CN106385473B - Housing, fingerprint module and mobile terminal - Google Patents
Housing, fingerprint module and mobile terminal Download PDFInfo
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- CN106385473B CN106385473B CN201610927604.XA CN201610927604A CN106385473B CN 106385473 B CN106385473 B CN 106385473B CN 201610927604 A CN201610927604 A CN 201610927604A CN 106385473 B CN106385473 B CN 106385473B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/31—User authentication
- G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
技术领域technical field
本发明涉及电子设备领域,尤其涉及一种壳体、指纹模组和移动终端。The invention relates to the field of electronic equipment, in particular to a casing, a fingerprint module and a mobile terminal.
背景技术Background technique
目前许多手机壳体的内侧均贴设有指纹芯片,指纹芯片透过手机壳体采集用户指纹信息。通常情况下,指纹芯片采集指纹信号的穿透力有限,需要对手机壳体相对指纹芯片处设置凹槽,以减小手机壳体相对指纹芯片处的厚度,方便指纹芯片采集指纹信息。然而手机壳体设置凹槽的结构容易对手机壳体形成应力损伤,即容易导致手机壳体的良率降低。目前没有一种可以保证指纹芯片采集指纹信息,又可以提高生产良率的手机壳体。At present, a fingerprint chip is attached to the inner side of many mobile phone casings, and the fingerprint chip collects user fingerprint information through the mobile phone casing. Usually, the penetration power of the fingerprint chip to collect the fingerprint signal is limited, so it is necessary to set a groove on the mobile phone case relative to the fingerprint chip to reduce the thickness of the mobile phone case relative to the fingerprint chip and facilitate the fingerprint chip to collect fingerprint information. However, the structure in which the grooves are arranged on the mobile phone case is likely to cause stress damage to the mobile phone case, that is, the yield rate of the mobile phone case is likely to decrease. At present, there is no mobile phone case that can ensure that the fingerprint chip collects fingerprint information and can improve the production yield.
发明内容SUMMARY OF THE INVENTION
本发明实施例所要解决的技术问题在于,提供一种即保证指纹芯片采集指纹信息又提高生产良率的壳体、指纹模组和移动终端。The technical problem to be solved by the embodiments of the present invention is to provide a casing, a fingerprint module and a mobile terminal that not only ensure that the fingerprint chip collects fingerprint information but also improve the production yield.
本发明提供一种壳体,其中,所述壳体包括上下层叠并相互贴合的外侧盖板和内侧盖板;所述外侧盖板朝向用户,所述外侧盖板或所述内侧盖板设有通孔;所述内侧盖板在与所述外侧盖板的通孔相对处用以贴合指纹芯片;或者所述内侧盖板的通孔用以供指纹芯片经过,以使所述指纹芯片贴合于所述外侧盖板。The present invention provides a casing, wherein the casing includes an outer cover plate and an inner cover plate that are stacked up and down and attached to each other; the outer cover plate faces a user, and the outer cover plate or the inner cover plate is provided with There are through holes; the inner cover plate is opposite to the through holes of the outer cover plate for attaching the fingerprint chip; or the through holes of the inner cover plate are used for the fingerprint chip to pass through, so that the fingerprint chip can pass through. Fitted to the outer cover.
本发明还提供一种指纹模组,其中,所述指纹模组包括所述壳体,所述指纹模组还包括指纹芯片,所述指纹芯片贴合于所述内侧盖板相对所述外侧盖板的通孔处,或者经过所述内侧盖板的通孔贴合于所述外侧盖板。The present invention also provides a fingerprint module, wherein the fingerprint module includes the casing, the fingerprint module further includes a fingerprint chip, and the fingerprint chip is attached to the inner cover plate and is opposite to the outer cover It is attached to the outer cover plate at the through hole of the plate or through the through hole of the inner cover plate.
本发明还提供一种移动终端,其中,所述移动终端包括所述指纹模组。The present invention also provides a mobile terminal, wherein the mobile terminal includes the fingerprint module.
本发明提供的壳体、指纹模组和移动终端,通过所述壳体包括相互层叠的外侧盖板和内侧盖板,而所述外侧盖板或所述内侧盖板设有通孔,进而保证了所述壳体在所述通孔处减小了指纹芯片与用户指纹的距离,方便指纹芯片采集指纹信息。并且,该通孔仅仅对所述外侧盖板或所述内侧盖板存在应力损伤,而所述壳体可以利用没有设置通孔的内侧盖板或没有设置通孔的外侧盖板得到应力补强,进而使得所述壳体的生产良率提高。In the case, fingerprint module and mobile terminal provided by the present invention, the case includes an outer cover plate and an inner cover plate that are stacked on each other, and the outer cover plate or the inner cover plate is provided with a through hole, thereby ensuring that The casing reduces the distance between the fingerprint chip and the user's fingerprint at the through hole, which facilitates the fingerprint chip to collect fingerprint information. In addition, the through hole only causes stress damage to the outer cover plate or the inner cover plate, and the shell can be stress reinforced by using the inner cover plate without through holes or the outer cover plate without through holes , thereby improving the production yield of the casing.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.
图1是本发明提供的第一实施例的壳体的局部截面示意图;FIG. 1 is a partial cross-sectional schematic diagram of a casing according to a first embodiment of the present invention;
图2是本发明提供的第二实施例的壳体的局部截面示意图;FIG. 2 is a partial cross-sectional schematic diagram of a casing according to a second embodiment of the present invention;
图3是本发明提供的第一实施例的壳体的另一截面示意图;3 is another schematic cross-sectional view of the housing according to the first embodiment of the present invention;
图4是图3的壳体的立体分解示意图;Fig. 4 is a perspective exploded schematic view of the housing of Fig. 3;
图5是本发明提供的第二实施例的壳体的另一截面示意图;FIG. 5 is another schematic cross-sectional view of the casing according to the second embodiment of the present invention;
图6是图5的壳体的立体分解示意图;Fig. 6 is a perspective exploded schematic view of the housing of Fig. 5;
图7是本发明提供的第三实施例的壳体的截面示意图;7 is a schematic cross-sectional view of a casing according to a third embodiment of the present invention;
图8是本发明提供的第一实施例的指纹模组的截面示意图;8 is a schematic cross-sectional view of the fingerprint module according to the first embodiment of the present invention;
图9是本发明提供的第二实施例的指纹模组的截面示意图;9 is a schematic cross-sectional view of a fingerprint module according to a second embodiment of the present invention;
图10是本发明提供的移动终端的局部截面示意图。FIG. 10 is a partial cross-sectional schematic diagram of a mobile terminal provided by the present invention.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
请参阅图1和图2,本发明提供一种壳体100,所述壳体100包括上下层叠并相互贴合的外侧盖板10和内侧盖板20。所述外侧盖板10朝向用户,所述外侧盖板10或所述内侧盖板20设有通孔30;所述内侧盖板20在与所述外侧盖板10的通孔相对处用以贴合指纹芯片40;或者所述内侧盖板20的通孔用以供指纹芯片40经过,以使所述指纹芯片40贴合于外侧盖板10。可以理解的是,所述壳体100对所述指纹芯片40进行遮盖,并且所述壳体100和所述指纹芯片40可以应用于移动终端中,以使用户经所述壳体100向所述指纹芯片40输入指纹芯片,进而利用指纹信息对该移动终端进行操控。该移动终端可以是手机、平板电脑或笔记本电脑等。Referring to FIG. 1 and FIG. 2 , the present invention provides a
通过所述壳体100包括相互层叠的外侧盖板10和内侧盖板20,而所述外侧盖板10或所述内侧盖板20设有通孔30,进而保证了所述壳体100在所述通孔30处方便减小了指纹芯片40与用户指纹的距离,方便所述指纹芯片40采集指纹信息。并且,该通孔30仅仅对所述外侧盖板10或所述内侧盖板20存在应力损伤,而所述壳体100可以利用没有设置通孔30的内侧盖板20或没有设置通孔30的外侧盖板10得到应力补强,进而使得所述壳体100的生产良率提高。Since the
所述壳体100可以是手机前盖,也可以是手机背壳,还可以是手机侧框。所述外侧盖板10和所述内侧盖板20可以采用相同材质,也可以采用不同材质。作为一种实施方式,所述外侧盖板10可以采用玻璃材质,从而使得所述壳体100的外观面光滑,并且使得所述壳体100外层结构具有耐磨、防水、防尘等性能。所述内侧盖板20可以采用有机玻璃材质,从而使得所述内侧盖板20方便加工,以减少所述壳体100的生产成本。为了提高所述外侧盖板10与所述内侧盖板20的贴合力,所述外侧盖板10贴合所述内侧盖板20的表面平整设置,而所述内侧盖板20朝向所述外侧盖板10的表面也是平整设置。所述外侧盖板10与所述内侧盖板20相背的表面作为所述壳体100的外观面,可以是光滑曲面,也可以是光滑平整面,还可以是散光面。所述外侧盖板10与所述内侧盖板20通过光学粘胶10a相贴合。The
所述通孔30可以经线切割工艺或者是经注塑工艺成型于所述外侧盖板10或所述内侧盖板20上。所述通孔30可以是“椭圆形”通孔,也可以是圆形通孔,还可以是矩形通孔。所述通孔30贯穿所述外侧盖板10或者所述内侧盖板20,从而使得所述外侧盖板10或所述内侧盖板20方便加工,并且减少对所述外侧盖板10或所述内侧盖板20的表面损伤,以保证所述壳体100的外观性能。所述通孔30的口径允许用户手指01经过或者允许指纹芯片经过。The through
提供第一实施例,所述通孔30开设于所述外侧盖板10。为了增加所述壳体100的强度,所述外侧盖板10采用硬度较高的铝硅钢化玻璃。因此,通过对一块完整的铝硅钢化玻璃进行线切割出所述通孔30,从而可以获得所述外侧盖板10。通过在所述外侧盖板10上开设所述通孔30,从而用户可以经所述通孔30接触所述内侧盖板20,以使用户的指纹抵触于所述内侧盖板20上,从而所述指纹芯片40经所述内侧盖板20采集用户抵触于所述内侧盖板20上的指纹。利用所述通孔30设置于所述外侧盖板10上,还可以为用户指示所述指纹芯片40的位置,方便用户指纹定位为了方便所述指纹芯片40可以透过所述内侧盖板20采集指纹信息,从而所述内侧盖板20厚度较薄。而通过所述外侧盖板10层叠于所述内侧盖板20上,从而使得所述壳体100在所述通孔30之外的区域厚度增加,从而增强所述壳体100整体强度。所述外侧盖板10的厚度可以大于所述内侧盖板20的厚度,以对所述内侧盖板20进行补强。为了方便用户手指01经过所述通孔30抵触于所述内侧盖板20,在所述通孔30远离所述内侧盖板20的开口端设置倒角31,该倒角31可以是圆弧倒角也可以是倾斜倒角,从而反防止所述通孔30的内侧壁与所述外侧盖板10的外表面的夹角刮伤用户手指01。当然,在其他实施方式中,所述外侧盖板10的厚度可以小于所述内侧盖板20的厚度。In the first embodiment, the
提供第二实施例,所述通孔30开设于所述内侧盖板20。所述内侧盖板20采用塑胶材质,从而所述通孔30可以采用注塑工艺成型。所述外侧盖板10由完整的铝硅钢化玻璃制成。所述外侧盖板10对所述通孔30进行遮盖。所述指纹芯片40经过所述通孔30贴合于所述外侧盖板10,而用户的指纹抵触于所述外侧盖板10相对所述通孔30处。所述指纹芯片40经所述外侧盖板10采集用户指纹,从而所述外侧盖板10的厚度较薄。通过所述内侧盖板20层叠于所述外侧盖板10,从而使得所述壳体100在所述通孔30之外的区域厚度增加,从而增强所述壳体100整体强度。所述内侧盖板20的厚度可以大于所述外侧盖板10的厚度,以对所述外侧盖板10进行补强。为了方便向所述通孔30内安装所述指纹芯片40并贴合于所述外侧盖板10,在所述通孔30远离所述外侧盖板10的开口端设置倒角32,该倒角32可以是圆弧倒角也可以是倾斜倒角,从而反防止所述通孔30的内侧壁与所述内侧盖板20的外表面的夹角刮伤所述指纹芯片40。当然,在其他实施方式中,所述内侧盖板20的厚度也可以小于所述外侧盖板10的厚度。In the second embodiment, the through
进一步地,所述内侧盖板20在与所述外侧盖板10的通孔30相对处的厚度小于或等于0.4mm,或者所述外侧盖板10在与所述内侧盖板20的通孔30相对处的厚度小于或等于0.4mm。Further, the thickness of the
在第一实施例中,所述内侧盖板20为平整板件。所述内侧盖板20在相对所述通孔30处的厚度与相对所述通孔30之外处的厚度相同。即所述内侧盖板20的整体厚度小于或等于0.4mm。从而用户经过所述通孔30抵触于所述内侧盖板20的指纹距离所述指纹芯片40小于或等于0.4mm。从而使得目前大多数所述指纹芯片40均可以透过所述内侧盖板20采集用户指纹。作为一种较优实施方式,所述内侧盖板20的整体厚度为0.3mm。一方面减少所述指纹芯片40采集指纹信号的穿透距离,以提高指纹采集性能;另一方面,使得所述壳体100的整体厚度不会增加,从而提高用户体验。In the first embodiment, the
在第二实施例中,所述外侧盖板10位平整板件。所述外侧盖板10在相对所述通孔30处的厚度与相对所述通孔30之外处的厚度相同。即所述外侧盖板10的整体厚度小于或等于0.4mm。从而用户经抵触于所述外侧盖板10的指纹距离所述指纹芯片40小于或等于0.4mm。从而使得目前大多数所述指纹芯片40均可以透过所述外侧盖板10采集用户指纹。作为一种较优实施方式,所述外侧盖板10的整体厚度为0.3mm。一方面减少所述指纹芯片40采集指纹信号的穿透距离,以提高指纹采集性能;另一方面,使得所述壳体100的整体厚度不会增加,从而提高用户体验。In the second embodiment, the
进一步地,所述壳体100的厚度大于或等于0.5mm。Further, the thickness of the
本实施方式中,所述壳体100的厚度等于所述外侧盖板10的厚度加上所述内侧盖板20的厚度,以及加上所述外侧盖板10与所述内侧盖板20之间间隙的厚度,由于所述外侧盖板10与所述内侧盖板20之间间隙的厚度较小,可以忽略不计。从而所述壳体100的厚度可以是看作所述外侧盖板10的厚度加上所述内侧盖板20的厚度。在第一实施例中,由于所述内侧盖板20的厚度小于或等于0.4mm,从而所述外侧盖板10的厚度大于或等于0.1mm。在第二实施例中,由于所述外侧盖板10的厚度小于或等于0.4mm,从而所述内侧盖板20的厚度大于或等于0.1mm。In this embodiment, the thickness of the
进一步地,请参阅3至图6,所述外侧盖板10具有朝向用户的外表面11,所述外表面11具有显示区域111和非显示区域112,所述显示区域111用以透过显示屏的显示画面,所述通孔30开设于所述外侧盖板10的非显示区域111,或者开设于所述内侧盖板20与所述非显示区域111相对处。Further, please refer to FIG. 3 to FIG. 6 , the
本实施方式中,所述壳体100为手机显示屏盖板。所述外侧盖板10和所述内侧盖板20均采用透光材质。在第一实施例和第二实施例中,所述外侧盖板10的长宽尺寸和所述内侧盖板20的长宽尺寸相同。即所述外侧盖板10和所述内侧盖板20完全重合。所述内侧盖板20在所述外侧盖板10的显示区域111和非显示区域112均与所述外侧盖板10相层叠。从而使得所述外侧盖板10和所述内侧盖板20方便加工,减少生产成本。所述非显示区域111位于所述显示区域112的下方,从而方便用户手指01靠近所述指纹芯片40。In this embodiment, the
具体的,在第一实施例中,请一并参阅图3和图4,所述外侧盖板10还包括与所述外表面11相对设置的第一贴合面12。所述第一贴合面12为平整面。所述第一贴合面12贴合于所述内侧盖板20。所述通孔30由所述外表面11的非显示区域111延伸至所述第一贴合面12。所述内侧盖板20包括贴合所述第一贴合面12的第二贴合面21,和相对所述第二贴面21的内表面22。所述第二贴合面21与所述第一贴合面12之间通过光学粘胶10a相粘接,从而一方面保证了所述外侧盖板10与所述内侧盖板20的稳固性,另一方面还保证了所述外侧盖板10与所述外侧盖板20之间的透光性。所述光学粘胶10a相对所述通孔30设置镂空10b,从而方便用户接触所述内侧盖板20。所述第二贴合面21为平整面。所述内表面22相对所述通孔30处贴合所述指纹芯片40。当用户的手指经过所述通孔30后,抵触于所述第二贴合面21与所述指纹芯片40相对,所述指纹芯片40经过所述内侧盖板20获得用户指纹信息。Specifically, in the first embodiment, please refer to FIG. 3 and FIG. 4 together, the
在第二实施例中,请一并参阅图5和图6,所述通孔30开设于所述第二贴合面21相对所述非显示区111处,并且由所述第二贴合面21延伸至所述内表面22。所述指纹芯片40经过所述通孔30贴合于所述外侧盖板10的第一贴合面12。用户的手指抵触于所述外表面11与所述通孔30相对处,从而所述指纹芯片40经过所述外侧盖板10获取用户指纹信息。In the second embodiment, please refer to FIG. 5 and FIG. 6 together, the through
提供三实施例,与第一实施例大致相同,请参阅图7,不同的是,所述外侧盖板10与所述内侧盖板20部分层叠。所述内侧盖板20在所述外侧盖板10的外表面11正投影区域与所述非显示区111相重合。具体的,所述外侧盖板10在与所述外表面11相背一侧设置于所述非显示区111相对的凹槽13,所述内侧盖板20在所述凹槽13处与所述外侧盖板10相层叠。所述通孔30由所述外表面11延伸至所述凹槽13,与所述凹槽13相贯通。所述凹槽13的深度等于所述内侧盖板20的厚度。所述第一贴合面21设置于所述凹槽13的底部,与所述非显示区111相对。所述外侧盖板20还包括与所述显示区112相对的显示屏贴合面14。所述显示屏贴合面14用以贴合所述显示屏。所述显示屏贴合面14与所述内侧盖板20的内表面22相平齐。利用所述外侧盖板10设置与所述非显示区111相对的凹槽13,从而使得所述内侧盖板20仅仅在与所述非显示区111相对的位置层叠于所述外侧盖板20,进而避免所述壳体100在所述显示区112的位置出现分层结构,进而避免了分层结构影响所述显示屏的透光性能,即提高所述壳体100在所述显示区112的显示性能,同时保证了所述壳体100的整体强度。当然,在其他实施方式中,所述内侧盖板20的厚度也可以大于所述凹槽13的深度,所述内表现22也可以相对所述显示屏贴合面14凸出。Three embodiments are provided, which are substantially the same as the first embodiment, please refer to FIG. 7 , the difference is that the
进一步地,请参阅3至图6,所述壳体100还包括油墨层50,所述油墨层50层叠于所述外层盖板10与所述外表面11相背一侧,并在所述外表面11的正投影区域与所述非显示区111相重合。Further, please refer to FIG. 3 to FIG. 6 , the
在第一实施例中,所述油墨层50层叠于所述内侧盖板20与所述外侧盖板10相背一侧,所述油墨层50在所述外侧盖板10的正投影区域覆盖所述外侧盖板10的通孔30。具体的,所述油墨层50经过丝网印刷工艺印刷于所述内侧盖板20的内表面22上。当然,在其他实施方式中,还可以在所述外侧盖板10的第一贴合面12增加印刷一层油墨层。In the first embodiment, the
在第二实施例中,所述油墨层50层叠于所述外侧盖板10和所述内侧盖板20之间,所述油墨层50遮盖所述内侧盖板20的通孔30。具体的,所述油墨层50经过丝网印刷工艺印刷于所述外侧盖板10的第一贴合面12上,所述内侧盖板20通过粘接于所述油墨层50,与所述外侧盖板10相结合。当然,在其他实施方式中,还可以在所述内侧盖板20的第二贴合面22增加印刷一层油墨层。In the second embodiment, the
请参阅8和图9,本发明还提供一种指纹模组200,所述指纹模组200包括所述壳体100,所述指纹模组200还包括指纹芯片40,所述指纹芯片40贴合于所述内侧盖板10相对所述外侧盖板20的通孔30处,或者经过所述内侧盖板20的通孔30贴合于所述外侧盖板10。Please refer to 8 and FIG. 9, the present invention further provides a
在第一实施例中,所述指纹芯片40贴合于所述内侧盖板10的内表面22与所述通孔30相对处。所述指纹模组200还包括与所述指纹芯片40焊接的基板60和电连接所述基板60的电路板70。所述电路板70为柔性电路板。当然,在其他实施方式中,所述电路板70还可以是印刷电路板。In the first embodiment, the
在第二实施例中,与所述第一实施例大致相同,不同的是,所述指纹芯片40经过所述通孔30贴合于所述外侧盖板10的第一贴合面12。The second embodiment is substantially the same as the first embodiment, except that the
请参阅图10,本发明还提供一种移动终端300,所述移动终端300包括所述指纹模组200,所述移动终端300还包括终端本体301和固定于所述终端本体301的主板302。所述壳体100与所述终端本体301相盖合,所述指纹芯片40经所述电路板70电连接所述主板302。所述指纹芯片40经所述内侧盖板20或经所述外侧盖板10接收用户指纹信息,并传递至主板302,主板302根据用户指纹信息控制移动终端300运行。所述移动终端300可为手机、电脑、平板、掌上游戏机或媒体播放器等智能移动终端。Referring to FIG. 10 , the present invention further provides a
本发明提供的壳体、指纹模组和移动终端,通过所述壳体包括相互层叠的外侧盖板和内侧盖板,而所述外侧盖板或所述内侧盖板设有通孔,进而保证了所述壳体在所述通孔处减小了指纹芯片与用户指纹的距离,方便指纹芯片采集指纹信息。并且,该通孔仅仅对所述外侧盖板或所述内侧盖板存在应力损伤,而所述壳体可以利用没有设置通孔的内侧盖板或没有设置通孔的外侧盖板得到应力补强,进而使得所述壳体的生产良率提高。In the case, fingerprint module and mobile terminal provided by the present invention, the case includes an outer cover plate and an inner cover plate that are stacked on each other, and the outer cover plate or the inner cover plate is provided with a through hole, thereby ensuring that The casing reduces the distance between the fingerprint chip and the user's fingerprint at the through hole, which facilitates the fingerprint chip to collect fingerprint information. In addition, the through hole only causes stress damage to the outer cover plate or the inner cover plate, and the shell can be stress reinforced by using the inner cover plate without through holes or the outer cover plate without through holes , thereby improving the production yield of the casing.
以上所述的实施方式,并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等,均应包含在该技术方案的保护范围之内。The above-mentioned embodiments do not constitute a limitation on the protection scope of the technical solution. Any modifications, equivalent replacements and improvements made within the spirit and principles of the above-mentioned embodiments shall be included within the protection scope of this technical solution.
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CN108664081B (en) * | 2017-03-31 | 2024-04-09 | 荣耀终端有限公司 | Fingerprint identification device and terminal equipment |
CN107092311B (en) * | 2017-04-27 | 2020-03-03 | Oppo广东移动通信有限公司 | Display screen, display device and mobile terminal |
CN107105077A (en) * | 2017-05-09 | 2017-08-29 | 广东欧珀移动通信有限公司 | Display and mobile terminal |
CN107040626A (en) * | 2017-05-09 | 2017-08-11 | 广东欧珀移动通信有限公司 | Display and mobile terminal |
CN107577278B (en) * | 2017-09-14 | 2020-02-04 | 维沃移动通信有限公司 | Display screen assembly and mobile terminal |
WO2019061500A1 (en) * | 2017-09-30 | 2019-04-04 | 深圳传音制造有限公司 | Electronic device |
CN110321876B (en) * | 2019-07-24 | 2021-05-25 | 维沃移动通信有限公司 | Capacitance fingerprint identification module and terminal equipment |
CN111198598A (en) * | 2019-12-19 | 2020-05-26 | 东莞宇龙通信科技有限公司 | Fingerprint module, installation method of fingerprint module and terminal |
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