CN106271044A - Laser marking machine and CCD coaxial light path localization method - Google Patents
Laser marking machine and CCD coaxial light path localization method Download PDFInfo
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- CN106271044A CN106271044A CN201610804503.3A CN201610804503A CN106271044A CN 106271044 A CN106271044 A CN 106271044A CN 201610804503 A CN201610804503 A CN 201610804503A CN 106271044 A CN106271044 A CN 106271044A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of laser marking machine and CCD coaxial light path localization method, it is provided with in laser marking machine: laser instrument, beam expanding lens, scanning galvanometer group and focus lamp, it is additionally provided with in laser marking machine: the light combination mirror of movement and CCD probe, wherein, during described light combination mirror is movable to the laser optical path sent by laser instrument；When light combination mirror moves to laser optical path, described laser instrument, beam expanding lens, light combination mirror and scanning galvanometer group are sequentially arranged, and scanning galvanometer group and focus lamp are sequentially arranged, and described light combination mirror and CCD probe are oppositely arranged.Due to the fact that light combination mirror can move, when location, light combination mirror moves in light path, and both the light path of CCD probe and laser optical path overlap, and after location is terminated, light combination mirror is removed, and laser machines；So accomplish to be accurately positioned and combine with glitch-free both processing；Meanwhile, light combination mirror is designed manufacturing just for the CCD floor light light of CCD probe, thus plated film requires to be greatly reduced, and can significantly save cost.
Description
Technical field
The invention belongs to technical field of laser processing, particularly relate to a kind of laser marking machine and CCD coaxial light path location
Method.
Background technology
Laser marking machine, as the retrofit equipment of a kind of advanced person, is applied in increasing place.Laser
The focal beam spot of marking machine is less than 0.01mm, and the repetitive positioning accuracy of laser marking machine itself is less than 0.01mm.In order to obtain essence
True processing effect, eliminates the position deviation that different workpieces work difference causes, and high-precision laser marking machine is equiped with CCD (electric charge
Coupled apparatus, charge coupled device) camera carries out auxiliary positioning, and CCD camera captures the position in region to be processed
After, feed back to laser marking machine, then laser marking machine is treated machining area and is accurately processed.Flow process is as follows: 1, workpiece arrives
Position；2, CCD camera starts to capture, and feedback data is to marking machine；3, after marking machine processes the data of feedback, control laser and carry out essence
Really processing.
Existing frequently-used CCD coaxial approach is to increase a piece of light combination mirror sheet in laser delivery optics, light combination mirror sheet it
After laser optical path and CCD light path be combined together.The light combination mirror sheet increased is fixed in laser optical path, and light combination mirror sheet can select
Anti-reflection laser and the CCD floor light light of total reflection CCD, it is also possible to select the CCD floor light of the anti-reflection CCD of total-reflection laser
Light.The advantage of the method is accurate positioning, and shortcoming is the highest for light combination mirror sheet requirement, and the film layer of light combination mirror sheet needs especially
Design, the cost of corresponding light combination mirror sheet is higher.Further, since light combination mirror sheet cannot be accomplished laser transmission very or
Person is reflected, and there is the risk of laser lines ghost image, is not suitable for the material that location processing is especially sensitive to laser.
Summary of the invention
The present invention provides a kind of laser marking machine, is provided with in it: laser instrument, beam expanding lens, scanning galvanometer group and focusing
Mirror, is additionally provided with in laser marking machine: the light combination mirror of movement and CCD probe, and wherein, described light combination mirror is movable to by laser instrument
In the laser optical path sent；When light combination mirror moves to laser optical path, described laser instrument, beam expanding lens, light combination mirror and scanning are shaken
Mirror group is sequentially arranged, and scanning galvanometer group and focus lamp are sequentially arranged, and described light combination mirror and CCD probe are oppositely arranged.
The present invention provides again a kind of laser marking machine, is provided with in it: laser instrument, beam expanding lens, scanning galvanometer group and focusing
Mirror, is additionally provided with in laser marking machine: the light combination mirror of movement and CCD probe, and wherein, described light combination mirror is movable to by laser instrument
In the laser optical path sent；When light combination mirror moves to laser optical path, described laser instrument, beam expanding lens and scanning galvanometer group depend on
Sequence is arranged, and described scanning galvanometer group, focus lamp and light combination mirror are sequentially arranged, and described light combination mirror and CCD probe are oppositely arranged.
The present invention provides again the CCD coaxial light path localization method of a kind of laser marking machine, comprises the steps:
The first step: workpiece to be processed puts in place, light combination mirror moves to laser optical path；
Second step: CCD floor light light illuminates workpiece, CCD floor light light reflects at workpiece, and reflection light beam is sequentially
Line focus mirror, scanning mirror group and light combination mirror transmission；
3rd step: the reflection light of CCD floor light light transmits to CCD probe after light combination mirror reflects；
4th step: CCD probe carries out location to reflection light and captures, and feedback data is to laser marking machine；
5th step: light combination mirror moves to outside laser optical path；
6th step: after laser marking machine processes the data of feedback, laser marking machine controls laser instrument and is processed workpiece.
The present invention provides again the CCD coaxial light path localization method of a kind of laser marking machine, comprises the steps:
The first step: workpiece to be processed puts in place, light combination mirror moves to laser optical path；
Second step: CCD floor light light illuminates workpiece, CCD floor light light reflects at workpiece, reflects beam Propagation
To light combination mirror；
3rd step: the reflection light of CCD floor light light transmits to CCD probe after light combination mirror reflects；
4th step: CCD probe carries out location to reflection light and captures, and feedback data is to laser marking machine；
5th step: light combination mirror moves to outside laser optical path；
6th step: after laser marking machine processes the data of feedback, laser marking machine controls laser instrument and is processed workpiece.
Due to the fact that light combination mirror can move, when location, light combination mirror moves in light path, and the light path of CCD probe is with sharp
Both light light paths overlap, and after location is terminated, light combination mirror is removed, and laser machines；So accomplish to be accurately positioned with glitch-free
Both processing combines；Meanwhile, light combination mirror is designed manufacturing just for the CCD floor light light of CCD probe, thus plated film is wanted
Ask and be greatly reduced, can significantly save cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing laser marking machine；
Fig. 2 is the structural representation of laser marking machine first embodiment of the present invention；
Fig. 3 is the structural representation of laser marking machine the second embodiment of the present invention；
Fig. 4 is the structural representation of the mapping relations between CCD coordinate of the present invention and the coordinate of laser marking machine.
Detailed description of the invention
The invention will be further described the most in conjunction with the embodiments.
Fig. 1 is the principle schematic of existing general laser marking machine, is provided with in laser marking machine: laser instrument 11, beam expanding lens
12, scanning galvanometer group 13 and focus lamp 14, wherein, beam expanding lens 12, scanning galvanometer group 13 and focus lamp 14 are sequentially arranged
On the path of laser beam；Scanning galvanometer group 13 includes X-axis scanning galvanometer 131 and Y axis scanning galvanometer 132.
The laser beam that laser instrument 11 sends is through A direction transmission to beam expanding lens 12, through beam expanding lens 12 to B direction transmission laser
Light beam is to X-axis scanning galvanometer 131, then transmits extremely to Y axis scanning galvanometer 132, the most backward D direction through C direction transmission laser beam
Focus lamp 14, laser beam line focus mirror 14 focuses on backward E direction and acts on workpiece 100.
Fig. 2 is the structural representation of laser marking machine first embodiment of the present invention, is provided with: laser instrument in laser marking machine
21, beam expanding lens 22, scanning galvanometer group 23, focus lamp 24, the light combination mirror 25 of movement and CCD probe 26, wherein, scanning galvanometer
Group 23 includes X-axis scanning galvanometer 231 and Y axis scanning galvanometer 232；Light combination mirror 25 is movable to the laser light sent by laser instrument 21
Lu Zhong, when light combination mirror 25 moves to laser optical path, laser instrument 21, beam expanding lens 22, light combination mirror 25 and scanning galvanometer group 23 depend on
Sequence is arranged, and scanning galvanometer group 23 and focus lamp 24 are sequentially arranged, and light combination mirror 25 and CCD probe 26 are oppositely arranged.
Light combination mirror: be also conjunction light microscopic.The effect of light combination mirror is used for indicating light path.Because 1064nm laser is invisible,
And during actual mark, we are usually it is to be appreciated that laser focusing point is in which position, so that it is determined that the position pair of mark
The most right.By light combination mirror, we utilize the HONGGUANG of the observable 650nm that diode emitter goes out under the effect of light combination mirror, with
The laser of 1064nm is combined into light beam, and the position of such 650nm HONGGUANG indication is exactly 1064nm laser position, thus reaches
Utilize the purpose of 650nm HONGGUANG instruction 1064nm laser.
The coaxial light path localization method of this laser marking machine, when positioning, light combination mirror 25 moves in light path, uses
CCD floor light light is irradiated and produces on workpiece 100 reflection light to workpiece 100, and reflection light reflexes to through light combination mirror 25
In CCD probe 26, and reflectance data is fed back in laser marking machine；After location is terminated, light combination mirror 25 moves to laser optical path
Outside, laser instrument 21 starts light processing, specifically includes following steps:
The first step: workpiece to be processed 100 puts in place, light combination mirror 25 moves to laser optical path；
Second step: CCD floor light light illuminates workpiece, CCD floor light light reflects at workpiece 100, reflects light beam
Sequentially line focus mirror 24, scanning mirror group 23 and light combination mirror 25 transmit；
3rd step: the reflection light of CCD floor light light transmits to CCD probe 26 after light combination mirror 25 reflects；
4th step: CCD probe 26 carries out location to reflection light and captures, and feedback data is to laser marking machine；
5th step: light combination mirror 25 moves to outside laser optical path；
6th step: after laser marking machine processes the data of feedback, laser marking machine controls laser instrument 21 and carries out workpiece 100
Processing.
Wherein, second step comprises the steps:
Step A1: reflection light beam line focus mirror 24 transmits to Y axis scanning galvanometer 232；
Step A2: reflection light beam changes the transmission direction of this reflection light beam and in transmission to X-axis through Y axis scanning galvanometer 232
Scanning galvanometer 231；
Step A3: reflection light beam transmits to light combination mirror 25 through X-axis scanning galvanometer 231.
Wherein, the 6th step comprises the steps:
Step B1: laser instrument 21 sends laser beam to beam expanding lens 21 toward A direction, laser beam through beam expanding lens 21 expand to
Scanning galvanometer group 23；
Step B2: scanned galvanometer group 23 indicates laser optical path direction in B direction and C direction and transmits to focus lamp 24,
Line focus mirror 24 focuses to workpiece 100；
Step B3: workpiece 100 is laser machined by laser.
Wherein, step B2 comprises the steps:
Step B21: laser beam expands to X-axis scanning galvanometer 231 in B direction through beam expanding lens 21；
Step B22: laser beam changes the transmission direction of laser beam through X-axis scanning galvanometer 231 and transmits in C direction sharp
Light light beam is to Y axis scanning galvanometer 232；
Step B23: laser beam transmits to focus lamp 24 through Y axis scanning galvanometer 232 in D direction, and line focus mirror 24 focuses on
To workpiece 100.
Fig. 3 is the structural representation of laser marking machine the second embodiment of the present invention, distinguishes with above-mentioned first embodiment:
Light combination mirror 35 is between focus lamp and workpiece.
In a second embodiment, it is provided with in laser marking machine: laser instrument 31, beam expanding lens 32, scanning galvanometer group 33, focus lamp
34, the light combination mirror 35 of movement and CCD probe 36, wherein, scanning galvanometer group 33 includes X-axis scanning galvanometer 331 and Y axis scanning
Galvanometer 332；Light combination mirror 35 is movable in the laser optical path sent by laser instrument 31, when light combination mirror 35 moves to laser optical path
Time, laser instrument 31, beam expanding lens 32 and scanning galvanometer group 33 sequentially arrange, scanning galvanometer group 33, focus lamp 34 and light combination mirror 35
Sequentially arranging, light combination mirror 35 and CCD probe 36 are oppositely arranged.The coaxial light path localization method of this laser marking machine, including as follows
Step:
The first step: workpiece to be processed 100 puts in place, light combination mirror 35 moves to laser optical path；
Second step: CCD floor light light illuminates workpiece, CCD floor light light reflects at workpiece 100, reflects light beam
Transmit to light combination mirror 35；
3rd step: the reflection light of CCD floor light light transmits to CCD probe 36 after light combination mirror 25 reflects；
4th step: CCD probe 36 carries out location to reflection light and captures, and feedback data is to laser marking machine；
5th step: light combination mirror 35 moves to outside laser optical path；
6th step: after laser marking machine processes the data of feedback, laser marking machine controls laser instrument 31 and carries out workpiece 100
Processing.
Wherein, the 6th step comprises the steps:
Step B1: laser instrument 31 sends laser beam to beam expanding lens 32 toward A direction, laser beam through beam expanding lens 32 expand to
Scanning galvanometer group 33；
Step B2: scanned galvanometer group 33 indicates laser optical path direction in B direction and C direction and transmits to focus lamp 34,
Line focus mirror 34 focuses to workpiece 100；
Step B3: workpiece 100 is laser machined by laser.
Wherein, step B2 comprises the steps:
Step B21: laser beam expands to X-axis scanning galvanometer 231 in B direction through beam expanding lens 32；
Step B22: laser beam changes the transmission direction of laser beam through X-axis scanning galvanometer 231 and transmits in C direction sharp
Light light beam is to Y axis scanning galvanometer 232；
Step B23: laser beam transmits to focus lamp 34 through Y axis scanning galvanometer 232 in D direction, and line focus mirror 34 focuses on
To workpiece 100.
Pass through said method, it is achieved CCD noiseless coaxial light path location during laser marking.
The CCD coaxial light path location of laser marking machine, its principle is summarized as follows: the focal plane of laser marking machine is that CCD visits
The object plane of head, it is first determined the mapping relations (as shown in Figure 4) between CCD coordinate and the coordinate of laser marking machine；Then CCD
Probe CCD grabs location profile and obtains X, the pixel deviations of Y-direction, maps mark deviation value (△ x, △ y), and profile placing attitude obtains
Take angular deviation θ；The template deviation data (△ x, △ y, θ) that location is obtained by CCD software, is sent to laser instrument mark software,
Then fight each other row of marking on a map of mark software carries out overall offset, then carries out angle benefit with this labelling point for center of rotation air exercise shape of marking on a map
Repay, the most again laser marking.
The concrete operation method of the CCD location of laser marking is as follows:
1, use 3 scaling methods, CCD coordinate system is demarcated with laser marking coordinate system, sets up two coordinate systems
The mapping relations of system.3 scaling methods: laser instrument goes out light and plays three spiders, and the intersection point of spider is as labelling point (three
The intersection point line of spider is a triangle), the most known 3 can determine that laser coordinates system, and CCD template tool catches should
3 point coordinates obtained under three visual coordinate systems, thus obtain deviation data (△ x, △ y, θ), close according to mathe-matical map
System sets up the mathematics transformational relation model of laser marking coordinate system and CCD visual coordinate system, it is achieved CCD positioning compensation data
Computing function.
2, CCD grabs location profile and obtains X, the pixel deviations of Y-direction, maps mark deviation value, and profile placing attitude obtains
Angular deviation；The template deviation data (△ x, △ y, θ) that location is obtained by CCD software, is sent to laser instrument mark software, mark
Then fight each other row of marking on a map of software carries out overall offset, then carries out angle compensation with this labelling point for center of rotation air exercise shape of marking on a map,
Last laser marking again.
Concrete CCD catches template that location needs and takes pictures effect customization according to target object, and choosing template characteristic principle is:
Clear-cut, feature has uniqueness, the specificity such as easy to identify.
Due to the fact that light combination mirror can move, when location, light combination mirror moves in light path, and the light path of CCD probe is with sharp
Both light light paths overlap, and after location is terminated, light combination mirror is removed, and laser machines；So accomplish to be accurately positioned with glitch-free
Both processing combines.Meanwhile, light combination mirror is designed manufacturing just for the CCD floor light light of CCD probe, thus plated film is wanted
Ask and be greatly reduced, can significantly save cost；Such as, for the light combination mirror of 10.6um wavelength, cost can save 80%；Separately
Outward, the laser marking machine of different wave length can use same light combination mirror, for batch production stock highly significant.
The present invention is as follows: first, and workpiece to be processed puts in place, and light combination mirror sheet puts in place；Secondly, CCD probe is carried out
Location is captured, and feedback data is to laser marking machine；Finally, after laser marking machine processes the data of feedback, control laser to workpiece
Accurately process, it is achieved CCD noiseless coaxial light path location during laser marking.
The preferred embodiment of the present invention described in detail above, but the present invention is not limited in above-mentioned embodiment
Detail, in the technology concept of the present invention, can carry out multiple equivalents to technical scheme, these
Equivalents belongs to protection scope of the present invention.
Claims (10)
1. a laser marking machine, is provided with in it: laser instrument, beam expanding lens, scanning galvanometer group and focus lamp, it is characterised in that:
Being additionally provided with in laser marking machine: the light combination mirror of movement and CCD probe, wherein, described light combination mirror is movable to be sent out by laser instrument
In the laser optical path gone out；When light combination mirror moves to laser optical path, described laser instrument, beam expanding lens, light combination mirror and scanning galvanometer
Group is sequentially arranged, and scanning galvanometer group and focus lamp are sequentially arranged, and described light combination mirror and CCD probe are oppositely arranged.
2. a laser marking machine, is provided with in it: laser instrument, beam expanding lens, scanning galvanometer group and focus lamp, it is characterised in that:
Being additionally provided with in laser marking machine: the light combination mirror of movement and CCD probe, wherein, described light combination mirror is movable to be sent out by laser instrument
In the laser optical path gone out；When light combination mirror moves to laser optical path, described laser instrument, beam expanding lens and scanning galvanometer group are sequentially
Arranging, described scanning galvanometer group, focus lamp and light combination mirror are sequentially arranged, and described light combination mirror and CCD probe are oppositely arranged.
Laser marking machine the most according to claim 1 and 2, it is characterised in that: described scanning galvanometer group includes that X-axis scanning is shaken
Mirror and Y axis scanning galvanometer.
4. the CCD of a laser marking machine coaxial light path localization method, it is characterised in that comprise the steps:
The first step: workpiece to be processed puts in place, light combination mirror moves to laser optical path；
Second step: CCD floor light light illuminates workpiece, CCD floor light light reflects at workpiece, and reflection light beam is sequentially through poly-
Jiao Jing, scanning mirror group and light combination mirror transmission；
3rd step: the reflection light of CCD floor light light transmits to CCD probe after light combination mirror reflects；
4th step: CCD probe carries out location to reflection light and captures, and feedback data is to laser marking machine；
5th step: light combination mirror moves to outside laser optical path；
6th step: after laser marking machine processes the data of feedback, laser marking machine controls laser instrument and is processed workpiece.
The coaxial light path localization method of laser marking machine the most according to claim 4, it is characterised in that: described second step bag
Include following steps:
Step A1: reflection light beam line focus mirror transmits to Y axis scanning galvanometer；
Step A2: reflection light beam changes the transmission direction of this reflection light beam through Y axis scanning galvanometer and shakes in transmission to X-axis scanning
Mirror；
Step A3: reflection light beam transmits to light combination mirror through X-axis scanning galvanometer.
The CCD coaxial light path localization method of laser marking machine the most according to claim 5, it is characterised in that: the described 6th
Step comprises the steps:
Step B1: laser instrument sends laser beam and expands to scanning galvanometer group through beam expanding lens to beam expanding lens, laser beam；
Step B2: scanned galvanometer group instruction laser optical path direction is also transmitted to focus lamp, and line focus mirror focuses to workpiece；
Step B3: workpiece is laser machined by laser.
The CCD coaxial light path localization method of laser marking machine the most according to claim 6, it is characterised in that: described step
B2 comprises the steps:
Step B21: laser beam expands to X-axis scanning galvanometer through beam expanding lens；
Step B22: laser beam changes the transmission direction of laser beam through X-axis scanning galvanometer and transmits laser beam and sweep to Y-axis
Retouch galvanometer；
Step B23: laser beam transmits to focus lamp through Y axis scanning galvanometer, and line focus mirror focuses to workpiece.
8. the CCD of a laser marking machine coaxial light path localization method, it is characterised in that comprise the steps:
The first step: workpiece to be processed puts in place, light combination mirror moves to laser optical path；
Second step: CCD floor light light illuminates workpiece, CCD floor light light reflects at workpiece, and reflection beam Propagation is to closing
In Shu Jing；
3rd step: the reflection light of CCD floor light light transmits to CCD probe after light combination mirror reflects；
4th step: CCD probe carries out location to reflection light and captures, and feedback data is to laser marking machine；
5th step: light combination mirror moves to outside laser optical path；
6th step: after laser marking machine processes the data of feedback, laser marking machine controls laser instrument and is processed workpiece.
The CCD coaxial light path localization method of laser marking machine the most according to claim 8, it is characterised in that: the described 6th
Step comprises the steps:
Step B1: laser instrument sends laser beam and expands to scanning galvanometer group through beam expanding lens to beam expanding lens, laser beam；
Step B2: scanned galvanometer group instruction laser optical path direction is also transmitted to focus lamp, and line focus mirror focuses to workpiece；
Step B3: workpiece is laser machined by laser.
The CCD coaxial light path localization method of laser marking machine the most according to claim 9, it is characterised in that: described step
B2 comprises the steps:
Step B21: laser beam is expanding to X-axis scanning galvanometer through beam expanding lens；
Step B22: laser beam changes the transmission direction of laser beam through X-axis scanning galvanometer and transmits laser beam and sweep to Y-axis
Retouch galvanometer；
Step B23: laser beam transmits to focus lamp through Y axis scanning galvanometer, and line focus mirror focuses to workpiece.
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| CN201610804503.3A CN106271044B (en) | 2016-09-05 | 2016-09-05 | Laser marking machine and CCD coaxial optical path localization method |
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| CN201610804503.3A CN106271044B (en) | 2016-09-05 | 2016-09-05 | Laser marking machine and CCD coaxial optical path localization method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11267868A (en) * | 1997-12-29 | 1999-10-05 | Shinozaki Seisakusho:Kk | Method and device for laser processing |
| JP2010260063A (en) * | 2009-04-30 | 2010-11-18 | Hamamatsu Photonics Kk | Laser beam machining apparatus |
| CN103963479A (en) * | 2014-05-08 | 2014-08-06 | 佛山市联动科技实业有限公司 | Laser marking machine with detection |
| CN204800146U (en) * | 2015-03-12 | 2015-11-25 | 深圳市奥华激光科技有限公司 | With three -dimensional coaxial CCD vision image device of mirror that shakes |
| CN105093464A (en) * | 2015-09-24 | 2015-11-25 | 江苏卓远激光科技有限公司 | Laser beam combiner bracket |
| CN105730019A (en) * | 2016-02-03 | 2016-07-06 | 深圳英诺激光科技有限公司 | Feedback type laser marking machine and laser marking method |
-
2016
- 2016-09-05 CN CN201610804503.3A patent/CN106271044B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11267868A (en) * | 1997-12-29 | 1999-10-05 | Shinozaki Seisakusho:Kk | Method and device for laser processing |
| JP2010260063A (en) * | 2009-04-30 | 2010-11-18 | Hamamatsu Photonics Kk | Laser beam machining apparatus |
| CN103963479A (en) * | 2014-05-08 | 2014-08-06 | 佛山市联动科技实业有限公司 | Laser marking machine with detection |
| CN204800146U (en) * | 2015-03-12 | 2015-11-25 | 深圳市奥华激光科技有限公司 | With three -dimensional coaxial CCD vision image device of mirror that shakes |
| CN105093464A (en) * | 2015-09-24 | 2015-11-25 | 江苏卓远激光科技有限公司 | Laser beam combiner bracket |
| CN105730019A (en) * | 2016-02-03 | 2016-07-06 | 深圳英诺激光科技有限公司 | Feedback type laser marking machine and laser marking method |
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