CN106350787A - Palladium inactivation process for electroless nickel-gold plating - Google Patents
Palladium inactivation process for electroless nickel-gold plating Download PDFInfo
- Publication number
- CN106350787A CN106350787A CN201510408370.3A CN201510408370A CN106350787A CN 106350787 A CN106350787 A CN 106350787A CN 201510408370 A CN201510408370 A CN 201510408370A CN 106350787 A CN106350787 A CN 106350787A
- Authority
- CN
- China
- Prior art keywords
- palladium
- inactivation
- gold
- nickel plating
- chemical nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims abstract description 128
- 229910052763 palladium Inorganic materials 0.000 title claims abstract description 64
- 238000007747 plating Methods 0.000 title claims abstract description 44
- 230000002779 inactivation Effects 0.000 title claims abstract description 30
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title abstract description 7
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 24
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000007864 aqueous solution Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000002791 soaking Methods 0.000 claims abstract description 8
- 239000004202 carbamide Substances 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims abstract description 6
- 239000008399 tap water Substances 0.000 claims abstract description 6
- 235000020679 tap water Nutrition 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- 239000003795 chemical substances by application Substances 0.000 claims abstract 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 74
- 239000000126 substance Substances 0.000 claims description 38
- 229910052759 nickel Inorganic materials 0.000 claims description 37
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 29
- 229910052737 gold Inorganic materials 0.000 claims description 29
- 239000010931 gold Substances 0.000 claims description 29
- 230000000937 inactivator Effects 0.000 claims description 20
- 238000005516 engineering process Methods 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000005555 metalworking Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 235000013877 carbamide Nutrition 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000001465 metallisation Methods 0.000 abstract description 7
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 abstract description 5
- 235000019253 formic acid Nutrition 0.000 abstract description 5
- 238000002360 preparation method Methods 0.000 abstract description 2
- 230000000415 inactivating effect Effects 0.000 abstract 3
- 238000003780 insertion Methods 0.000 abstract 2
- 230000037431 insertion Effects 0.000 abstract 2
- 230000009849 deactivation Effects 0.000 abstract 1
- 238000009776 industrial production Methods 0.000 abstract 1
- 239000011148 porous material Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Chemically Coating (AREA)
Abstract
The invention provides a thiourea-type palladium inactivation process for electroless nickel-gold plating. The palladium deactivation process comprises the following steps: preparing 25 wt.% of a palladium inactivating agent aqueous solution, wherein the palladium inactivating agent contains 50 g/L of thiourea, 10 g/L of formic acid and 10 g/L of urea; heating a palladium inactivation cylinder to 30-40 DEG C by a heater; placing an electroless nickel-gold plating insertion plate frame in the palladium inactivation cylinder, and soaking for 60-90 seconds; taking out the soaked electroless nickel-gold plating insertion plate frame, cleaning with tap water for 1-2 min, and transferring to an electroless nickel-gold plating process for use. The palladium inactivation process provided by the invention not only is suitable for soaking operation, but also is more suitable for a horizontal line production mode, has excellent and complete inactivation performance for residual palladium during non-porous metallization, avoids a phenomenon of plating nickel-gold in pores required in non-porous metallization after inactivating palladium, needs no complicated equipment, and is simple, wide in material source, low in price and preparation cost, free from pollution in the production process, and suitable for industrial production.
Description
Technical field
The present invention relates to a kind of palladium inactivation technology for chemical nickel plating gold, lost activity so that the palladium rapidly and efficiently making non-porous metal requirement hole residual can be reached, so that being capable of chemical nickel plating gold in subsequent chemistry plating nickel gold operation.
Background technology
Printed wiring board, because of Functional Requirement, needs to carry out chemical nickel plating gold.However, because printed wiring board non-porous metalization requires, because of hole metallization operation, etched after, however it remains palladium remains in the hole.This residual palladium in chemical nickel plating gold so as to palladium loses activity, chemical nickel plating metal working sequence will not plated with nickel gold, cause chemical nickel plating gold the scrapping of rear board, scrappage up to more than 10%, so that production cost is remained high.Palladium inactivator so that the palladium that the hole of non-porous metal requirement remains is lost activity so that in subsequent chemistry plating nickel gold cannot plated with nickel gold, make the scrappage of chemical nickel plating metal working sequence therefore be reduced to 0.05%.With the printed circuit board development of electron trade, the number of species of chemical nickel plating golden plate is increasing, and the quality for improving chemical nickel plating gold needs efficient, high-quality palladium inactivator.Therefore, in the urgent need to a kind of palladium inactivation technology for chemical nickel plating gold.
Content of the invention
It is an object of the invention to a kind of palladium inactivation technology for chemical nickel plating gold, lost activity so that the palladium rapidly and efficiently making non-porous metal requirement hole residual can be reached, so that being capable of chemical nickel plating gold in subsequent chemistry plating nickel gold operation.
To achieve these goals, the invention provides a kind of palladium inactivation technology for Thiourea Type chemical nickel plating gold, described palladium inactivation technology comprises the steps: 1) prepare Thiourea Type palladium inactivator aqueous solution 25wt.%, described palladium inactivator is thiourea 50g/l, formic acid 10g/l and carbamide 10g/l；2) using heater, 30～40 DEG C are heated to palladium inactivation cylinder body；3) chemical nickel plating gold flashboard rack is put in described palladium inactivation cylinder body, soak 60～90 seconds；And 4) chemical nickel plating soaking gold flashboard rack is taken out, cleaned up 1～2 minute with tap water at room temperature, to proceed to the use of chemical nickel plating metal working sequence.
Further illustrating it is preferable that the acidity of described palladium inactivator aqueous solution is 0.95～1.15n as the described cleaning to the present invention, proportion is 0.95～1.15g/cm3.
Further illustrating it is preferable that the water in described palladium inactivator aqueous solution is deionized water as the described cleaning to the present invention.
Further illustrating it is preferable that the material that described palladium inactivates cylinder body is pp as the described cleaning to the present invention, the material of described heating tube is imperial for ferrum Buddhist.
Further illustrating it is preferable that the material of described flashboard rack is pp or ferrum Buddhist dragon as the described cleaning to the present invention.
The palladium inactivation technology of the present invention has following benefit effect: 1) process time is short, 2) be both suitable for soaking, also be adapted for the horizontal line mode of production, 3) operation temperature is low, 4) to the inactivation function admirable of palladium, thoroughly, 5) improve the yields of chemical nickel plating gold.The palladium inactivation technology of the present invention has prevented the phenomenon of the in the hole plated with nickel gold that non-porous metal requires, thus improve the yields of chemical nickel plating gold, reduces the production cost of printed wiring board.The present invention does not need the equipment of complexity, and process is simple, extensively, cheap, preparation cost is low, and production process is pollution-free, is therefore with a wide range of applications in printed wiring board field, suitable industrialized production for material source.
Specific embodiment
In order that auditor can further appreciate that structure, feature and the other purposes of the present invention, describe in detail as follows in conjunction with appended preferred embodiment, embodiment described is merely to illustrate technical scheme, and the non-limiting present invention.
Embodiment 1
Prepare Thiourea Type palladium inactivator aqueous solution 25wt.% first, described palladium inactivator is thiourea 50g/l, formic acid 10g/l and carbamide 10g/l, the acidity of palladium inactivator aqueous solution is 0.95n, and proportion is 0.95g/m3, the water in palladium inactivator aqueous solution is deionized water.Using pp material heater, 30 DEG C are heated to palladium inactivation cylinder body, pp material chemical nickel plating gold flashboard rack are put in palladium inactivation cylinder body and soaks 60 seconds.Again the chemical nickel plating soaking gold flashboard rack is taken out, cleaned up 1 minute with tap water at room temperature, proceed to chemical nickel plating metal working sequence and use.After chemical nickel plating gold, the in the hole that inspection non-porous metalization requires does not plate chemical nickel and gold.
Embodiment 2
Prepare Thiourea Type palladium inactivator aqueous solution 25wt.% first, described palladium inactivator is thiourea 50g/l, formic acid 10g/l and carbamide 10g/l, the acidity of palladium inactivator aqueous solution is 1.15n, and proportion is 1.15g/m3, the water in palladium inactivator aqueous solution is deionized water.Using ferrum Buddhist dragon material heater, 40 DEG C are heated to palladium inactivation cylinder body, ferrum Buddhist dragon material chemical nickel plating gold flashboard rack are put in palladium inactivation cylinder body and soaks 90 seconds.Again the chemical nickel plating soaking gold flashboard rack is taken out, cleaned up 2 minutes with tap water at room temperature, proceed to chemical nickel plating metal working sequence and use.After chemical nickel plating gold, the in the hole that inspection non-porous metalization requires does not plate chemical nickel and gold.
Embodiment 3
Prepare Thiourea Type palladium inactivator aqueous solution 25wt.% first, described palladium inactivator is thiourea 50g/l, formic acid 10g/l and carbamide 10g/l, the acidity of palladium inactivator aqueous solution is 0.95n, and proportion is 0.95g/cm3, the water in palladium inactivator aqueous solution is deionized water.Using pp material heater, 35 DEG C are heated to palladium inactivation cylinder body, pp material chemical nickel plating gold flashboard rack are put in palladium inactivation cylinder body and soaks 75 seconds.Again the chemical nickel plating soaking gold flashboard rack is taken out, cleaned up 1.5 minutes with tap water at room temperature, proceed to chemical nickel plating metal working sequence and use.After chemical nickel plating gold, the in the hole that inspection non-porous metalization requires does not plate chemical nickel and gold.
It is to be understood that, foregoing invention content and specific embodiment are intended to prove the practical application of technical scheme provided by the present invention, should not be construed as limiting the scope of the present invention.Those skilled in the art in spirit and principles of the present invention, when can various modifications may be made, equivalent or improvement.Protection scope of the present invention is defined by appended claims.
Claims (5)
1. a kind of palladium inactivation technology for chemical Thiourea Type plating nickel gold is it is characterised in that described
Palladium inactivation technology comprises the steps:
1) prepare palladium inactivator aqueous solution 25wt., described palladium inactivator is thiourea 50g/l, first
Sour 10g/l and carbamide 10g/l；
2) using heater, 30～40 DEG C are heated to palladium inactivation cylinder body；
3) chemical nickel plating gold flashboard rack is put in described palladium inactivation cylinder body, soak 60～90 seconds；
And
4) chemical nickel plating soaking gold flashboard rack is taken out, cleaned with tap water dry at room temperature
Net 1～2 minute, to proceed to the use of chemical nickel plating metal working sequence.
2. palladium inactivation technology according to claim 1 is it is characterised in that described palladium inactivates
The acidity of agent aqueous solution is 0.95～1.15n, and proportion is 0.95～1.15g/cm3.
3. cleaning according to claim 1 and 2 is it is characterised in that described palladium goes out
The water lived in agent aqueous solution is deionized water.
4. palladium inactivation technology according to claim 1 is it is characterised in that described palladium inactivates
The material of cylinder body is pp, and the material of described heating tube is ferrum Buddhist dragon.
5. palladium inactivation technology according to claim 1 is it is characterised in that described flashboard rack
Material be pp or ferrum Buddhist dragon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510408370.3A CN106350787A (en) | 2015-07-13 | 2015-07-13 | Palladium inactivation process for electroless nickel-gold plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510408370.3A CN106350787A (en) | 2015-07-13 | 2015-07-13 | Palladium inactivation process for electroless nickel-gold plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106350787A true CN106350787A (en) | 2017-01-25 |
Family
ID=57842038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510408370.3A Pending CN106350787A (en) | 2015-07-13 | 2015-07-13 | Palladium inactivation process for electroless nickel-gold plating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106350787A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102105020A (en) * | 2009-12-16 | 2011-06-22 | 北大方正集团有限公司 | Making method for printed-circuit boards and palladium removing device for printed-circuit boards |
| CN201908148U (en) * | 2010-12-15 | 2011-07-27 | 深圳市星河电路有限公司 | Copper-precipitating board-inserting frame for PCB (Printed Circuit Board) sheet |
| CN103228112A (en) * | 2013-04-03 | 2013-07-31 | 深圳崇达多层线路板有限公司 | Electroless copper plating method for PCBs (printed circuit boards) with high aspect ratios |
| CN103249254A (en) * | 2013-04-22 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Method of removing palladium in NPTHs of PCB |
| CN103789779A (en) * | 2014-02-24 | 2014-05-14 | 昆山苏杭电路板有限公司 | Process for preventing gold deposition in non plated though hole of chemical gold-plated board and palladium removal treating solution used in process |
-
2015
- 2015-07-13 CN CN201510408370.3A patent/CN106350787A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102105020A (en) * | 2009-12-16 | 2011-06-22 | 北大方正集团有限公司 | Making method for printed-circuit boards and palladium removing device for printed-circuit boards |
| CN201908148U (en) * | 2010-12-15 | 2011-07-27 | 深圳市星河电路有限公司 | Copper-precipitating board-inserting frame for PCB (Printed Circuit Board) sheet |
| CN103228112A (en) * | 2013-04-03 | 2013-07-31 | 深圳崇达多层线路板有限公司 | Electroless copper plating method for PCBs (printed circuit boards) with high aspect ratios |
| CN103249254A (en) * | 2013-04-22 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Method of removing palladium in NPTHs of PCB |
| CN103789779A (en) * | 2014-02-24 | 2014-05-14 | 昆山苏杭电路板有限公司 | Process for preventing gold deposition in non plated though hole of chemical gold-plated board and palladium removal treating solution used in process |
Non-Patent Citations (1)
| Title |
|---|
| 郑贤敏: ""钯基催化剂的失活原因及预防措施"", 《浙江海洋学院学报(自然科学版)》 * |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170125 |