CN106231874A - A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure - Google Patents

Abstract

The invention discloses a radiator heat-conducting glue pressing tool and a board heat dissipation structure. One board is provided with only one radiator, and the pressed heat-conducting glue blocks are used to fill gaps between electronic components and radiators on the board. The heat-conducting glue The pressing tool includes a frame on which a cement mold is placed horizontally, and the upper plane of the cement mold is provided with a cement cavity for placing the cement and a radiator positioning structure for realizing the positioning of the radiator. The frame A briquetting block for pressing the radiator on the briquette mold and a briquetting lifting drive device for driving the briquetting block up and down are arranged above the mastic mold. The heat dissipation structure of the board card adopted in the present invention can solve the problem of installing heat-conducting components due to the different heights of the electronic components, and the corresponding heat-conducting glue pressing tool can meet the thickness and shape requirements of the glue and ensure the pressing quality of the heat-conducting glue.

Description

Heat-conducting glue pressing tool for radiator and heat dissipation structure of board card

technical field

The invention relates to a heat dissipation technology of a board card, in particular to a heat dissipation structure of a board card and a pressing tool for heat conduction glue of a radiator.

Background technique

In the prior art, a heat conduction pad is installed between the board and the heat sink. The commonly used installation method of the heat conduction pad is to use an elastic heat conduction pad to be die-cut by the manufacturer, then place the heat conduction pad on the device that needs heat dissipation, and use screws or spring pins to install the heat conduction pad. Fix the heat sink on the circuit board to ensure that the heat sink is in close contact with the device to be cooled through the elastic thermal pad, and usually each heat dissipation element needs to be installed with a heat sink, and a board needs to be installed with multiple heat sinks.

Although the fixing method of the screw is simple, if multiple heat dissipation elements are required to be in contact with a heat sink to dissipate heat at the same time, it is often necessary to select thermal pads with different thicknesses due to the different heights of the components. Inconsistencies lead to deformation of the board, or by re-machining the plane of the heat sink to solve the problem of deformation of the circuit board due to the difference in pressure of the thermal pad. Although the heat sink can be fixed by spring pins to adjust the height of the heat sink by using the spring force, the heat sink will be deflected due to the different compression heights of the springs, which will cause the heat sink, heat conduction pad and heat dissipation elements to not be in close contact and affect heat dissipation. There is a fit gap between the heat dissipation holes, which makes this installation method unsuitable for use in a vibration environment and will generate relatively loud noises.

Contents of the invention

The technical problem to be solved by the present invention is to provide a radiator heat-conducting glue pressing tool and a board heat dissipation structure. By designing the board heat dissipation structure, the electronic components on a board can share a heat sink for heat dissipation. At the same time, through a dedicated Advanced heat transfer paste pressing tools solve the problem of heat transfer paste pressing for radiators, improve the pressing efficiency of heat transfer paste, and ensure the quality of pressing.

In order to solve the above-mentioned technical problems, the present invention adopts the following technical scheme: a heat-conducting cement pressing tool for radiators, including a frame, a cement mold is placed horizontally on the frame, and the upper plane of the cement mold is provided with a hole for placing the cement. The cement cavity and the radiator positioning structure used to realize the positioning of the radiator, the frame is provided above the cement mold with a pressing block that presses the radiator on the cement mold and a pressing block lifting drive device that drives the pressing block up and down .

Preferably, the radiator positioning structure is a radiator positioning hole arranged on the upper plane of the cement mold, and the radiator is provided with a riveting stud fixed to the board, and the riveting stud is inserted into the radiator positioning hole. in the hole.

Preferably, the press block lifting drive device includes a press block slider fixed to the press block and driving the press block up and down, and a guide rail guiding the press block slider to slide up and down, and the press block slider is connected with a crank linkage mechanism.

Preferably, the frame is provided with a pressing block guide rod for guiding the pressing block to slide up and down.

Preferably, the frame includes a base plate at the bottom, and the cement mold is detachably mounted on the base plate.

Preferably, the bottom of the cement mold is provided with several mold positioning holes, and the bottom plate is provided with positioning guide rods correspondingly inserted into the mold positioning holes so as to realize the positioning of the cement mold on the bottom plate.

Preferably, the surface of the cement mold is provided with Teflon coating or PET release paper.

In addition, the present invention also provides a board card heat dissipation structure, including a board card and a corresponding heat sink, the board card is provided with a plurality of electronic components that need to be dissipated, and the heat sink is respectively equipped with a heat conduction device corresponding to each electronic component. The glue block, between each electronic component and the heat sink, the gap between the board and the heat sink is filled by the corresponding heat-conducting glue block.

Further, the heights of the electronic components are different.

Further, the fixing between the board and the heat sink is achieved by screwing the pressure riveting studs of the heat sink.

In the technical solution adopted by the present invention, one board is provided with only one heat sink, and the pressed heat-conducting cement blocks are used to fill the gaps between the electronic components and the heat sink on the board, which can solve the problems caused by the different heights of the electronic components. It is difficult to set up, so the heat dissipation structure is also simplified. Due to the use of heat-conducting cement as the heat-conducting medium between the cooling element and the radiator, the heat-conducting cement has good thermal conductivity, the thermal conductivity is 8W/mk, and it is super soft and can be compressed to any thickness. After pressing to a certain thickness That is, it can be maintained with a small reaction force to avoid deformation of the board due to excessive reaction force.

In addition, in view of the fact that there are few options for the thickness of the heat-conducting glue, and the compression from the thickness of the glue to the specified thickness often requires a large pressure, which leads to the technical problem that the glue is difficult to apply, the present invention uses a special heat-conducting glue for radiators. The heat-conducting cement is placed in the cement cavity of the cement mold, and the pressing block is driven to reciprocate up and down by the lifting drive device. When the pressing block is at the bottom end, the pressing block presses the radiator on the cement mold, and through the cement cavity Specifically designed, the glue can be pressed on the heat sink to reach the required thickness, so as to meet the problem of different thicknesses of heat-conducting glue blocks due to the different heights of electronic components. And when the briquetting block is at the uppermost end, the pressed heat sink and heat-conducting cement can be taken out, which is convenient for subsequent installation. Therefore, the pressing efficiency of the cement is higher, and the thickness and shape requirements of the cement can be met to ensure the pressing quality of the heat-conducting cement.

Description of drawings

The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:

Fig. 1 is a structural representation of the present invention;

Fig. 2 is the structural representation of the present invention in the state of not placing the cement mold;

Fig. 3 is the front structure schematic diagram of cement mold;

Figure 4 is a schematic diagram of the back structure of the cement mold

FIG. 5 is a schematic structural view of the back of the radiator.

detailed description

As shown in Fig. 1 and Fig. 2, a kind of radiator heat-conducting glue pressing tool comprises frame 1, and described frame 1 is horizontally placed with glue mold 2, and the upper plane of described glue mold is provided with for realizing radiator 3 Positioning radiator positioning structure, the frame 1 is provided with a briquetting block 4 pressing the radiator 3 on the mastic mold and a briquetting lifting drive device driving the briquetting up and down above the mastic mold.

As shown in FIG. 3 , the upper plane of the cement mold is provided with a cement cavity 21 for placing the cement. The size and height of the cement cavity corresponding to the electronic components on the board are designed to be pressed into the corresponding heat-conducting cement block. Therefore, the position, quantity, depth and area of the cement cavity 21 can be adjusted as required to meet the requirements of the heat-conducting cement block. Depending on the thickness and shape requirements, the heat-conducting cement is placed in the cement cavity 21 of the cement mold, and then the pressing block 4 exerts pressure on the heat sink 3, and the pressed heat-conducting cement block can fill the gap between the board and the heat sink to maintain heat dissipation The heat sink and the surface of the heat dissipation element are in close contact, and a heat transfer channel with high efficiency and low thermal resistance is established.

As shown in Figure 4, the bottom of the cement mold is provided with several mold positioning holes 23, and the frame includes a base plate and a support plate perpendicular to the base plate. As shown in FIG. 2 , the base plate is provided with positioning guide rods 11 correspondingly inserted into the mold positioning holes 23 so as to realize the positioning of the cement mold on the base plate. After the positioning guide rod 11 is inserted in the mold positioning hole 23, the positioning of the cement mold 2 on the base plate can be realized, so that the versatility of the pressing tool can be realized. By replacing the cement mold 2, the thickness and shape of the cement with different requirements can be suppressed.

As shown in Figure 3, the radiator positioning structure is a radiator positioning hole 22 arranged on the upper plane of the cement mold, and as shown in Figure 5, the radiator 3 is provided with a riveting stud 31 fixed to the board , the press riveting stud 31 is inserted into the positioning hole 22 of the radiator. The pressure riveting stud 31 is used to ensure that the height of the radiator on the circuit board is consistent, so as to avoid the deformation of the board due to the large locking force. Reliable positioning between molds. Since the shape changes greatly during pressing, and the heat transfer mastic is in contact with the mastic mold and the radiator at the same time, in order to make the heat transfer mastic fit closely on the radiator instead of the mastic mold, the surface of the mastic mold (including the inside of the mastic cavity) needs to use Non-stick material Teflon coating, or additional PET release paper, to ensure that the bonding force between the thermally conductive mastic and the mastic mold is small, and to ensure that the pressed mastic can be effectively peeled off from the mastic mold.

As shown in Figure 1, the described briquetting lifting drive device includes a briquetting slider 6 that is fixed to the briquetting block and drives the briquetting up and down, and a guide rail 7 that guides the briquetting slider to slide up and down, and the briquetting slider is connected with Crank Mechanism. Wherein, the guide rail is fixed on the support plate. In this embodiment, the guide rail adopts a cylindrical guide sleeve, and the pressing block slider 6 is cylindrical and slides in the cylindrical guide sleeve. The frame is provided with a briquetting guide rod 5 that guides the briquetting block to slide up and down, the bracket plate is fixed with an upper fixing plate above the base plate, the briquetting guide rod is a cylindrical rod, the upper end is fixed on the upper fixing plate, and the lower end is fixed to the base plate . The crank-link mechanism includes a connecting rod 8 and a crank 9. With the swing of the crank 9, the connecting rod drives the pressing block slider 6 and the pressing block 4, and reciprocates up and down under the linear limit of the guide rail 7 and the pressing block guide rod 5. , when the pressing block is at the uppermost end, the pressed heat sink and thermal paste can be taken out, which is convenient for subsequent installation. Compared with the technical solution that the heat conduction glue is coated on the heat sink first, and then pressed and flattened, not only the efficiency is low, but also the thickness and uniformity are not easy to control. The heat-conducting mastic pressing tool for radiators adopted in the present invention has higher mastic pressing efficiency, can meet the thickness and shape requirements of the mastic, guarantees the pressing quality of the heat-conducting mastic, can realize the required thickness and shape by using a general jig, and is easy to operate.

The present invention also provides a board card heat dissipation structure, including a board card and a corresponding heat sink, the board card is provided with a plurality of electronic components that need to be dissipated, and the heat sink is respectively provided with heat-conducting clay blocks corresponding to each electronic component , Between each electronic component and the heat sink, the gap between the board and the heat sink is filled by corresponding heat-conducting clay blocks. Thermally conductive cement is a kind of thermally conductive material and bonding material as the main material. The thermally conductive cement is used as the heat conduction medium between the heat dissipation element and the radiator. The thermally conductive cement has good thermal conductivity, and the thermal conductivity is 8W/mk. It has a super soft Features, can be compressed to any thickness, when pressed to a certain thickness, it can be maintained with a small reaction force, to avoid deformation of the board caused by excessive reaction force. Therefore, a heat transfer paste is provided between the board and the heat sink to increase the heat conduction area and establish a heat transfer channel with high efficiency and low thermal resistance.

Wherein, the heights of the electronic components are different, or they can be the same. When the heights are different, a plurality of heat-conducting cement blocks with different thicknesses can be pressed at one time by the radiator heat-conducting cement pressing tool to meet the connection between multiple electronic components and the radiator. Therefore, the advantages of the heat dissipation structure and the radiator heat-conducting cement pressing tool can be better embodied.

In addition, the fixing between the board and the heat sink is achieved by screwing the pressure riveting studs of the heat sink. Through the above-mentioned pressing tool, the heat-conducting glue can be pressed on the heat sink to a required thickness.

Claims (10)

1. A radiator heat-conducting mastic pressing tool is characterized in that: it comprises a frame, and a mastic mold is placed horizontally on the frame, and the upper plane of the mastic mold is provided with a mastic cavity for placing the mastic and is used to realize The radiator positioning structure for radiator positioning, the frame is provided with a briquetting block pressing the radiator on the mastic mold and a briquetting lifting drive device driving the briquetting up and down above the cement mold. 2. A radiator heat-conducting mortar pressing tool according to claim 1, characterized in that: the radiator positioning structure is a radiator positioning hole arranged on the upper plane of the clay mold, and the radiator is provided with a plate The clamping rivet studs are fixed, and the rivet studs are inserted into the positioning holes of the radiator. 3. A heat-conducting cement pressing tool for radiators according to claim 1, characterized in that: the lifting and lowering driving device of the pressing block includes a pressing block slider fixed to the pressing block and driving the pressing block to lift up and down, and a guiding pressing block slider A guide rail that slides up and down, and the slider of the pressing block is connected with a crank linkage mechanism. 4 . The heat-conducting cement pressing tool for radiators according to claim 1 , wherein the frame is provided with a pressing block guide rod for guiding the pressing block to slide up and down. 5 . 5 . The radiator heat-conducting glue pressing tool according to any one of claims 1 to 4 , wherein the frame includes a bottom plate, and the glue mold is detachably mounted on the bottom plate. 6 . 6. A heat-conducting mortar pressing tool for radiators according to claim 5, characterized in that: the bottom of the clay mold is provided with several mold positioning holes, and the base plate is provided with corresponding inserting mold positioning holes so as to realize the molding of the clay. Positioning guides for positioning the mold on the base plate. 7 . The heat-conducting cement pressing tool for radiators according to claim 1 , wherein the surface of the cement mold is provided with Teflon coating or PET release paper. 8 . 8. A board card heat dissipation structure, including a board card and a corresponding heat sink, the board card is provided with a plurality of electronic components that need to be dissipated, and it is characterized in that: the heat sink is respectively provided with heat-conducting glue corresponding to each electronic component Blocks, each electronic component and the heat sink are filled with corresponding heat-conducting clay blocks to fill the gap between the board and the heat sink. 9. The board card heat dissipation structure according to claim 8, wherein the heights of the electronic components are different. 10 . The heat dissipation structure of the board card according to claim 8 , wherein the fixing between the board card and the heat sink is achieved by screw-locking the riveting studs of the heat sink. 11 .