastomer is one or more of polystyrene butadiene polymer, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer, and styrene-ethylene-propylene-styrene block copolymer. The material has low cost, strong operability and simple matching process in the process of producing the adhesive, and does not need a special polymerization reaction device.
Furthermore, the tackifying resin is one or more of terpene resin, rosin resin, petroleum resin and poly-a-methyl styrene resin, has excellent compatibility with rubber elastomer, and has excellent weather resistance and stability on the premise of ensuring the peeling strength of the adhesive.
Furthermore, the softening agent is one or more of alkane paraffin and microcrystalline paraffin, can improve the initial bonding performance of the product, and has a great effect on the leveling property of the adhesive.
Furthermore, the antioxidant is one or more of 2, 6-di-tert-butyl-p-cresol (antioxidant 264), tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester (antioxidant 1010) and 2,2' -methylenebis (4-methyl-6-tert-butylphenol) (antioxidant 2246), and the ultraviolet rays can be well absorbed by adding the antioxidant, so that the weather resistance and the stability of the adhesive are improved.
The invention has the following beneficial technical effects: the invention adopts the four-layer structure, the heat-sensitive adhesive layer is not sticky at the initial stage of bonding, the adhesive tape is pasted on the inner side of the shell through vacuum adsorption, then the heating is carried out, when the temperature is raised to the softening temperature of the base material, the base material begins to be soft and the colloid is still not sticky, at the moment, the soft base material and the adhesive layer are well contacted with the corners and the radian parts of the shell through the vacuum adsorption, the colloid begins to generate stickiness after being continuously heated, the peeling strength of the heat-sensitive adhesive layer is improved, the fixing and protecting effects are achieved, the adhesive tape can be well pasted on the surface of the shell after being cooled, thereby avoiding the scratch or damage to the adhesive tape in the subsequent process, reducing the bubbles or marks generated by the corners and the radian parts of the shell wrapped by the adhesive material, and compared with the prior process of the integrated shell, the wrapping and protecting area is improved by 10-25%, the incidence rate of pasting the bubbles is reduced by 15-40%, and the process difficulty is reduced, the yield can be improved by 10-30%; the invention not only can meet the requirement that bubbles which influence the beauty and the use are not easy to generate between the protective film and the adhered body, but also can achieve perfect reworking effect, and particularly when the sticking process is abnormal, the protective film is conveniently peeled without being heated and no residual glue is left; the invention adopts softer materials such as polyethylene film, polyurethane film, polyvinyl chloride film, polyester urethane film, polypropylene film, polybutylene terephthalate film and the like as the base materials, has better following performance, can meet better pasting and covering effect, reduces the risk of edge warping and further improves the protection effect.
[ description of the drawings ]
Fig. 1 is a schematic structural view of the adhesive tape of the present invention.
Description of the labeling: 1, a release film layer; 2, a thermosensitive adhesive layer; 3, a pressure-sensitive adhesive layer; and 4, a base material layer.
[ detailed description ] embodiments
The invention is further described with reference to specific examples.
The following examples are not intended to limit the scope of the present invention, nor are the steps described to limit the order of execution. Modifications of the invention which are obvious to those skilled in the art in view of the prior art are also within the scope of the invention as claimed.
Example 1
The adhesive tape for manufacturing protection is characterized by comprising a release film layer 1, a thermosensitive adhesive layer 2, a pressure-sensitive adhesive layer 3 and a substrate layer 4 which are sequentially attached, as shown in figure 1. The substrate layer 4 is a polyethylene film, the release film layer 1 is a silicon-based release film, and the thermosensitive adhesive layer 2 is a rubber thermosensitive adhesive. The thickness of the base material layer 4 was 30 μm.
The rubber heat-sensitive adhesive is prepared from the following components in parts by weight: 45 parts of styrene-butadiene-styrene block copolymer, 55 parts of terpene resin, 1 part of alkane paraffin and 5 parts of 2, 6-di-tert-butyl-p-cresol (antioxidant 264).
The preparation method of the adhesive tape comprises the following steps:
1) preparing rubber heat-sensitive adhesive: respectively dissolving styrene-butadiene-styrene block copolymer and terpene resin to form slurry with solid content of 50%, adding 90kg of rubber slurry, 110kg of resin slurry, 1kg of alkane paraffin and 5kg of 2, 6-di-tert-butyl-p-cresol (antioxidant 264) into a stirring device, dissolving and stirring to form uniform and stable viscous liquid.
2) Filtering the pressure-sensitive adhesive by using a 200-mesh filter screen, standing for 30min, coating the pressure-sensitive adhesive on a release film release surface by using a comma shaft, wherein the coating thickness is 10 mu m, the temperature of an oven is set to be 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 110 ℃ and 100 ℃, the coating speed is 15-30m/min, the pressure-sensitive adhesive is dried and then is attached and curled with one side with high surface tension of the polyethylene film to form a pressure-sensitive adhesive layer 3 and a base material layer 4, and the release film is peeled off when being attached in the next step.
3) Filtering the prepared rubber heat-sensitive adhesive by using a 200-mesh filter screen, standing for 30min, coating the rubber heat-sensitive adhesive on a release film by using a comma shaft, wherein the coating thickness is 5 mu m, the temperature of an oven is set to be 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 110 ℃ and 100 ℃, the coating speed is 15-30m/min, forming a heat-sensitive adhesive layer 2 and a release film layer 1 after completely drying, attaching the heat-sensitive adhesive layer 2 to a pressure-sensitive adhesive layer 3 after the release film is peeled, and curing at a certain temperature after winding.
Use this sticky tape as the inboard processing procedure protection of apple integration cell-phone metal casing sticky tape, the initial stage heat-sensitive glue layer invisibility of laminating, it is inboard with the shell with material subsides through vacuum adsorption, heat the intensification afterwards, when the temperature promoted to the substrate softening temperature, the substrate begins to soften and the colloid still invisibility, through the better contact of softer substrate of vacuum adsorption and glue film and turning and radian position this moment, it begins to produce viscidity to continue to heat the colloid, the sticky tape can be fine after the cooling pastes at the casing inboardly, the problem that other sticky tapes are difficult to solve has been overcome, can be fine solution in-process casing turning and radian position can't wrap up or wrap up the not good bubble that produces in the solution that makes than conventional sticky tape, the seal of a government organization remains the old china, the yield improves more than 20%, not only production technology is simple, and convenient operation, the cost of product has greatly been reduced.
Example 2
The adhesive tape for manufacturing protection is characterized by comprising a release film layer 1, a thermosensitive adhesive layer 2, a pressure-sensitive adhesive layer 3 and a substrate layer 4 which are sequentially attached, as shown in figure 1. The substrate layer 4 is a polyvinyl chloride film, the release film layer 1 is a silicon-based release film, and the thermosensitive adhesive layer 2 is a rubber thermosensitive adhesive. The thickness of the substrate layer was 50 μm.
The rubber heat-sensitive adhesive is prepared from the following components in parts by weight: 50 parts of styrene-isoprene-styrene block copolymer, 60 parts of rosin resin, 5 parts of paraffin wax, 5 parts of dioctyl phthalate (DOP) and 10 parts of tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester (antioxidant 1010).
The preparation method of the adhesive tape for process protection comprises the following steps:
1) preparing rubber heat-sensitive adhesive: respectively dissolving styrene-isoprene-styrene block copolymer and rosin resin to form slurry with solid content of 50%, adding 100kg of rubber slurry, 120kg of resin slurry, 5kg of paraffin wax, 5kg of dioctyl phthalate (DOP) and 10kg of pentaerythritol tetrakis [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ] (antioxidant 1010) into a stirring device, completely dissolving and stirring to form uniform and stable viscous liquid.
2) Filtering the pressure-sensitive adhesive by using a 300-mesh filter screen, standing for 35min, coating the pressure-sensitive adhesive on a release film release surface by using a comma shaft, wherein the coating thickness is 20 mu m, the temperature of an oven is set to be 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 110 ℃ and 100 ℃, the coating speed is 15-30m/min, drying, then laminating and coiling the pressure-sensitive adhesive with the high surface tension of the polyvinyl chloride film to form a pressure-sensitive adhesive layer 3 and a substrate layer 4, and peeling off the release film when the release film is laminated in the next step.
3) Filtering the prepared rubber heat-sensitive adhesive by using a 300-mesh filter screen, standing for 35min, coating the rubber heat-sensitive adhesive on a release film by using a comma shaft, wherein the coating thickness is 10 mu m, the temperature of an oven is set to be 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 110 ℃ and 100 ℃, the coating speed is 15-30m/min, forming a heat-sensitive adhesive layer 2 and a release film layer 1 after completely drying, attaching the heat-sensitive adhesive layer 2 to a pressure-sensitive adhesive layer 3 after the release film is peeled, and curing at a certain temperature after winding.
The adhesive tape is used as an integrated adhesive tape for protecting the process procedure of the inner side of a metal shell of a mobile phone such as Huaji, the like, the initial-stage thermosensitive adhesive layer is adhered without adhesiveness, the material is adhered to the inner side of the shell by vacuum adsorption, then the heating is carried out, when the temperature is raised to the softening temperature of the base material, the base material begins to soften and the colloid remains without adhesiveness, at the moment, the colloid begins to generate adhesiveness by continuously heating through the contact of the softer base material and the adhesive layer with corners and radian parts by vacuum adsorption, the adhesive tape can be well adhered to the inner side of the shell after the temperature is reduced,
the problem that other adhesive tapes are difficult to solve is solved, compared with the conventional adhesive tape, the problems that the corners and the radian parts of the shell cannot be wrapped or poor wrapping generates bubbles and marks are remained in the shell during the manufacturing process can be well solved, the yield is improved by more than 30%, the production process is simple, the operation is convenient, and the product cost is greatly reduced.
Example 3
The adhesive tape for the process protection is characterized by comprising a release film layer 1, a heat-sensitive adhesive layer 2, a pressure-sensitive adhesive layer 3 and a substrate layer 4 which are sequentially attached, as shown in figure 1. The substrate layer 4 is a polyethylene film, the release film layer 1 is a silicon-based release film, and the thermosensitive adhesive layer 2 is a rubber thermosensitive adhesive. The thickness of the substrate layer was 100 μm.
The rubber heat-sensitive adhesive is prepared from the following components in parts by weight: 40 parts of styrene-ethylene-butylene-styrene block copolymer, 50 parts of petroleum resin, 2 parts of microcrystalline paraffin and 2 parts of 2,2' -methylenebis (4-methyl-6-tert-butylphenol) (antioxidant 2246).
The preparation method of the adhesive tape for process protection comprises the following steps:
1) preparing rubber heat-sensitive adhesive: respectively dissolving styrene-ethylene-butylene-styrene block copolymer and petroleum resin to form slurry with the solid content of 80%, adding 50kg of rubber slurry, 62.5kg of resin slurry, 2kg of microcrystalline paraffin and 2kg of 2,2' -methylenebis (4-methyl-6-tert-butylphenol) (antioxidant 2246) into a stirring device, completely dissolving and stirring to form uniform and stable viscous liquid.
2) Filtering the pressure-sensitive adhesive by using a filter screen of 150 meshes, standing for 30min, coating the pressure-sensitive adhesive on a release film release surface by using a comma shaft, wherein the coating thickness is 15 mu m, the temperature of an oven is set to be 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 110 ℃ and 100 ℃, the coating speed is 15-30m/min, after drying, laminating and coiling the pressure-sensitive adhesive with a polyethylene film surface tension high surface to form a pressure-sensitive adhesive layer 3 and a substrate layer 4, and peeling the release film when laminating in the next step.
3) Filtering the prepared rubber heat-sensitive adhesive by using a 150-mesh filter screen, standing for 30min, coating on a release film by using a comma shaft, wherein the coating thickness is 5 mu m, the temperature of an oven is set to be 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 110 ℃ and 100 ℃, the coating speed is 15-30m/min, after complete drying, forming a heat-sensitive adhesive layer 2 and a release film layer 1, attaching the heat-sensitive adhesive layer 2 to a pressure-sensitive adhesive layer 3 stripped from the release film, and curing at a certain temperature after winding.
Use this sticky tape as inboard processing procedure protection sticky tape of integrated cell-phone metal casing, the initial stage heat-sensitive adhesive layer invisibility of laminating, it is inboard with the shell with material subsides through vacuum adsorption, heat the intensification afterwards, when the temperature promoted to the substrate softening temperature, the substrate begins to soften and the colloid still invisibility, through the better contact in vacuum adsorption softer substrate of this moment and glue film and turning and radian position, it begins to produce viscidity to continue to heat the colloid, the sticky tape can be fine after the cooling pastes at the casing inboardly, the problem that other sticky tapes are difficult to solve has been overcome, can be fine solution in-process casing turning and radian position compared in conventional sticky tape, unable parcel or parcel bad bubble production, the seal of a government organization remains the scheduling problem, the yield improves more than 10%, not only production simple process, and convenient operation, the cost of product has greatly been reduced.
Example 4
The adhesive tape for manufacturing protection is characterized by comprising a release film layer 1, a thermosensitive adhesive layer 2, a pressure-sensitive adhesive layer 3 and a substrate layer 4 which are sequentially attached, as shown in figure 1. Wherein, the substrate layer 4 is a polyester urethane film, the release film layer 1 is a silicon-based release film, and the heat-sensitive adhesive layer 2 is a rubber-based heat-sensitive adhesive. The thickness of the substrate layer was 80 μm.
The rubber heat-sensitive adhesive is prepared from the following components in parts by weight: 42 parts of styrene-ethylene-propylene-styrene block copolymer, 52 parts of poly-a-methylstyrene resin, 2 parts of 2, 6-di-tert-butyl-p-cresol (antioxidant 264) and 6 parts of tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester (antioxidant 1010).
The preparation method of the adhesive tape for process protection comprises the following steps:
1) preparing rubber heat-sensitive adhesive: respectively dissolving styrene-ethylene-propylene-styrene block copolymer and poly-alpha-methylstyrene resin to form a slurry with a solid content of 50%, adding 84kg of rubber slurry, 104kg of resin slurry, 2kg of 2, 6-di-tert-butyl-p-cresol (antioxidant 264) and 6kg of tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester (antioxidant 1010) into a stirring device, and completely dissolving and stirring to form uniform and stable viscous liquid.
2) Filtering the pressure-sensitive adhesive by using a filter screen of 150 meshes, standing for 30min, coating the pressure-sensitive adhesive on a release film release surface by using a comma shaft, wherein the coating thickness is 15 mu m, the temperature of an oven is set to be 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 110 ℃ and 100 ℃, the coating speed is 15-30m/min, after drying, laminating and coiling the pressure-sensitive adhesive with the surface tension high surface of the polyester urethane film to form a pressure-sensitive adhesive layer 3 and a substrate layer 4, and peeling the release film when laminating in the next step.
3) Filtering the prepared rubber heat-sensitive adhesive by using a filter screen with 150 meshes, standing for 30min, coating the rubber heat-sensitive adhesive on a release film by using a comma shaft, wherein the coating thickness is 8 mu m, the temperature of an oven is set to be 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 110 ℃ and 100 ℃, the coating speed is 15-30m/min, forming a heat-sensitive adhesive layer 2 and a release film layer 1 after completely drying, attaching the heat-sensitive adhesive layer 2 to a pressure-sensitive adhesive layer 3 after the release film is peeled, and curing at a certain temperature after winding.
Use this sticky tape as inboard processing procedure protection sticky tape of integrated computer metal casing, the initial stage heat-sensitive glue layer invisibility of laminating, paste the shell inboard with the material through vacuum adsorption, heat the intensification afterwards, when the temperature promoted to the substrate softening temperature, the substrate began to soften and the colloid still invisibility, through the better contact of softer substrate of vacuum adsorption and glue film and turning and radian position this moment, it begins to produce viscidity to continue to heat up the colloid, the sticky tape can be fine after the cooling is pasted in the casing inboard, the problem that other sticky tapes are difficult to solve has been overcome, can be fine solution in-process casing turning and radian position compared with conventional sticky tape, can't wrap up or wrap up the not good bubble that produces, the seal mark remains the scheduling problem, the yield improves more than 20%, not only production simple process, and convenient operation, greatly reduced the cost of product.
Example 5
The adhesive tape for manufacturing protection is characterized by comprising a release film layer 1, a thermosensitive adhesive layer 2, a pressure-sensitive adhesive layer 3 and a substrate layer 4 which are sequentially attached, as shown in figure 1. The substrate layer 4 is a polyethylene film, the release film layer 1 is a silicon-based release film, and the thermosensitive adhesive layer 2 is a rubber thermosensitive adhesive. The thickness of the substrate layer was 40 μm.
The rubber heat-sensitive adhesive is prepared from the following components in parts by weight: 20 parts of styrene-butadiene-styrene block copolymer, 28 parts of styrene-isoprene-styrene block copolymer, 10 parts of terpene resin, 10 parts of rosin resin, 35 parts of poly (a-methylstyrene) resin and 3 parts of microcrystalline paraffin.
The preparation method of the adhesive tape for process protection comprises the following steps:
1) preparing rubber heat-sensitive adhesive: dissolving styrene-butadiene-styrene block copolymer and styrene-isoprene-styrene block copolymer according to a proportion to form rubber slurry with solid content of 50%, dissolving terpene resin, rosin resin and poly-alpha-methylstyrene resin to form resin slurry with solid content of 50%, adding 96kg of rubber slurry, 110kg of resin slurry and 3kg of microcrystalline paraffin into a stirring device, and completely dissolving and stirring to form uniform and stable viscous liquid.
2) Filtering the pressure-sensitive adhesive by using a 100-mesh filter screen, standing for 30min, coating the pressure-sensitive adhesive on a release film release surface by using a comma shaft, wherein the coating thickness is 20 mu m, the temperature of an oven is set to be 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 110 ℃ and 100 ℃, the coating speed is 15-30m/min, after drying, bonding and coiling are carried out on the release film release surface and the high surface of the polyethylene film surface tension to form a pressure-sensitive adhesive layer 3 and a substrate layer 4, and the release film is peeled off when being bonded in the next step.
3) Filtering the prepared rubber heat-sensitive adhesive by using a 100-mesh filter screen, standing for 30min, coating the rubber heat-sensitive adhesive on a release film by using a comma shaft, wherein the coating thickness is 5 mu m, the temperature of an oven is set to be 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 110 ℃ and 100 ℃, the coating speed is 15-30m/min, forming a heat-sensitive adhesive layer 2 and a release film layer 1 after completely drying, attaching the heat-sensitive adhesive layer 2 to a pressure-sensitive adhesive layer 3 after peeling off the first release film, and curing at a certain temperature after winding.
Use this sticky tape as inboard processing procedure protection sticky tape of integration intelligent machine shell, laminating initial stage heat-sensitive adhesive layer inviscid, it is inboard with material subsides shell through vacuum adsorption, heat the intensification afterwards, when the temperature promoted to substrate softening temperature, the substrate begins to soften and the colloid still inviscid, through the better contact in softer substrate of vacuum adsorption and glue film and turning and radian position this moment, it begins to produce viscidity to continue to heat up the colloid, the subsides that the sticky tape can be fine after the cooling is inboard at the casing, the problem that other sticky tapes are difficult to solve has been overcome, make in-process casing turning and radian position in the solution that can be fine in comparison in conventional sticky tape, unable parcel or the bad production seal of a government organization in old china remain the scheduling problem, the yield improves more than 20%, not only production technology is simple, and convenient for operation, the cost of product has greatly been reduced.
Example 6
The adhesive tape for the process protection is characterized by comprising a release film layer 1, a heat-sensitive adhesive layer 2, a pressure-sensitive adhesive layer 3 and a substrate layer 4 which are sequentially attached, as shown in figure 1. The substrate layer 4 is a polypropylene film, the release film layer 1 is a silicon-based release film, and the thermosensitive adhesive layer 2 is a rubber thermosensitive adhesive. The thickness of the substrate layer was 75 μm.
The rubber heat-sensitive adhesive is prepared from the following components in parts by weight: 20 parts of styrene-butadiene-styrene block copolymer, 10 parts of styrene-isoprene-styrene block copolymer, 10 parts of styrene-ethylene-butylene-styrene block copolymer, 10 parts of styrene-ethylene-propylene-styrene block copolymer, 10 parts of terpene resin, 10 parts of rosin resin, 15 parts of petroleum resin, 10 parts of poly (a-methylstyrene) resin, 4 parts of paraffin wax, 1 part of 2, 6-di-tert-butyl-p-cresol (antioxidant 264), 1 part of tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester (antioxidant 1010) and 1 part of 2,2' -methylenebis (4-methyl-6-tert-butylphenol) (antioxidant 2246).
The preparation method of the adhesive tape for process protection comprises the following steps:
1) preparing rubber heat-sensitive adhesive: dissolving styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer and styrene-ethylene-propylene-styrene block copolymer in proportion to form rubber slurry with the solid content of 50%, dissolving terpene resin, rosin resin, petroleum resin and poly (alpha-methylstyrene) in proportion to form resin slurry with the solid content of 50%, and adding 100kg of the rubber slurry, 90kg of the resin slurry, 4kg of paraffin wax, 1kg of 2, 6-di-tert-butyl-p-cresol (antioxidant 264), 1kg of tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester (antioxidant 1010), 1kg of a stirring device, 1kg of 2,2' -methylenebis (4-methyl-6-tert-butylphenol) (antioxidant 2246) was dissolved completely and stirred to form a uniform and stable viscous liquid.
2) Filtering the pressure-sensitive adhesive by using a 200-mesh filter screen, standing for 30min, coating the pressure-sensitive adhesive on a release film release surface by using a comma shaft, wherein the coating thickness is 10 mu m, the temperature of an oven is set to be 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 110 ℃ and 100 ℃, the coating speed is 15-30m/min, after drying, bonding and coiling are carried out on the release film release surface and the high surface of the polyethylene film surface tension to form a pressure-sensitive adhesive layer 3 and a substrate layer 4, and the release film is peeled off when being bonded in the next step.
3) Filtering the prepared rubber heat-sensitive adhesive by using a 200-mesh filter screen, standing for 30min, coating on a release film by using a comma shaft, wherein the coating thickness is 10 mu m, the temperature of an oven is set to be 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 110 ℃ and 100 ℃, the coating speed is 15-30m/min, after complete drying, forming a heat-sensitive adhesive layer 2 and a release film layer 1, attaching the heat-sensitive adhesive layer 2 to a pressure-sensitive adhesive layer 3 stripped from the release film, and curing at a certain temperature after winding.
Use this sticky tape as inboard processing procedure protection sticky tape of integrated electronic equipment metal casing, the initial stage heat-sensitive glue layer invisibility of laminating, it is inboard with the shell with material subsides through vacuum adsorption, heat the intensification afterwards, when the temperature promoted to the substrate softening temperature, the substrate begins to soften and the colloid still invisibility, through the better contact of softer substrate of vacuum adsorption and glue film and turning and radian position this moment, it begins to produce viscidity to continue to heat up the colloid, the sticky tape can be fine after the cooling is pasted in the casing inboard, the problem that other sticky tapes are difficult to solve has been overcome, can be fine solution in-process casing turning and radian position compared in conventional sticky tape, can't wrap up or wrap up the not good bubble that produces, the seal of a government organization remains the scheduling problem, the yield improves more than 20%, and not only the production technology is simple, and convenient for operation, the cost of product has greatly been reduced.

Claims (3)

1. The using method of the adhesive tape for process protection is characterized by comprising a release film layer (1), a heat-sensitive adhesive layer (2), a pressure-sensitive adhesive layer (3) and a substrate layer (4) which are sequentially attached, wherein the heat-sensitive adhesive layer (2) is a rubber heat-sensitive adhesive, and the gluing thickness of the heat-sensitive adhesive layer (2) is 5-20 mu m; the heat-sensitive adhesive layer (2) is prepared from the following raw materials in parts by weight: 40-50 parts of rubber elastomer, 50-60 parts of tackifying resin, 0-5 parts of softener, 0-10 parts of antioxidant and 0-5 parts of plasticizer; the rubber elastomer is one or more of polystyrene butadiene copolymer, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer and styrene-ethylene-propylene-styrene block copolymer; the tackifying resin is one or more of terpene resin, rosin resin, petroleum resin and poly alpha-methyl styrene resin;
the substrate layer (4) is a polyethylene film, a polyvinyl chloride film, a polyester urethane film, a polypropylene film or a polybutylene terephthalate film; the sticky tape is used in the processing procedure protection, no cohesiveness in initial stage is laminated in thermal sensitive adhesive layer (2), the sticky tape passes through vacuum adsorption and applies the shell inboard, heat the intensification afterwards, promote when substrate layer (4) softening temperature when the temperature, substrate layer (4) begin to soften and thermal sensitive adhesive layer (2) are still inviscid, the turning and the radian position contact through softer substrate layer (4) of vacuum adsorption and thermal sensitive adhesive layer (2) and shell this moment, it begins to produce viscidity to continue to heat up thermal sensitive adhesive layer (2) colloid, thermal sensitive adhesive layer (2) peel strength improves, the sticky tape subsides after the cooling are at housing face.
2. The method of claim 1, wherein the softening agent is paraffin wax and/or microcrystalline wax.
3. The method of claim 1, wherein the antioxidant is one or more of 2, 6-di-tert-butyl-p-cresol, pentaerythrityl tetrakis [ β - (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ], and 2,2' -methylenebis (4-methyl-6-tert-butylphenol).
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