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CN106334851A - Desktop Selective Wave Crest Welding Machine - Google Patents

Desktop Selective Wave Crest Welding Machine Download PDF

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Publication number
CN106334851A
CN106334851A CN201611006043.6A CN201611006043A CN106334851A CN 106334851 A CN106334851 A CN 106334851A CN 201611006043 A CN201611006043 A CN 201611006043A CN 106334851 A CN106334851 A CN 106334851A
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tin
axis
linear module
drive
axis driving
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CN201611006043.6A
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CN106334851B (en
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左大利
李笑勉
吴铁军
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Dongguan Polytechnic
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Dongguan Polytechnic
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明公开了一种桌面式选择性波峰焊接机,其固定安装座上端侧装设活动安装架,活动安装架装设活动托板,固定安装座于活动托板下端侧装设锡泵组件;固定安装座装设Y轴驱动线性模组,Y轴驱动线性模组的驱动端装设Z轴驱动线性模组,活动安装架装设X轴驱动线性模组;锡泵组件包括有锡泵安装架、锡锅组件、锡液泵送机构,锡锅组件包括锡锅锅体、锡锅盖板、电加热板,锡液泵送机构包括壳体底座、壳体面板、驱动叶轮、驱动转轴、泵送驱动电机、锡液喷嘴;该桌面式选择性波峰焊接机配装控制器。本发明具有结构设计新颖、自动化程度高、占地面积小、结构简单、维护方便并可实现精密焊接的优点,且能够有效地适用于小批量PCB板焊接作业。

The invention discloses a desktop-type selective wave soldering machine. A movable mounting frame is installed on the upper end side of a fixed mounting seat, a movable supporting plate is installed on the movable mounting frame, and a tin pump assembly is installed on the lower end side of the movable supporting plate on the fixed mounting seat; The fixed mounting base is installed with the Y-axis driving linear module, the driving end of the Y-axis driving linear module is installed with the Z-axis driving linear module, and the movable mounting frame is installed with the X-axis driving linear module; the tin pump assembly includes a tin pump installation Rack, tin pot assembly, tin liquid pumping mechanism, tin pot assembly includes tin pot body, tin pot cover, electric heating plate, tin liquid pumping mechanism includes shell base, shell panel, drive impeller, drive shaft, Pumping drive motor, liquid tin nozzle; this desktop selective wave soldering machine is equipped with a controller. The invention has the advantages of novel structural design, high degree of automation, small occupied area, simple structure, convenient maintenance and precision welding, and can be effectively applied to small-batch PCB board welding operations.

Description

一种桌面式选择性波峰焊接机A desktop selective wave soldering machine

技术领域technical field

本发明涉及焊接设备技术领域,尤其涉及一种桌面式选择性波峰焊接机。The invention relates to the technical field of welding equipment, in particular to a desktop selective wave soldering machine.

背景技术Background technique

DIP封装类电子元器件的焊接比较常见的焊接方式为波峰焊接,但是波峰焊接设备一般价格昂贵、锡膏消耗量大、维护复杂,且比较适用于大批量、成规模的焊接生产;而对于小批量或样品打样,目前还是使用手工锡焊,自动化程度低、人工成本且焊接质量很难控制。The more common soldering method for DIP packaged electronic components is wave soldering, but wave soldering equipment is generally expensive, consumes a lot of solder paste, and is complicated to maintain, and is more suitable for large-scale and large-scale soldering production; and for small For batch or sample proofing, manual soldering is still used at present, which has a low degree of automation, labor costs, and welding quality is difficult to control.

另外,传统波峰焊本质上属于浸焊,在实际焊接过程中依然存在焊点控制不精确的现象,即很难实现精密焊接,且焊接时锡液易于与空气中的氧气发生氧化并产生锡渣,这就会导致焊接质量差等问题。In addition, traditional wave soldering is essentially dip soldering, and there is still the phenomenon of inaccurate solder joint control in the actual soldering process, that is, it is difficult to achieve precise soldering, and the tin liquid is easy to oxidize with the oxygen in the air during soldering and produce tin slag , which will lead to problems such as poor welding quality.

综合上述情况可知,传统波峰焊接机存在以下缺陷,具体为:Based on the above situation, it can be seen that the traditional wave soldering machine has the following defects, specifically:

1、传统波峰焊接机为浸焊方式,焊接面广,焊点精度无法控制;1. The traditional wave soldering machine adopts the dip soldering method, the welding area is wide, and the accuracy of solder joints cannot be controlled;

2、传统波峰焊接机的锡炉为敞开式加热模式,熔化的锡液很容易与空气中的氧气发生氧化并产生焊渣,影响焊接质量;2. The tin furnace of the traditional wave soldering machine is an open heating mode. The molten tin liquid is easily oxidized with the oxygen in the air and produces welding slag, which affects the welding quality;

3、传统波峰焊接机体积庞大,结构复杂,成本高,维护困难;3. Traditional wave soldering machines are bulky, complex in structure, high in cost and difficult to maintain;

4、传统波峰焊接机适用于大批量的PCB板的焊接,难适用于单件小批量的PCB板焊接。4. The traditional wave soldering machine is suitable for the welding of large quantities of PCB boards, but it is difficult to apply to the welding of single and small batches of PCB boards.

发明内容Contents of the invention

本发明的目的在于针对现有技术的不足而提供一种桌面式选择性波峰焊接机,该桌面式选择性波峰焊接机结构设计新颖、自动化程度高、占地面积小、结构简单、维护方便并可实现精密焊接,且能够有效地适用于小批量PCB板焊接作业。The purpose of the present invention is to provide a desktop selective wave soldering machine for the deficiencies of the prior art. The desktop selective wave soldering machine has novel structural design, high degree of automation, small footprint, simple structure, convenient maintenance and It can realize precision welding, and can be effectively applied to small batch PCB board welding operations.

为达到上述目的,本发明通过以下技术方案来实现。In order to achieve the above object, the present invention is achieved through the following technical solutions.

一种桌面式选择性波峰焊接机,包括有呈矩形状的固定安装座,固定安装座包括有呈水平横向布置的安装座底板,安装座底板的上表面螺装有四个呈矩形分布且依次连接的安装座侧板,各安装座侧板分别呈竖向布置,固定安装座的上端侧可相对活动地装设有活动安装架,活动安装架可相对活动地装设有活动托板,安装座底板的上表面于活动托板的下端侧装设有锡泵组件;A desktop selective wave soldering machine, including a rectangular fixed mounting base, the fixed mounting base includes a horizontally arranged mounting base bottom plate, the upper surface of the mounting base bottom plate is screwed with four rectangular distribution and sequentially The side plates of the connected mounting seats are vertically arranged respectively, and the upper end side of the fixed mounting seat can be equipped with a movable mounting frame relatively movably, and the movable mounting frame can be relatively movably equipped with a movable supporting plate. The upper surface of the base plate is equipped with a tin pump assembly on the lower end side of the movable supporting plate;

固定安装座的安装座侧板装设有前后水平动作的Y轴驱动线性模组,Y轴驱动线性模组的驱动端装设有上下升降动作的Z轴驱动线性模组,Z轴驱动线性模组的驱动端与活动安装架连接,活动安装架装设有左右水平动作的X轴驱动线性模组,X轴驱动线性模组的驱动端与活动托板连接;The side plate of the fixed mounting seat is equipped with a Y-axis driven linear module that moves forward and backward horizontally, and the driving end of the Y-axis driven linear module is equipped with a Z-axis driven linear module that moves up and down. The driving end of the group is connected to the movable mounting frame, and the movable mounting frame is equipped with an X-axis driving linear module that moves left and right horizontally, and the driving end of the X-axis driving linear module is connected to the movable supporting plate;

锡泵组件包括有锡泵安装架、装设于锡泵安装架上端部的锡锅组件,锡锅组件包括有锡锅锅体、锡锅盖板,锡锅锅体的内部开设有朝上开口且用于盛装熔化锡液的锅体容置腔,锡锅盖板盖装于锅体容置腔的上端开口处,锡锅锅体的下表面装设有电加热板;锡锅锅体的锅体容置腔内嵌装有锡液泵送机构,锡液泵送机构包括有锡泵壳体,锡泵壳体包括有壳体底座、螺装于壳体底座上表面的壳体面板,壳体面板位于锡锅盖板的正下方且壳体面板与锡锅盖板连接,锡泵壳体的内部于壳体底座与壳体面板之间成型有叶轮安装腔室、锡液泵送腔室、连通叶轮安装腔室与锡液泵送腔室的导流槽,叶轮安装腔室内可相对转动地装设有驱动叶轮,壳体底座的外表面开设有与叶轮安装腔室连通的进锡液孔,锡锅盖板可相对转动地装设有呈竖向布置的驱动转轴,驱动转轴的上端部延伸至锡锅盖板的上端侧,驱动转轴的下端部依次穿过锡锅盖板、壳体面板而伸入至叶轮安装腔室内,驱动叶轮套卡于驱动转轴的下端部,锡泵安装架装设有泵送驱动电机,泵送驱动电机的动力输出轴与驱动转轴的上端部驱动连接;壳体面板的上表面开设有与锡液泵送腔室连通的出锡液孔,壳体面板的上表面螺装有呈竖向布置且与出锡液孔连通的锡液喷嘴,锡液喷嘴的上端部穿过锡锅盖板并延伸至锡锅盖板的上端侧;The tin pump assembly includes a tin pump mounting frame and a tin pot assembly installed on the upper end of the tin pump mounting frame. The tin pot assembly includes a tin pot body and a tin pot cover. The tin pot body has an upward opening And it is used to hold the pot body cavity for melting tin liquid, the tin pot cover plate is installed at the upper opening of the pot body cavity, and the lower surface of the tin pot body is equipped with an electric heating plate; A tin liquid pumping mechanism is embedded in the pot body accommodating cavity, and the tin liquid pumping mechanism includes a tin pump housing, and the tin pump housing includes a housing base, a housing panel screwed on the upper surface of the housing base, The shell panel is located directly below the tin pot cover and is connected to the tin pot cover. The inside of the tin pump shell is formed with an impeller installation chamber and a tin liquid pumping chamber between the shell base and the shell panel. chamber, the diversion groove connecting the impeller installation chamber and the liquid tin pumping chamber, the impeller installation chamber is relatively rotatably installed with a drive impeller, and the outer surface of the shell base is provided with a tin inlet port communicating with the impeller installation chamber. The liquid hole and the tin pot cover plate can be relatively rotatably equipped with a vertically arranged drive shaft, the upper end of the drive shaft extends to the upper end side of the tin pot cover plate, and the lower end of the drive shaft passes through the tin pot cover plate, The shell panel extends into the impeller installation chamber, and the driving impeller is clamped on the lower end of the driving shaft. The tin pump mounting frame is equipped with a pumping drive motor, and the power output shaft of the pumping drive motor is driven by the upper end of the driving shaft. Connection; the upper surface of the shell panel is provided with a tin liquid hole that communicates with the tin liquid pumping chamber, and the upper surface of the shell panel is screwed with a tin liquid nozzle that is vertically arranged and communicated with the tin liquid hole. The upper end of the liquid nozzle passes through the tin pot cover plate and extends to the upper end side of the tin pot cover plate;

该桌面式选择性波峰焊接机配装有装设于固定安装座的控制器,控制器包括有控制器壳体、嵌装于控制器壳体内部且与外部电源电连接的PCB控制线路板,控制器壳体的上表面装设有触摸显示屏、控制按钮,X轴驱动线性模组、Y轴驱动线性模组、Z轴驱动线性模组、电加热板、泵送驱动电机、触摸显示屏、控制按钮分别PCB控制线路板电连接。The desktop selective wave soldering machine is equipped with a controller mounted on a fixed mounting base. The controller includes a controller housing, a PCB control circuit board embedded in the controller housing and electrically connected to an external power supply. The upper surface of the controller housing is equipped with a touch screen, control buttons, X-axis drive linear module, Y-axis drive linear module, Z-axis drive linear module, electric heating plate, pumping drive motor, touch screen , control button respectively PCB control circuit board electrical connection.

其中,所述X轴驱动线性模组包括有分别装设于所述活动安装架的X轴驱动电机、X轴主动同步带轮、与X轴主动同步带轮左右水平间隔布置的X轴从动同步带轮,X轴驱动电机的动力输出轴与X轴主动同步带轮驱动连接,X轴主动同步带轮与X轴从动同步带轮之间绕装有X轴传动同步带,所述活动托板与X轴传动同步带连接,X轴驱动电机与所述PCB控制线路板电连接。Wherein, the X-axis drive linear module includes an X-axis drive motor, an X-axis active synchronous pulley, and an X-axis driven drive that is horizontally spaced from the X-axis active synchronous pulley and arranged on the left and right sides of the movable mounting frame. Synchronous pulley, the power output shaft of the X-axis drive motor is connected to the X-axis active synchronous pulley, and the X-axis transmission synchronous belt is wound between the X-axis active synchronous pulley and the X-axis driven synchronous pulley. The supporting plate is connected with the X-axis transmission synchronous belt, and the X-axis driving motor is electrically connected with the PCB control circuit board.

其中,所述Y轴驱动线性模组包括有分别装设于所述安装座侧板的Y轴驱动电机、Y轴主动同步带轮、与Y轴主动同步带轮前后水平间隔布置的Y轴从动同步带轮,Y轴驱动电机的动力输出轴与Y轴主动同步带轮驱动连接,Y轴主动同步带轮与Y轴从动同步带轮之间绕装有Y轴传动同步带,Y轴传动同步带装设有前后活动安装板,所述Z轴驱动线性模组装设于前后活动安装板,Y轴驱动电机与所述PCB控制线路板电连接。Wherein, the Y-axis drive linear module includes a Y-axis drive motor installed on the side plate of the mounting seat, a Y-axis active synchronous pulley, and a Y-axis slave that is horizontally spaced from the front and back of the Y-axis active synchronous pulley. The power output shaft of the Y-axis driving motor is connected with the active synchronous pulley of the Y-axis. A Y-axis drive synchronous belt is wound between the active synchronous pulley of the Y-axis and the driven synchronous pulley of the Y-axis. The Y-axis The transmission synchronous belt is equipped with front and rear movable mounting plates, the Z-axis driving linear module is installed on the front and rear movable mounting plates, and the Y-axis driving motor is electrically connected to the PCB control circuit board.

其中,所述Z轴驱动线性模组包括有装设于所述前后活动安装板的Z轴驱动电机,Z轴驱动电机的动力输出轴连设有呈竖向布置的驱动丝杆,所述活动安装架对应驱动丝杆装设有丝杆螺母,丝杆螺母与驱动丝杆相配合,Z轴驱动电机与所述PCB控制线路板电连接。Wherein, the Z-axis driving linear module includes a Z-axis driving motor installed on the front and rear movable mounting plates, the power output shaft of the Z-axis driving motor is connected with a driving screw rod arranged vertically, and the movable The mounting frame is equipped with a screw nut corresponding to the driving screw rod, and the screw nut is matched with the driving screw rod, and the Z-axis driving motor is electrically connected with the PCB control circuit board.

其中,所述锡锅盖板的上表面装设有套装于所述锡液喷嘴外围且用于接入氮气的氮气保护罩。Wherein, the upper surface of the tin pot cover is equipped with a nitrogen protective cover which is set on the periphery of the tin liquid nozzle and is used to access nitrogen.

其中,所述泵送驱动电机的动力输出轴通过链条传动机构与所述驱动转轴的上端部驱动连接。Wherein, the power output shaft of the pumping driving motor is drivingly connected to the upper end of the driving shaft through a chain transmission mechanism.

其中,所述锡锅盖板装设有伸入至所述锅体容置腔内的温度传感器,所述控制器壳体的上表面还装设有温控器,温度传感器与温控器电连接,温控器与所述PCB控制线路板电连接。Wherein, the cover plate of the tin pot is provided with a temperature sensor extending into the accommodating cavity of the pot body, and the upper surface of the controller housing is also provided with a temperature controller, and the temperature sensor and the temperature controller are electrically connected to each other. connected, the temperature controller is electrically connected with the PCB control circuit board.

本发明的有益效果为:本发明所述的一种桌面式选择性波峰焊接机,其固定安装座上端侧装设活动安装架,活动安装架装设活动托板,固定安装座于活动托板下端侧装设锡泵组件;固定安装座装设Y轴驱动线性模组,Y轴驱动线性模组的驱动端装设Z轴驱动线性模组,Z轴驱动线性模组的驱动端与活动安装架连接,活动安装架装设驱动活动托板的X轴驱动线性模组;锡泵组件包括有锡泵安装架、装设于锡泵安装架上端部的锡锅组件,锡锅组件包括锡锅锅体、锡锅盖板、电加热板,锡锅锅体的锅体容置腔内嵌装锡液泵送机构,锡液泵送机构包括壳体底座、壳体面板,壳体底座与壳体面板之间成型叶轮安装腔室、锡液泵送腔室、导流槽,叶轮安装腔室内装设通过泵送驱动电机、驱动转轴驱动的驱动叶轮,壳体底座外表面开设进锡液孔,壳体面板上表面的出锡液孔出装设锡液喷嘴;该桌面式选择性波峰焊接机配装控制器。通过上述结构设计,本发明具有结构设计新颖、自动化程度高、占地面积小、结构简单、维护方便并可实现精密焊接的优点,且能够有效地适用于小批量PCB板焊接作业。The beneficial effects of the present invention are: a desktop selective wave soldering machine according to the present invention, a movable mounting frame is installed on the upper end side of the fixed mounting base, the movable mounting frame is equipped with a movable pallet, and the fixed mounting base is mounted on the movable pallet The tin pump assembly is installed on the lower end side; the Y-axis drive linear module is installed on the fixed mount, the Z-axis drive linear module is installed on the drive end of the Y-axis drive linear module, and the drive end of the Z-axis drive linear module is connected to the movable installation frame connection, the movable mounting frame is equipped with an X-axis driven linear module that drives the movable pallet; the tin pump assembly includes a tin pump mounting frame, a tin pot assembly installed on the upper end of the tin pump mounting frame, and the tin pot assembly includes a tin pot Pot body, tin pot cover plate, electric heating plate, tin liquid pumping mechanism embedded in the pot body cavity of tin pot body, tin liquid pumping mechanism includes shell base, shell panel, shell base and shell The impeller installation chamber, tin liquid pumping chamber, and diversion groove are formed between the body panels. The impeller installation chamber is equipped with a drive impeller driven by a pumping drive motor and a drive shaft, and the outer surface of the shell base is opened with a tin liquid hole. , The tin liquid nozzle on the upper surface of the shell panel is equipped with a tin liquid nozzle; the desktop selective wave soldering machine is equipped with a controller. Through the above-mentioned structural design, the present invention has the advantages of novel structural design, high degree of automation, small floor space, simple structure, convenient maintenance and precision welding, and can be effectively applied to small-batch PCB board welding operations.

附图说明Description of drawings

下面利用附图来对本发明进行进一步的说明,但是附图中的实施例不构成对本发明的任何限制。The present invention will be further described below using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention.

图1为本发明的结构示意图。Fig. 1 is a structural schematic diagram of the present invention.

图2为本发明的锡泵组件的结构示意图。Fig. 2 is a structural schematic diagram of the tin pump assembly of the present invention.

图3为本发明的锡泵组件的剖面示意图。Fig. 3 is a schematic cross-sectional view of the tin pump assembly of the present invention.

图4为本发明的锡液泵送机构的结构示意图。Fig. 4 is a structural schematic diagram of the liquid tin pumping mechanism of the present invention.

在图1至图4中包括有:In Figures 1 to 4 include:

1——固定安装座 11——安装座底板1——fixed mount 11——base plate of mount

12——安装座侧板 2——活动安装架12——Installation seat side plate 2——Active mounting frame

3——活动托板 4——锡泵组件3——Active pallet 4——Tin pump assembly

41——锡泵安装架 42——锡锅组件41——Tin pump mounting bracket 42——Tin pot assembly

421——锡锅锅体 4211——锅体容置腔421——Tin pot body 4211——Pot body cavity

422——锡锅盖板 423——电加热板422——Tin pot cover 423——Electric heating plate

43——锡液泵送机构 431——锡泵壳体43——Tin Liquid Pumping Mechanism 431——Tin Pump Shell

4311——壳体底座 43111——进锡液孔4311——shell base 43111——tin liquid inlet hole

4312——壳体面板 43121——出锡液孔4312——Shell panel 43121——Tin liquid hole

4313——叶轮安装腔室 4314——锡液泵送腔室4313——Impeller installation chamber 4314——Tin liquid pumping chamber

4315——导流槽 432——驱动叶轮4315——Guzzle 432——Drive impeller

433——驱动转轴 434——泵送驱动电机433——drive shaft 434——pumping drive motor

435——锡液喷嘴 44——氮气保护罩435——Tin liquid nozzle 44——Nitrogen protective cover

45——温度传感器 51——X轴驱动线性模组45——Temperature sensor 51——X-axis drive linear module

511——X轴驱动电机 512——X轴主动同步带轮511——X-axis driving motor 512——X-axis driving synchronous pulley

513——X轴从动同步带轮 514——X轴传动同步带513——X-axis driven synchronous pulley 514——X-axis drive synchronous belt

52——Y轴驱动线性模组 521——Y轴驱动电机52——Y-axis drive linear module 521——Y-axis drive motor

522——Y轴主动同步带轮 523——Y轴从动同步带轮522——Y axis active synchronous pulley 523——Y axis driven synchronous pulley

524——Y轴传动同步带 525——前后活动安装板524——Y-axis transmission synchronous belt 525——front and rear movable mounting plate

53——Z轴驱动线性模组 531——Z轴驱动电机53——Z axis drive linear module 531——Z axis drive motor

532——驱动丝杆 533——丝杆螺母532——drive screw 533——screw nut

6——控制器 61——控制器壳体6——controller 61——controller shell

62——触摸显示屏 63——控制按钮62——touch screen 63——control buttons

64——温控器。64—thermostat.

具体实施方式detailed description

下面结合具体的实施方式来对本发明进行说明。The present invention will be described below in conjunction with specific embodiments.

如图1至图4所示,一种桌面式选择性波峰焊接机,包括有呈矩形状的固定安装座1,固定安装座1包括有呈水平横向布置的安装座底板11,安装座底板11的上表面螺装有四个呈矩形分布且依次连接的安装座侧板12,各安装座侧板12分别呈竖向布置,固定安装座1的上端侧可相对活动地装设有活动安装架2,活动安装架2可相对活动地装设有活动托板3,安装座底板11的上表面于活动托板3的下端侧装设有锡泵组件4。As shown in Figures 1 to 4, a desktop selective wave soldering machine includes a rectangular fixed mount 1, the fixed mount 1 includes a mount base 11 arranged horizontally and horizontally, the mount base 11 The upper surface of the upper surface is screw-mounted with four mounting seat side plates 12 distributed in a rectangular shape and connected in sequence, each mounting seat side plate 12 is vertically arranged respectively, and the upper end side of the fixed mounting seat 1 can be relatively movably equipped with a movable mounting frame. 2. The movable mounting frame 2 can be relatively movably equipped with a movable supporting plate 3 , and the tin pump assembly 4 is installed on the lower end side of the movable supporting plate 3 on the upper surface of the mounting base bottom plate 11 .

进一步的,固定安装座1的安装座侧板12装设有前后水平动作的Y轴驱动线性模组52,Y轴驱动线性模组52的驱动端装设有上下升降动作的Z轴驱动线性模组53,Z轴驱动线性模组53的驱动端与活动安装架2连接,活动安装架2装设有左右水平动作的X轴驱动线性模组51,X轴驱动线性模组51的驱动端与活动托板3连接。Further, the side plate 12 of the fixed mounting base 1 is equipped with a Y-axis driven linear module 52 that moves forward and backward horizontally, and the driving end of the Y-axis driven linear module 52 is equipped with a Z-axis driven linear module that moves up and down. Group 53, the driving end of the Z-axis driving linear module 53 is connected to the movable mounting frame 2, and the movable mounting frame 2 is equipped with an X-axis driving linear module 51 that moves left and right horizontally, and the driving end of the X-axis driving linear module 51 is connected to the Movable pallet 3 is connected.

更进一步的,锡泵组件4包括有锡泵安装架41、装设于锡泵安装架41上端部的锡锅组件42,锡锅组件42包括有锡锅锅体421、锡锅盖板422,锡锅锅体421的内部开设有朝上开口且用于盛装熔化锡液的锅体容置腔4211,锡锅盖板422盖装于锅体容置腔4211的上端开口处,锡锅锅体421的下表面装设有电加热板423;锡锅锅体421的锅体容置腔4211内嵌装有锡液泵送机构43,锡液泵送机构43包括有锡泵壳体431,锡泵壳体431包括有壳体底座4311、螺装于壳体底座4311上表面的壳体面板4312,壳体面板4312位于锡锅盖板422的正下方且壳体面板4312与锡锅盖板422连接,锡泵壳体431的内部于壳体底座4311与壳体面板4312之间成型有叶轮安装腔室4313、锡液泵送腔室4314、连通叶轮安装腔室4313与锡液泵送腔室4314的导流槽4315,叶轮安装腔室4313内可相对转动地装设有驱动叶轮432,壳体底座4311的外表面开设有与叶轮安装腔室4313连通的进锡液孔43111,锡锅盖板422可相对转动地装设有呈竖向布置的驱动转轴433,驱动转轴433的上端部延伸至锡锅盖板422的上端侧,驱动转轴433的下端部依次穿过锡锅盖板422、壳体面板4312而伸入至叶轮安装腔室4313内,驱动叶轮432套卡于驱动转轴433的下端部,锡泵安装架41装设有泵送驱动电机434,泵送驱动电机434的动力输出轴与驱动转轴433的上端部驱动连接;壳体面板4312的上表面开设有与锡液泵送腔室4314连通的出锡液孔43121,壳体面板4312的上表面螺装有呈竖向布置且与出锡液孔43121连通的锡液喷嘴435,锡液喷嘴435的上端部穿过锡锅盖板422并延伸至锡锅盖板422的上端侧。Further, the tin pump assembly 4 includes a tin pump mounting frame 41, a tin pot assembly 42 installed on the upper end of the tin pump mounting frame 41, the tin pot assembly 42 includes a tin pot body 421, a tin pot cover plate 422, The inside of the tin pot body 421 is provided with a pot body accommodating chamber 4211 that opens upwards and is used for containing molten tin liquid. The lower surface of 421 is equipped with an electric heating plate 423; the tin liquid pumping mechanism 43 is embedded in the pot body accommodating chamber 4211 of the tin pot body 421, and the tin liquid pumping mechanism 43 includes a tin pump housing 431, and the tin liquid pumping mechanism 43 includes a tin pump housing 431. The pump housing 431 includes a housing base 4311, a housing panel 4312 screwed on the upper surface of the housing base 4311, the housing panel 4312 is located directly below the tin pot cover 422 and the housing panel 4312 and the tin pot cover 422 Connection, the inside of the tin pump housing 431 is formed with an impeller installation chamber 4313, a tin liquid pumping chamber 4314, and a connecting impeller installation chamber 4313 and tin liquid pumping chamber between the housing base 4311 and the housing panel 4312 The diversion groove 4315 of 4314, the impeller installation chamber 4313 is relatively rotatably equipped with a driving impeller 432, the outer surface of the housing base 4311 is provided with a tin liquid inlet 43111 communicating with the impeller installation chamber 4313, and the tin pot cover The plate 422 can be relatively rotatably equipped with a vertically arranged driving shaft 433, the upper end of the driving shaft 433 extends to the upper end side of the tin pot cover 422, and the lower end of the driving shaft 433 passes through the tin pot cover 422, The shell panel 4312 extends into the impeller installation chamber 4313, the drive impeller 432 is sleeved on the lower end of the drive shaft 433, the tin pump installation frame 41 is equipped with a pumping drive motor 434, and the power output of the pumping drive motor 434 The shaft is driven and connected to the upper end of the drive shaft 433; the upper surface of the housing panel 4312 is provided with a tin liquid hole 43121 communicating with the tin liquid pumping chamber 4314, and the upper surface of the housing panel 4312 is screwed with a vertical arrangement. And the tin liquid nozzle 435 communicating with the tin liquid hole 43121 , the upper end of the tin liquid nozzle 435 passes through the tin pot cover plate 422 and extends to the upper end side of the tin pot cover plate 422 .

另外,该桌面式选择性波峰焊接机配装有装设于固定安装座1的控制器6,控制器6包括有控制器壳体61、嵌装于控制器壳体61内部且与外部电源电连接的PCB控制线路板,控制器壳体61的上表面装设有触摸显示屏62、控制按钮63,X轴驱动线性模组51、Y轴驱动线性模组52、Z轴驱动线性模组53、电加热板423、泵送驱动电机434、触摸显示屏62、控制按钮63分别PCB控制线路板电连接。In addition, the desktop selective wave soldering machine is equipped with a controller 6 mounted on the fixed mounting base 1. The controller 6 includes a controller housing 61, embedded in the controller housing 61 and connected to an external power supply. The connected PCB control circuit board, the upper surface of the controller housing 61 is equipped with a touch display 62, a control button 63, an X-axis driving linear module 51, a Y-axis driving linear module 52, and a Z-axis driving linear module 53 , the electric heating plate 423, the pumping drive motor 434, the touch screen 62, and the control button 63 are electrically connected to the PCB control circuit board respectively.

需进一步解释,如图1所示,X轴驱动线性模组51为同步带式线性模组,具体的,X轴驱动线性模组51包括有分别装设于活动安装架2的X轴驱动电机511、X轴主动同步带轮512、与X轴主动同步带轮512左右水平间隔布置的X轴从动同步带轮513,X轴驱动电机511的动力输出轴与X轴主动同步带轮512驱动连接,X轴主动同步带轮512与X轴从动同步带轮513之间绕装有X轴传动同步带514,活动托板3与X轴传动同步带514连接,X轴驱动电机511与PCB控制线路板电连接;另外,除了采用上述同步带式线性模组结构形式外,本发明的X轴驱动线性模组51还可以为滚珠丝杆副线性模组。Further explanation is required. As shown in FIG. 1, the X-axis drive linear module 51 is a synchronous belt-type linear module. Specifically, the X-axis drive linear module 51 includes an X-axis drive motor mounted on the movable mounting frame 2 respectively. 511, X-axis active synchronous pulley 512, X-axis driven synchronous pulley 513 horizontally spaced from the X-axis active synchronous pulley 512, the power output shaft of the X-axis driving motor 511 is driven by the X-axis active synchronous pulley 512 connection, X-axis driving synchronous belt pulley 512 and X-axis driven synchronous belt pulley 513 are wound with X-axis transmission synchronous belt 514, movable pallet 3 is connected with X-axis transmission synchronous belt 514, and X-axis driving motor 511 is connected to PCB The control circuit board is electrically connected; in addition, in addition to the above synchronous belt type linear module structure, the X-axis driving linear module 51 of the present invention can also be a ball screw secondary linear module.

如图1所示,本发明的Y轴驱动线性模组52为同步带式线性模组,具体的,Y轴驱动线性模组52包括有分别装设于安装座侧板12的Y轴驱动电机521、Y轴主动同步带轮522、与Y轴主动同步带轮522前后水平间隔布置的Y轴从动同步带轮523,Y轴驱动电机521的动力输出轴与Y轴主动同步带轮522驱动连接,Y轴主动同步带轮522与Y轴从动同步带轮523之间绕装有Y轴传动同步带524,Y轴传动同步带524装设有前后活动安装板525,Z轴驱动线性模组53装设于前后活动安装板525,Y轴驱动电机521与PCB控制线路板电连接。另外,除了采用上述同步带式线性模组结构形式外,本发明的Y轴驱动线性模组52还可以为滚珠丝杆副线性模组。As shown in Figure 1, the Y-axis drive linear module 52 of the present invention is a synchronous belt-type linear module. Specifically, the Y-axis drive linear module 52 includes Y-axis drive motors respectively installed on the side plates 12 of the mounting base. 521, the Y-axis active synchronous pulley 522, the Y-axis driven synchronous pulley 523 arranged at a horizontal interval before and after the Y-axis active synchronous pulley 522, the power output shaft of the Y-axis driving motor 521 is driven by the Y-axis active synchronous pulley 522 Connection, the Y-axis driving synchronous belt pulley 522 and the Y-axis driven synchronous belt pulley 523 are wound with a Y-axis transmission synchronous belt 524, the Y-axis transmission synchronous belt 524 is equipped with front and rear movable mounting plates 525, and the Z-axis drives the linear mold The group 53 is mounted on the front and rear movable mounting plates 525, and the Y-axis drive motor 521 is electrically connected to the PCB control circuit board. In addition, in addition to adopting the synchronous belt linear module structure above, the Y-axis driving linear module 52 of the present invention can also be a ball screw secondary linear module.

如图1所示,Z轴驱动线性模组53为滚珠丝杆副线性模组,具体的,Z轴驱动线性模组53包括有装设于前后活动安装板525的Z轴驱动电机531,Z轴驱动电机531的动力输出轴连设有呈竖向布置的驱动丝杆532,活动安装架2对应驱动丝杆532装设有丝杆螺母533,丝杆螺母533与驱动丝杆532相配合,Z轴驱动电机531与PCB控制线路板电连接。另外,除了采用上述滚珠丝杆副线性模组结构形式外,本发明的Z轴驱动线性模组53还可以为同步带式线性模组。As shown in Figure 1, the Z-axis driving linear module 53 is a ball screw paired linear module. Specifically, the Z-axis driving linear module 53 includes a Z-axis driving motor 531 installed on the front and rear movable mounting plates 525, Z The power output shaft of the shaft driving motor 531 is connected with a vertically arranged driving screw mandrel 532, and the movable mounting frame 2 is equipped with a screw nut 533 corresponding to the driving screw mandrel 532, and the screw mandrel nut 533 is matched with the driving screw mandrel 532, The Z-axis drive motor 531 is electrically connected to the PCB control circuit board. In addition, in addition to adopting the above-mentioned ball screw pair linear module structure, the Z-axis driving linear module 53 of the present invention can also be a synchronous belt type linear module.

需进一步指出,本发明的泵送驱动电机434的动力输出轴可以通过链条传动机构、皮带传动机构、同步带传动机构或者齿轮传动机构与驱动转轴433的上端部驱动连接。It should be further pointed out that the power output shaft of the pumping drive motor 434 of the present invention can be drivingly connected to the upper end of the driving shaft 433 through a chain transmission mechanism, a belt transmission mechanism, a synchronous belt transmission mechanism or a gear transmission mechanism.

其中,对于本发明的锡锅组件42而言,在PCB板焊接前,先将锡条放入至锡锅锅体421的锅体容置腔4211内,PCB控制线路板控制电加热板423通电,电加热板423通电后所产生的热量传导至锡锅锅体421,进而实现对锡锅锅体421进行加热,放入至锅体容置腔4211内的锡条加热后熔化并形成锡液。Wherein, for the tin pot assembly 42 of the present invention, before the PCB board is welded, the tin bar is put into the pot body accommodating cavity 4211 of the tin pot pot body 421, and the PCB control circuit board controls the electric heating plate 423 to energize , the heat generated after the electric heating plate 423 is energized is conducted to the tin pot body 421, and then the tin pot body 421 is heated, and the tin bars put into the pot body accommodating cavity 4211 are heated and melted to form tin liquid .

在本发明工作过程中,待焊接PCB板放置于活动托板3,在PCB板焊接前,本发明可以通过X轴驱动线性模组51来调节PCB板的左右位置,通过Y轴驱动线性模组52来调节PCB板的前后位置,并通过Z轴驱动线性模组53来调节PCB板的上下位置;其中,在调节PCB板左右位置过程中,X轴驱动电机511驱动由X轴主动同步带轮512、X轴从动同步带轮513以及X轴传动同步带514所组成的同步带传动机构动作,X轴传动同步带514带动活动托板3以及放置于活动托板3的PCB板左右移动;在调节PCB板上下位置过程中,Z轴驱动电机531通过由驱动丝杆532、丝杆螺母533所组成的丝杆传动机构驱动活动安装架2上下移动,上下移动的活动安装架2带动活动托板3以及放置于活动托板3的PCB板上下移动;在调节PCB板前后位置过程中,Y轴驱动电机521驱动有Y轴主动同步带轮522、Y轴从动同步带轮523以及Y轴传动同步带524所组成的同步带传动机构动作,Y轴传动同步带524带动前后活动安装板525前后移动,前后活动安装板525带动Z轴驱动线性模组53、活动安装架2、活动托板3以及放置于活动托板3的PCB板前后移动。In the working process of the present invention, the PCB board to be welded is placed on the movable pallet 3. Before the PCB board is welded, the present invention can drive the linear module 51 through the X axis to adjust the left and right positions of the PCB board, and drive the linear module through the Y axis. 52 to adjust the front and rear positions of the PCB board, and adjust the up and down position of the PCB board through the Z-axis drive linear module 53; wherein, in the process of adjusting the left and right positions of the PCB board, the X-axis drive motor 511 is driven by the X-axis active synchronous pulley 512. The synchronous belt transmission mechanism composed of the X-axis driven synchronous pulley 513 and the X-axis transmission synchronous belt 514 moves, and the X-axis transmission synchronous belt 514 drives the movable pallet 3 and the PCB board placed on the movable pallet 3 to move left and right; In the process of adjusting the upper and lower positions of the PCB board, the Z-axis driving motor 531 drives the movable mounting frame 2 to move up and down through the screw drive mechanism composed of the driving screw 532 and the screw nut 533, and the movable mounting frame 2 moving up and down drives the movable bracket The board 3 and the PCB board placed on the movable pallet 3 move up and down; in the process of adjusting the front and rear positions of the PCB board, the Y-axis drive motor 521 drives the Y-axis active synchronous pulley 522, the Y-axis driven synchronous pulley 523 and the Y-axis The synchronous belt transmission mechanism composed of transmission synchronous belt 524 acts, the Y-axis transmission synchronous belt 524 drives the front and rear movable mounting plates 525 to move back and forth, and the front and rear movable mounting plates 525 drive the Z-axis to drive the linear module 53, the movable mounting frame 2, and the movable pallet 3 and the PCB board placed on the movable pallet 3 moves back and forth.

需进一步指出,在本发明对PCB板焊接的过程中,PCB板在X轴驱动线性模组51、Y轴驱动线性模组52以及Z轴驱动线性模组53的驱动作用下而移动,并使得PCB板的焊点位置对准锡液喷嘴435;在通过锡泵组件4实现焊接的过程中,焊接时,PCB控制线路板控制泵送驱动电机434启动,泵送驱动电机434的动力输出轴驱动驱动转轴433转动,转动的驱动转轴433带动叶轮安装腔室4313内的驱动叶轮432转动,在驱动叶轮432的驱动作用下,锅体容置腔4211内的锡液依次经由进锡液孔43111、叶轮安装腔室4313以及导流槽4315而进入至锡液泵送腔室4314内,进入至锡液泵送腔室4314内的锡液经出锡液孔43121而进入至锡液喷嘴435内并最终经由锡液喷嘴435喷出,锡液喷嘴435所喷出的锡液呈一定高度的锡柱,其中,锡柱的高度可通过控制器6调节泵送驱动电机434的转速来实现调节,且锡柱所形成的柱状锡流便于实现精密焊接。It should be further pointed out that in the process of welding the PCB board in the present invention, the PCB board moves under the driving action of the X-axis driven linear module 51, the Y-axis driven linear module 52 and the Z-axis driven linear module 53, and makes The solder joint position of the PCB board is aligned with the tin liquid nozzle 435; in the process of realizing welding by the tin pump assembly 4, during welding, the PCB control circuit board controls the pumping drive motor 434 to start, and the power output shaft of the pumping drive motor 434 drives The driving shaft 433 rotates, and the rotating driving shaft 433 drives the driving impeller 432 in the impeller installation chamber 4313 to rotate. Under the driving action of the driving impeller 432, the tin liquid in the pot body accommodating cavity 4211 passes through the tin liquid inlet hole 43111, The impeller installation chamber 4313 and the guide groove 4315 enter into the tin liquid pumping chamber 4314, and the tin liquid entering into the tin liquid pumping chamber 4314 enters into the tin liquid nozzle 435 through the tin liquid outlet hole 43121 and Finally, it is ejected through the tin liquid nozzle 435, and the tin liquid ejected by the tin liquid nozzle 435 is a tin column of a certain height, wherein the height of the tin column can be adjusted by the controller 6 to adjust the speed of the pumping drive motor 434, and The columnar tin flow formed by the tin column facilitates precision soldering.

在本发明工作过程中,工作人员通过触摸显示屏62输入操作指令并查看焊接过程;另外,本发明可通过控制按钮63对焊接过程进行控制,本发明的控制按钮63包括有急停按钮、启动电源按钮、启动按钮、停止按钮等。During the working process of the present invention, the staff inputs operation instructions and checks the welding process through the touch screen 62; in addition, the present invention can control the welding process through the control button 63, and the control button 63 of the present invention includes an emergency stop button, a Power button, start button, stop button, etc.

综合上述情况可知,通过上述结构设计,本发明具有结构设计新颖、自动化程度高、占地面积小、结构简单、维护方便并可实现精密焊接的优点,且能够有效地适用于小批量PCB板焊接作业。Based on the above situation, it can be seen that through the above structural design, the present invention has the advantages of novel structural design, high degree of automation, small footprint, simple structure, convenient maintenance and precision welding, and can be effectively applied to small batch PCB board welding Operation.

作为优选的实施方式,如图2和图3所示,锡锅盖板422的上表面装设有套装于锡液喷嘴435外围且用于接入氮气的氮气保护罩44。在锡液喷嘴435将锡液喷出时,氮气保护罩44通入氮气且氮气保护罩44可以在锡柱形成氮气隔断空间,以避免锡液直接与空气中的氧气接触并产生锡渣,进而可有效地提高焊接质量。As a preferred embodiment, as shown in FIG. 2 and FIG. 3 , the upper surface of the tin pot cover plate 422 is provided with a nitrogen protective cover 44 which is set on the periphery of the tin liquid nozzle 435 and is used for nitrogen gas access. When the tin liquid nozzle 435 sprays the tin liquid, the nitrogen protection cover 44 is fed with nitrogen and the nitrogen protection cover 44 can form a nitrogen isolation space in the tin column, so as to avoid the direct contact of the tin liquid with the oxygen in the air and produce tin slag, and then It can effectively improve the welding quality.

作为优选的实施方式,如图1和图2所示,锡锅盖板422装设有伸入至锅体容置腔4211内的温度传感器45,控制器壳体61的上表面还装设有温控器64,温度传感器45与温控器64电连接,温控器64与PCB控制线路板电连接。As a preferred embodiment, as shown in Figure 1 and Figure 2, the tin pot cover plate 422 is equipped with a temperature sensor 45 extending into the pot body accommodating cavity 4211, and the upper surface of the controller housing 61 is also equipped with The temperature controller 64, the temperature sensor 45 is electrically connected to the temperature controller 64, and the temperature controller 64 is electrically connected to the PCB control circuit board.

在本发明工作过程中,温度传感器45实时采集锡液的温度信号并实时将温度信号发送至PCB控制线路板,当锡液的温度达到温控器64的设定值时,控制器6控制电加热板423断电;当锡液的温度低于温控器64的设定值时,PCB控制线路板控制电加热板423通电,以进行继续加热。故而,本发明可以准确有效地控制锡液的温度。In the working process of the present invention, the temperature sensor 45 collects the temperature signal of the tin liquid in real time and sends the temperature signal to the PCB control circuit board in real time. When the temperature of the tin liquid reaches the set value of the thermostat 64, the controller 6 controls the electric circuit board The heating plate 423 is powered off; when the temperature of the tin liquid is lower than the set value of the temperature controller 64, the PCB control circuit board controls the electric heating plate 423 to be powered on to continue heating. Therefore, the present invention can accurately and effectively control the temperature of the tin liquid.

基金项目:东莞职业技术学院2016年政校行企合作开展科研与服务项目资助(编号:政201604)。Fund project: Dongguan Vocational and Technical College's 2016 government-school-business cooperation to carry out scientific research and service projects (No. 201604).

以上内容仅为本发明的较佳实施例,对于本领域的普通技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处,本说明书内容不应理解为对本发明的限制。The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. limits.

Claims (7)

1.一种桌面式选择性波峰焊接机,其特征在于:包括有呈矩形状的固定安装座(1),固定安装座(1)包括有呈水平横向布置的安装座底板(11),安装座底板(11)的上表面螺装有四个呈矩形分布且依次连接的安装座侧板(12),各安装座侧板(12)分别呈竖向布置,固定安装座(1)的上端侧可相对活动地装设有活动安装架(2),活动安装架(2)可相对活动地装设有活动托板(3),安装座底板(11)的上表面于活动托板(3)的下端侧装设有锡泵组件(4);1. A desktop selective wave soldering machine, characterized in that: it includes a rectangular fixed mount (1), and the fixed mount (1) includes a mount base (11) arranged horizontally and horizontally. The upper surface of the seat bottom plate (11) is screw-mounted with four mounting seat side plates (12) distributed in a rectangular shape and connected in sequence. Each mounting seat side plate (12) is vertically arranged respectively, and the upper end of the mounting seat (1) is fixed The side can be equipped with a movable mounting frame (2) relatively movably, and the movable mounting frame (2) can be equipped with a movable supporting plate (3) relatively movably, and the upper surface of the mounting seat base plate (11) is on the movable supporting plate (3). ) is equipped with a tin pump assembly (4) on the lower end side; 固定安装座(1)的安装座侧板(12)装设有前后水平动作的Y轴驱动线性模组(52),Y轴驱动线性模组(52)的驱动端装设有上下升降动作的Z轴驱动线性模组(53),Z轴驱动线性模组(53)的驱动端与活动安装架(2)连接,活动安装架(2)装设有左右水平动作的X轴驱动线性模组(51),X轴驱动线性模组(51)的驱动端与活动托板(3)连接;The side plate (12) of the fixed mounting base (1) is equipped with a Y-axis driving linear module (52) that moves forward and backward horizontally, and the driving end of the Y-axis driving linear module (52) is equipped with a vertical movement The Z-axis drives the linear module (53), the driving end of the Z-axis drives the linear module (53) is connected to the movable mounting frame (2), and the movable mounting frame (2) is equipped with an X-axis driving linear module that moves left and right horizontally (51), the driving end of the X-axis driving linear module (51) is connected to the movable pallet (3); 锡泵组件(4)包括有锡泵安装架(41)、装设于锡泵安装架(41)上端部的锡锅组件(42),锡锅组件(42)包括有锡锅锅体(421)、锡锅盖板(422),锡锅锅体(421)的内部开设有朝上开口且用于盛装熔化锡液的锅体容置腔(4211),锡锅盖板(422)盖装于锅体容置腔(4211)的上端开口处,锡锅锅体(421)的下表面装设有电加热板(423);锡锅锅体(421)的锅体容置腔(4211)内嵌装有锡液泵送机构(43),锡液泵送机构(43)包括有锡泵壳体(431),锡泵壳体(431)包括有壳体底座(4311)、螺装于壳体底座(4311)上表面的壳体面板(4312),壳体面板(4312)位于锡锅盖板(422)的正下方且壳体面板(4312)与锡锅盖板(422)连接,锡泵壳体(431)的内部于壳体底座(4311)与壳体面板(4312)之间成型有叶轮安装腔室(4313)、锡液泵送腔室(4314)、连通叶轮安装腔室(4313)与锡液泵送腔室(4314)的导流槽(4315),叶轮安装腔室(4313)内可相对转动地装设有驱动叶轮(432),壳体底座(4311)的外表面开设有与叶轮安装腔室(4313)连通的进锡液孔(43111),锡锅盖板(422)可相对转动地装设有呈竖向布置的驱动转轴(433),驱动转轴(433)的上端部延伸至锡锅盖板(422)的上端侧,驱动转轴(433)的下端部依次穿过锡锅盖板(422)、壳体面板(4312)而伸入至叶轮安装腔室(4313)内,驱动叶轮(432)套卡于驱动转轴(433)的下端部,锡泵安装架(41)装设有泵送驱动电机(434),泵送驱动电机(434)的动力输出轴与驱动转轴(433)的上端部驱动连接;壳体面板(4312)的上表面开设有与锡液泵送腔室(4314)连通的出锡液孔(43121),壳体面板(4312)的上表面螺装有呈竖向布置且与出锡液孔(43121)连通的锡液喷嘴(435),锡液喷嘴(435)的上端部穿过锡锅盖板(422)并延伸至锡锅盖板(422)的上端侧;The tin pump assembly (4) includes a tin pump mounting frame (41), a tin pot assembly (42) installed on the upper end of the tin pump mounting frame (41), and the tin pot assembly (42) includes a tin pot body (421 ), the tin pot cover (422), the inside of the tin pot body (421) is provided with a pot body cavity (4211) that opens upward and is used to hold molten tin liquid, and the tin pot cover (422) covers At the upper opening of the pot body accommodating cavity (4211), an electric heating plate (423) is installed on the lower surface of the tin pot body (421); the pot body accommodating cavity (4211) of the tin pot body (421) A tin liquid pumping mechanism (43) is embedded inside, and the tin liquid pumping mechanism (43) includes a tin pump housing (431), and the tin pump housing (431) includes a housing base (4311), screwed on The shell panel (4312) on the upper surface of the shell base (4311), the shell panel (4312) is located directly below the tin pot cover (422) and the shell panel (4312) is connected to the tin pot cover (422), The interior of the tin pump housing (431) is formed between the housing base (4311) and the housing panel (4312) with an impeller installation chamber (4313), a tin liquid pumping chamber (4314), and a connected impeller installation chamber (4313) and the diversion groove (4315) of the liquid tin pumping chamber (4314), the impeller installation chamber (4313) is relatively rotatably equipped with a driving impeller (432), and the outer shell base (4311) There is a tin liquid inlet hole (43111) connected to the impeller installation chamber (4313) on the surface, and the tin pot cover plate (422) is relatively rotatably equipped with a vertically arranged drive shaft (433), and the drive shaft (433 ) extends to the upper end side of the tin pot cover (422), and the lower end of the drive shaft (433) passes through the tin pot cover (422) and the shell panel (4312) in sequence to extend into the impeller installation chamber (4313), the driving impeller (432) is sleeved on the lower end of the driving shaft (433), the tin pump mounting bracket (41) is equipped with a pumping drive motor (434), and the power output of the pumping drive motor (434) The shaft is drivingly connected to the upper end of the drive shaft (433); the upper surface of the shell panel (4312) is provided with a tin liquid hole (43121) communicating with the tin liquid pumping chamber (4314), and the shell panel (4312) The upper surface of the screw is equipped with a tin liquid nozzle (435) arranged vertically and communicated with the tin liquid hole (43121). The upper end of the tin liquid nozzle (435) passes through the tin pot cover (422) and extends to the tin pot The upper end side of the pot cover plate (422); 该桌面式选择性波峰焊接机配装有装设于固定安装座(1)的控制器(6),控制器(6)包括有控制器壳体(61)、嵌装于控制器壳体(61)内部且与外部电源电连接的PCB控制线路板,控制器壳体(61)的上表面装设有触摸显示屏(62)、控制按钮(63),X轴驱动线性模组(51)、Y轴驱动线性模组(52)、Z轴驱动线性模组(53)、电加热板(423)、泵送驱动电机(434)、触摸显示屏(62)、控制按钮(63)分别PCB控制线路板电连接。The desktop selective wave soldering machine is equipped with a controller (6) mounted on a fixed mount (1), the controller (6) includes a controller housing (61), embedded in the controller housing ( 61) The PCB control circuit board inside and electrically connected to the external power supply, the upper surface of the controller housing (61) is equipped with a touch display (62), control buttons (63), and an X-axis drive linear module (51) , Y-axis drive linear module (52), Z-axis drive linear module (53), electric heating plate (423), pumping drive motor (434), touch display screen (62), and control buttons (63) respectively PCB Control circuit board electrical connections. 2.根据权利要求1所述的一种桌面式选择性波峰焊接机,其特征在于:所述X轴驱动线性模组(51)包括有分别装设于所述活动安装架(2)的X轴驱动电机(511)、X轴主动同步带轮(512)、与X轴主动同步带轮(512)左右水平间隔布置的X轴从动同步带轮(513),X轴驱动电机(511)的动力输出轴与X轴主动同步带轮(512)驱动连接,X轴主动同步带轮(512)与X轴从动同步带轮(513)之间绕装有X轴传动同步带(514),所述活动托板(3)与X轴传动同步带(514)连接,X轴驱动电机(511)与所述PCB控制线路板电连接。2. A desktop selective wave soldering machine according to claim 1, characterized in that: the X-axis driving linear module (51) includes X Shaft drive motor (511), X-axis driving synchronous pulley (512), X-axis driven synchronous pulley (513) horizontally spaced from the X-axis driving synchronous pulley (512), X-axis driving motor (511) The power output shaft of the drive is connected with the X-axis driving synchronous pulley (512), and the X-axis driving synchronous belt (514) is wound between the X-axis driving synchronous pulley (512) and the X-axis driven synchronous pulley (513). , the movable pallet (3) is connected to the X-axis transmission timing belt (514), and the X-axis drive motor (511) is electrically connected to the PCB control circuit board. 3.根据权利要求2所述的一种桌面式选择性波峰焊接机,其特征在于:所述Y轴驱动线性模组(52)包括有分别装设于所述安装座侧板(12)的Y轴驱动电机(521)、Y轴主动同步带轮(522)、与Y轴主动同步带轮(522)前后水平间隔布置的Y轴从动同步带轮(523),Y轴驱动电机(521)的动力输出轴与Y轴主动同步带轮(522)驱动连接,Y轴主动同步带轮(522)与Y轴从动同步带轮(523)之间绕装有Y轴传动同步带(524),Y轴传动同步带(524)装设有前后活动安装板(525),所述Z轴驱动线性模组(53)装设于前后活动安装板(525),Y轴驱动电机(521)与所述PCB控制线路板电连接。3. A desktop selective wave soldering machine according to claim 2, characterized in that: said Y-axis drive linear module (52) includes The Y-axis drive motor (521), the Y-axis driving synchronous pulley (522), the Y-axis driven synchronous pulley (523) arranged at a horizontal interval before and after the Y-axis driving synchronous pulley (522), the Y-axis drive motor (521 ) is driven and connected to the Y-axis driving synchronous pulley (522), and the Y-axis driving synchronous belt (524) is wound between the Y-axis driving synchronous pulley (522) and the Y-axis driven synchronous pulley (523). ), the Y-axis transmission synchronous belt (524) is equipped with front and rear movable mounting plates (525), the Z-axis drive linear module (53) is installed on the front and rear movable mounting plates (525), and the Y-axis drive motor (521) It is electrically connected with the PCB control circuit board. 4.根据权利要求3所述的一种桌面式选择性波峰焊接机,其特征在于:所述Z轴驱动线性模组(53)包括有装设于所述前后活动安装板(525)的Z轴驱动电机(531),Z轴驱动电机(531)的动力输出轴连设有呈竖向布置的驱动丝杆(532),所述活动安装架(2)对应驱动丝杆(532)装设有丝杆螺母(533),丝杆螺母(533)与驱动丝杆(532)相配合,Z轴驱动电机(531)与所述PCB控制线路板电连接。4. A desktop selective wave soldering machine according to claim 3, characterized in that: said Z-axis drive linear module (53) includes Z The shaft drive motor (531), the power output shaft of the Z-axis drive motor (531) is connected with a vertically arranged drive screw (532), and the movable mounting bracket (2) is installed correspondingly to the drive screw (532). There is a screw nut (533), and the screw nut (533) cooperates with the driving screw (532), and the Z-axis driving motor (531) is electrically connected to the PCB control circuit board. 5.根据权利要求1所述的一种桌面式选择性波峰焊接机,其特征在于:所述锡锅盖板(422)的上表面装设有套装于所述锡液喷嘴(435)外围且用于接入氮气的氮气保护罩(44)。5. A desktop selective wave soldering machine according to claim 1, characterized in that: the upper surface of the tin pot cover (422) is equipped with a Nitrogen shield (44) for nitrogen access. 6.根据权利要求1所述的一种桌面式选择性波峰焊接机,其特征在于:所述泵送驱动电机(434)的动力输出轴通过链条传动机构与所述驱动转轴(433)的上端部驱动连接。6. A desktop selective wave soldering machine according to claim 1, characterized in that: the power output shaft of the pumping drive motor (434) is connected to the upper end of the drive shaft (433) through a chain transmission mechanism External drive connection. 7.根据权利要求1所述的一种桌面式选择性波峰焊接机,其特征在于:所述锡锅盖板(422)装设有伸入至所述锅体容置腔(4211)内的温度传感器(45),所述控制器壳体(61)的上表面还装设有温控器(64),温度传感器(45)与温控器(64)电连接,温控器(64)与所述PCB控制线路板电连接。7. A desktop selective wave soldering machine according to claim 1, characterized in that: the tin pot cover (422) is equipped with a hole extending into the pot body cavity (4211) The temperature sensor (45), the upper surface of the controller housing (61) is also equipped with a thermostat (64), the temperature sensor (45) is electrically connected to the thermostat (64), and the thermostat (64) It is electrically connected with the PCB control circuit board.
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106984937A (en) * 2017-05-28 2017-07-28 郑州嘉晨化工科技有限公司 A kind of welding machine tool pushes chassis and its application method
CN109202203A (en) * 2017-07-04 2019-01-15 深圳普洲自动化设备有限公司 A kind of angle gear high-temperature tin alloy liquid furnace
CN109253702A (en) * 2018-11-08 2019-01-22 东莞职业技术学院 A kind of PCB drilling Quick overhaul method and apparatus
CN112518068A (en) * 2020-12-16 2021-03-19 彼勒豪斯(苏州)自动焊锡系统有限公司 Selective wave soldering equipment and soldering method for electronic component
CN113941749A (en) * 2021-11-29 2022-01-18 珠海飞创智能科技有限公司 Liquid tin supply equipment for wave soldering
CN115090989A (en) * 2022-07-25 2022-09-23 江苏丰源电子科技有限公司 Electronic component lead welding machine

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560534A (en) * 1994-03-18 1996-10-01 Fujitsu Limited Soldering apparatus
JP2000108072A (en) * 1998-09-30 2000-04-18 Nec Corp Multi-axis driving mechanism
CN101780575A (en) * 2009-01-16 2010-07-21 海尔集团公司 Wave-soldering tin-soldering spout device and wave-soldering soldering system
CN102039465A (en) * 2009-10-22 2011-05-04 西安中科麦特电子技术设备有限公司 Selective spraying machine
CN202910425U (en) * 2012-10-25 2013-05-01 深圳市艾贝特电子科技有限公司 Intelligent power module (IPM) full-automatic welding system for main board of variable frequency air conditioner
CN103192156A (en) * 2013-04-17 2013-07-10 北京埃森恒业科技有限公司 Miniature nitrogen protective solder pump system
CN204030231U (en) * 2014-07-28 2014-12-17 胡绍梁 A fully automatic device for dipping tin, striking terminals, and inserting plastic shells for connecting wires
CN104625290A (en) * 2015-01-16 2015-05-20 东莞新爱荣机械自动化设备有限公司 Cantilever type automatic tin soldering device
JP2015115427A (en) * 2013-12-11 2015-06-22 株式会社パラット Soldering device and method
CN105128341A (en) * 2015-09-30 2015-12-09 石家庄宝信防伪科技有限公司 Matrix type 3D printer and printing method thereof
CN105665939A (en) * 2016-04-20 2016-06-15 东莞理工学院 Advertising character manufacturing equipment and manufacturing method integrating laser engraving and 3D printing
CN105904062A (en) * 2016-06-13 2016-08-31 孙玉荣 Spray flow welding device with adjustable nozzle spacing

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560534A (en) * 1994-03-18 1996-10-01 Fujitsu Limited Soldering apparatus
JP2000108072A (en) * 1998-09-30 2000-04-18 Nec Corp Multi-axis driving mechanism
CN101780575A (en) * 2009-01-16 2010-07-21 海尔集团公司 Wave-soldering tin-soldering spout device and wave-soldering soldering system
CN102039465A (en) * 2009-10-22 2011-05-04 西安中科麦特电子技术设备有限公司 Selective spraying machine
CN202910425U (en) * 2012-10-25 2013-05-01 深圳市艾贝特电子科技有限公司 Intelligent power module (IPM) full-automatic welding system for main board of variable frequency air conditioner
CN103192156A (en) * 2013-04-17 2013-07-10 北京埃森恒业科技有限公司 Miniature nitrogen protective solder pump system
JP2015115427A (en) * 2013-12-11 2015-06-22 株式会社パラット Soldering device and method
CN204030231U (en) * 2014-07-28 2014-12-17 胡绍梁 A fully automatic device for dipping tin, striking terminals, and inserting plastic shells for connecting wires
CN104625290A (en) * 2015-01-16 2015-05-20 东莞新爱荣机械自动化设备有限公司 Cantilever type automatic tin soldering device
CN105128341A (en) * 2015-09-30 2015-12-09 石家庄宝信防伪科技有限公司 Matrix type 3D printer and printing method thereof
CN105665939A (en) * 2016-04-20 2016-06-15 东莞理工学院 Advertising character manufacturing equipment and manufacturing method integrating laser engraving and 3D printing
CN105904062A (en) * 2016-06-13 2016-08-31 孙玉荣 Spray flow welding device with adjustable nozzle spacing

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CN106984937A (en) * 2017-05-28 2017-07-28 郑州嘉晨化工科技有限公司 A kind of welding machine tool pushes chassis and its application method
CN106984937B (en) * 2017-05-28 2019-03-08 郑州嘉晨化工科技有限公司 A kind of welding machine tool push chassis and its application method
CN109202203A (en) * 2017-07-04 2019-01-15 深圳普洲自动化设备有限公司 A kind of angle gear high-temperature tin alloy liquid furnace
CN109253702A (en) * 2018-11-08 2019-01-22 东莞职业技术学院 A kind of PCB drilling Quick overhaul method and apparatus
CN109253702B (en) * 2018-11-08 2023-07-28 东莞职业技术学院 PCB drilling quick overhaul method and equipment
CN112518068A (en) * 2020-12-16 2021-03-19 彼勒豪斯(苏州)自动焊锡系统有限公司 Selective wave soldering equipment and soldering method for electronic component
CN112518068B (en) * 2020-12-16 2023-12-05 彼勒豪斯(苏州)自动焊锡系统有限公司 Selective wave soldering equipment for electronic element
CN113941749A (en) * 2021-11-29 2022-01-18 珠海飞创智能科技有限公司 Liquid tin supply equipment for wave soldering
CN115090989A (en) * 2022-07-25 2022-09-23 江苏丰源电子科技有限公司 Electronic component lead welding machine

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