CN106291301A - Semiconductor component pressure testing device and testing equipment thereof - Google Patents

Abstract

A semiconductor component pressure testing device and a testing device thereof are provided, the semiconductor component pressure testing device comprises a plurality of pressure testing units and a turntable unit. Each pressure test unit comprises a support frame, an upper test seat and a lower test seat, the turntable unit comprises a pivot shaft, a turntable and a plurality of floating test seats, and each floating test seat is connected with the turntable by a plurality of elastic pieces. The turntable rotates to enable each floating test seat to be correspondingly positioned between each upper test seat and each lower test seat, each lower test seat comprises a heating device and a heat conducting plate which are fixedly arranged on the lower test seat, and each pressure test unit supplies different test pressure and temperature so as to be beneficial to continuously testing each semiconductor component under different temperature and pressure environments. Therefore, the invention can be used for continuously conveying and testing the semiconductor assembly to be tested among the plurality of pressure testing units, thereby greatly improving the testing productivity.

Description

Semiconductor component pressure test device and its test equipment

technical field

The invention relates to a semiconductor component pressure testing device and testing equipment thereof, in particular to a testing device and testing equipment suitable for testing the pressure sensing characteristics of a semiconductor component.

Background technique

For example, the stress testing device for semiconductor components disclosed in US Patent Publication No. 2009/0015277 A1, please refer to FIG. 8 , which is a side view of a known stress testing device for semiconductor components. As shown in the figure, the pressure testing device described herein includes a first half cavity 91 and a second half cavity 92, wherein the first half cavity 91 is a fixed end, and the second half cavity 92 is lifted by a The device 90 moves vertically up and down to seal or separate the pressure testing device. The first half-cavity 91 has a lower groove 95 for carrying a carrier plate 97 on which a semiconductor component 96 is installed. The second half-cavity 92 has an upper groove 98 and a plurality of protruding test probes 913 for correspondingly contacting the aforementioned semiconductor device 96 . In addition, the pressing structure adopted in this case includes two clamping jaws 93 pivotally disposed on the second half-cavity 92 , which can rotate along a rotating shaft 94 .

When the pressure test starts, an upper surface 99 of the first half-cavity 91 will be pressed against a lower surface 910 of the second half-cavity 92, and the outer edge of the first half-cavity 91 will be pushed against by the jaws 93. An O-ring 912 disposed in a groove 911 seals the gas pressure. After the test is completed, the jaws 93 leave the first half-cavity 91 , and the first half-cavity 91 is transferred to the discharge through the lifting device 90 . However, this design can only test a single pressure chamber at a time during the pressure test. In addition, the case uses a quick connection and clip method, resulting in a high gas leakage rate and a relatively low production capacity.

Contents of the invention

The purpose of the present invention is to provide a semiconductor component pressure testing device. Through the setting of the turntable, the semiconductor components to be tested can be continuously transported and tested among multiple pressure testing units, which greatly improves the testing capacity. In addition, each pressure test unit and the bearing seat of the semiconductor component adopt a separate design, which can avoid pulling the air supply pipeline and signal flat cable.

Another object of the present invention is to provide a semiconductor component stress testing device, which combines the above-mentioned semiconductor component stress testing device with a sorting machine to effectively integrate stress testing and sorting and sorting to achieve fast and convenient feeding and discharging efficiency.

To achieve the above object, the present invention provides a semiconductor component pressure testing device, which includes a plurality of pressure testing units and a turntable unit. Each pressure test unit includes a support frame, an upper test seat and a lower test seat, the support frame is fixed on a work table, and a first power device with a first lower pressure rod is installed, and the upper test seat Connected with the first lower pressing rod, it includes an upper jig, a circuit adapter board and at least one needle measuring base, and the lower testing base is fixed on a work table, including the lower jig and at least one gas supply pipeline. Therefore, in the process of pressure testing, the circuit adapter board provided with at least one needle measuring base is arranged on the upper testing base. When it is transmitted to the circuit board, the flat cable will be entangled and broken with the rotation of the turntable unit, so that the test signal can immediately transmit the test data and improve the test stability.

In addition, the turntable unit includes a pivot shaft, a turntable and a plurality of floating test seats. The pivot shaft is fixed on the work table, and the turntable is pivoted on the pivot shaft. There is a floating jig and a bearing base, and the bearing base is used for bearing at least one semiconductor component. Rotation of the turntable causes each floating test seat to be correspondingly located between each upper test seat and lower test seat, and each pressure test unit supplies different test pressures to continuously test each semiconductor component under different pressure environments.

Based on the above design, in addition to effectively enabling the semiconductor components to be tested to be continuously transported and tested between multiple pressure test units, and greatly improving the test production capacity, the present invention also has a floating test seat on the turntable for testing on the During the process of pressing down the seat, the tightness of the overall test environment is improved, the pressure leakage rate is improved and the test accuracy is increased.

Each of the above pressure testing units may further include a heating device and a heat conduction plate fixed on the lower testing seat. Thus, in the process of stress testing, the impact on semiconductor components under different temperature environments can be detected at the same time, so that each semiconductor component can be continuously tested under different pressure and temperature environments, and the semiconductor component stress testing device of the present invention can be added. Versatility and improve test efficiency.

The above-mentioned semiconductor component pressure testing device may further include a plurality of preheating stations, wherein each preheating station includes a preheating support frame, a preheating upper test seat and a preheating lower test seat, and the preheating support frame is fixed on On a work table, a second power device with a second lower pressure rod is installed, the preheated upper test seat is connected with the second lower pressure rod, and the preheated lower test seat is fixed on the A work table. Thus, when each pressure test unit is testing the pressure, the preheating heating device can be turned on at the same time and the heating operation of the preheating heat conducting plate can be carried out, so that the floating test seat on the turntable can first contact with the preheating heat conducting plate to avoid Waste of heating time.

The plurality of preheating stations and the plurality of pressure testing units mentioned above may be arranged at annular intervals. Thus, when each pressure test unit is testing pressure, the adjacent floating test seats can simultaneously perform the heating operation of the preheating heat conduction plate, so that each pressure test unit can continue to carry out the pressure test at the specified temperature without interruption , to maximize the rotation efficiency of the turntable.

The above-mentioned at least one needle measuring seat can be a two-pin measuring seat, including a first needle measuring seat and a second needle measuring seat, the first needle measuring seat is in contact with the bearing seat, and at the same time the second needle measuring seat is in contact with a circuit substrate . Thus, when the first pressing rod pushes the upper test seat to make the first needle test seat contact the bearing seat, the obtained test information will be immediately transmitted from the second needle test seat to the circuit board, and then imported to the computer or For other analytical instruments, the turntable unit can carry out continuous rotation test, and the needle measuring seat does not need to be transmitted to the circuit board through the flat cable, so that the flat cable will not rotate with the turntable unit, which will cause the flat cable to be entangled and broken.

Each of the above-mentioned floating test seats may further include at least one O-ring, which may be disposed on the surface of the bearing seat. Thus, the tightness between the floating test seat and the upper test seat can be improved, so that the gas is not easy to leak, and a good pressure environment can be established.

The plurality of elastic parts can be a plurality of springs, which provide the extended length for pressing and sealing, so the floating test seat and the lower test seat can be tightly connected, so that the gas is not easy to leak, and a good pressure environment is established.

On the other hand, the semiconductor component pressure testing equipment of the present invention includes a sorting machine and a semiconductor component pressure testing device. The sorting machine includes a turret arranged on a work table and a feed trough arranged around the turret, A viewing device, a material tray and a transfer mechanism, the turret includes a plurality of suction heads arranged at intervals at an angle, the transfer mechanism includes a pick-and-place device, and the feeding chute, inspection device and material tray are respectively arranged under the plurality of suction heads .

The pressure test device for semiconductor components includes a plurality of pressure test units and a turntable unit. Each pressure test unit includes a support frame, an upper test seat and a lower test seat. The support frame is fixed on the work table and equipped with a A first power device of the first lower pressure rod, the upper test seat is connected with the first lower pressure rod, and includes an upper fixture, a circuit adapter board and at least one needle test seat, and the lower test seat includes a lower fixture and At least one gas supply pipeline. The turntable unit includes a pivot shaft, a turntable and a plurality of floating test seats. The pivot shaft is fixed on the work table, and the turntable is pivoted on the pivot shaft. Each floating test seat is connected with the turntable by a plurality of elastic parts, including a floating Tool and a bearing seat, the bearing seat is used to carry at least one semiconductor component, the rotation of the turntable causes each floating test seat to be correspondingly located between each upper test seat and the lower test seat, and the lower test seat includes a test seat fixed on the lower test seat A heating device and a heat conduction plate, whereby each pressure test unit is supplied with different test pressures and temperatures, so as to continuously test each semiconductor component under different pressure and temperature environments.

The above design not only integrates multiple functions of feeding, inspection, and testing, but also can effectively integrate pressure testing and sorting and picking operations by simply connecting the above two devices in series, achieving fast and convenient feeding and discharging efficiency.

The above summary and the following detailed description are exemplary in order to further illustrate the scope of the present invention. Other purposes and advantages of the present invention will be described in the subsequent description and accompanying drawings.

Description of drawings

FIG. 1 is a perspective view of a semiconductor device stress testing device according to a preferred embodiment of the present invention.

FIG. 2 is an exploded view of a semiconductor device stress testing device according to a preferred embodiment of the present invention.

FIG. 3A is a perspective view of a pressure testing unit and a preheating station according to a preferred embodiment of the present invention.

FIG. 3B is a perspective view from another perspective of the pressure testing unit and the preheating station according to a preferred embodiment of the present invention.

FIG. 4 is a perspective view of the connection between the circuit adapter board and the circuit substrate according to a preferred embodiment of the present invention.

Fig. 5 is an A-A cross-sectional view of the upper test seat before pressing down of the semiconductor component pressure testing device according to a preferred embodiment of the present invention.

Fig. 6 is an A-A cross-sectional view of the pressure testing device for semiconductor components according to a preferred embodiment of the present invention after the upper test seat is pressed down.

FIG. 7 is a perspective view of a semiconductor device stress testing device according to a preferred embodiment of the present invention.

FIG. 8 is a side view of a conventional semiconductor component stress testing device.

Explanation of symbols in the drawings

1 semiconductor component pressure test device, 2 pressure test unit, 20 preheating station, 201 preheating support frame, 2011 second lower pressure rod, 2012 second power device, 202 preheating upper test seat, 203 preheating lower test seat, 21 support frame, 211 first lower pressure rod, 212 first power unit, 213 receiving plate, 22 upper test seat, 221 upper fixture, 222 circuit adapter board, 223 first needle test seat, 224 second needle test seat . 330 elastic member, 331 floating fixture, 3311 through hole, 332 bearing seat, 3321 chip storage slot, 3322 connection hole, 333 O-ring, 4 semiconductor components, 5 heating device, 50 heat conducting plate, 6 sorting machine, 61 turns Tower, 611 suction head, 62 feeding trough, 63 inspection device, 64 material tray, 65 moving mechanism, 651 pick and place device, 66 vibration plate, 7 semiconductor component pressure test equipment, 90 lifting device, 91 first half cavity, 910 lower surface, 911 tank body, 912 O-ring, 913 test probe, 92 second half cavity, 93 gripper jaw, 94 rotating shaft, 95 lower groove, 96 semiconductor component, 97 carrier plate, 98 upper groove, 99 upper surface.

detailed description

Please refer to FIG. 1 and FIG. 2 , which are a perspective view and an exploded view of a semiconductor component pressure testing device according to a preferred embodiment of the present invention. The figure shows a semiconductor component stress testing device 1, including a plurality of stress testing units 2, a plurality of preheating stations 20 and a turntable unit 3, each preheating station 20 and each stress testing unit 2 are arranged at intervals in a ring, In this embodiment, there are altogether five pressure testing units 2 and five adjacent preheating stations 20 , but the number is not limited thereto. In FIG. 1 , a group of pressure test units 2 is specially removed to facilitate description of some features on the turntable unit 3 .

As shown in the figure, each pressure testing unit 2 includes a support frame 21 , an upper test seat 22 and a lower test seat 23 . The support frame 21 is fixed on a work table 30, and is equipped with a first power unit 212 with a first pressing rod 211. The first power unit 212 can be a motor or a cylinder to provide a Jack thrust. The upper test seat 22 is connected with the first lower pressure rod 211 and includes an upper jig 221 , a circuit adapter board 222 , a first needle test seat 223 and a second needle test seat 224 . The lower test seat 23 is fixed on the work table 30 and includes a lower fixture 231 , a heating device 5 , a heat conducting plate 50 and two gas supply pipelines 232 . Wherein, the present invention is different from the prior art in that the circuit adapter board 222 and the two-pin test bases 223 and 224 are arranged on the upper test base 22 . According to the spirit of the present invention, the turntable unit can carry out continuous rotation test through the circuit adapter board and the two-pin test seat on the upper test seat, avoiding the known use of flat cables, which are prone to entanglement and tearing, so that the test signal can immediately transmit test data and Improve test stability efficiency.

Moreover, the turntable unit 3 includes a pivot shaft 31 , a turntable 32 and a plurality of floating test seats 33 , and the pivot shaft 31 is fixed on the work table 30 as the rotation center of the whole turntable unit 3 . The turntable 32 is pivoted on the pivot shaft 31, and each floating test seat 33 is connected with the turntable 32 by four elastic members 330, wherein the elastic members 330 used in this embodiment are tension springs, but not limited thereto. , For example, any member with elasticity and stretching and buffering functions can be used as the elastic member 330 of the present invention. The floating test seat 33 includes a floating jig 331 and a bearing seat 332 , and the bearing base 332 is assembled on the floating jig 331 to support a plurality of semiconductor components 4 . As shown in Figure 1, the rotation of the turntable 32 causes each floating test seat 33 to be located between each upper test seat 22 and the lower test seat 23, and each pressure test unit 2 is supplied with different test pressures, so as to operate under different pressure environments. Each semiconductor component 4 is tested successively. In addition to effectively enabling the semiconductor components 4 to be tested to be continuously transported and tested between a plurality of pressure test units, and greatly improving the test production capacity, the present invention is also equipped with a floating test seat 33 on the turntable 32 to test the test seat on the upper test seat. 22 In the process of pressing down, the tightness of the overall test environment is improved, the pressure leakage rate is improved and the test accuracy is increased.

Next, please refer to FIG. 3A and FIG. 3B , which are a perspective view of a pressure testing unit and a preheating station in a preferred embodiment of the present invention and a perspective view from another perspective. The figure shows a group of adjacent pressure test units 2 and preheating station 20. From the perspective of FIG. 3B, it can be seen that the supporting frame 21 is provided with a receiving plate 213 for carrying a circuit board 225. Refer to FIG. 4 together. , is a joint perspective view of a circuit adapter board and a circuit substrate according to a preferred embodiment of the present invention. The above circuit substrate 225 has an adapter slot 226 and a plurality of output ports 227. When the upper test seat 22 is pressed down so that the first needle test seat 223 contacts the bearing seat 332, the second needle test seat 224 will contact the circuit substrate 225. contact with the adapter slot 226 of each pressure test unit 2, so that the test information obtained by each pressure test unit 2 from each semiconductor component 4 will be immediately transmitted to the circuit board 255 by the second probe socket 224, and connected to the plurality of output ports 227 The signal flat cable (not shown in the figure) imports the above test information to the computer or other analysis instruments, so that the turntable unit can be connected and separated from the circuit substrate through the circuit adapter board, and the turntable unit can perform continuous rotation test to solve Restrictions on signaling.

Returning to Figure 3A and Figure 3B, the preheating station 20 of the semiconductor component pressure testing device 1 of the present invention includes a preheating support frame 201, a preheating upper test seat 202 and a preheating lower test seat 203, the preheating support The frame 201 is fixed on the work table 30, and is equipped with a second power unit 2012 with a second pressing rod 2011. The second power unit 2012 can be a motor or a cylinder to provide a thrust , by pressing the floating test seat 33 in contact with a heat conduction plate of the preheated lower test seat 203, wherein the preheated lower test seat 203 only has a heating device and a heat conduction plate, and does not need to be provided with an air supply pipeline. The preheating upper test seat 202 is connected with the second lower pressing rod 2011 , and the preheating lower test seat 203 is fixed on the work table 30 . Thus, when each pressure test unit 2 is testing the pressure, the adjacent floating test bases 33 can be heated simultaneously by the preheating station 20, so that each pressure test unit 2 can continue to carry out the pressure test at a specified temperature. Without interruption, the rotation efficiency of the turntable is improved to the maximum.

Next, please refer to FIG. 5 and FIG. 6 , which are A-A cross-sectional views of the upper test seat before pressing down and A-A cross-sectional views of the upper test seat after pressing down of the semiconductor component pressure testing device according to a preferred embodiment of the present invention. As shown in Figure 5, before the upper test seat 22 is pressed down, it can be clearly seen from the cross-sectional view that the upper test seat 22, the turntable 32 and the lower test seat 23 are three separate components, wherein the floating part connected with the turntable 32 There is a gap D between the test seat 33 and the surface of the lower test seat 23 , so that the turntable 32 is less likely to be disturbed during the rotation. More preferably, in this embodiment, in order to avoid the change of the pressure value caused by the leakage of the filling gas, the bearing seat 332 corresponds to the first needle measuring seat 223, the bearing seat 332 corresponds to the circuit adapter board 222, and the floating jig 331 The surface corresponding to the bearing seat 332 and the lower test seat 23 corresponding to the floating jig 331 is respectively provided with an annular groove to accommodate an O-ring 333, which is a ring-shaped elastic gasket, used as a seal when the two components are compressed. The interface can improve the airtightness of the joints of each component. In addition, each chip accommodating groove 3321 of the carrier 332 has a connecting hole 3322 connected with each through hole 3311 of the floating jig 331, which forms a pneumatic path with the two air supply pipelines 232, so that each chip accommodating A semiconductor component 4 in the groove 3321 can feel the air pressure change, so as to achieve the purpose of pressure test.

As shown in Figure 6, when the upper test seat 22 is pressed downward by the first power device 212, the first needle test seat 223 fits the bearing seat 332, and the floating test seat 33 is forced to move downward until it reaches the As far as the lower test seat 23, at this time, the floating test seat 33 is only subjected to the tension of the plurality of elastic members 330 to produce vertical displacement, while the rotating disk 32 is not affected and remains in the original position, so that the floating test seat 33 and the lower test seat 23 There is no longer a gap D between the surfaces, so that the tight joint between the components can be achieved, the gas is not easy to leak, and a good pressure environment is established. In addition, each pressure test unit 2 is designed separately from the bearing seat 332 of the semiconductor component 4, which can avoid pulling the air supply pipeline 232 and the signal flat cable, and at the same time facilitates the turntable to carry the semiconductor component 4 to the next pressure test unit 2, improving Test efficiency.

Please refer to FIG. 7 , which is a perspective view of a semiconductor device stress testing device according to a preferred embodiment of the present invention. The figure shows a semiconductor component stress testing device 7 including a sorting machine 6 and the above-mentioned semiconductor component stress testing device 1, wherein, for detailed information about the semiconductor component stress testing device 1, please refer to the aforementioned embodiment, and will not repeat it here. repeat. As shown in the figure, the sorting machine 6 includes a turret 61 arranged on the work table 30 and a feed chute 62 arranged around the turret 61, a viewing device 63, a tray 64 and a moving mechanism 65, The turret 61 includes a plurality of suction heads 611 arranged at angular intervals, and can rotate to make each suction head 611 produce an angular displacement. The moving mechanism 65 includes a pick-and-place device 651, a feed chute 62, an inspection device 63 and a feeder. The disks 64 are correspondingly disposed under the plurality of suction heads 611 .

One end of the feed chute 62 in this embodiment extends below the suction head 611, and the other end is connected to a vibrating plate 66, which is a disc-shaped structure protruding from the center, so after the semiconductor component vibrates and falls from the feed area, it immediately falls to the Vibrate the circumference of the disc 66. The vibrating plate 66 is vibrated by the vibrating mechanism, so that the semiconductor components climb up along with the spiral guide rail on the peripheral side wall. Once the semiconductor assembly is judged to be in the correct orientation, the assembly is then fed forward into the feed trough 62 . The semiconductor components in the feeding trough 62 are pushed along the trend, and after the suction head 611 sucks the semiconductor components at the end of the feeding trough 62, it is displaced to the platform of the appearance inspection area by the rotation of the turret 61, that is, the aforementioned Inspection device 63.

The part where the inspection device 63 accepts the semiconductor components is also located under the suction head 611. It mainly uses a camera module such as a charge-coupled device (CCD) to check the correctness of the appearance of the semiconductor components, such as whether the printed text on the surface is correct or whether there is any defect. Once it is judged as an error or defect, the suction head 611 can send the semiconductor component to a recycling area. The semiconductor components inspected by the inspecting device 63 are then transferred to a tray 64 by the suction head 611 .

The travel mechanism 65 has a pick-and-place device 651 for picking, placing and carrying semiconductor components between the sorting machine 6 and the semiconductor component pressure testing device 1 , that is, the pick-and-place device 651 can move spatially. In detail, the pick-and-place device 651 can move to the tray 64 located below the suction head 611 to take the tray 64, wherein the tray 64 is responsible for storing a plurality of semiconductor components put down from the pick-up head 611; after that, the pick-and-place device 651 can transport the tray 64 together with the semiconductor components on it to the semiconductor component pressure testing device 1, and use a suction head (not shown) to load each semiconductor component into the chip accommodating groove 3321 of the carrier 332 respectively in for component testing. Finally, start the test program of the above-mentioned semiconductor component stress test device 1, according to different test items or different customer needs, give each stress test unit 2 different test pressures and temperatures, and driven by the turntable unit 3, for Each semiconductor component 4 can achieve continuous testing, which effectively solves the problems of conventional pressure testing devices that need to continuously change the pressure and temperature states, and improves testing efficiency.

The above-mentioned embodiments are only examples for convenience of description, and the scope of rights claimed by the present invention should be based on the scope of claims in the application, rather than limited to the above-mentioned embodiments.

Claims (18)

1. A semiconductor component pressure testing device, comprising: A plurality of pressure test units, each pressure test unit includes a support frame, an upper test seat and a lower test seat, the support frame is fixed on a work table, and is equipped with a first lower pressure rod A power device, the upper test seat is connected with the first lower pressure rod, including an upper jig, a circuit adapter board and at least one needle test seat, the lower test seat is fixed on the work table, including the following fixture and at least one air supply pipeline; and A turntable unit includes a pivot shaft, a turntable and a plurality of floating test seats. The turntable is connected, including a floating fixture and a bearing seat, the bearing seat is used to carry at least one semiconductor component, the rotation of the turntable makes each floating test seat correspondingly located between each upper test seat and the lower test seat, And each stress test unit supplies different test pressures to continuously test each semiconductor component under different stress environments. 2 . The semiconductor device stress testing device according to claim 1 , wherein each stress testing unit comprises a heating device and a heat conduction plate fixed on the lower test seat. 3 . 3. The semiconductor device stress testing device according to claim 2, wherein the semiconductor device stress testing device comprises a plurality of preheating stations. 4. The semiconductor device pressure testing device according to claim 3, wherein each preheating station includes a preheating support frame, a preheating upper test seat and a preheating lower test seat, and the preheating support frame is fixed It is installed on the work table and is equipped with a second power device with a second lower pressure rod. The preheated upper test seat is connected with the second lower pressure rod. The preheated lower test seat is fixed on the The working table includes a preheating heating device and a preheating heat conduction plate. 5 . The semiconductor device stress testing device according to claim 3 , wherein the plurality of preheating stations and the plurality of stress testing units are arranged at intervals in a ring. 5 . 6. The semiconductor component pressure testing device according to claim 1, wherein the at least one probe base is a two-pin probe base, comprising a first probe base and a second probe base, the first probe base contact with the bearing seat, and at the same time, the second needle measuring seat is in contact with a circuit substrate. 7. The semiconductor device stress testing device according to claim 1, wherein each floating test socket comprises at least one O-ring. 8. The semiconductor device pressure testing device according to claim 7, wherein the at least one O-ring is disposed on the surface of the bearing base. 9. The semiconductor device pressure testing device according to claim 1, wherein the plurality of elastic members are a plurality of springs. 10. A semiconductor component stress testing equipment, comprising: A sorting machine platform includes a turret arranged on a work table and a feed trough arranged around the turret, a viewing device, a material tray and a moving mechanism, the turret includes angularly spaced For a plurality of suction heads, the moving mechanism includes a pick-and-place device, and the feeding chute, the viewing device and the tray are correspondingly arranged under the plurality of suction heads; and A pressure test device for semiconductor components, including a plurality of pressure test units and a turntable unit, each pressure test unit includes a support frame, an upper test seat and a lower test seat, the support frame is fixed on the work table, and A first power device with a first lower pressure rod is installed, and the upper test seat is connected with the first lower pressure rod, including an upper jig, a circuit adapter board and at least one needle test seat, the The lower test seat includes a lower fixture and at least one air supply pipeline; the turntable unit includes a pivot shaft, a turntable and a plurality of floating test seats, the pivot shaft is fixed on the work table, and the turntable is pivoted on the pivot shaft, Each floating test seat is connected to the turntable by a plurality of elastic members, including a floating jig and a bearing seat, which is used to carry at least one semiconductor component, and the rotation of the turntable makes each floating test seat correspondingly located Between each upper test seat and the lower test seat, and each pressure test unit supplies different test pressures to continuously test each semiconductor component under different pressure environments. 11. The semiconductor component stress testing device according to claim 10, wherein each stress testing unit comprises a heating device and a heat conducting plate fixed on the lower test seat. 12. The semiconductor device stress testing device according to claim 11, wherein the semiconductor device stress testing device comprises a plurality of preheating stations. 13. The semiconductor component pressure testing device according to claim 12, wherein each preheating station includes a preheating support frame, a preheating upper test seat and a preheating lower test seat, and the preheating support frame is fixed It is installed on the work table and is equipped with a second power device with a second lower pressure rod. The preheated upper test seat is connected with the second lower pressure rod. The preheated lower test seat is fixed on the The working table includes a preheating heating device and a preheating heat conduction plate. 14. The stress testing device for semiconductor components according to claim 12, wherein the plurality of preheating stations and the plurality of stress testing units are arranged at intervals in a ring. 15. The semiconductor device pressure testing device according to claim 10, wherein the at least one probe base is a two-pin probe base, comprising a first probe base and a second probe base, the first probe base contact with the bearing seat, and at the same time, the second needle measuring seat is in contact with a circuit substrate. 16. The semiconductor device stress testing device according to claim 10, wherein each floating test socket comprises at least one O-ring. 17. The semiconductor device pressure testing device according to claim 16, wherein the at least one O-ring is disposed on the surface of the bearing seat. 18. The semiconductor device pressure testing device according to claim 10, wherein the plurality of elastic members are a plurality of springs.