CN106354332A - Electronic device, touch display screen, touch assembly and touch conductive film - Google Patents

Abstract

The invention relates to an electronic device, a touch display screen, a touch component and a touch conductive film thereof. The touch conductive film includes a transparent substrate, a conductive layer, a first electrode lead, a second electrode lead, an insulating protective layer and an adhesive layer. knot layer, by providing an adhesive layer around the edge of the insulating protective layer, and the adhesive layer is located between the edge of the insulating protective layer and the transparent substrate, and the edge of the insulating protective layer is attached to the transparent substrate through the adhesive layer, so The adhesion between the adhesive layer and the transparent substrate, and the adhesion between the insulating protective layer and the adhesive layer are greater than the adhesive force when the insulating protective layer is directly attached to the transparent substrate, and the adhesive layer itself has a certain thickness. , when the insulating protective layer is attached to the transparent substrate through the adhesive layer, the tensile force generated by the edge of the insulating protective layer is smaller than that generated by the edge of the insulating protective layer when the insulating protective layer is directly attached to the transparent substrate, which can effectively avoid The outer edge of the insulating protective layer is peeled off.

Description

Electronic equipment, touch display screen, touch component and touch conductive film

technical field

The invention relates to the field of electronic technology, in particular to an electronic device, a touch display screen, a touch component and a touch conductive film thereof.

Background technique

With the development of electronic technology, in order to protect the circuit from oxidation, isolate water vapor, and improve product reliability, most touch screen electronic devices will add an insulating protective layer. Due to the limitation of the narrow frame, the shape design of the insulating protective layer will be 0.5mm larger than the overall functional circuit, but because there is a gap between the insulating protective layer and the film substrate, and the adhesion between the insulating protective layer and the film substrate cannot reach To meet the requirements of reliability, it is easy to cause the appearance edge of the insulating protective layer to fall off, thereby reducing the quality of the product.

Contents of the invention

Based on this, it is necessary to address the above-mentioned technical problems and provide an electronic device, a touch display screen, a touch component and a touch conductive film thereof that can effectively prevent the appearance edge of the insulating protective layer from falling off.

A touch conductive film, comprising:

a transparent substrate, including a first surface and a second surface disposed away from the first surface;

a first conductive layer disposed on the first surface of the transparent substrate;

a first electrode lead electrically connected to the first conductive layer;

a first insulating protection layer, covering the first conductive layer and the surface of the first electrode lead;

The first adhesive layer is disposed on the first surface of the transparent substrate, the first adhesive layer is disposed around the edge of the first insulating protection layer, and is located between the edge of the first insulating protection layer and the first insulating protection layer. Between the first surface of the transparent substrate, the edge of the first insulating protection layer is attached to the first surface of the transparent substrate through the first adhesive layer, and the first adhesive layer is connected to the first surface of the transparent substrate. Intervals are arranged between the first conductive layers;

a second conductive layer disposed on the second surface of the transparent substrate;

a second electrode lead electrically connected to the second conductive layer;

a second insulating protective layer covering the surface of the second conductive layer and the second electrode lead; and

The second adhesive layer is disposed on the second surface of the transparent substrate, the second adhesive layer is disposed around the edge of the second insulating protection layer, and is located between the edge of the second insulating protection layer and the second insulating protection layer. Between the second surface of the transparent substrate, the edge of the second insulating protection layer is attached to the second surface of the transparent substrate through the second adhesive layer, and the second adhesive layer is connected to the second surface of the transparent substrate. The second conductive layers are arranged at intervals.

In one of the embodiments, the first adhesive layer is made of the same material as the first conductive layer, and is formed on the first surface of the transparent substrate through the same processing step; and/or

The second adhesive layer is made of the same material as the second conductive layer, and is formed on the second surface of the transparent substrate through the same processing step.

In one of the embodiments, the first bonding layer comprises a plurality of first bonding blocks arranged at intervals; and/or

The second adhesive layer includes a plurality of second adhesive blocks arranged at intervals.

In one of the embodiments, the first adhesive layer is partially located between the edge of the first insulating protection layer and the transparent substrate, and the remaining part is exposed to the first insulating protection layer; and/or

The second adhesive layer is partially located between the edge of the second insulating protection layer and the transparent substrate, and the remaining part is exposed on the second insulating protection layer.

A touch conductive film, comprising:

a transparent substrate, including a first surface and a second surface disposed away from the first surface;

a conductive layer disposed on the first surface of the transparent substrate, the conductive layer includes a first conductive pattern and a second conductive pattern, and the first conductive pattern and the second conductive pattern are insulated from each other;

a first electrode lead electrically connected to the first conductive pattern;

a second electrode lead electrically connected to the second conductive pattern;

an insulating protective layer covering the surface of the conductive layer, the first electrode lead and the second electrode lead; and

An adhesive layer, arranged on the first surface of the transparent substrate, the adhesive layer is arranged around the edge of the insulating protective layer, and is located between the edge of the insulating protective layer and the first surface of the transparent substrate In between, the edge of the insulating protection layer is attached to the first surface of the transparent substrate through the adhesive layer, and the adhesive layer is spaced apart from the conductive layer.

In one embodiment, the adhesive layer is made of the same material as the conductive layer.

A touch conductive film, comprising:

a transparent substrate, including a first surface and a second surface disposed away from the first surface;

a first conductive layer disposed on the first surface of the transparent substrate;

a first electrode lead electrically connected to the first conductive layer;

The second conductive layer is located on the same side of the transparent substrate as the first conductive layer;

a second electrode lead electrically connected to the second conductive layer;

an insulating layer, located between the first conductive layer and the second conductive layer, to insulate the first conductive layer and the second conductive layer from each other;

an insulating protective layer covering the surface of the second conductive layer and the second electrode lead; and

An adhesive layer, arranged on the first surface of the transparent substrate, the adhesive layer is arranged around the edge of the insulating protective layer, and is located between the edge of the insulating protective layer and the first surface of the transparent substrate Between, the edge of the insulating protection layer is attached to the first surface of the transparent substrate through the adhesive layer, and the adhesive layer is spaced from the first conductive layer and the second conductive layer set up.

A touch component, characterized in that, comprising:

The touch conductive film as described in any one of the above; and

The flexible circuit board is respectively bound to the first electrode lead and the second electrode lead.

A touch display, comprising:

The touch conductive film as described in any one of the above;

a flexible circuit board, respectively bound to the first electrode lead and the second electrode lead; and

display screen.

An electronic device comprising:

Touchscreen display as described above.

The above touch conductive film has at least the following advantages:

By disposing the (first, second) adhesive layer around the edge of the (first, second) insulating protection layer, and the (first, second) adhesive layer is located on the (first, second) insulating protective layer Between the edge and the transparent substrate, the edges of the (first, second) insulating protective layer are attached to the transparent substrate through the (first, second) adhesive layer, so the (first, second) adhesive layer and The adhesion between the transparent substrates, the adhesion between the (first, second) insulating protective layer and the (first, second) adhesive layer are all greater than the (first, second) insulating protective layer directly attached to the Adhesion on the transparent substrate, and the (first, second) adhesive layer itself has a certain thickness, and the (first, second) insulating protection layer is attached to the transparent substrate through the (first, second) adhesive layer. When on the material, the tensile force produced by the edge of the insulating protective layer is less than that produced by the edge of the insulating protective layer when the insulating protective layer is directly attached to the transparent substrate, which can effectively avoid the shape of the (first, second) insulating protective layer The edges are peeling off.

Description of drawings

FIG. 1 is a schematic structural view of a touch component in an embodiment;

2 is a cross-sectional view of the touch conductive film in the first embodiment;

3 is a cross-sectional view of a touch conductive film in a second embodiment;

4 is a cross-sectional view of a touch conductive film in a third embodiment;

FIG. 5 is a cross-sectional view of the touch conductive film in the fourth embodiment.

detailed description

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

An electronic device in an embodiment includes a touch display screen. The touch display screen includes a display screen and a touch control component, and the display screen is used for displaying various information such as text, graphics, images, animations, quotations, video, and video signals.

Please refer to FIG. 1 and FIG. 2 together. The touch component 10 includes a flexible circuit board 101 and a touch conductive film 100 . The flexible circuit board 101 is electrically connected to the touch conductive film 100 . Specifically, in the first embodiment, the touch conductive film 100 is a double-sided single-layer conductive structure. The touch conductive film 100 includes a transparent substrate 110, a first conductive layer 120, a first electrode lead 130, a first insulating protection layer 140, a first adhesive layer 150, a second conductive layer 160, a second electrode lead 170, a first Two insulation protection layers 180 and a second bonding layer 190 .

The transparent substrate 110 includes a first surface 111 and a second surface 112 disposed away from the first surface 111 . The transparent substrate 110 can be made of transparent glass material, or can be made of transparent PET material.

The first conductive layer 120 is disposed on the first surface 111 of the transparent substrate 110 . Specifically in this embodiment, the first conductive layer 120 may be formed of a transparent conductive material through an exposure-development-etching process. For example, the first conductive layer 120 may be a transparent material such as ITO.

The first electrode lead 130 is electrically connected to the first conductive layer 120 . Specifically, in this embodiment, one end of the first electrode lead 130 is overlapped on the first conductive layer 120 , that is, the first electrode lead 130 and the first conductive layer 120 are located in different planes. The other end of the first electrode lead 130 extends to the pin area to be electrically connected to the pin, and the flexible circuit board 101 is bound to the first electrode lead 130 through pin binding in the pin area.

Of course, as shown in FIG. 3 , in the second embodiment, one end of the first electrode lead 130 is directly connected to the end of the first conductive layer 120 , that is, the first electrode lead 130 and the first conductive layer 120 are located at the same in plane. The other end of the first electrode lead 130 extends to the pin area to be electrically connected to the pin, and the flexible circuit board 101 is bound to the first electrode lead 130 through pin binding in the pin area.

The first insulating protection layer 140 covers the surface of the first conductive layer 120 and the first electrode lead 130 . Specifically, the area of the first insulating protection layer 140 is greater than the area of the overall functional circuit formed by the first conductive layer 120 and the first electrode lead 130, so as to ensure that the first insulating protection layer 140 has a positive impact on the first conductive layer 120 and the first electrode. The protection of the lead wire 130 protects the circuit from oxidation, isolates water vapor, and improves the reliability of the product. The first insulating protection layer 140 may be formed of insulating ink or photosensitive resin dry film.

The first adhesive layer 150 is disposed on the first surface 111 of the transparent substrate 110, the first adhesive layer 150 is disposed around the edge of the first insulating protection layer 140, and is located between the edge of the first insulating protective layer 140 and the transparent substrate 110. Between the first surface 111 of the. The edge of the first insulating protective layer 140 is attached to the first surface 111 of the transparent substrate 110 through the first adhesive layer 150, and the first adhesive layer 150 is used to increase the distance between the first insulating protective layer 140 and the transparent substrate 110. Adhesion.

The first adhesive layer 150 is spaced apart from the first conductive layer 120 . The first adhesive layer 150 is made of the same material as the first conductive layer 120 , and is formed on the first surface 111 of the transparent substrate 110 simultaneously with the first conductive layer 120 . Because the added first adhesive layer 150 is made of the same material as the first conductive layer 120, both of which are transparent conductive materials, and the first adhesive layer 150 is not connected to the first conductive layer 120, so it can isolate the peripheral static electricity from the first conductive layer. layer 120, and the first adhesive layer 150 and the first conductive layer 120 are formed simultaneously through the same process, which can simplify the process steps and improve production efficiency.

Specifically in this embodiment, the first bonding layer 150 includes a plurality of first bonding blocks 151 arranged at intervals. The first bonding block 151 is roughly rectangular, and a plurality of first bonding blocks 151 together surround the large rectangular shape of the first insulating protection layer 140 . Therefore, the first insulating protective layer 140 is attached to the transparent substrate 110 through the small rectangular first adhesive blocks 151 one by one. When one or some of the first adhesive blocks 151 fall off, it will not affect the entire first insulating layer. The protection layer 140 is peeled off from the transparent substrate 110 .

Specifically in this embodiment, the first adhesive layer 150 is partly located between the edge of the first insulating protection layer 140 and the transparent substrate 110 , and the remaining part is exposed to the first insulating protection layer 140 . Therefore, the impact of the peripheral static electricity on the first conductive layer 120 can be effectively isolated. Of course, in other embodiments, the first adhesive layer 150 can also be entirely located between the edge of the first insulating protection layer 140 and the transparent substrate 110, that is, the entire surface of the first adhesive layer 150 is connected to the first insulating protective layer. 140 to increase the adhesion between the first bonding layer 150 and the first insulating protection layer 140 .

The second conductive layer 160 is disposed on the second surface 112 of the transparent substrate 110 . That is, the first conductive layer 120 and the second conductive layer 160 are respectively located on different sides of the transparent substrate 110 . Specifically in this embodiment, the second conductive layer 160 may be formed of a transparent conductive material through an exposure-development-etching process. The material of the second conductive layer 160 may be the same as that of the first conductive layer 120 . For example, the second conductive layer 160 may be a transparent material such as ITO.

The second electrode lead 170 is electrically connected to the second conductive layer 160 . Specifically in this embodiment, one end of the second electrode lead 170 is overlapped on the second conductive layer 160 , that is, the second electrode lead 170 and the second conductive layer 160 are located in different planes. The other end of the second electrode lead 170 extends to the pin area to be electrically connected to the pin, and the flexible circuit board 101 is bound to the second electrode lead 170 through pin binding in the pin area.

Of course, as shown in FIG. 3 , in the second embodiment, one end of the second electrode lead 170 is directly connected to the end of the second conductive layer 160 , that is, the second electrode lead 170 and the second conductive layer 160 are located at the same in plane. The other end of the second electrode lead 170 extends to the pin area to be electrically connected to the pin, and the flexible circuit board 101 is bound to the first electrode lead 130 through pin binding in the pin area.

The second insulating protection layer 180 covers the surface of the second conductive layer 160 and the second electrode lead 170 . Specifically, the area of the second insulating protection layer 180 is greater than the area of the overall functional circuit formed by the second conductive layer 160 and the second electrode lead 170, so as to ensure that the second insulating protection layer 180 has a positive impact on the second conductive layer 160 and the second electrode. The protection of the lead wire 170 protects the circuit from oxidation, isolates water vapor, and improves the reliability of the product. The second insulating protection layer 180 may be formed of insulating ink or photosensitive resin dry film.

The second adhesive layer 190 is disposed on the second surface 112 of the transparent substrate 110, the second adhesive layer 190 is disposed around the edge of the second insulating protection layer 180, and is located between the edge of the second insulating protective layer 180 and the transparent substrate 110. Between the second surface 112 of the. The edge of the second insulating protection layer 180 is attached to the second surface 112 of the transparent substrate 110 through the second adhesive layer 190, and the second adhesive layer 190 is used to increase the distance between the second insulating protective layer 180 and the transparent substrate 110. Adhesion.

The second adhesive layer 190 is spaced apart from the second conductive layer 160 . The second adhesive layer 190 is made of the same material as the second conductive layer 160 , and is formed on the second surface 112 of the transparent substrate 110 at the same time as the second conductive layer 160 . Because the added second adhesive layer 190 is made of the same material as the second conductive layer 160, both are transparent conductive materials, and the second adhesive layer 190 is not connected with the second conductive layer 160, so it can simultaneously isolate the peripheral static electricity from the second conductive layer. The influence of the conductive layer 160, and the second adhesive layer 190 and the second conductive layer 160 are formed simultaneously through the same process, which can simplify the process steps and improve the production efficiency.

Specifically in this embodiment, the second adhesive layer 190 includes a plurality of second adhesive blocks (not shown) arranged at intervals. The second bonding blocks are roughly rectangular, and a plurality of second bonding blocks collectively surround the large rectangular shape of the second insulating protection layer 180 . Therefore, the second insulating protection layer 180 is attached to the transparent substrate 110 through small rectangular second bonding blocks. When one or some of the second bonding blocks fall off, the entire second insulating protecting layer will not be affected. 180 is peeled off from the transparent substrate 110 .

Specifically in this embodiment, the second adhesive layer 190 is partly located between the edge of the second insulating protection layer 180 and the transparent substrate 110 , and the remaining part is exposed to the second insulating protection layer 180 . Therefore, the impact of the peripheral static electricity on the second conductive layer 160 can be effectively isolated. Of course, in other embodiments, the second adhesive layer 190 can also be entirely located between the edge of the second insulating protection layer 180 and the transparent substrate 110, that is, the entire surface of the second adhesive layer 190 is connected to the second insulating protective layer. 180 to increase the adhesion between the second adhesive layer 190 and the second insulating protection layer 180 .

The above touch conductive film 100 has at least the following advantages:

By setting the first adhesive layer 150 around the edge of the first insulating protective layer 140, and the first adhesive layer 150 is located between the edge of the first insulating protective layer 140 and the transparent substrate 110, the edge of the first insulating protective layer 140 Attached to the transparent substrate 110 through the first adhesive layer 150, a second adhesive layer 190 is provided around the edge of the second insulating protection layer 180, and the second adhesive layer 190 is located between the edge of the second insulating protective layer 180 and the transparent Between the substrates 110, the edge of the second insulating protection layer 180 is attached to the transparent substrate 110 through the second adhesive layer 190, so that the first adhesive layer 150, the second adhesive layer 190 and the transparent substrate 110 The adhesion between the first insulating protective layer 140 and the first adhesive layer 150, the second insulating protective layer 180 and the second adhesive layer 190 are all greater than the first insulating protective layer 140, the second insulating protective layer 180 is directly attached to the transparent substrate 110, and the first adhesive layer 150 and the second adhesive layer 190 themselves have a certain thickness, the pull produced by the edges of the first insulating protective layer 140 and the second insulating protective layer 180 The stretching force is less than the stretching force produced when the first insulating protective layer 140 and the second insulating protective layer 180 are directly attached to the transparent substrate 110, which can effectively avoid the shape edge of the first insulating protective layer 140 and the second insulating protective layer 180. Shedding occurs.

Please refer to FIG. 4 , which is a partial cross-sectional view of the touch conductive film in the third embodiment. In this embodiment, the touch conductive film includes a single-sided single-layer conductive structure. The touch conductive film includes a transparent substrate 310 , a conductive layer 320 , a first electrode lead 330 , a second electrode lead (not shown), an insulating protection layer 340 and an adhesive layer 350 .

The transparent substrate 310 includes a first surface 311 and a second surface 312 disposed away from the first surface 311 . The transparent substrate 310 can be made of transparent glass material, or can be made of transparent PET material.

The conductive layer 320 is disposed on the first surface 311 of the transparent substrate 310 . The conductive layer 320 includes a first conductive pattern and a second conductive pattern, and the first conductive pattern and the second conductive pattern are insulated from each other. The conductive layer 320 can be formed of a transparent conductive material through an exposure-development-etching process. For example, the conductive layer 320 may be a transparent material such as ITO.

The first electrode lead 330 is electrically connected with the first conductive pattern. Specifically in this embodiment, one end of the first electrode lead 330 overlaps the first conductive pattern, that is, the first electrode lead 330 and the first conductive pattern are located in different planes. The other end of the first electrode lead 330 extends to the pin area to be electrically connected to the pin, and the flexible circuit board is bound to the first electrode lead 330 through pin binding in the pin area.

Of course, in other embodiments, one end of the first electrode lead 330 is directly connected to the end of the first conductive pattern, that is, the first electrode lead 330 and the first conductive pattern are located in the same plane. The other end of the first electrode lead 330 extends to the pin area to be electrically connected to the pin, and the flexible circuit board is bound to the first electrode lead 330 through pin binding in the pin area.

The second electrode lead is electrically connected with the second conductive pattern. Specifically, in this embodiment, one end of the second electrode lead is overlapped on the second conductive pattern, that is, the second electrode lead and the first conductive pattern are located in different planes. The other end of the second electrode lead extends to the pin area to be electrically connected to the pin, and the flexible circuit board is bound to the second electrode lead through the pin binding of the pin area.

Of course, in other embodiments, one end of the second electrode lead is directly connected to the end of the second conductive pattern, that is, the second electrode lead and the second conductive pattern are located in the same plane. The other end of the second electrode lead extends to the pin area to be electrically connected to the pin, and the flexible circuit board is bound to the second electrode lead through the pin binding of the pin area.

The insulating protection layer 340 covers the surfaces of the conductive layer 320 , the first electrode leads 330 and the second electrode leads. Specifically, the area of the insulating protective layer 340 is greater than the area of the overall functional circuit formed by the conductive layer 320, the first electrode lead 330 and the second electrode lead, so as to ensure that the insulating protective layer 340 is opposite to the conductive layer 320, the first electrode lead 330 and the second electrode lead. The protection of the second electrode leads protects the circuit from oxidation, isolates water vapor, and improves product reliability. The insulating protective layer 340 may be formed of insulating ink or photosensitive resin dry film.

The adhesive layer 350 is disposed on the first surface 311 of the transparent substrate 310 . The adhesive layer 350 is disposed around the edge of the insulating protection layer 340 and between the edge of the insulating protection layer 340 and the first surface 311 of the transparent substrate 310 . The edge of the insulating protection layer 340 is attached to the first surface 311 of the transparent substrate 310 through the adhesive layer 350 , and the adhesive layer 350 is used to increase the adhesion between the insulating protection layer 340 and the transparent substrate 310 .

The adhesive layer 350 is spaced apart from the conductive layer 320 . The adhesive layer 350 is made of the same material as the conductive layer 320 , and is formed on the first surface 311 of the transparent substrate 310 simultaneously with the conductive layer 320 . Because the added adhesive layer 350 is made of the same material as the conductive layer 320, both are transparent conductive materials, and the adhesive layer 350 is not connected to the conductive layer 320, so it can isolate the influence of the peripheral static electricity on the conductive layer 320, and the adhesive layer 350 Forming simultaneously with the conductive layer 320 through the same process can simplify process steps and improve production efficiency.

Specifically in this embodiment, the adhesive layer 350 includes a plurality of adhesive blocks arranged at intervals. The bonding blocks are roughly rectangular, and a plurality of bonding blocks collectively surround the large rectangular shape of the insulating protection layer 340 . Therefore, the insulating protective layer 340 is attached to the transparent substrate 310 through small rectangular adhesive blocks, and when one or some of the adhesive blocks fall off, the entire insulating protective layer 340 will not be affected from falling off from the transparent substrate 310 .

Specifically in this embodiment, part of the adhesive layer 350 is located between the edge of the insulating protection layer 340 and the transparent substrate 310 , and the remaining part is exposed to the insulating protection layer 340 . Therefore, the effect of the peripheral static electricity on the conductive layer 320 can be effectively isolated. Of course, in other embodiments, the adhesive layer 350 can also be entirely located between the edge of the insulating protective layer 340 and the transparent substrate 310, that is, the entire surface of the adhesive layer 350 is connected to the insulating protective layer 340, increasing the bonding layer 350 and the adhesion between the insulating protective layer 340.

The above touch conductive film has at least the following advantages:

By setting the adhesive layer 350 around the edge of the insulating protective layer 340, and the adhesive layer 350 is located between the edge of the insulating protective layer 340 and the transparent substrate 310, the edge of the insulating protective layer 340 is attached to the transparent substrate through the adhesive layer 350. Therefore, the adhesive force between the adhesive layer 350 and the transparent substrate 310 and the adhesive force between the insulating protective layer 340 and the adhesive layer 350 are greater than that when the insulating protective layer 340 is directly attached to the transparent substrate 310. Adhesion, and the adhesive layer 350 itself has a certain thickness, when the insulating protective layer 340 is attached to the transparent substrate 310 through the adhesive layer 350, the tensile force generated by the edge of the insulating protective layer 340 is less than that of the insulating protective layer 340 directly attached to the transparent substrate 310. The tensile force generated by the edge of the insulating protection layer 340 when it is on the base material 310 can effectively prevent the edge of the insulating protection layer 340 from falling off.

Please refer to FIG. 5 , which is a partial cross-sectional view of the touch conductive film in the fourth embodiment. In this embodiment, the touch conductive film includes a single-sided double-layer conductive structure. The touch conductive film includes a transparent substrate 410 , a first conductive layer 420 , a first electrode lead 430 , a second conductive layer 440 , a second electrode lead 450 , an insulating layer 460 , an insulating protection layer 470 and an adhesive layer 480 .

The transparent substrate 410 includes a first surface 411 and a second surface 412 disposed away from the first surface 411 . The transparent substrate 410 can be made of transparent glass material, or can be made of transparent PET material.

The first conductive layer 420 is disposed on the first surface 411 of the transparent substrate 410 . Specifically in this embodiment, the first conductive layer 420 may be formed of a transparent conductive material through an exposure-development-etching process. For example, the first conductive layer 420 may be a transparent material such as ITO.

The first electrode lead 430 is electrically connected to the first conductive layer 420 . Specifically in this embodiment, one end of the first electrode lead 430 is overlapped on the first conductive layer 420 , that is, the first electrode lead 430 and the first conductive layer 420 are located in different planes. The other end of the first electrode lead 430 extends to the pin area to be electrically connected to the pin, and the flexible circuit board is bound to the first electrode lead 430 through pin binding in the pin area.

Of course, in other embodiments, one end of the first electrode lead 430 is directly connected to the end of the first conductive layer 420 , that is, the first electrode lead 430 and the first conductive layer 420 are located in the same plane. The other end of the first electrode lead 430 extends to the pin area to be electrically connected to the pin, and the flexible circuit board is bound to the first electrode lead 430 through pin binding in the pin area.

The second conductive layer 440 is located on the same side of the transparent substrate 410 as the first conductive layer 420 . The insulating layer 460 is located between the first conductive layer 420 and the second conductive layer 440 to insulate the first conductive layer 420 and the second conductive layer 440 from each other. Specifically in this embodiment, the second conductive layer 440 may be formed of a transparent conductive material through an exposure-development-etching process. The material of the second conductive layer 440 may be the same as that of the first conductive layer 420 . For example, the second conductive layer 440 may be a transparent material such as ITO.

The second electrode lead 450 is electrically connected to the second conductive layer 440 . Specifically in this embodiment, one end of the second electrode lead 450 is overlapped on the second conductive layer 440 , that is, the second electrode lead 450 and the second conductive layer 440 are located in different planes. The other end of the second electrode lead 450 extends to the pin area to be electrically connected to the pin, and the flexible circuit board is bound to the second electrode lead 450 through pin binding in the pin area.

Of course, in other embodiments, one end of the second electrode lead 450 is directly connected to the end of the second conductive layer 440 , that is, the second electrode lead 450 and the second conductive layer 440 are located in the same plane. The other end of the second electrode lead 450 extends to the pin area to be electrically connected to the pin, and the flexible circuit board is bound to the first electrode lead 430 through pin binding in the pin area.

The insulating protection layer 470 covers the surface of the second conductive layer 440 and the second electrode lead 450 . Specifically, the area of the insulating protection layer 470 is greater than the area of the overall functional circuit formed by the second conductive layer 440 and the second electrode lead 450, so as to ensure that the insulating protection layer 470 protects the second conductive layer 440 and the second electrode lead 450. , Protect the circuit from oxidation, isolate water vapor, and improve product reliability. The insulating protective layer 470 may be formed of insulating ink or photosensitive resin dry film.

The adhesive layer 480 is disposed on the first surface 411 of the transparent substrate 410 . The adhesive layer 480 is disposed around the edge of the insulating protection layer 470 and is located between the edge of the insulating protection layer 470 and the first surface 411 of the transparent substrate 410 . The edge of the insulating protection layer 470 is attached to the first surface 411 of the transparent substrate 410 through the adhesive layer 480 , and the adhesive layer 480 is used to increase the adhesion between the insulating protection layer 470 and the transparent substrate 410 .

The adhesive layer 480 is spaced apart from the first conductive layer 420 and the second conductive layer 440 . The adhesive layer 480 is made of the same material as the first conductive layer 420 , and is formed on the first surface 411 of the transparent substrate 410 simultaneously with the first conductive layer 420 . Because the added adhesive layer 480 is made of the same material as the first conductive layer 420, both of which are transparent conductive materials, and the adhesive layer 480 is not connected to the conductive layer, it can simultaneously isolate the impact of peripheral static electricity on the first conductive layer 420, and The adhesive layer 480 and the first conductive layer 420 are formed through the same process, which can simplify the process steps and improve the production efficiency.

Specifically in this embodiment, the adhesive layer 480 includes a plurality of adhesive blocks arranged at intervals. The bonding blocks are roughly rectangular, and a plurality of bonding blocks collectively surround the large rectangular shape of the insulating protection layer 470 . Therefore, the insulating protective layer 470 is attached to the transparent substrate 410 through small rectangular adhesive blocks one by one. When one or some of the adhesive blocks fall off, the entire insulating protective layer 470 will not be affected from falling off from the transparent substrate 410. .

Specifically in this embodiment, part of the adhesive layer 480 is located between the edge of the insulating protection layer 470 and the transparent substrate 410 , and the remaining part is exposed to the insulating protection layer 470 . Therefore, the impact of the peripheral static electricity on the conductive layer can be effectively isolated. Of course, in other embodiments, the adhesive layer 480 can also be entirely located between the edge of the insulating protective layer 470 and the transparent substrate 410, that is, the entire surface of the adhesive layer 480 is connected to the insulating protective layer 470, increasing the bonding layer 480 and the adhesion between the insulating protective layer 470.

The above touch conductive film has at least the following advantages:

By setting the adhesive layer 480 around the edge of the insulating protective layer 470, and the adhesive layer 480 is located between the edge of the insulating protective layer 470 and the transparent substrate 410, the edge of the insulating protective layer 470 is attached to the transparent substrate through the adhesive layer 480 410, so the adhesion between the adhesive layer 480 and the transparent substrate 410, and the adhesion between the insulating protective layer 470 and the adhesive layer 480 are greater than when the insulating protective layer 470 is directly attached to the transparent substrate 410. In addition, the adhesive layer 480 itself has a certain thickness, and the stretching force produced by the edge of the insulating protective layer 470 is smaller than that produced when the insulating protective layer 470 is directly attached to the transparent substrate 410, which can effectively avoid the insulating protective layer 470. The edge of the shape is peeled off.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. A touch conductive film, characterized in that, comprising: a transparent substrate, including a first surface and a second surface disposed away from the first surface; a first conductive layer disposed on the first surface of the transparent substrate; a first electrode lead electrically connected to the first conductive layer; a first insulating protection layer, covering the first conductive layer and the surface of the first electrode lead; The first adhesive layer is disposed on the first surface of the transparent substrate, the first adhesive layer is disposed around the edge of the first insulating protection layer, and is located between the edge of the first insulating protection layer and the first insulating protection layer. Between the first surface of the transparent substrate, the edge of the first insulating protection layer is attached to the first surface of the transparent substrate through the first adhesive layer, and the first adhesive layer is connected to the first surface of the transparent substrate. Intervals are arranged between the first conductive layers; a second conductive layer disposed on the second surface of the transparent substrate; a second electrode lead electrically connected to the second conductive layer; a second insulating protective layer covering the surface of the second conductive layer and the second electrode lead; and The second adhesive layer is disposed on the second surface of the transparent substrate, the second adhesive layer is disposed around the edge of the second insulating protection layer, and is located between the edge of the second insulating protection layer and the second insulating protection layer. Between the second surface of the transparent substrate, the edge of the second insulating protection layer is attached to the second surface of the transparent substrate through the second adhesive layer, and the second adhesive layer is connected to the second surface of the transparent substrate. The second conductive layers are arranged at intervals. 2. The touch conductive film according to claim 1, wherein the first adhesive layer is made of the same material as the first conductive layer, and is formed on the first layer of the transparent substrate through the same processing step. surface; and/or The second adhesive layer is made of the same material as the second conductive layer, and is formed on the second surface of the transparent substrate through the same processing step. 3. The touch conductive film according to claim 1, wherein the first bonding layer comprises a plurality of first bonding blocks arranged at intervals; and/or The second adhesive layer includes a plurality of second adhesive blocks arranged at intervals. 4. The touch conductive film according to claim 1, wherein the first adhesive layer is partly located between the edge of the first insulating protection layer and the transparent substrate, and the remaining part is exposed on the said transparent substrate. the first insulating protective layer; and/or The second adhesive layer is partially located between the edge of the second insulating protection layer and the transparent substrate, and the remaining part is exposed on the second insulating protection layer. 5. A touch conductive film, characterized in that, comprising: a transparent substrate, including a first surface and a second surface disposed away from the first surface; a conductive layer disposed on the first surface of the transparent substrate, the conductive layer includes a first conductive pattern and a second conductive pattern, and the first conductive pattern and the second conductive pattern are insulated from each other; a first electrode lead electrically connected to the first conductive pattern; a second electrode lead electrically connected to the second conductive pattern; an insulating protective layer covering the surface of the conductive layer, the first electrode lead and the second electrode lead; and An adhesive layer, arranged on the first surface of the transparent substrate, the adhesive layer is arranged around the edge of the insulating protective layer, and is located between the edge of the insulating protective layer and the first surface of the transparent substrate In between, the edge of the insulating protection layer is attached to the first surface of the transparent substrate through the adhesive layer, and the adhesive layer is spaced apart from the conductive layer. 6 . The touch conductive film according to claim 5 , wherein the adhesive layer is made of the same material as the conductive layer. 7. A touch conductive film, characterized in that, comprising: a transparent substrate, including a first surface and a second surface disposed away from the first surface; a first conductive layer disposed on the first surface of the transparent substrate; a first electrode lead electrically connected to the first conductive layer; The second conductive layer is located on the same side of the transparent substrate as the first conductive layer; a second electrode lead electrically connected to the second conductive layer; an insulating layer, located between the first conductive layer and the second conductive layer, to insulate the first conductive layer and the second conductive layer from each other; an insulating protective layer covering the surface of the second conductive layer and the second electrode lead; and An adhesive layer, arranged on the first surface of the transparent substrate, the adhesive layer is arranged around the edge of the insulating protective layer, and is located between the edge of the insulating protective layer and the first surface of the transparent substrate Between, the edge of the insulating protective layer is attached to the first surface of the transparent substrate through the adhesive layer, and the adhesive layer is spaced from the first conductive layer and the second conductive layer set up. 8. A touch component, characterized in that, comprising: The touch conductive film according to any one of claims 1 to 7; and The flexible circuit board is respectively bound to the first electrode lead and the second electrode lead. 9. A touch display screen, characterized in that it comprises: The touch conductive film according to any one of claims 1 to 7; a flexible circuit board, respectively bound to the first electrode lead and the second electrode lead; and display screen. 10. An electronic device, characterized in that it comprises: The touch display screen as claimed in claim 9.