CN106353331A - Wafer quality detection device - Google Patents
Wafer quality detection device Download PDFInfo
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- CN106353331A CN106353331A CN201610972714.8A CN201610972714A CN106353331A CN 106353331 A CN106353331 A CN 106353331A CN 201610972714 A CN201610972714 A CN 201610972714A CN 106353331 A CN106353331 A CN 106353331A
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- robot
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- Life Sciences & Earth Sciences (AREA)
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- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
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- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention discloses a wafer quality detecting device, which comprises a frame, an upper computer, a camera, a robot, a moving light source, a vacuum suction head, a vacuum source, a working table for carrying a wafer matrix and a control circuit, wherein the working table and the robot are mounted at the lower part of the frame, and the robot is located on one side of the working table; the camera is installed at the upper part of the frame, and faces towards the working table; the moving light source is installed at the middle part of the frame, and is located above the working table; the vacuum suction head is fixed on the manipulator of the robot, and faces towards the working table; the control circuit comprises a controller, the input end of the controller is connected with the output end of the upper computer, the control end of the moving light source is connected with the control signal output end of the controller; and the robot is in separate communication connection with the upper computer and the controller, and the camera is in communication connection with the upper computer. The wafer quality detecting device disclosed by the invention has a simple structure and less operating steps, and can carry out accurate identification and recognition of a large number of wafers at one time, resulting in high production efficiency.
Description
[technical field]
The present invention relates to wafer quality detection, more particularly, to a kind of wafer quality detection means.
[background technology]
With developing rapidly of quartz crystal industry, product type also increasingly tends to miniaturization, at present to quartz wafer
Quality testing be in and manually with the naked eye directly observed or be observed with magnifier.Due to there are subjective factorss, each
The touchstone of people can be different.And the miniaturization with product, artificial naked-eye observation difficulty is increasing, therefore manually examines
Survey the requirement that can not meet market and technique processing.
The utility model of Patent No. cn201020120666.8 discloses a kind of chip appearance detection device, and it includes bottom
Plate, the supply assembly being arranged on base plate, vision-based detection assembly and rewinding assembly and a host computer, supply assembly includes supplying
Material camera, feed suction nozzle and bulk cargo disk；Vision-based detection assembly includes having the feedboard of charging hole thereon, and feedboard is arranged on
Between bright load plate top surface and feed suction nozzle, feed suction nozzle can be directed at described charging by the second described horizontal drive apparatus
The charging hole setting of plate, the first detection camera and the 3rd detection camera are arranged on top and the second detection camera of transparent load plate
Setting is thereunder.This device is realized can achieve that the upper and lower surface to chip is entered without to the upset of chip using transparent load plate
Row detection, decrease due to upset cause the damage to chip and pollution, and using uniform template detection mode reduce due to
The standard that manual detection causes is inconsistent, improves production efficiency it is ensured that product quality.But this apparatus structure is complicated, behaviour
Make step many, production efficiency is relatively low.
[content of the invention]
The technical problem to be solved in the present invention is to provide a kind of structure simple, and operating procedure is few, the high chip of production efficiency
Quality detection device.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is, a kind of wafer quality detection means, including
Frame, host computer, camera, robot, mobile light source, vacuum cups, vacuum source, the workbench for bearing wafer matrix and control
Circuit processed；Workbench and robot are arranged on the bottom of frame, and robot is located at the side of workbench；Camera is arranged on frame
Top, towards workbench；Mobile light source is arranged on the middle part of frame, positioned at the top of workbench；Vacuum cups is fixed on machine
On the mechanical hand of people, towards workbench；Control circuit includes controller, and the input of controller connects the outfan of host computer, moves
The control of dynamic light source terminates the control signal outfan of controller；Robot is communicated to connect with host computer and controller respectively, phase
Machine is communicated to connect with host computer.
Above-described wafer quality detection means, including source of the gas and electromagnetic valve, mobile light source includes cylinder and light source, gas
Cylinder is horizontally fixed in frame, and positioned at the top of workbench, light source is fixed on the slide block of cylinder；Cylinder connects the defeated of electromagnetic valve
Go out end, the input termination source of the gas of electromagnetic valve, the control of electromagnetic valve terminates the control signal outfan of controller.
Above-described wafer quality detection means, described workbench bag rotating disk, rotating blade drive and a plurality of hold
Carry the pallet of wafer matrix, pallet is uniform along the circumference of rotating disk；The control of rotating blade drive terminates the control signal of controller
Outfan.
Above-described wafer quality detection means, including defective chip collection device, defective chip collection device is connected on
In pipeline between suction nozzle and vacuum source.
Above-described wafer quality detection means, work process comprises the following steps:
501st, wafer matrix to be checked is put on the pallet of rotating disk operative employee；
502nd, controller controls rotating disk to rotate, and the pallet of bearing wafer matrix is turned to the underface of camera；
503rd, controller controls cylinder by the surface of Light Source Translation to pallet；
504th, after pallet and light source put in place, controller notifies robot, and robot sends the life of capture of taking pictures to host computer
Order；
505th, camera is taken pictures after capture, and host computer processes image, obtains the coordinate data of defect chip, and by defect chip
Coordinate data send robot to, robot notification controller, camera photograph finishes；
506th, controller controls cylinder by Light Source Translation, leaves pallet；
507th, robot drives vacuum cups, siphons away defect chip one by one by the coordinate of defect chip；
508th, after the defect chip in wafer matrix all siphons away, robot drives vacuum cups to leave the top of pallet,
Notification controller, defect chip absorption work completes；
509th, repeat step 502 to 508.
Above-described wafer quality detection means, in step 507, defect chip is directly siphoned away by vacuum cups.
Above-described wafer quality detection means, in step 507, after defect chip is held by vacuum cups, machine
People drives vacuum cups, defect chip is taken to and is arranged in by the suction nozzle of robot side；Vacuum cups discharges defect chip,
Defect chip is siphoned away by suction nozzle；Robot drives vacuum cups to return, then draws next defective chip.
The wafer quality structure of the detecting device of the present invention is simple, and operating procedure is few, and it is accurate to a large amount of chips to accomplish once
Identification is picked and is taken, and production efficiency is high.
[brief description]
The present invention is further detailed explanation with reference to the accompanying drawings and detailed description.
Fig. 1 is the schematic diagram that the embodiment of the present invention 1 wafer quality detection means images state.
Fig. 2 is the schematic diagram that the embodiment of the present invention 1 wafer quality detection means draws defect chip.
Fig. 3 is the control circuit block diagram of the embodiment of the present invention 1 wafer quality detection means.
Fig. 4 is the schematic diagram that the embodiment of the present invention 2 wafer quality detection means draws defect chip.
[specific embodiment]
The structure of the embodiment of the present invention 1 wafer quality detection means and principle as shown in Figure 1 to Figure 3, including frame 1, on
Position machine, camera 2, robot 3, sunken chip collection device, mobile light source, vacuum cups 5, vacuum valve, vacuum source, source of the gas, electromagnetism
Valve, workbench and control circuit.
Robot 3 adopts the horizontal articulated robot of yamaha yk400xr.
Workbench and robot 3 are arranged on the bottom of frame 1, and robot 3 is located at the side of workbench.Workbench bag rotating disk
6,7,4 pallets 7 of pallet of rotating blade drive and 4 bearing wafer matrixes 10 are uniform along the circumference of rotating disk 6.
Camera 2 is arranged on the top of frame 1, towards the pallet 7 on workbench, camera 2 and host computer communication connection.
Vacuum cups 5 is fixed on the mechanical hand 301 of robot 3, towards rotating disk 6.Vacuum cups 5 pass through pipeline 501 with
Vacuum valve connects, and defective chip collection device is connected in the pipeline between suction nozzle and vacuum valve.
Control circuit includes plc controller, and the input of plc controller connects the outfan of host computer, the control of mobile light source
The control end at end processed, the control end of rotating blade drive and vacuum valve connects the control signal outfan of plc controller respectively.Machine
People is communicated to connect respectively with host computer and controller.
Mobile light source is arranged on the middle part of frame 1, positioned at the top of workbench.
Mobile light source includes cylinder 8 and light source 9, and cylinder 8 is horizontally fixed in frame 1, positioned at the top of workbench.Light
Source 9 is fixed on the slide block 801 of cylinder.Cylinder 8 connects the outfan of electromagnetic valve, the input termination compressed air source of electromagnetic valve, electricity
The control of magnet valve terminates the control signal outfan of plc controller.
Light source 9 is red LED light source, and the led lamp beads that light source 9 has many redness are arranged on the inner conical surface of annulus, inner cone
Face down, the cone angle of inner conical surface can be adjusted according to the different detection environment in scene, detectable substance and detecting distance, the present embodiment
It is set as 30 °.The light cone of light source 9 is a back taper, and the cone angle of back taper is 120 °, and the focus point of light cone is positioned at upper by inspection chip
Side.
Because damaged chip point assumes blueness in itself, the present embodiment adopts red light source to irradiate, and the defect point of chip is compared
White light source or blue-light source radiation response become apparent from, and more can highlight wafer defect point.
The work process of above example of the present invention comprises the following steps:
1) wafer matrix 10 to be checked is put on the pallet 7 of rotating disk 6 operative employee；Vacuum valve is opened by plc controller；
2) controller controls rotating disk 6 to rotate, and the pallet 7 of bearing wafer matrix 10 is turned to the underface of camera 2；
3) controller controls cylinder 8 to move to light source 9 directly over the 7 of pallet；
4) after pallet 7 and light source 9 put in place, controller notifies robot 3, and robot 3 sends, to host computer, capture of taking pictures
Order；
5) camera is taken pictures after capture, and host computer processes image, obtains the coordinate data of defect chip, and by defect chip
Coordinate data sends robot 3 to, and robot 3 notifies plc controller, and camera photograph finishes；
6) controller controls cylinder 8 to translate light source 9, leaves pallet 7；
7) robot 3 drives vacuum cups 5, siphons away defect chip one by one by the coordinate of defect chip；Vacuum cups 5 is straight
Footpath is larger, and vacuum cups 5 directly defect chip is drawn onto in defective chip collection device；
8), after the defect chip in wafer matrix 10 all siphons away, robot 3 drives vacuum cups 5 to leave the upper of pallet 7
Side；Notification controller, defect chip absorption work completes；
9) repeat step 2), start subsequent work circulation.
The structure of the embodiment of the present invention 2 wafer quality detection means and principle are as shown in figure 4, different from utility model 1
It is that vacuum cups 5 diameter is less, robot side is mounted with a suction nozzle 11, in the step 7 of embodiment 1, embodiment 2
Vacuum cups 5 defect chip is held after, the mechanical hand 301 of robot 3 drives vacuum cups 5, and defect chip is taken to suction
The porch of trachea 11, vacuum cups 5 discharges defect chip, and defect chip is siphoned away by suction nozzle 11；Then the machinery of robot 3
Handss 301 drive vacuum 5 suction nozzle to return, then draw next defective chip.
The wafer quality structure of the detecting device of above example of the present invention is simple, and operating procedure is few, once can detect perhaps
Multi-wafer, automatization's line production, production efficiency is high.
Claims (7)
1. a kind of wafer quality detection means, including frame, host computer, camera, vacuum cups, vacuum source and control circuit, phase
Machine communicates to connect it is characterised in that including robot, mobile light source and the workbench for bearing wafer matrix with host computer,
Workbench and robot are arranged on the bottom of frame, and robot is located at the side of workbench；Camera is arranged on the top of frame, court
To workbench；Mobile light source is arranged on the middle part of frame, positioned at the top of workbench；Vacuum cups is fixed on the machinery of robot
On hand, towards workbench；Control circuit includes controller, and the input of controller connects the outfan of host computer, mobile light source
Control the control signal outfan of termination controller；Robot is communicated to connect with host computer and controller respectively.
2. wafer quality detection means according to claim 1, it is characterised in that including source of the gas and electromagnetic valve, moves light
Source includes cylinder and light source, and cylinder is horizontally fixed in frame, and positioned at the top of workbench, light source is fixed on the slide block of cylinder
On；Cylinder connects the outfan of electromagnetic valve, the input termination source of the gas of electromagnetic valve, and the control of electromagnetic valve terminates the control signal of controller
Outfan.
3. wafer quality detection means according to claim 2 is it is characterised in that described workbench bag rotating disk, rotating disk
Driving means and the pallet of a plurality of bearing wafer matrix, pallet is uniform along the circumference of rotating disk；The control end of rotating blade drive
Connect the control signal outfan of controller.
4. wafer quality detection means according to claim 1, it is characterised in that including defective chip collection device, lacks
Sunken chip collection device is connected in the pipeline between suction nozzle and vacuum source, assists to collect by vacuum amplifier (V-AMP).
5. wafer quality detection means according to claim 3 is it is characterised in that work process comprises the following steps:
501st, wafer matrix to be checked is put on the pallet of rotating disk operative employee；
502nd, controller controls rotating disk to rotate, and the pallet of bearing wafer matrix is turned to the underface of camera；
503rd, controller controls cylinder by the surface of Light Source Translation to pallet；
504th, after pallet and light source put in place, controller notifies host computer to send the order of capture of taking pictures；
505th, after capture taken pictures by camera, host computer processes image, obtains the coordinate data of defect chip, and the seat by defect chip
Mark data sends robot to, and camera photograph finishes；
506th, controller controls cylinder by Light Source Translation, leaves pallet；
507th, robot drives vacuum cups, siphons away defect chip one by one by the coordinate of defect chip；
508th, after the defect chip in wafer matrix all siphons away, robot drives vacuum cups to leave the top of pallet, notifies
Controller, defect chip absorption work completes；
509th, repeat step 502 to 508.
6. wafer quality detection means according to claim 5 is it is characterised in that in step 507, vacuum cups is direct
Defect chip is siphoned away.
7. wafer quality detection means according to claim 5 will be it is characterised in that in step 507, vacuum cups will lack
After sunken chip holds, robot drives vacuum cups, defect chip is taken to and is arranged in by the suction nozzle of robot side；Vacuum
Suction nozzle discharges defect chip, and defect chip is siphoned away by suction nozzle；Robot drives vacuum cups to return, then draws next defect
Chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610972714.8A CN106353331A (en) | 2016-10-28 | 2016-10-28 | Wafer quality detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610972714.8A CN106353331A (en) | 2016-10-28 | 2016-10-28 | Wafer quality detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106353331A true CN106353331A (en) | 2017-01-25 |
Family
ID=57864584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610972714.8A Pending CN106353331A (en) | 2016-10-28 | 2016-10-28 | Wafer quality detection device |
Country Status (1)
| Country | Link |
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| CN (1) | CN106353331A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108593681A (en) * | 2018-03-28 | 2018-09-28 | 中车唐山机车车辆有限公司 | Vehicle body side wall glass defect detection system and detection method |
| CN109580655A (en) * | 2018-12-14 | 2019-04-05 | 武汉华星光电半导体显示技术有限公司 | Substrate detection system and method for testing substrate |
| CN109959339A (en) * | 2019-05-16 | 2019-07-02 | 中国工程物理研究院电子工程研究所 | A kind of measuring device of disk size |
| CN110118529A (en) * | 2019-05-16 | 2019-08-13 | 中国工程物理研究院电子工程研究所 | A kind of measurement method of disk size |
| CN111141754A (en) * | 2019-12-30 | 2020-05-12 | 上海感图网络科技有限公司 | Device and method for wafer detection based on AI vision |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030169916A1 (en) * | 2002-02-19 | 2003-09-11 | Toshiba Ceramics Co., Ltd. | Wafer inspection apparatus |
| CN2877897Y (en) * | 2005-09-30 | 2007-03-14 | 南京熊猫仪器仪表有限公司 | Wafer sorting device |
| CN201653918U (en) * | 2010-03-01 | 2010-11-24 | 天津必利优科技发展有限公司 | Chip appearance detection device |
| CN102500554A (en) * | 2011-10-12 | 2012-06-20 | 浙江大学台州研究院 | Fully-automatic visual inspection machine for wafer |
| CN206161548U (en) * | 2016-10-28 | 2017-05-10 | 深圳旭升智能装备有限公司 | Wafer quality detection device |
-
2016
- 2016-10-28 CN CN201610972714.8A patent/CN106353331A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030169916A1 (en) * | 2002-02-19 | 2003-09-11 | Toshiba Ceramics Co., Ltd. | Wafer inspection apparatus |
| CN2877897Y (en) * | 2005-09-30 | 2007-03-14 | 南京熊猫仪器仪表有限公司 | Wafer sorting device |
| CN201653918U (en) * | 2010-03-01 | 2010-11-24 | 天津必利优科技发展有限公司 | Chip appearance detection device |
| CN102500554A (en) * | 2011-10-12 | 2012-06-20 | 浙江大学台州研究院 | Fully-automatic visual inspection machine for wafer |
| CN206161548U (en) * | 2016-10-28 | 2017-05-10 | 深圳旭升智能装备有限公司 | Wafer quality detection device |
Non-Patent Citations (2)
| Title |
|---|
| 张洁等: "石英晶片外观缺陷自动分选控制技术研究", 《电子设计工程》 * |
| 胡辉等: "基于视觉检测技术的机器人自动贴片系统设计", 《机械制造》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108593681A (en) * | 2018-03-28 | 2018-09-28 | 中车唐山机车车辆有限公司 | Vehicle body side wall glass defect detection system and detection method |
| CN109580655A (en) * | 2018-12-14 | 2019-04-05 | 武汉华星光电半导体显示技术有限公司 | Substrate detection system and method for testing substrate |
| CN109959339A (en) * | 2019-05-16 | 2019-07-02 | 中国工程物理研究院电子工程研究所 | A kind of measuring device of disk size |
| CN110118529A (en) * | 2019-05-16 | 2019-08-13 | 中国工程物理研究院电子工程研究所 | A kind of measurement method of disk size |
| CN111141754A (en) * | 2019-12-30 | 2020-05-12 | 上海感图网络科技有限公司 | Device and method for wafer detection based on AI vision |
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| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 518000 501-1, building 2, Jiangnan times building, shangxiaokeng mountain area, Gangtou community, Bantian street, Longgang District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN XUSHENG INTELLIGENT EQUIPMENT Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Qianhai Shenzhen Hong Kong cooperation zone before Bay Road No. 1 building 201 room A Applicant before: SHENZHEN XUSHENG VISION TECHNOLOGY Co.,Ltd. |
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Application publication date: 20170125 |
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