CN106231801A - For the technique making pottery plate HDI plate - Google Patents
For the technique making pottery plate HDI plate Download PDFInfo
- Publication number
- CN106231801A CN106231801A CN201610693649.5A CN201610693649A CN106231801A CN 106231801 A CN106231801 A CN 106231801A CN 201610693649 A CN201610693649 A CN 201610693649A CN 106231801 A CN106231801 A CN 106231801A
- Authority
- CN
- China
- Prior art keywords
- plate
- central layer
- layer
- pottery plate
- hdi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 238000000227 grinding Methods 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims description 36
- 239000010949 copper Substances 0.000 claims description 36
- 239000000919 ceramic Substances 0.000 claims description 12
- 238000005553 drilling Methods 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 10
- 239000010408 film Substances 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 97
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000011889 copper foil Substances 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000012792 core layer Substances 0.000 abstract description 2
- 238000012797 qualification Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a kind of technique for making pottery plate HDI plate, this technological process uses mechanical blind hole mode to make by unified for the blind hole of pottery plate central layer, after filling holes with resin flow process being changed to brown flow process simultaneously, save the operation of blind hole layer central layer abrasive belt grinding, it is to avoid abrasive belt grinding causes the situation that core layer is inclined.The beneficial effects of the present invention is: by optimized production process flow process, reduce pottery plate HDI plate because the PP sheet risk that cause wiring board scrap poor with Copper Foil adhesion, improve the qualification rate of pottery plate HDI plate.
Description
Technical field
The present invention relates to circuit board making technical field, refer in particular to a kind of technique for making pottery plate HDI plate.
Background technology
In modern technologies, electronic signal develops towards high frequency, high speed direction, installs electronic signal transmission and components and parts
The PCB of supporting role constantly develops to multifunction, densification direction.Integrated level higher HDI plate occurs and becomes PCB city
The main product of field, is applied in increasing electronic product.Along with signal transmission frequencies is more and more higher, make HDI plate
Sheet material is also replaced by high-frequency ceramic sheet material by common FR-4 plate.High-frequency ceramic sheet material is added with ceramic packing, and ceramic
Filler can cause PP sheet to decline with Copper Foil binding ability, and existing pottery plate HDI plate mainly has two kinds of production technologies, and one is sharp
Light HDI plate, another kind is machinery HDI plate.
The technological process of laser HDI plate is:
Copper is electroplated → is subtracted in internal layer making → brown → pressing → brown (2) → laser drill → move back brown → heavy copper → filling perforation
→ outer layer boring → outer layer sinks copper → electric plating of whole board → outer graphics → graphic plating → outer layer alkalescence moment → outer layer AOI → resistance
Weldering → character → surface process → molding → electrical testing → FQC → packaging, laser HDI plate is because central layer is relatively thin, easily by high temperature
Impact causes copper sheet to bubble, and final wiring board is scrapped；
The technological process of machinery HDI plate is:
Sawing sheet → internal layer boring → internal layer sinks copper → inner plating electricity → internal layer plated hole figure → plated hole → take off film → resin plug
Hole → abrasive belt grinding → inner figure → internal layer etching → OPE punching → internal layer AOI → brown → pressing → except gummosis → outer layer
Boring → outer layer sinks copper → electric plating of whole board → outer graphics → graphic plating → outer layer alkalescence moment → outer layer AOI → welding resistance → word
Symbol → surface process → molding → electrical testing → FQC → packaging, machinery HDI plate is then relatively thin due to blind hole layer medium, grinds in abrasive band
Being susceptible to harmomegathus problem after plate, layer is inclined to make multilayer circuit board occur, causes wiring board to be scrapped.
As can be seen here, old production technology can not meet the production of pottery plate HDI plate.
Summary of the invention
The technical problem to be solved is: easily occur that copper sheet bubbles and ceramic wafer for pottery plate HDI plate
Easily there is the problem that layer is inclined in material HDI central layer, it is provided that a kind of applicable production technology making pottery plate HDI plate.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is: one is used for making pottery plate HDI plate
Technique, in turn include the following steps:
S1, the central layer of the applicable machine drilling of selection, described central layer is the ceramic plate central layer that copper is covered on two sides；
S2, sawing sheet, it would be desirable to the central layer making blind hole is cut by required size；
S3, to described pottery the upper and lower surface of plate central layer layers of copper subtract Copper treatment；
S4, to described pottery plate central layer carry out machine drilling；
S5, described pottery plate central layer is carried out internal layer sink copper, make machine drilling is formed layers of copper；
S6, to described pottery plate central layer carry out electroplating processes, make the layers of copper of machine drilling thicken；
S7, described pottery plate central layer is carried out inner figure making, will be after film image transfers to electroplating processes
On the plate face of internal layer circuit plate；
S8, to described pottery plate central layer carry out internal layer etch processes；
S9, to described pottery plate central layer carry out OPE punching process；
S10, to described pottery plate central layer carry out internal layer AOI process；
S11, to described pottery plate central layer carry out brown process, make copper foil surface formed brown film；
S12, to described pottery plate central layer plated through-hole carry out clog resin treatment；
S13, utilize thin film by described pottery plate core plate surface Excess resin glue；
S14, described pottery plate central layer, prepreg and lamina rara externa are carried out pressing process, make pottery plate HDI
Plate；
S15, abrasive belt grinding, carry out abrasive belt grinding process to the upper and lower surface of the ceramic plate HDI plate completed.
Further, table copper is thinned to 8-10 μm by the Copper treatment that subtracts in described S3 step.
Further, between described step S12 and step S13 the most successively include stand central layer, on central layer film laying
And thin film is executed stressed step.
Further, also include between described step S13 and step S14 toasting the step that central layer makes resin solidify.
Further, include after described step S15 that outer layer is holed, outer layer sinks copper, electric plating of whole board, outer layer figure the most successively
Shape, graphic plating, outer layer alkali etching, outer layer AOI, welding resistance, character, surface process, molding, electrical testing, FQC, the step of packaging
Suddenly.
The beneficial effects of the present invention is: make by the way of pottery plate HDI plate is used uniformly across machine drilling, solve
The problem that ceramic plate HDI plate copper sheet of having determined bubbles, cancels the abrasive belt grinding operation of pottery plate HDI central layer, reduces central layer
Layer local derviation causes the risk scrapped.
Accompanying drawing explanation
The technological process of the present invention is described in detail in detail below in conjunction with the accompanying drawings:
Fig. 1 is the process flow diagram of the present invention.
Detailed description of the invention
By describing the technology contents of the present invention, structural feature in detail, being realized purpose and effect, below in conjunction with embodiment
And coordinate accompanying drawing to be explained in detail.
Refer to Fig. 1, a kind of technique for making pottery plate HDI plate, in turn include the following steps:
S1, the central layer of the applicable machine drilling of selection, described central layer is the ceramic plate central layer that copper is covered on two sides；
S2, sawing sheet, it would be desirable to the central layer making blind hole is cut by required size；
S3, to described pottery the upper and lower surface of plate central layer layers of copper subtract Copper treatment；
S4, to described pottery plate central layer carry out machine drilling；
S5, described pottery plate central layer is carried out internal layer sink copper, make machine drilling is formed layers of copper；
S6, to described pottery plate central layer carry out electroplating processes, make the layers of copper of machine drilling thicken；
S7, described pottery plate central layer is carried out inner figure making, will be after film image transfers to electroplating processes
On the plate face of internal layer circuit plate；
S8, to described pottery plate central layer carry out internal layer etch processes；
S9, to described pottery plate central layer carry out OPE punching process；
S10, described pottery plate central layer is carried out internal layer AOI inspection, check internal layer circuit whether exist open circuit, short circuit,
The defects such as circuit breach, circuit pin hole；
S11, to described pottery plate central layer carry out brown process, make copper foil surface formed brown film；
S12, to described pottery plate central layer plated through-hole carry out clog resin treatment；
S13, utilize thin film by described pottery plate core plate surface Excess resin glue；
S14, described pottery plate central layer, prepreg and lamina rara externa are carried out pressing process, make pottery plate HDI
Plate；
S15, abrasive belt grinding, carry out abrasive belt grinding process to the upper and lower surface of the ceramic plate HDI plate completed.
Knowable to foregoing description, the beneficial effects of the present invention is: by pottery plate HDI plate is used uniformly across power auger
The mode in hole makes, and solves the problem that pottery plate HDI plate copper sheet bubbles, cancels the abrasive belt grinding of pottery plate HDI central layer
Operation, reduces the risk that core layer local derviation causes to scrap.
Embodiment 1
Table copper is thinned to 8-10 μm by the Copper treatment that subtracts in described S3 step.The central layer being provided with blind hole layer is subtracted at copper
Reason, can make internal layer etching work procedure below be easier to make for, and replaces abrasive belt grinding operation with subtracting copper process, can avoid
The abrasive belt grinding impact on pottery plate central layer.
Embodiment 2
Include the most successively between described step S12 and step S13 standing central layer, on central layer film laying thin film is executed
Stressed step.In the present embodiment, under the conditions of room temperature environment, standing central layer a period of time is to allow resin in metallization
Reaching steady statue in hole, be then placed on resin machine by central layer, central layer is through pressure reel, and viscosity resin machine is by thin film (preferably
Use PET film) spread the upper and lower surface being pressed in central layer, and apply 0.5kgf/cm2Pressure, speed is set to 1m/min, pressure
Under power, thin film sticks together with the numerical value of prominent core plate surface, and when central layer leaves pressure reel, the thin film on the upper and lower surface of central layer is torn
Removing, the resin protruding core plate surface departs from central layer with thin film the most in the lump.
Embodiment 3
Also include between described step S13 and step S14 toasting the step that central layer makes resin solidify.By core in the present embodiment
Plate is placed at 120 DEG C baking 27-33min, makes resin solidify in plated through-hole.
Embodiment 4
Include after described step S15 that outer layer is holed, outer layer sinks copper, electric plating of whole board, outer graphics, figure electricity the most successively
Plating, outer layer alkali etching, outer layer AOI, welding resistance, character, surface process, molding, electrical testing, FQC, the step of packaging.This enforcement
In example, can ensure to make production efficiency and the yields of pottery plate HDI plate well by this flow process.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
Equivalent structure or equivalence flow process that bright description and accompanying drawing content are made convert, or are directly or indirectly used in other relevant skills
Art field, is the most in like manner included in the scope of patent protection of the present invention.
Claims (5)
1., for making a technique for pottery plate HDI plate, in turn include the following steps:
S1, the central layer of the applicable machine drilling of selection, described central layer is the ceramic plate central layer that copper is covered on two sides；
S2, sawing sheet, it would be desirable to the central layer making blind hole is cut by required size；
S3, to described pottery the upper and lower surface of plate central layer layers of copper subtract Copper treatment；
S4, to described pottery plate central layer carry out machine drilling；
S5, described pottery plate central layer is carried out internal layer sink copper；
S6, to described pottery plate central layer carry out electroplating processes；
S7, to described pottery plate central layer carry out inner figure making；
S8, to described pottery plate central layer carry out internal layer etch processes；
S9, to described pottery plate central layer carry out OPE punching process；
S10, to described pottery plate central layer carry out internal layer AOI process；
S11, to described pottery the upper and lower surface of plate central layer carry out brown process；
S12, to described pottery plate central layer plated through-hole carry out clog resin treatment；
S13, utilize thin film by described pottery plate core plate surface Excess resin glue；
S14, described pottery plate central layer, prepreg and lamina rara externa are carried out pressing process, make pottery plate HDI plate；
S15, abrasive belt grinding, carry out abrasive belt grinding process to the upper and lower surface of the ceramic plate HDI plate completed.
2. the technique for making pottery plate HDI plate as claimed in claim 1, it is characterised in that: in described S3 step
Subtract Copper treatment and table copper is thinned to 8-10 μm.
3. the technique for making pottery plate HDI plate as claimed in claim 1, it is characterised in that: described step S12 and step
Include the most successively between rapid S13 standing central layer, on central layer film laying thin film is executed stressed step.
4. the technique for making pottery plate HDI plate as claimed in claim 1, it is characterised in that: described step S13 and step
Also include between rapid S14 toasting the step that central layer makes resin solidify.
5. the technique for making pottery plate HDI plate as claimed in claim 1, it is characterised in that: after described step S15 also
Include that outer layer is holed, outer layer sinks copper, electric plating of whole board, outer graphics, graphic plating, outer layer alkali etching, outer layer AOI, resistance successively
Weldering, character, surface process, molding, electrical testing, FQC, the step of packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610693649.5A CN106231801A (en) | 2016-08-19 | 2016-08-19 | For the technique making pottery plate HDI plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610693649.5A CN106231801A (en) | 2016-08-19 | 2016-08-19 | For the technique making pottery plate HDI plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106231801A true CN106231801A (en) | 2016-12-14 |
Family
ID=57553945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610693649.5A Pending CN106231801A (en) | 2016-08-19 | 2016-08-19 | For the technique making pottery plate HDI plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106231801A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108200735A (en) * | 2018-02-08 | 2018-06-22 | 深圳市昶东鑫线路板有限公司 | Blind buried via hole circuit board machining process |
| CN110099523A (en) * | 2019-03-29 | 2019-08-06 | 东莞联桥电子有限公司 | A kind of manufacture craft of multilayer circuit board |
| CN111065203A (en) * | 2020-01-06 | 2020-04-24 | 东莞市五株电子科技有限公司 | High-end LED circuit board with good heat dissipation performance and preparation method thereof |
| CN111818737A (en) * | 2020-07-23 | 2020-10-23 | 深圳市和美精艺科技有限公司 | Method for plugging ink front plug coating hole of packaging substrate |
| CN112165782A (en) * | 2020-11-02 | 2021-01-01 | 胜华电子（惠阳）有限公司 | A high aspect ratio printed circuit board resin plug hole technology |
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| CN101699932A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Production method of high-thermal-conductivity ceramic circuit board |
| CN102143647A (en) * | 2010-11-25 | 2011-08-03 | 聚信科技有限公司 | Circuit board and manufacturing method thereof |
| CN102523693A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Process for manufacturing printed circuit boards having high-frequency and low-frequency mixed board structures |
| CN103037640A (en) * | 2012-06-05 | 2013-04-10 | 北京凯迪思电路板有限公司 | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate |
| US20150122535A1 (en) * | 2013-11-04 | 2015-05-07 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein |
-
2016
- 2016-08-19 CN CN201610693649.5A patent/CN106231801A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699932A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Production method of high-thermal-conductivity ceramic circuit board |
| CN102143647A (en) * | 2010-11-25 | 2011-08-03 | 聚信科技有限公司 | Circuit board and manufacturing method thereof |
| CN102523693A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Process for manufacturing printed circuit boards having high-frequency and low-frequency mixed board structures |
| CN103037640A (en) * | 2012-06-05 | 2013-04-10 | 北京凯迪思电路板有限公司 | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate |
| US20150122535A1 (en) * | 2013-11-04 | 2015-05-07 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108200735A (en) * | 2018-02-08 | 2018-06-22 | 深圳市昶东鑫线路板有限公司 | Blind buried via hole circuit board machining process |
| CN110099523A (en) * | 2019-03-29 | 2019-08-06 | 东莞联桥电子有限公司 | A kind of manufacture craft of multilayer circuit board |
| CN111065203A (en) * | 2020-01-06 | 2020-04-24 | 东莞市五株电子科技有限公司 | High-end LED circuit board with good heat dissipation performance and preparation method thereof |
| CN111065203B (en) * | 2020-01-06 | 2022-04-26 | 东莞市五株电子科技有限公司 | High-end LED circuit board with good heat dissipation performance and preparation method thereof |
| CN111818737A (en) * | 2020-07-23 | 2020-10-23 | 深圳市和美精艺科技有限公司 | Method for plugging ink front plug coating hole of packaging substrate |
| CN111818737B (en) * | 2020-07-23 | 2022-01-07 | 深圳和美精艺半导体科技股份有限公司 | Method for plugging ink front plug coating hole of packaging substrate |
| CN112165782A (en) * | 2020-11-02 | 2021-01-01 | 胜华电子（惠阳）有限公司 | A high aspect ratio printed circuit board resin plug hole technology |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161214 |
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