CN106313178B - A kind of integrated processing method of die cutting product - Google Patents
A kind of integrated processing method of die cutting product Download PDFInfo
- Publication number
- CN106313178B CN106313178B CN201610701535.0A CN201610701535A CN106313178B CN 106313178 B CN106313178 B CN 106313178B CN 201610701535 A CN201610701535 A CN 201610701535A CN 106313178 B CN106313178 B CN 106313178B
- Authority
- CN
- China
- Prior art keywords
- product
- conducting resinl
- die cutting
- die
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 34
- 238000003672 processing method Methods 0.000 title claims abstract description 11
- 239000002699 waste material Substances 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 12
- 238000013329 compounding Methods 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 9
- 150000001875 compounds Chemical class 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000001815 facial effect Effects 0.000 description 2
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of integrated processing methods of die cutting product, and steps are as follows：（One）In counterdie（1）Both sides be die cut out two side conducting resinls respectively along its length（2）；In side conducting resinl（2）Upper die cutting product；（Two）In counterdie（1）Its width direction of upper edge is die cut out three width conducting resinls（3）；In width conducting resinl（3）Upper die cutting product；（Three）In side conducting resinl（2）Inside be die cut inner conductive glue（4）；In inside conducting resinl（4）Upper die cutting product；（Four）Side conducting resinl is excluded respectively（2）And product, width conducting resinl（3）And product, inner conductive glue（4）And the waste material on product.The present invention, which realizes multiple material and makes compound product, OEM sections in same level, the independent product of more moneys and repeatedly assemble, to be become once assembling.
Description
Technical field
The present invention relates to a kind of integrated processing methods of die cutting product.
Background technology
Traditional processing industry at present is especially die cut industry, and the synthesis materials and parts for different materials are the difficulties for being difficult to break through
Point.It can not machine-shaping on machine, it is necessary to could be realized by way of assembling and assembling, expend a large amount of board and people in this way
Power.
Invention content
In view of the deficiencies of the prior art mentioned above, problems solved by the invention is：A kind of efficient die cutting product is provided
Integrated processing method.
To solve the above problems, the technical solution adopted by the present invention is as follows：
A kind of integrated processing method of die cutting product, steps are as follows：（One）In counterdie（1）Both sides divide along its length
It is not die cut out two side conducting resinls（2）；In side conducting resinl（2）Upper die cutting product；（Two）In counterdie（1）Its width side of upper edge
To being die cut out three width conducting resinls（3）；In width conducting resinl（3）Upper die cutting product；（Three）In side conducting resinl（2）Inside
It is die cut inner conductive glue（4）；In inside conducting resinl（4）Upper die cutting product；（Four）Side conducting resinl is excluded respectively（2）And production
Product, width conducting resinl（3）And product, inner conductive glue（4）And the waste material on product.
Further, the step（Four）Using the above compounding machine of four stations.
Further, side conducting resinl is excluded in the first station of compounding machine first（2）And product and width conducting resinl（3）With
And the waste material on product；Then inner conductive glue is excluded in compounding machine second station（4）And the waste material on product；Again compound
Machine 3rd station whole piece strength silica gel adhesive tape, excludes whole waste material；Finally in four station of compounding machine on product
Cover facial tissue, shipment.
Further, the step（One）It is middle to use a 420 asynchronous die-cutting machines and a compounding machine.
Further, the step（Two）It is middle to use a 420 asynchronous die-cutting machines and a compounding machine.
Further, the step（Three）It is middle to use a 420 asynchronous die-cutting machines.
Beneficial effects of the present invention
The present invention realizes multiple material and makes compound product, OEM sections multiple group in same level, the independent product of more moneys
Dress becomes once assembling.The different materials product of multiple single levels is completed into board coproduction by group line technology, core content is
Multiple material is mounted into a part and meets the tolerance of ± 0.1mm, to replace man-made assembly or even board to fill automatically
Patch.This technique control technology, moreover it is possible to which human cost is greatly lowered in the automatization level for improving die cutting product, promotes the competing of product
Power is striven, juice is obtained.
Description of the drawings
Fig. 1 is step of the present invention（One）Structural schematic diagram.
Fig. 2 is step of the present invention（Two）Structural schematic diagram.
Fig. 3 is step of the present invention（Three）Structural schematic diagram.
Fig. 4 is step of the present invention（Three）Structural schematic diagram.
Specific implementation mode
The content of present invention is described in further detail below in conjunction with the accompanying drawings.
As shown in Figures 1 to 4, the integrated processing method of a kind of die cutting product, steps are as follows：（One）On the both sides edge of counterdie 1
Its length direction is die cut out two side conducting resinls 2 respectively；The die cutting product on side conducting resinl 2；（Two）1 upper edge of counterdie its
Width direction is die cut out three width conducting resinls 3；The die cutting product on width conducting resinl 3；（Three）The inside of conducting resinl 2 in side
It is die cut inner conductive glue 4；The die cutting product on inside conducting resinl 4；（Four）Side conducting resinl 2 and product, width are excluded respectively
Waste material on conducting resinl 3 and product, inner conductive glue 4 and product.Further, the step（Four）Use four stations with
Upper compounding machine.Further, first the first station of compounding machine exclude side conducting resinl 2 and product and width conducting resinl 3 and
Waste material on product；Then the waste material on inner conductive glue 4 and product is excluded in compounding machine second station；Again in compounding machine
Three stations whole piece strength silica gel adhesive tape, excludes whole waste material；Finally covered on product in four station of compounding machine
Facial tissue, shipment.Further, the step（One）It is middle to use a 420 asynchronous die-cutting machines and a compounding machine.Further, institute
The step of stating（Two）It is middle to use a 420 asynchronous die-cutting machines and a compounding machine.Further, the step（Three）In use one
420 asynchronous die-cutting machine of platform.
The present invention realizes multiple material and makes compound product, OEM sections multiple group in same level, the independent product of more moneys
Dress becomes once assembling.The different materials product of multiple single levels is completed into board coproduction by group line technology, core content is
Multiple material is mounted into a part and meets the tolerance of ± 0.1mm, to replace man-made assembly or even board to fill automatically
Patch.This technique control technology, moreover it is possible to which human cost is greatly lowered in the automatization level for improving die cutting product, promotes the competing of product
Power is striven, juice is obtained.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
With within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention god.
Claims (4)
1. a kind of integrated processing method of die cutting product, which is characterized in that steps are as follows：（One）In counterdie（1）Both sides along it
Length direction is die cut out two side conducting resinls respectively（2）；In side conducting resinl（2）Upper die cutting product；（Two）In counterdie（1）On
It is die cut out three width conducting resinls along its width direction（3）；In width conducting resinl（3）Upper die cutting product；（Three）In side conduction
Glue（2）Inside be die cut inner conductive glue（4）；In inside conducting resinl（4）Upper die cutting product；（Four）Side conducting resinl is excluded respectively
（2）And product, width conducting resinl（3）And product, inner conductive glue（4）And the waste material on product；Use four stations with
Upper compounding machine excludes side conducting resinl in the first station of compounding machine first（2）And product and width conducting resinl（3）And product
On waste material；Then inner conductive glue is excluded in compounding machine second station（4）And the waste material on product；Again in compounding machine third
Station whole piece strength silica gel adhesive tape, excludes whole waste material；Finally in four station of compounding machine on product upper cover
Paper, shipment.
2. the integrated processing method of die cutting product according to claim 1, which is characterized in that the step（One）In adopt
With a 420 asynchronous die-cutting machines and a compounding machine.
3. the integrated processing method of die cutting product according to claim 1, which is characterized in that the step（Two）In adopt
With a 420 asynchronous die-cutting machines and a compounding machine.
4. the integrated processing method of die cutting product according to claim 1, which is characterized in that the step（Three）In adopt
With a 420 asynchronous die-cutting machines.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610701535.0A CN106313178B (en) | 2016-08-23 | 2016-08-23 | A kind of integrated processing method of die cutting product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610701535.0A CN106313178B (en) | 2016-08-23 | 2016-08-23 | A kind of integrated processing method of die cutting product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106313178A CN106313178A (en) | 2017-01-11 |
| CN106313178B true CN106313178B (en) | 2018-10-19 |
Family
ID=57742802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610701535.0A Active CN106313178B (en) | 2016-08-23 | 2016-08-23 | A kind of integrated processing method of die cutting product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106313178B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112571919A (en) * | 2020-12-21 | 2021-03-30 | 成都冠佳科技有限公司 | Waste discharge mechanism for foam processing and waste discharge method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120242814A1 (en) * | 2011-03-25 | 2012-09-27 | Kenneth Kubala | Miniature Wafer-Level Camera Modules |
| CN104108199A (en) * | 2013-04-18 | 2014-10-22 | 襄阳金飞环彩色包装有限公司 | Connected finished product die-cutting anti-adhesion and all-waste cleaning integrated system of die-cutting machine |
| CN103448087B (en) * | 2013-09-04 | 2015-04-08 | 东莞市飞新达精密机械科技有限公司 | Method and system for removing waste edges in die cutting processing of sheet products |
| CN204505394U (en) * | 2015-03-30 | 2015-07-29 | 淮安和顺彩印包装有限公司 | Be provided with the die-cutting machine removing Waste paper strip device |
-
2016
- 2016-08-23 CN CN201610701535.0A patent/CN106313178B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106313178A (en) | 2017-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110561881A (en) | A die-cut integrative equipment of rubber coating tectorial membrane for adhesive label production | |
| CN106903964A (en) | A kind of preparation method of layer cloth seamless adhesion | |
| CN106313178B (en) | A kind of integrated processing method of die cutting product | |
| CN108237762B (en) | Die cutting device for multilayer conductive cloth | |
| CN108247740A (en) | Without tool marks foam rubber die-cutting production method | |
| CN106590455A (en) | Preparation technology of insulating Mylar | |
| CN206436610U (en) | A kind of die-cutting apparatus for multilayer conductive cloth | |
| CN206840904U (en) | A kind of die-cutting apparatus of the conductive fabric with ultra-thin one side glue-line | |
| CN102742966A (en) | Novel sole | |
| CN109572084A (en) | A kind of die cutting product and its processing technology being able to solve anti-release problem | |
| CN105392278B (en) | It is a kind of local without glue reinforcing chip former | |
| CN108284147A (en) | Method of the combination of mould knife sharp angle degree and pad knife material for processing sheet metal | |
| CN108724913A (en) | A kind of electric eye of non-flanged location hole is to pasting make-up machine | |
| CN205291787U (en) | Sole board | |
| CN205276650U (en) | Dome curved surface furred ceiling | |
| CN110238900B (en) | Positioning hole transfer and pull-down waste discharge process | |
| CN203602139U (en) | Dual-blade-position cutting machine | |
| CN202029185U (en) | Large format multiple layer bamboo surface venetian blind sheet integrated plate with curve-shaped cross section | |
| CN107081953A (en) | A kind of laminating apparatus for heat conduction foam piece | |
| CN209158510U (en) | A kind of label cutting tool | |
| CN208117979U (en) | A kind of die-cutting device of different-thickness and the glue product of shape | |
| US11571562B2 (en) | Shape cutting device for skin electrode patch | |
| CN206840281U (en) | A kind of cutting machine | |
| CN207256808U (en) | A kind of solid full coated coextrusion moulds of PVC | |
| CN101837660A (en) | Fruit bag machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |