CN106298614A - A kind of thimble for backside openings chip - Google Patents
A kind of thimble for backside openings chip Download PDFInfo
- Publication number
- CN106298614A CN106298614A CN201510243752.5A CN201510243752A CN106298614A CN 106298614 A CN106298614 A CN 106298614A CN 201510243752 A CN201510243752 A CN 201510243752A CN 106298614 A CN106298614 A CN 106298614A
- Authority
- CN
- China
- Prior art keywords
- chip
- needle point
- point contact
- thimble
- contact site
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 244000030765 Phaleria macrocarpa Species 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The present invention provides a kind of thimble for backside openings chip, including several needle point contact sites, supporting part and connecting portion, described needle point contact site, supporting part and connecting portion are structure as a whole, the chip of the top contact backside openings of described needle point contact site, the bottom of described needle point contact site is connected with described supporting part, described connecting portion one end connects described supporting part, and the other end connects loader.This thimble acts on the corner of chip or polygonal, can be by the four of chip angles or multiple angle jack-up the most simultaneously, and such chip just can be siphoned away smoothly and not affect other chips, can promote production capacity with the stability of Improving The Quality of Products.
Description
[technical field]
The present invention relates to technical field of microelectronic mechanical systems, particularly to a kind of for backside openings chip
Thimble.
[background technology]
MEMS is MEMS, in the load operation of a kind of MEMS pressure sensor with a lid encapsulation
In, owing to chip back has opening, and aperture area exceedes the 3/4 of chip area, and common thimble is difficult to
Normally by chip jack-up from blue film, existing conventional jack-up mode has 2 kinds: mode one, directly withstands on
The central area of chip, but the silicon stress film in the middle of the type chip is easily damaged, easily after by external force
Cause disabler；Mode two, referring to Fig. 1, Fig. 1 is that in prior art, the structure of thimble jack-up chip is shown
It is intended to, as it is shown in figure 1, thimble 3 withstands on the marginal area of chip 1, easily causes described chip 1 and tilt,
Then take up side one chips, have a strong impact on the quality of production capacity and product.
Therefore, it is necessary to provide the technical scheme of a kind of improvement to overcome the problems referred to above.
[summary of the invention]
It is an object of the invention to provide a kind of thimble for backside openings chip, solve common thimble difficult
With normally by chip from blue film jack-up so that the problem that production capacity is low, product quality is poor.
In order to solve the problems referred to above, the present invention provides a kind of thimble for backside openings chip, comprising:
Several needle point contact sites, supporting part and connecting portion, described needle point contact site, supporting part and connecting portion are one
Body structure, the chip of the top contact backside openings of described needle point contact site, the bottom of described needle point contact site
Being connected with described supporting part, described connecting portion one end connects described supporting part, and the other end connects loader.
As a preferred embodiment of the present invention, the chip of described backside openings have first surface and with
The corresponding second surface of described first surface, offers groove in the center of described second surface, described
Groove is arranged to described first surface direction from described second surface, the bottom surface of described groove and described first table
Face is the most parallel with second surface, and the bottom surface of described groove is provided with silicon stress film, the face, bottom surface of described groove
The long-pending area less than described first surface, described second surface structure in the shape of a frame, the top of described needle point contact site
Portion contacts described frame like structure, and several described needle point contact sites are evenly spaced in described frame like structure, institute
State the number of needle point contact site more than or equal to four.
As a preferred embodiment of the present invention, the number of described needle point contact site is equal to four, four
Described needle point contact site is evenly spaced in described frame like structure, constitutes four angles of a rectangle.
Compared with prior art, the thimble used in the present invention be by tradition thimble top half make with
Chip size is close, then top is made similar crown-shaped, makes four angles of Phaleria macrocarpa or multiple angle to withstand on
The surrounding of chip.This thimble acts on the corner of chip or polygonal, can be by the four of chip angles or multiple
Angle jack-up the most simultaneously, such chip just can be siphoned away smoothly and not affected other chips, Ke Yiti
Rise the stability of product quality, promote production capacity.
[accompanying drawing explanation]
In order to be illustrated more clearly that the technical scheme of the embodiment of the present invention, required in embodiment being described below
Accompanying drawing to be used is briefly described, it should be apparent that, the accompanying drawing in describing below is only the present invention's
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work,
Other accompanying drawing can also be obtained according to these accompanying drawings.Wherein:
Fig. 1 is the structural representation of thimble jack-up chip in prior art；With,
Fig. 2 is the structural representation of a kind of thimble jack-up chip for backside openings chip in the present invention.
Wherein: 1 is chip, 11 is first surface, and 12 is second surface, and 2 is groove, and 21 is bottom surface, 3
For thimble, 31 is needle point contact site, and 32 is supporting part, and 33 is connecting portion.
[detailed description of the invention]
Refer to the knot that Fig. 2, Fig. 2 are a kind of thimble jack-up chip for backside openings chip in the present invention
Structure schematic diagram.As shown in Figure 2, although say in Fig. 2 is needle point contact site 31 situation with 4, but
It is from Fig. 2, still will appreciate that a kind of thimble for backside openings chip that the present invention provides, if including
Dry individual needle point contact site 31, supporting part 32 and connecting portion 33, described needle point contact site 31, supporting part 32 and
Connecting portion 33 is structure as a whole, and the top of described needle point contact site 31 contacts with the chip 1 of backside openings,
The bottom of described needle point contact site 31 is connected with described supporting part 32, and described connecting portion 33 one end connects described
Supporting part 32, the other end connects loader (not shown), and when described loader works, thimble is towards described
The back side motion of chip 1, described needle point contact site 31 contacts the back side of described chip 1, by described chip 1
Jack-up.
For the ease of understanding the position at 31 contact chip 1 back sides of described needle point contact site, below first place of matchmakers
State chip 1: the chip 1 of described backside openings has first surface 11 and corresponding with described first surface 11
Second surface 12, offer groove 2 in the center of described second surface 12, described groove 2 is from institute
State second surface 12 to arrange to described first surface 11 direction, the bottom surface 21 and described first of described groove 2
Surface 11 is the most parallel with second surface 12, and the bottom surface 21 of described groove 2 is provided with silicon stress film and (does not schemes
Show), bottom surface 21 area of described groove 2 is less than the area of described first surface 11, described second surface
12 structures in the shape of a frame (not shown).
Frame like structure described in the top contact of described needle point contact site 31, and do not contact described bottom surface 21, this is
Because the bottom surface 21 of described groove 2 is provided with silicon stress film, silicon stress film is more sensitive, fragile.If
A dry described needle point contact site 31 is evenly spaced in described frame like structure, so ensures upwards to eject at thimble
During described chip 1, each described needle point contact site 31 uniform force, chip 1 run-off the straight can be avoided.
The number of described needle point contact site 31 is more than or equal to four.Chip 1 generally rectangular in shape, thus many
Individual described needle point contact site 31 is uniformly distributed in around four summits of described rectangle.
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with the accompanying drawings and
The present invention is further detailed explanation for detailed description of the invention.
" embodiment " or " embodiment " referred to herein refers to may be included in the present invention, and at least one is real
Special characteristic, structure or characteristic in existing mode.Different local in this manual occur " a reality
Execute in example " not refer both to same embodiment, it is not single or the most mutual with other embodiments
The embodiment repelled.
Embodiment one
Please continue to refer to Fig. 2, as in figure 2 it is shown, the number of described needle point contact site 31 is equal to four, four institutes
State needle point contact site 31 to be evenly spaced in described frame like structure, constitute foursquare four angles；Four institutes
Stating needle point contact site 31 length equal, now thimble is similar to crown-shaped, and four needle point contact site 31 classes
It is similar to four angles of Phaleria macrocarpa, the surrounding of chip 1 can be withstood on.This thimble acts on the corner of chip 1 can
With by four angles of chip 1 smoothly simultaneously jack-up, such chip 1 just can be siphoned away and not shadow smoothly
Ring other chips.
Those of ordinary skill in art it should be appreciated that, one of the feature of the present invention or purpose
It is: 1: thimble uses special construction, it is ensured that chip can be at same level height by jack-up simultaneously；2: four
The area that individual needle point contact site makes thimble contact chip is little, it is simple to adjust the relative position relation of itself and chip,
Required degree of accuracy is low, it is easy to operation.So chip just can be siphoned away smoothly and not affected other cores
Sheet, the design of such thimble can promote production capacity with the stability of Improving The Quality of Products.
It is pointed out that what the detailed description of the invention of the present invention done by one skilled in the art appoints
What changes the scope all without departing from claims of the present invention.Correspondingly, the model of the claim of the present invention
Enclose and be also not limited only to previous embodiment.
Claims (3)
1. the thimble for backside openings chip, it is characterised in that including: several needle point contact sites,
Supporting part and connecting portion, described needle point contact site, supporting part and connecting portion be structure as a whole, and described needle point connects
The chip of the top contact backside openings of contact portion, the bottom of described needle point contact site is connected with described supporting part,
Described connecting portion one end connects described supporting part, and the other end connects loader.
Thimble for backside openings chip the most according to claim 1, it is characterised in that the described back of the body
The chip of face opening has first surface and second surface corresponding with described first surface, at described second table
The center in face offers groove, and described groove is arranged to described first surface direction from described second surface,
The bottom surface of described groove is the most parallel with described first surface and second surface, and the bottom surface of described groove is provided with silicon
Stress film, the base area of described groove is less than the area of described first surface, and described second surface is frame
Shape structure, frame like structure described in the top contact of described needle point contact site, several described needle point contact sites are equal
Even being arranged in described frame like structure, the number of described needle point contact site is more than or equal to four.
Thimble for backside openings chip the most according to claim 2, it is characterised in that described pin
The number of point contact site is equal to four, and four described needle point contact sites are evenly spaced in described frame like structure,
Constitute four angles of a rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510243752.5A CN106298614A (en) | 2015-05-13 | 2015-05-13 | A kind of thimble for backside openings chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510243752.5A CN106298614A (en) | 2015-05-13 | 2015-05-13 | A kind of thimble for backside openings chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106298614A true CN106298614A (en) | 2017-01-04 |
Family
ID=57631529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510243752.5A Pending CN106298614A (en) | 2015-05-13 | 2015-05-13 | A kind of thimble for backside openings chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106298614A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108281373A (en) * | 2017-12-15 | 2018-07-13 | 华灿光电（浙江）有限公司 | Pickup device of light emitting diode chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254852A (en) * | 2011-08-23 | 2011-11-23 | 南通富士通微电子股份有限公司 | Thimble cap of die bonder |
| CN102419227A (en) * | 2011-09-13 | 2012-04-18 | 河南省电力公司信阳供电公司 | Novel micro-pressure sensor chip |
| CN202871768U (en) * | 2012-11-01 | 2013-04-10 | 江阴苏阳电子股份有限公司 | Flower type ejector pin used in high-power component packaging |
| CN103471950A (en) * | 2013-09-23 | 2013-12-25 | 东南大学 | Multichannel quartz crystal microbalance detection device |
| US20140208556A1 (en) * | 2013-01-25 | 2014-07-31 | Tokyo Electron Limited | Joining device and joining system |
-
2015
- 2015-05-13 CN CN201510243752.5A patent/CN106298614A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254852A (en) * | 2011-08-23 | 2011-11-23 | 南通富士通微电子股份有限公司 | Thimble cap of die bonder |
| CN102419227A (en) * | 2011-09-13 | 2012-04-18 | 河南省电力公司信阳供电公司 | Novel micro-pressure sensor chip |
| CN202871768U (en) * | 2012-11-01 | 2013-04-10 | 江阴苏阳电子股份有限公司 | Flower type ejector pin used in high-power component packaging |
| US20140208556A1 (en) * | 2013-01-25 | 2014-07-31 | Tokyo Electron Limited | Joining device and joining system |
| CN103471950A (en) * | 2013-09-23 | 2013-12-25 | 东南大学 | Multichannel quartz crystal microbalance detection device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108281373A (en) * | 2017-12-15 | 2018-07-13 | 华灿光电（浙江）有限公司 | Pickup device of light emitting diode chip |
| CN108281373B (en) * | 2017-12-15 | 2020-07-07 | 华灿光电（浙江）有限公司 | Pickup device of light emitting diode chip |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |
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| RJ01 | Rejection of invention patent application after publication |