CN106211702B - Cooling fin with Electromagnetic Interference function of shielding - Google Patents
Cooling fin with Electromagnetic Interference function of shielding Download PDFInfo
- Publication number
- CN106211702B CN106211702B CN201510218219.3A CN201510218219A CN106211702B CN 106211702 B CN106211702 B CN 106211702B CN 201510218219 A CN201510218219 A CN 201510218219A CN 106211702 B CN106211702 B CN 106211702B
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- China
- Prior art keywords
- layer
- thermally conductive
- conductive ink
- ink layer
- cooling fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001816 cooling Methods 0.000 title claims abstract description 31
- 239000011248 coating agent Substances 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 239000000843 powder Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 239000011889 copper foil Substances 0.000 claims description 13
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 239000003595 mist Substances 0.000 claims description 3
- 238000002310 reflectometry Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000012360 testing method Methods 0.000 description 4
- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of cooling fins with Electromagnetic Interference function of shielding, it is made of thermally conductive ink layer, metal layer, conductive adhesion coating and release film layer, the metal layer is located between the thermally conductive ink layer and the conductive adhesion coating, the conduction adhesion coating is between the metal layer and the release film layer, the thermally conductive ink layer with a thickness of 2-5 microns, the metal layer with a thickness of 5-105 microns, it is described conduction adhesion coating with a thickness of 5-8 microns.Cooling fin of the invention has the advantages that structure is simple, is simple to manufacture, thickness is thin, also has splendid heat dissipation characteristics, ELECTROMAGNETIC OBSCURANT effect, electrical characteristic and low thermal resistance, also having both pliability makes it be fairly easy to process.
Description
Technical field
The present invention relates to a kind of cooling fins, in particular to a kind of to have Electromagnetic Interference shielding, and need to have high flexible
And the cooling fin of excellent thermal conduction characteristic and electrical characteristic.
Background technique
Electronic system is towards light and short, high-fire resistance, multifunctionality, densification, high reliability and low cost at present
Direction develop, and functionally, then powerful and high-speed signal is needed to transmit.Therefore, line density certainly will improve, support plate route
Between distance from increasingly closer and working frequency towards high broadband, if along with configuration, wiring do not conform to
It is increasingly severe to manage lower electromagnetic interference (Electromagnetic Interference, EMI) situation, it is therefore necessary to effectively management
Electromagnetic compatibility (Electromagnetic Compatibility, EMC), thus to maintain the normal signal of electronic product to transmit
And improve reliability.Furthermore must have high thermal conductivity, high dimensional stability, high screening color effect, high-cooling property, high-fire resistance
And the material property of low thermal coefficient of expansion.
Summary of the invention
In order to solve the above-mentioned technical problems, the present invention provides a kind of cooling fin with electromagnetic interference shielding function,
Cooling fin of the invention can be made of straightforward procedure, and cooling fin of the invention has good heat dissipation performance, and has
Good electromagnetic wave shielding, while there is high flexible and excellent electrical characteristic.
The present invention is to solve technical solution used by its technical problem:
A kind of cooling fin with Electromagnetic Interference function of shielding, by thermally conductive ink layer, metal layer, conductive adhesion coating and from
Type film layer is constituted, and the metal layer is located between the thermally conductive ink layer and the conductive adhesion coating, the conduction adhesion coating position
Between the metal layer and the release film layer, the thermally conductive ink layer with a thickness of 2-5 microns, the thickness of the metal layer
Be 5-105 microns, it is described conduction adhesion coating with a thickness of 5-8 microns.
The present invention is to solve further technical solution used by its technical problem:
Further say, the release film layer with a thickness of 25-100 microns.
Further say, the thermally conductive ink layer is the ink layer containing conduction powder, the conduction powder be metal
At least one of powder and inorganic conduction powder (such as graphene, aluminium oxide, boron nitride, silicon carbide, aluminium nitride etc.), it is described
Conduction powder accounts for the 5%-70% of thermally conductive ink layer solid content.
It further says, the thermally conductive ink layer is colored heat-conductive ink layer.
Furthermore, the thermally conductive ink layer can be greater than 85% for the thermally conductive ink layer of white, reflectivity.It is described to lead
Hot oil layer of ink may be black and be that 50 ° of Gloss > of the thermally conductive ink layer of bright black or 20 ° of Gloss < of mist degree are black
The thermally conductive ink layer of color.
It further says, the metal layer is copper foil, aluminium foil or metal alloy layer.
Furthermore, when the cooling fin is used for flex circuit application, the metal layer is copper foil, and is to stretch by force
Degree is 250MPa or less and thickness is in 50 microns of copper foils or tensile strength 400MPa or less below and thickness is at 70 microns or less
Copper foil.
Further say, the conduction adhesion coating is the adhesion coating containing metallic, the metallic be aluminium powder,
At least one of copper powder body and metal alloy powder.
It further says, the release film layer is single-sided parting film or two-sided release film.
The beneficial effects of the present invention are: the cooling fin with Electromagnetic Interference function of shielding of the invention is by thermally conductive ink
Layer, metal layer, conductive adhesion coating and release film layer are constituted, and cooling fin production method of the invention is simple, have structure simple, thick
Thin, splendid heat dissipation characteristics, ELECTROMAGNETIC OBSCURANT effect, electrical characteristic and low thermal resistance are spent, also having both pliability is fairly easy to it
Processing.
Detailed description of the invention
Fig. 1 is the heat sink structure illustration with Electromagnetic Interference function of shielding of the invention；
Fig. 2 is the heat sink structure illustration with electromagnetic interference shielding function after present invention removing release film layer.
Specific embodiment
Illustrate a specific embodiment of the invention below by way of specific specific example, those skilled in the art can be by this theory
The bright revealed content of book understands advantages of the present invention and effect easily.The present invention can also give reality in further, different ways
It applies, that is, under the scope of not departing from disclosed, different modification and change can be given.
Embodiment: a kind of cooling fin with Electromagnetic Interference function of shielding, as shown in Figure 1, by thermally conductive ink layer 101,
Metal layer 102, conductive adhesion coating 103 and release film layer 104 are constituted, and the metal layer is located at the thermally conductive ink layer and described leads
Between electric adhesion coating, it is described conduction adhesion coating between the metal layer and the release film layer, the thermally conductive ink layer
With a thickness of 2-5 microns, the metal layer with a thickness of 5-105 microns, the conduction adhesion coating with a thickness of 5-8 microns, it is described
Release film layer with a thickness of 25-100 microns.
The thermally conductive ink layer is the ink layer containing conduction powder, and the conduction powder is to be metal-powder and inorganic lead
The mixing of one or more of hot powder (such as graphene, aluminium oxide, boron nitride, silicon carbide, aluminium nitride etc.), it is described thermally conductive
Powder accounts for the 5%-70% of thermally conductive ink layer solid content.
The thermally conductive ink layer in addition to can be presented with the difference for the conduction powder wherein adulterated different colors with
Outside, inorganic pigment or organic pigment etc. can also be added and change its color, thermally conductive ink layer can be black, white, yellow, red
Color, green etc..The thermally conductive ink layer of white has a reflection enhanced shine, and reflectivity is suitble to application at least more than 85% and color inhibition
In the headlamp of LED photovoltaic product, has and increase brightness effect.The thermally conductive ink layer of black has masking route, aesthetic appeal
Effect, and bright black (Gloss>50 °) or mist degree black (Gloss<20 °) can be made into.
The metal layer is copper foil, aluminium foil or metal alloy layer.When cooling fin is used for flex circuit application, the metal layer
For copper foil, copper foil preferentially selects tensile strength for 250MPa or less and thickness is in 50 microns of copper foils below or tensile strength
400MPa or less and thickness is in 70 microns of copper foils below.
The conduction adhesion coating is the adhesion coating containing metallic, and the metallic is aluminium powder, copper powder body and gold
Belong at least one of alloy powder.
The release film layer is single-sided parting film or two-sided release film, and color is transparent or white.Release film layer is used
In the viscosity for keeping protecting thermally conductive ink layer and the conductive adhesion coating of holding, circuit board or other pressings system are bonded in favor of subsequent
Journey uses.The release film is conducive to differentiate for other colors such as transparent or white facilitates operability.
Whole cooling fin has the stiffening plate function of super flat high stiffening property；Conducive to applied on printed circuit board.
Cooling fin with electromagnetic interference shielding function of the invention can be made by the following method: in appointing for metal layer
One surface is coated with thermally conductive ink, and is dried and to form thermally conductive ink layer；Then, release film layer any surface coating or
Conductive adhesion coating is formed on release film layer surface by transfer printing, and conductive adhesion coating is made to be in (half polymerization half of B-stage state
Hardening state)；Finally another surface of metal layer is covered on conductive adhesion coating, and being pressed closely bonds it, i.e. shape
At the cooling fin of the present invention with electromagnetic interference shielding function.
As shown in Fig. 2, carrying out hot biography to the cooling fin with electromagnetic interference shielding function after the two-sided release film of removing
It leads analysis test: carrying out heat conduction analysis test with Hot Disk thermal conductivity coefficient instrument, descend two sides covering two on a sensor completely
Cooling fin print after solidification, and the sandwiched print of two steel plates and sensor are used respectively in two print lateral surfaces, and by sensing
Device measurement has the heating conduction of the cooling fin of electromagnetic interference shielding function, will have electromagnetic interference shielding function to the present invention
The made test of the cooling fin of energy is used as embodiment, and the heating conduction for testing generally thermally conductive product in the same way, which is used as, to be compared
Example, the coefficient of heat conduction result measured is embedded in table 1.
Table 1:
As seen from the above table, the cooling fin with electromagnetic interference shielding function of the invention is compared to common product, really
The heat dissipation effect of material can be increased substantially, and there is good conductive effect and shielding.
Description above and embodiment are merely illustrative the principle of the present invention and its effect, are not to of the invention
Limitation.Any creation fallen within the scope of the appended claims comes under the range that the present invention is protected.
Claims (6)
1. a kind of cooling fin with Electromagnetic Interference function of shielding, it is characterised in that: by thermally conductive ink layer (101), metal layer
(102), conductive adhesion coating (103) and release film layer (104) composition, the metal layer are located at the thermally conductive ink layer and described lead
Between electric adhesion coating, it is described conduction adhesion coating between the metal layer and the release film layer, the thermally conductive ink layer
With a thickness of 2-5 microns, the metal layer with a thickness of 5-105 microns, the conduction adhesion coating with a thickness of 5-8 microns；
The thermally conductive ink layer is the ink layer containing conduction powder, the conduction powder be metal-powder and inorganic conductive powder
At least one of body, the conduction powder account for the 5%-70% of thermally conductive ink layer solid content；
The thermally conductive ink layer is colored heat-conductive ink layer；
The thermally conductive ink layer is the thermally conductive ink layer of white, and reflectivity is greater than 85%；
The thermally conductive ink layer is black and is 50 ° of Gloss > of the thermally conductive ink layer of bright black or 20 ° of Gloss < of mist
Spend the thermally conductive ink layer of black.
2. as described in claim 1 with the cooling fin of Electromagnetic Interference function of shielding, it is characterised in that: the release film layer
With a thickness of 25-100 microns.
3. as described in claim 1 with the cooling fin of Electromagnetic Interference function of shielding, it is characterised in that: the metal layer is
Copper foil, aluminium foil or metal alloy layer.
4. as claimed in claim 3 with the cooling fin of Electromagnetic Interference function of shielding, it is characterised in that: the cooling fin is used
When flex circuit application, the metal layer is copper foil, and is that tensile strength is 250MPa or less and thickness is at 50 microns or less
Copper foil or tensile strength 400MPa or less and thickness in 70 microns of copper foils below.
5. as described in claim 1 with the cooling fin of Electromagnetic Interference function of shielding, it is characterised in that: the conductive adhesion
Layer is the adhesion coating containing metallic, and the metallic is at least one in aluminium powder, copper powder body and metal alloy powder
Kind.
6. as described in claim 1 with the cooling fin of Electromagnetic Interference function of shielding, it is characterised in that: the release film layer
It is single-sided parting film or two-sided release film.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510218219.3A CN106211702B (en) | 2015-04-30 | 2015-04-30 | Cooling fin with Electromagnetic Interference function of shielding |
| TW105205816U TWM526265U (en) | 2015-04-30 | 2016-04-25 | Heat sink with electromagnetic wave shielding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510218219.3A CN106211702B (en) | 2015-04-30 | 2015-04-30 | Cooling fin with Electromagnetic Interference function of shielding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106211702A CN106211702A (en) | 2016-12-07 |
| CN106211702B true CN106211702B (en) | 2019-04-02 |
Family
ID=56996975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510218219.3A Active CN106211702B (en) | 2015-04-30 | 2015-04-30 | Cooling fin with Electromagnetic Interference function of shielding |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106211702B (en) |
| TW (1) | TWM526265U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019200566A1 (en) * | 2018-04-18 | 2019-10-24 | 深圳市柔宇科技有限公司 | Flexible electronic device and manufacturing method thereof |
| CN110205046A (en) * | 2019-07-04 | 2019-09-06 | 东莞市古川胶带有限公司 | A kind of conduction one-faced tapes and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200412207A (en) * | 2002-12-26 | 2004-07-01 | Sumitomo Elec Printed Circuits | Flexible printed circuit substrate |
| CN102950835A (en) * | 2011-08-26 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Copper foil substrate for flexible printed circuit boards |
| CN103042762A (en) * | 2011-10-13 | 2013-04-17 | 昆山雅森电子材料科技有限公司 | High thermal conductive metal substrate |
| CN204733501U (en) * | 2015-04-30 | 2015-10-28 | 昆山雅森电子材料科技有限公司 | There is the fin of Electromagnetic Interference function of shielding |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202857219U (en) * | 2012-09-14 | 2013-04-03 | 昆山雅森电子材料科技有限公司 | Electromagnetic wave shielding structure and flexible printed circuit board possessing the structure |
| CN203210782U (en) * | 2013-04-26 | 2013-09-25 | 昆山明讯电子科技有限公司 | Heat conductive copper foil |
| CN203859981U (en) * | 2014-05-06 | 2014-10-01 | 昆山雅森电子材料科技有限公司 | Thin high-transmission electromagnetic interference shielding film and printed circuit board having same |
-
2015
- 2015-04-30 CN CN201510218219.3A patent/CN106211702B/en active Active
-
2016
- 2016-04-25 TW TW105205816U patent/TWM526265U/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200412207A (en) * | 2002-12-26 | 2004-07-01 | Sumitomo Elec Printed Circuits | Flexible printed circuit substrate |
| CN102950835A (en) * | 2011-08-26 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Copper foil substrate for flexible printed circuit boards |
| CN103042762A (en) * | 2011-10-13 | 2013-04-17 | 昆山雅森电子材料科技有限公司 | High thermal conductive metal substrate |
| CN204733501U (en) * | 2015-04-30 | 2015-10-28 | 昆山雅森电子材料科技有限公司 | There is the fin of Electromagnetic Interference function of shielding |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM526265U (en) | 2016-07-21 |
| CN106211702A (en) | 2016-12-07 |
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