CN106271054A - Improve the auxiliary device of scanning galvanometer system working ability and improve method - Google Patents

Abstract

The invention belongs to the technical field of laser processing, and in particular relates to an auxiliary device and an improving method for improving the processing capability of a scanning galvanometer system. It solves the problems that the prior art cannot discharge the processing waste in time and damage the focusing lens and the like. The auxiliary device for improving the processing capability of the scanning galvanometer system includes an auxiliary processing head which is arranged in the light emitting direction of the focusing mirror and has a laser passage. The compound discharge mechanism that discharges the waste and forces the processing waste away from the focusing mirror so as to suck the processing waste out of the laser passage. The improvement methods include: A. Discharging the processing waste in the hole or groove; B. Suctioning away the processing waste. The invention has the advantages that processing waste can be discharged in time and the focusing mirror can be prevented from being damaged by the processing waste.

Description

Auxiliary device and improving method for improving processing capability of scanning galvanometer system

technical field

The invention belongs to the technical field of laser processing, and in particular relates to an auxiliary device and an improving method for improving the processing capability of a scanning galvanometer system.

Background technique

Laser processing technology is a processing technology that uses the characteristics of the interaction between laser beams and substances to cut, weld, surface treat, drill and micro-process materials (including metals and non-metals). It adopts the combination of optical, mechanical and electrical technologies, which can effectively ensure the efficiency in the processing process and has the advantages of being suitable for special processing. It has been widely used in mechanical processing, automobile manufacturing, electronic semiconductors, aerospace and other industrial fields. Applications. With the introduction of the laser scanning galvanometer system, the efficiency and quality of laser processing can be effectively improved. At present, the galvanometer scanning system has been widely used in many fields such as automobile, metallurgy, textile, chemical industry and microelectronics. The working principle of the laser scanning galvanometer is: a laser beam is reflected by the X and Y scanning galvanometers, and passes through a focusing mirror field mirror. Driven by the motor, the oscillating lens rotates back and forth along the axis at high speed to achieve the purpose of changing the path of the laser beam.

However, the laser scanning galvanometer system also encounters some problems in the actual processing process. For example, during laser drilling and micromachining, due to the short pulse time of the laser and the small diameter of the spot (generally 10-20um), each pulse energy acts on the surface of the workpiece. The matrix of the workpiece is stripped to form very fine particles. Under the action of the impulse generated at the moment of laser processing, the fine particles break away from the matrix at a certain speed, and then fall down again under the action of gravity. When the depth of the hole or groove reaches a certain threshold, the initial velocity generated by the laser pulse is not enough to make the fine particles throw out of the hole or groove against the force of gravity. These particles will accumulate in the hole or groove and be repeatedly processed by the next pulse laser. Therefore, the laser energy actually acting on the workpiece substrate will be greatly reduced. In this case, the efficiency of scanning galvanometer laser processing will be greatly reduced, thereby limiting the processing depth of holes and grooves.

The current traditional method is to add a positive pressure protective gas behind the focusing lens (coaxially add protective gas), or add a lateral positive pressure protective gas to the side of the laser head. These two methods have their own problems. The method of coaxially adding protective gas is to add a downward blowing airflow under the lens. The downward thrust generated by this airflow is in the same direction as gravity, so that the laser pulse energy The force of the instantaneous impulse acting on the matrix to the particles will be less than or equal to the sum of the gravity and the thrust of the airflow. Although this solves the problem that the lens is not damaged, it is not conducive to the discharge of the particles from the hole or groove, but reduces the processing efficiency to a certain extent. and processing depth. Although the method of adding protective gas sideways can discharge the particles out of the holes or grooves in one direction in time, it is incapable of dealing with micropores, deep holes, microgrooves, and deep grooves.

Therefore, in order to protect the field mirror of the scanning galvanometer system from smoke and splashes, the dust and nanoparticles accumulated in the holes are discharged to the maximum in time, so that the laser energy can always act on the surface of the workpiece, reducing the Because the dust accumulated in the hole cannot be discharged in time and affects the depth and quality of laser drilling, it is necessary to propose a method and device that is feasible and effective, so as to greatly improve the drilling depth and processing efficiency of the scanning galvanometer laser. Breakthrough The limitation of the laser drilling depth of the scanning galvanometer.

Contents of the invention

The object of the present invention is to solve the above problems and provide an auxiliary device for improving the processing capacity of the scanning galvanometer system, which has a more reasonable design, can improve the drilling depth and processing efficiency, and has a long service life.

Another object of the present invention is to provide an auxiliary device for improving the processing capability of the scanning galvanometer system, which is simple in method and can improve the drilling depth and processing efficiency.

In order to achieve the above object, the present invention adopts the following technical solutions: the auxiliary device for improving the processing capacity of the scanning galvanometer system, the scanning galvanometer system includes scanning galvanometers and focusing mirrors arranged in sequence, and when the incident laser light passes through the scanning galvanometer and the focusing mirror in sequence At least one hole or groove can be processed on the workpiece after the focusing mirror. This auxiliary device includes an auxiliary processing head which is arranged in the light emitting direction of the focusing mirror and has a laser passage. The processing waste in the hole or groove is discharged and forced away from the focusing mirror so that the processing waste is sucked away to the compound type discharge mechanism outside the passage of the laser.

In the above-mentioned auxiliary device for improving the processing capability of the scanning galvanometer system, the composite type ejection mechanism includes a separation structure capable of separating the passage of the laser light into a positive pressure cavity and a negative pressure cavity, and the positive pressure The cavity is located between the focusing mirror and the negative pressure cavity, and the positive pressure cavity communicates with the negative pressure cavity to form a compound cavity. At least one positive pressure protective gas inlet connected to the positive pressure cavity is provided on the auxiliary processing head. There is also at least one negative pressure suction port in communication with the negative pressure chamber.

In the above-mentioned auxiliary device for improving the processing capacity of the scanning galvanometer system, the partition structure includes a partition arranged in the passage of the laser beam, and a partition is provided in the axial center of the partition to make the positive pressure chamber communicate with the negative pressure chamber. the first spout.

In the aforementioned auxiliary device for improving the processing capability of the scanning galvanometer system, the partition is a tapered partition, and the outer diameter of the partition gradually decreases from the side of the positive pressure chamber to the side of the negative pressure chamber. The conical separator has two functions of separation and flow diversion.

In the above-mentioned auxiliary device for improving the processing capacity of the scanning galvanometer system, the end of the auxiliary processing head away from the focusing mirror has a second nozzle with a small outer end and a large inner end, and the first nozzle and the second nozzle have a small outer end and a larger inner end. The large tapered spout structure at the inner end, the axis line of the second spout coincides with the axis line of the first spout and the diameter of the small end of the first spout is smaller than or equal to the diameter of the small end of the second spout. A chamfer is provided at the small head end of the second spout.

In the above-mentioned auxiliary device for improving the processing capacity of the scanning galvanometer system, the positive pressure protection gas inlet is arranged in the circumferential direction of the auxiliary processing head and is connected to the positive pressure protection gas supply part through the first pipeline; There are at least two pressure and suction outlets and they are evenly distributed along the circumference of the auxiliary processing head. Negative pressure suction part between the outlet and the negative pressure generating part. The negative pressure suction part is used for filtering and settling the processing waste sucked from the negative pressure suction opening, preventing the processing waste from entering into the negative pressure generating part.

In the above-mentioned auxiliary device for improving the processing capability of the scanning galvanometer system, the auxiliary processing head includes an upper cavity of the processing head with a positive pressure cavity and a lower cavity of the processing head with a negative pressure cavity, and the upper cavity of the processing head is The cavity and the lower cavity of the processing head are connected through a first detachable connection structure or welding; or the auxiliary processing head includes a one-piece processing head base with a composite cavity and an integral structure.

In the aforementioned auxiliary device for improving the processing capability of the scanning galvanometer system, the auxiliary processing head is connected to the scanning galvanometer through a second detachable connection structure; or the auxiliary processing head is connected to the galvanometer through a third detachable connection structure. On the fixed bracket, the scanning vibrating mirror is connected to the fixed bracket through a fourth detachable connection structure.

The method for improving the processing capability of the scanning galvanometer system includes the following steps:

A. Processing waste in the discharge hole or groove: the positive pressure chamber and the negative pressure chamber are connected through the first nozzle, and the positive pressure protection gas passes through the positive pressure protection gas inlet, the positive pressure chamber, the first nozzle, the negative pressure chamber and the second nozzle in sequence. The second nozzle blows to the workpiece, and the processing waste trapped in the hole or groove during the processing is discharged to the outside of the hole or groove in real time through the positive pressure protective gas, and the air pressure in the positive pressure chamber is greater than that in the negative pressure chamber to prevent Processing waste enters into the positive pressure chamber; the positive pressure chamber can prevent processing waste splashed during processing and processing waste discharged out of the hole or groove from entering into the positive pressure chamber.

B. Suction of processing waste: the processing waste in the negative pressure chamber is discharged from the negative pressure suction port to the outside of the negative pressure chamber through the action of negative pressure suction and separation gas. Processing waste includes processing waste spattered during processing and processing waste discharged to the outside of a hole or a tank.

In the above-mentioned method for improving the processing capacity of the scanning galvanometer system, in the above-mentioned step A, the first nozzle is a structure with a small outer end and a large inner end, and the second nozzle is a structure with a small outer end and an inner end. For a large structure, the axis line of the first nozzle coincides with the axis line of the second nozzle, and the diameter of the small head end of the first nozzle is smaller than or equal to the diameter of the small head end of the second nozzle.

Compared with the existing technology, the advantages of the auxiliary device and improving method for improving the processing capacity of the scanning galvanometer system are: 1. The design is more reasonable, and the processing waste in the hole or groove can be effectively discharged, which improves the efficiency of punching or drilling. The depth of the groove further improves the processing ability of the scanning galvanometer system to process holes or grooves. At the same time, it improves the product processing quality and processing efficiency, and virtually reduces the production cost of the enterprise. 2. It can effectively prevent the processing waste from damaging the focusing lens and prolong the service life of the focusing lens. Secondly, it also reduces the subsequent maintenance cost and the use cost. 3. The structure is simple and easy to manufacture, has strong practicability, and is easy to be popularized and applied. 4. In line with the current development trend of social technology.

Description of drawings

Fig. 1 is a schematic diagram of the structure provided by the present invention.

Fig. 2 is a schematic diagram of the first structure of the nozzle provided by the present invention.

Fig. 3 is a schematic diagram of the second structure of the spout provided by the present invention.

Fig. 4 is a schematic diagram of the third structure of the spout provided by the present invention.

Fig. 5 is a schematic structural diagram of Embodiment 2 provided by the present invention.

Fig. 6 is a schematic structural diagram of Embodiment 3 provided by the present invention.

Fig. 7 is a schematic structural diagram of Embodiment 4 provided by the present invention.

In the figure, scanning galvanometer 11, focusing mirror 12, auxiliary processing head 2, laser passage 21, positive pressure chamber 22, processing head upper chamber 22a, processing head lower chamber 22b, negative pressure chamber 23, positive pressure shielding gas Inlet 24, negative pressure suction port 25, second nozzle 26, composite discharge mechanism 3, separator 31, first nozzle 32, first pipeline 41, positive pressure protection gas supply part 42, second pipeline 43 , Negative pressure generating part 44, negative pressure dust suction part 45, fixed bracket 5, workpiece a.

detailed description

The following are specific embodiments of the invention and in conjunction with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.

Embodiment one

As shown in Figure 1, the auxiliary device for improving the processing capability of the scanning galvanometer system, the scanning galvanometer system includes a scanning galvanometer 11 and a focusing mirror 12 arranged in sequence, and when the incident laser light passes through the scanning galvanometer 11 and the focusing mirror 12 in sequence At least one hole or groove can be processed on the workpiece a. This auxiliary device includes an auxiliary processing head 2 which is arranged in the light emitting direction of the focusing lens 12 and has a laser passage 21. The auxiliary processing head 2 is provided with a real-time processing process. The processing waste remaining in the hole or groove is discharged and the processing waste is forced away from the focusing lens 12 so that the processing waste is sucked away to the composite discharge mechanism 3 outside the laser passage 21 . Processing waste includes processing waste such as dust, fume and nanoparticles. Due to the composite discharge mechanism 3, the composite discharge mechanism 3 has the following functions: ① It can discharge the processing waste trapped in the hole or groove to the outside of the hole or groove; ② It can prevent the processing waste splashed during processing, And the processing waste outside the discharge hole or groove splashes upwards to damage the focusing lens 12; ③ three functions that can discharge the processing waste out of the auxiliary processing head 2.

Specifically, the composite type ejection mechanism 3 of the present embodiment includes a separation structure capable of separating the laser through the channel 21 into a positive pressure chamber 22 and a negative pressure chamber 23. The positive pressure chamber 22 is located between the focusing mirror 12 and the negative pressure chamber. 23 and the positive pressure chamber 22 communicates with the negative pressure chamber 23 to form a compound cavity, where the positive pressure chamber 22 has a funnel-shaped structure, and the negative pressure chamber 23 has a V-shaped structure. In an optimized solution, the partition structure includes a partition 31 arranged in the laser passage 21 , and a first nozzle 32 that enables the positive pressure chamber 22 to communicate with the negative pressure chamber 23 is provided at the axial center of the partition 31 . Secondly, the partition body 31 is a tapered partition body, and the outer diameter of the partition body 31 gradually decreases from the side of the positive pressure chamber 22 to the side of the negative pressure chamber 23 . The outer surface of the conical partition is an annular inclined flow guide surface, which can improve the smoothness of discharge of processing waste and also greatly improve the discharge efficiency. The separator 31 is connected with the auxiliary processing head 2 as an integral structure.

In order to be able to improve adsorption capacity and discharge speed, there is a second nozzle 26 with a small outer end and a large inner end at the end of the auxiliary processing head 2 away from the focusing lens 12, and the first nozzle 32 and the second nozzle 26 are all in the form of a small outer end and an inner end. Large tapered spout structure, the axis line of the second spout 26 coincides with the axis line of the first spout 32 and the diameter of the small end of the first spout 32 is smaller than the diameter of the small end of the second spout 26 . A chamfer is provided at the small head end of the second spout. This structure can not only prevent processing waste from entering the positive pressure chamber, but also improve the suction capacity of the negative pressure chamber. In addition, the coincidence of the axis lines can facilitate manufacturing and assembly, and can also improve the suction efficiency. In addition, the cross-sectional shapes of the first nozzle 32 and the second nozzle 26 are the same, which can further improve the efficiency of discharge. The cross-sectional shape and size of the first nozzle 32 and the second nozzle 26 form a series according to the size of the scanning range of the scanning galvanometer required for laser processing of workpieces in common use, and the appropriate cross-sectional shape and size can be selected in the actual laser processing process Size, that is, the auxiliary processing head 2 can be replaced. As shown in Figures 2-4, in addition, the cross-sectional shapes of the first nozzle 32 and the second nozzle 26 include any one of rectangle, square and circle, and can also be various irregular shapes, while the laser beam moves The shape of range and direction includes rectangle or triangle or various irregular shapes, which are set according to actual product processing requirements.

As shown in Figure 1, at least one positive pressure protection gas inlet 24 communicating with the positive pressure chamber 22 is provided on the auxiliary processing head 2. The positive pressure protection gas inlet 24 is arranged in the circumferential direction of the auxiliary processing head 2 and passes through the first tube The passage 41 is connected to a positive pressure shielding gas supply unit 42 . The first nozzle 32 can increase the pressure of the positive pressure protection gas inlet 24 entering the negative pressure chamber 23 from the positive pressure chamber 22 . Positive pressure shielding gas includes any one of nitrogen and argon. After the positive pressure shielding gas enters the positive pressure chamber 22 , a positive pressure P ₁ is formed in the positive pressure chamber 22 . Under the action _of the positive pressure P1, the processing waste cannot pass through the first nozzle 32 upwards.

At least one negative pressure suction port 25 communicating with the negative pressure chamber 23 is also provided on the auxiliary processing head 2 . The number of negative pressure suction ports 25 in this embodiment is at least two and evenly distributed along the circumferential direction of the auxiliary processing head 2. The negative pressure suction ports 25 are connected to the negative pressure generating part 44 through the second pipeline 43, The second pipeline 43 is provided with a negative pressure suction component 45 located between the negative pressure suction opening 25 and the negative pressure generating component 44 . When the negative pressure generating part 44 is activated, a negative pressure P2 is formed in the negative pressure chamber ₂₃ , and the processing waste generated during the laser processing of the workpiece a and discharged to the outside of the hole or groove is absorbed by the negative pressure _P2 , and processed The waste is sucked away from the auxiliary processing head 2 through the negative pressure suction port 25 . In addition, by adjusting the magnitude of the negative pressure P ₂ , the processing waste can be effectively sucked away through the negative pressure suction port 25 . The negative pressure suction part 45 is used to filter and settle the processing waste sucked from the negative pressure suction opening 25 to prevent the processing waste from entering the negative pressure generating part 44 . The first nozzle 32 has a tapered structure, and the first nozzle 32 can improve the adsorption capacity under the action of the negative pressure suction port 25 . The negative pressure suction openings 25 evenly distributed in the circumferential direction can ensure the high efficiency of suction.

In the optimized solution, in order to facilitate disassembly and assembly, the auxiliary processing head 2 of this embodiment includes an upper cavity 22a of the processing head with a positive pressure cavity 22 and a lower cavity 22b of the processing head with a negative pressure cavity 23. The upper cavity of the processing head The body 22a is connected to the lower cavity 22b of the processing head through a first detachable connection structure. The first detachable connection structure includes an external thread provided on the upper cavity 22a of the processing head, and an internal thread connected with the external thread is provided on the lower cavity 22b of the processing head. Of course, the external thread here can also be provided on the lower cavity 22b of the processing head, while the internal thread can be provided on the upper cavity 22a of the processing head. It can be designed and manufactured according to actual requirements. The first detachable connection structure also includes flanges that cooperate with each other.

Secondly, the auxiliary processing head 2 is connected with the scanning galvanometer 11 through the second detachable connection structure; connected external thread.

The working principle of this embodiment is as follows: the incident laser light from the laser passes through the scanning galvanometer 11, the focusing mirror 12 and the laser of the auxiliary processing head 2 through the channel 21, and then hits the workpiece a, and the scanning galvanometer 11 acts to thereby Machining holes or grooves on the workpiece a;

When the depth of the hole or groove is continuously deepened, the positive pressure protection gas supply part 42 is activated, and the positive pressure protection gas is input into the positive pressure chamber 22 from the positive pressure protection gas inlet 24 through the first pipeline 41, and the positive pressure protection gas in the positive pressure chamber A positive pressure P ₁ is formed in 22. At the same time, the positive pressure shielding gas discharges the processing waste trapped in the hole or groove to the outside of the hole or groove. Under the action of the positive pressure P ₁ , the processing waste cannot pass through the first a spout 32;

Start the negative pressure generating part 44 to form a negative pressure P ₂ in the negative pressure chamber 23, and the processing waste produced in the laser processing of the workpiece a and discharged to the outside of the hole or groove is absorbed by the negative pressure P ₂ , and the processing waste It is sucked away from the auxiliary processing head 2 through the second pipeline 43 and the negative pressure suction port 25. In order to prevent the processing waste from entering the negative pressure generating part 44 and ensure the environment of the production operation, a negative pressure dust suction part 45 is provided. It can effectively prevent processing waste from entering the negative pressure generating part 44, and at the same time, the requirement of production order can be met by periodically cleaning the negative pressure dust suction part 45.

In addition, the conical separator has two functions of separation and flow diversion.

The method for improving the processing capability of the scanning galvanometer system includes the following steps:

A. Processing waste in the discharge hole or groove: the positive pressure chamber 22 and the negative pressure chamber 23 are connected through the first nozzle 32, and the positive pressure protection gas passes through the positive pressure protection gas inlet 24, the positive pressure chamber 22, and the first nozzle 32 in sequence , the negative pressure chamber 23 and the second nozzle 26 are blown to the workpiece, and the processing waste trapped in the hole or groove during the processing is discharged to the outside of the hole or groove in real time through the positive pressure protective gas, and the air pressure in the positive pressure chamber 22 It is greater than the air pressure in the negative pressure chamber 23 so as to prevent processing waste from entering into the positive pressure chamber 22; cavity.

B. Suction of processing waste: the processing waste in the negative pressure chamber 23 is discharged from the negative pressure suction port 25 to the outside of the negative pressure chamber 23 through the effect of negative pressure suction and separation gas.

In the above-mentioned step A, the first spout 32 is a structure with a small outer end and a large inner end, the second spout 26 is a structure with a small outer end and a large inner end, and the axis of the first spout 32 is The line coincides with the axis line of the second nozzle 26 and the diameter of the small head end of the first nozzle 32 is smaller than the diameter of the small head end of the second nozzle 26 .

Embodiment two

As shown in Fig. 5, the structure and principle of this embodiment are basically the same as those of Embodiment 1, and will not be repeated here. The difference is that the upper cavity 22a of the processing head and the lower cavity 22b of the processing head are welded way connected.

Embodiment three

As shown in Figure 6, the structure and principle of this embodiment are basically the same as those of Embodiment 1, so we will not repeat them here. Processing head base.

Embodiment Four

As shown in Fig. 7, the structure and principle of this embodiment are basically the same as those of Embodiment 1, and will not be repeated here. The difference is that the auxiliary processing head 2 is connected to the fixed bracket 5 through the third detachable connection structure. , the scanning galvanometer 11 is connected to the fixed bracket 5 through a fourth detachable connection structure. Both the third detachable connection structure and the fourth detachable connection structure are connection structures with internal and external threads.

Embodiment five

The structure and principle of this embodiment are basically the same as those of Embodiment 1, and will not be repeated here. The difference is that the diameter of the small end of the first nozzle 32 is equal to the diameter of the small end of the second nozzle 26 .

The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which the present invention belongs can make various modifications or supplements to the described specific embodiments or adopt similar methods to replace them, but they will not deviate from the spirit of the present invention or go beyond the definition of the appended claims range.

Although the scanning mirror 11, the focusing mirror 12, the auxiliary processing head 2, the laser passage 21, the positive pressure chamber 22, the upper chamber 22a of the processing head, the lower chamber 22b of the processing head, the negative pressure chamber 23, Positive pressure protection gas inlet 24, negative pressure suction and departure port 25, second nozzle 26, compound type discharge mechanism 3, separator 31, first nozzle 32, first pipeline 41, positive pressure protection gas supply part 42, the second Two pipelines 43, negative pressure generating part 44, negative pressure dust suction part 45, fixed bracket 5, workpiece a and other terms, but the possibility of using other terms is not excluded. These terms are used only for the purpose of describing and explaining the essence of the present invention more conveniently; interpreting them as any kind of additional limitation is against the spirit of the present invention.

Claims (10)

1. An auxiliary device for improving the processing capability of the scanning galvanometer system, the scanning galvanometer system includes a scanning galvanometer (11) and a focusing mirror (12) arranged in sequence, and when the incident laser light passes through the scanning galvanometer (11) and the focusing lens successively After the mirror (12), at least one hole or groove can be processed on the workpiece (a), and it is characterized in that the auxiliary device includes an auxiliary processing head arranged in the light emitting direction of the focusing mirror (12) and having a laser passage (21) (2), the auxiliary processing head (2) is equipped with a device that can discharge the processing waste remaining in the hole or groove during the processing in real time and force the processing waste away from the focusing lens (12) so as to absorb the processing waste. From the composite type discharge mechanism (3) to the laser passing through the channel (21). 2. The auxiliary device for improving the processing capability of the scanning galvanometer system according to claim 1, characterized in that, the composite type ejection mechanism (3) includes a channel (21) capable of separating the laser into positive The separation structure of the pressure chamber (22) and the negative pressure chamber (23), the positive pressure chamber (22) is located between the focusing mirror (12) and the negative pressure chamber (23), and the positive pressure chamber (22) and the negative pressure chamber The pressure chamber (23) communicates to form a compound cavity, and at least one positive pressure protection gas inlet (24) communicated with the positive pressure chamber (22) is provided on the auxiliary processing head (2), and the auxiliary processing head (2) is also provided with At least one negative pressure suction opening (25) communicated with the negative pressure chamber (23) is provided. 3. The auxiliary device for improving the processing capability of the scanning galvanometer system according to claim 2, wherein the partition structure includes a partition (31) arranged in the passage (21) of the laser, and the partition ( The axial center of 31) is provided with the first nozzle (32) that can make the positive pressure chamber (22) communicate with the negative pressure chamber (23). 4. The auxiliary device for improving the processing capacity of the scanning galvanometer system according to claim 3, characterized in that, the separator (31) is a tapered separator, and the outer diameter of the separator (31) is from positive The side of the pressure chamber (22) shrinks gradually toward the side of the negative pressure chamber (23). 5. The auxiliary device for improving the processing capacity of the scanning galvanometer system according to claim 3 or 4, characterized in that, the end of the auxiliary processing head (2) away from the focusing mirror (12) is provided with a second nozzle (26 ), the first spout (32) and the second spout (26) are all in the form of a large conical spout structure with a small outer end and a large inner end, and the axis of the second spout (26) coincides with the axis of the first spout (32) And the diameter of the small head end of the first nozzle (32) is smaller than or equal to the diameter of the small head end of the second nozzle (26). 6. The auxiliary device for improving the processing capacity of the scanning galvanometer system according to claim 2, 3 or 4, characterized in that, the positive pressure protection gas inlet (24) is arranged in the circumferential direction of the auxiliary processing head (2) And through the first pipeline (41) connected to the positive pressure protection gas supply part (42); the number of the negative pressure suction openings (25) is at least two and evenly distributed along the circumference of the auxiliary processing head (2), The negative pressure suction port (25) is connected to the negative pressure generating part (44) through the second pipeline (43), and the negative pressure suction port (25) and Negative pressure dust suction parts (45) between the negative pressure generating parts (44). 7. The auxiliary device for improving the processing capability of the scanning galvanometer system according to claim 2, 3 or 4, characterized in that, the auxiliary processing head (2) includes a processing head upper chamber with a positive pressure chamber (22) body (22a) and the lower cavity (22b) of the processing head with a negative pressure cavity (23), the upper cavity (22a) of the processing head and the lower cavity (22b) of the processing head are connected through the first detachable connected by structure or welding; or the auxiliary processing head (2) includes a one-piece processing head base body with composite cavity and one-piece structure. 8. The auxiliary device for improving the processing capability of the scanning galvanometer system according to claim 7, wherein the auxiliary processing head (2) is connected to the scanning galvanometer (11) through a second detachable connection structure; or The auxiliary processing head (2) is connected to the fixed support (5) through a third detachable connection structure, and the scanning vibrating mirror (11) is connected to the fixed support (5) through a fourth detachable connection structure. 9. A method for improving the processing capacity of the scanning galvanometer system, characterized in that the method comprises the steps of: A. Processing waste in the discharge hole or groove: the positive pressure chamber (22) and the negative pressure chamber (23) are connected through the first nozzle (32), and the positive pressure protection gas passes through the positive pressure protection gas inlet (24), the positive pressure protection gas The pressure chamber (22), the first nozzle (32), the negative pressure chamber (23) and the second nozzle (26) are blown to the workpiece, and the positive pressure protective gas is used to discard the processing trapped in the hole or groove during the processing in real time. The waste is discharged to the outside of the hole or groove, and the air pressure in the positive pressure chamber (22) is greater than the air pressure in the negative pressure chamber (23) so as to prevent processing waste from entering into the positive pressure chamber (22); B. Suction processing waste: the processing waste in the negative pressure chamber (23) is discharged from the negative pressure suction opening (25) to the outside of the negative pressure chamber (23) through the effect of negative pressure suction and separation gas. 10. The method for improving the processing capacity of the scanning vibrating mirror system according to claim 9, characterized in that, in the above-mentioned A step, the first nozzle (32) is a structure with a small outer end and a larger inner end, The second spout (26) is a structure with a small outer end and a large inner end, the axis of the first spout (32) coincides with the axis of the second spout (26) and the first spout (32) is small The bore of the head end is less than the bore of the second nozzle (26) small head end.