CN106206614B - Flexible display panel and flexible display device - Google Patents
Flexible display panel and flexible display device Download PDFInfo
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- CN106206614B CN106206614B CN201610727014.2A CN201610727014A CN106206614B CN 106206614 B CN106206614 B CN 106206614B CN 201610727014 A CN201610727014 A CN 201610727014A CN 106206614 B CN106206614 B CN 106206614B
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- 239000000758 substrate Substances 0.000 claims abstract description 56
- 238000003825 pressing Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 48
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 6
- 230000000994 depressogenic effect Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical class [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
本发明提供了一种柔性显示面板和柔性显示装置，包括第一柔性基板，所述第一柔性基板的绑定区具有多个引线；所述引线包括中心引线区以及位于所述中心引线区周边的多个侧边引线区，其中，与所述引线延伸方向相同的两个所述侧边引线区在垂直于所述第一柔性基板的方向上的厚度大于所述中心引线区在垂直于所述第一柔性基板的方向上的厚度，因此，在绑定的过程中，与引线延伸方向相同的两个侧边引线区受压下沉，缓解了中心引线区的溢胶和凹陷变形，从而保证了引线与驱动芯片连接线的压合均匀性，提高了绑定连接性能。
The present invention provides a flexible display panel and a flexible display device, comprising a first flexible substrate, and a binding area of the first flexible substrate has a plurality of leads; the leads include a central lead area and a peripheral area of the center lead area. a plurality of side lead regions, wherein the thickness of the two side lead regions in the direction perpendicular to the first flexible substrate with the same extension direction of the leads is greater than that of the central lead region in a direction perpendicular to the first flexible substrate. Therefore, in the process of bonding, the two side lead areas in the same direction as the lead extension are pressed and sunk, which relieves the overflow and concave deformation of the central lead area. This ensures the uniformity of pressing between the leads and the connecting wires of the driving chip, and improves the bonding connection performance.
Description
Technical field
The present invention relates to flexible display device technical fields, more specifically to a kind of flexible display panels and flexibility
Display device.
Background technique
Prior art discloses a kind of flexible display panels, the flexible display panels include the flexible base board that is oppositely arranged and
Transparent flexible cover board is arranged in flexible base board towards the display function layer of one side surface of transparent flexible cover board and is arranged transparent
Flexible cover plate deviates from multiple touch control electrodes of one side surface of flexible base board, wherein display function layer includes cathode, anode and organic
Luminescent layer etc..
In the manufacturing process of above-mentioned flexible display panels, need to distinguish in the binding of flexible base board and transparent flexible cover board
It Bang Ding not driving chip.It is illustrated below by for touch-control driving chip is bound in the binding area of transparent flexible cover board, it is transparent
Touch control electrode on flexible cover plate is connected one to one by touch-control lead and the lead in binding area, and with reference to Fig. 1, Fig. 1 is above-mentioned
Transparent flexible cover board binds the schematic diagram of the section structure in area, and lead 11 is perpendicular to each on 10 direction of transparent flexible cover board
The strip lead that the thickness in region is equal.
It is the binding structural schematic diagram of transparent flexible cover board 10 and touch-control driving chip with reference to Fig. 2, Fig. 2, wherein transparent
During the binding area binding touch-control driving chip of flexible cover plate 10, PSA can be attached below transparent flexible cover board 10
(Polyethylene terephthalate gathers pair for (pressure sensitive adhesive, pressure sensitive adhesive) 12 and PET film
Ethylene terephthalate) 13 protect transparent flexible cover board 10.But since there is PSA glue 12 mobility, PET film 13 to have
It is flexible, therefore, it is easy to cause the intermediate region of lead 11 that depressed deformation occurs during binding, and then lead to lead 11
The binding switching performance for unevenly influencing touch-control driving chip is pressed with the connecting line 14 of touch-control driving chip.
Summary of the invention
In view of this, the present invention provides a kind of flexible display panels and flexible display apparatus, to solve in the prior art
Lead to the non-uniform problem of connection pressing of lead Yu touch-control driving chip since in binding depressed deformation occurs for lead.
To achieve the above object, the invention provides the following technical scheme:
The binding area of a kind of flexible display panels, including first flexible substrate, the first flexible substrate has multiple draw
Line；
The lead includes central tap area and multiple side lead district positioned at central tap area periphery,
In, two side lead district identical with the lead extending direction are in the direction perpendicular to the first flexible substrate
Thickness be greater than thickness of the central tap area in the direction perpendicular to the first flexible substrate.
A kind of flexible display apparatus, including flexible display panels as described above.
Compared with prior art, the technical scheme provided by the invention has the following advantages:
Flexible display panels provided by the present invention and flexible display apparatus, the lead packet in the binding area of first flexible substrate
Central tap area and multiple side lead district positioned at central tap area periphery are included, due to identical with lead extending direction two
Thickness of a side lead district on the direction perpendicular to first flexible substrate is greater than central tap area perpendicular to the first flexibility
Thickness on the direction of substrate, therefore, during binding, two side lead district identical with lead extending direction are pressurized
Sink, the excessive glue and depressed deformation in central tap area is alleviated, to ensure that the pressing of lead and driving chip connecting line is equal
Even property, improves binding switching performance.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the cross-section structure signal that transparent flexible cover board binds area in flexible display panels disclosed in the prior art
Figure；
Fig. 2 is the binding structural schematic diagram of transparent flexible cover board shown in FIG. 1 and touch-control driving chip；
Fig. 3 is the schematic diagram of the section structure of flexible display panels provided in an embodiment of the present invention；
Fig. 4 is the overlooking structure diagram of flexible base board shown in Fig. 3；
Fig. 5 is the overlooking structure diagram of transparent flexible substrate shown in Fig. 3；
Fig. 6 is the overlooking structure diagram of lead shown in Fig. 4；
Fig. 7 is the schematic diagram of the section structure of the lead shown in fig. 6 along AA ' cutting line；
Fig. 8 a is a kind of overlooking structure diagram of lead provided in an embodiment of the present invention；
Fig. 8 b is the schematic diagram of the section structure of the lead shown in Fig. 8 a along CC ' cutting line；
Fig. 9 a is the overlooking structure diagram of another lead provided in an embodiment of the present invention；
Fig. 9 b is the schematic diagram of the section structure of the lead shown in Fig. 9 a along CC ' line；
Fig. 9 c is the overlooking structure diagram of another lead provided in an embodiment of the present invention；
Fig. 9 d is the schematic diagram of the section structure of the lead shown in Fig. 9 c along CC ' line；
Figure 10 a is the overlooking structure diagram of another lead provided in an embodiment of the present invention；
Figure 10 b is the schematic diagram of the section structure of the lead shown in Figure 10 a along CC ' line；
Figure 10 c is the overlooking structure diagram of another lead provided in an embodiment of the present invention；
Figure 10 d is the schematic diagram of the section structure of the lead shown in Figure 10 c along CC ' line；
Figure 11 a is the schematic diagram of the section structure of another lead provided in an embodiment of the present invention；
Figure 11 b is the schematic diagram of the section structure of another lead provided in an embodiment of the present invention；
Figure 11 c is the schematic diagram of the section structure of another lead provided in an embodiment of the present invention；
Figure 11 d is the schematic diagram of the section structure of another lead provided in an embodiment of the present invention；
Figure 12 a is the overlooking structure diagram of another lead provided in an embodiment of the present invention；
Figure 12 b is the schematic diagram of the section structure of another lead provided in an embodiment of the present invention；
Figure 13 is the schematic diagram of the section structure of another lead provided in an embodiment of the present invention；
Figure 14 is the binding structural schematic diagram of flexible base board provided in an embodiment of the present invention and display driver chip.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the invention provides a kind of flexible display panels, and with reference to Fig. 3, Fig. 3 is provided in an embodiment of the present invention soft
The schematic diagram of the section structure of property display panel, which includes the flexible base board 20 and transparent flexible base being oppositely arranged
Plate 21, be arranged in flexible base board 20 towards 21 1 side surface of transparent flexible substrate display function layer 22, be arranged in transparent flexible
Substrate 21 deviates from multiple touch control electrodes 23 of 20 1 side surface of flexible base board.Certainly, 23 surface of touch control electrode can also have OCA
The film layer 24 etc. of (Optically Clear Adhesive, Optical transparent adhesive) production, details are not described herein.
With reference to Fig. 4, Fig. 4 is the overlooking structure diagram of flexible base board 20 shown in Fig. 3, the display function on flexible base board 20
Ergosphere 23 includes a plurality of grid line 230, multiple data lines 231 and is handed over by a plurality of grid line 230 and the insulation of multiple data lines 231
The multiple pixel units 232 limited are pitched, each pixel unit 232 is including thin film transistor (TFT) and is successively set on flexible base board
The anode and luminescent layer on 20 surfaces, certainly, the display function layer 23 further include the cathode for covering all pixels unit 232.Wherein,
The grid of thin film transistor (TFT) is connect with grid line 230, and the source electrode of thin film transistor (TFT) is connect with data line 231, thin film transistor (TFT)
Drain electrode is connect with anode.The thin film transistor (TFT) opens or closes under the action of the scanning signal that grid line 230 inputs, when this is thin
When film transistor is opened, the data drive signal in data line 231 is transmitted to anode by the source electrode and drain electrode of thin film transistor (TFT),
So that anode and cathode drives luminescent layer to shine jointly.
Wherein, 20 surface of flexible base board also has multiple data leads 233, each data lead 233 and a data line
231 connections.The binding area of the flexible base board 20 also has multiple leads 234, which is located at same with data lead 233
Layer, and the lead 234 connects one to one with data lead 233.The binding area binding of the flexible base board 20 has display driving core
Piece 235, the display driver chip 235 include multiple first pins, and each first pin and lead 234 correspond pressing and connect
It connects, to provide data drive signal to data line 231.
With reference to Fig. 5, Fig. 5 is the overlooking structure diagram of transparent flexible substrate 21 shown in Fig. 3, and multiple touch control electrodes 24 are in
Array arrangement, and each touch control electrode 24 is block type electrode, certainly, the present invention is not limited to this, in other embodiments
In, touch control electrode 24 can also be the electrode of other shapes.Also, also there are multiple touch-control leads on transparent flexible substrate 21
240, each touch control electrode 24 is electrically connected with a touch-control lead 240.The binding area of the transparent flexible substrate 21 also has more
A lead 241, each lead 241 are connect with a touch-control lead 240.Wherein, the binding area binding of transparent flexible substrate 21 has
Touch-control driving chip 242, the touch-control driving chip 242 include multiple second pins, and each second pin and lead 241 1 are a pair of
Connection should be pressed, to provide touching signals to touch control electrode 24, carries out the detection of position of touch.
In the present embodiment, flexible base board 20 can be first flexible substrate, and transparent flexible substrate 21 may be first soft
Property substrate, be based on this, multiple leads that the binding area of first flexible substrate has can be flexible base board 20 on lead 234,
Or the lead 241 on transparent flexible substrate 21.
Below to this by taking first flexible substrate is flexible base board 20, the lead in first flexible substrate is lead 234 as an example
The structure of lead is illustrated in invention.With reference to Fig. 6, Fig. 6 is the overlooking structure diagram of lead 234 shown in Fig. 4, the lead
234 be strip lead, i.e. the length L on X in a first direction of lead 2341Less than its length L on second direction Y2.Also,
The lead 234 includes central tap area a and multiple side lead district positioned at the central tap area periphery a.In the present embodiment only
It is illustrated so that the central tap area periphery a has 4 side lead district as an example, this four side lead district are respectively b1, b2, b3
And b4, wherein the extending direction of side lead district b1 and b2 are identical as the extending direction of lead 234, that is, second direction Y.Namely
It says, side lead district b1 and b2 are located at the left and right sides of central tap area a, and side lead district b3 and b4 are located at center
The two sides up and down of lead district a.
With reference to Fig. 7, Fig. 7 is the schematic diagram of the section structure of the lead 234 shown in fig. 6 along AA ' cutting line, wherein with lead
Thickness D of the identical two sides lead district b1 and b2 of 234 extending directions in the direction perpendicular to first flexible substrate 201Greatly
In thickness D of the central tap area a in the direction perpendicular to first flexible substrate 202.It should be noted that in the present embodiment
The thickness of side lead district b1 and side lead district b2 in the direction perpendicular to first flexible substrate 20 is equal, still, this hair
Bright to be not limited to that, in other embodiments, side lead district b1 and side lead district b2 are perpendicular to first flexible substrate
Thickness on 20 direction can also slightly have gap.
During making lead 234, it can be initially formed in the direction perpendicular to first flexible substrate 20, Ge Geyin
Then the structure sheaf that line area thickness is equal performs etching the corresponding structure sheaf of center lead district a to form shown in Fig. 7 draw
Cable architecture, certainly, the present invention is not limited to this.Below with reference to specific embodiment to the specific structure of lead 234 and
Manufacturing process is illustrated.
It in a specific embodiment, is a kind of lead 234 provided in an embodiment of the present invention with reference to Fig. 8 a and 8b, Fig. 8 a
Overlooking structure diagram, Fig. 8 b be Fig. 8 a shown in the schematic diagram of the section structure of the lead 234 along CC ' cutting line, central tap
Area a includes first structure floor 30, any one side in two sides lead district b1 and b2 identical with 234 extending direction of lead
Side lead district includes the second structure sheaf 31, i.e. side lead district b1 includes the second structure sheaf 31, and side lead district b2 also includes the
Two structure sheafs 31, wherein first structure layer 30 and the second structure sheaf 31 are all located at the surface of first flexible substrate 20, first structure
The projection no overlap of layer 30 and the second structure sheaf 31 in the direction perpendicular to first flexible substrate 20, also, the second structure sheaf
The 31 thickness D in the direction perpendicular to first flexible substrate 201Greater than first structure layer 30 perpendicular to first flexible substrate
Thickness D on 20 direction2。
In the specific embodiment, after 20 surface of first flexible substrate forms first structure layer 30, blocked using exposure mask
First structure layer 30 is formed in 30 two sides of first structure layer with a thickness of D1The second structure sheaf 31, not only can be to avoid mistake
Etching, and production process is relatively easy.It is that the present invention is real with reference to Fig. 9 a to Fig. 9 d, Fig. 9 a in another specific embodiment
The overlooking structure diagram of another lead 234 of example offer is applied, Fig. 9 b is section of the lead 234 shown in Fig. 9 a along CC ' line
Structural schematic diagram, Fig. 9 c are the overlooking structure diagram of another lead 234 provided in an embodiment of the present invention, and Fig. 9 d is Fig. 9 c institute
For the lead 234 shown along the schematic diagram of the section structure of CC ' line, central tap area a includes positioned at the of 20 surface of first flexible substrate
One structure sheaf 30, any one side lead district in two sides lead district b1 and b2 identical with 234 extending direction of lead
The surface for being located at first structure layer 30 including first structure layer 30 and the second structure sheaf 31, at least partly the second structure sheaf 31.It needs
It is noted that the first structure floor 30 of central tap area a and the first structure floor 30 of side lead district b1 and b2 are using same
The continuous same film layer of one process production.Wherein, the second structure sheaf 31 can be entirely located in the surface of first structure layer 30, such as
Shown in Fig. 9 a and Fig. 9 b；Alternatively, the second structure sheaf 31 can partially be located at the surface of first structure layer 30, other parts are located at the
The surface of one flexible base board 20, as shown in Fig. 9 c and Fig. 9 d.
In the specific embodiment, after first flexible substrate surface forms first structure layer 30, using exposure mask occlusion part
Divide first structure layer 30, side the lead district b1 and b2 in 30 two sides of first structure layer are formed with a thickness of D1-D2The second structure sheaf
31, compared with the structure shown in Fig. 8 b, the thickness of the second structure sheaf 31 in present embodiment is smaller, opposite can save production
Time and cost.
In still another embodiment, with reference to Figure 10 a to Figure 10 d, Figure 10 a is another kind provided in an embodiment of the present invention
The overlooking structure diagram of lead 234, Figure 10 b are the schematic diagram of the section structure of the lead 234 shown in Figure 10 a along CC ' line, figure
10c is the overlooking structure diagram of another lead 234 provided in an embodiment of the present invention, and Figure 10 d is lead shown in Figure 10 c
234 along CC ' line the schematic diagram of the section structure, central tap area a and two side lead district identical with 234 extending direction of lead
Any one side lead district in b1 and b2 all includes first structure layer 30 and the second structure sheaf 31, and first structure layer 30 is located at
The surface of first flexible substrate 20, the second structure sheaf 31 are located at the surface of first structure layer 30.Also, with lead extending direction phase
Second structure sheaf 31 of any one side lead district in two same sides lead district b1 and b2 is perpendicular to the first flexibility
Thickness D on the direction of substrate 203The second structure sheaf 31 greater than central tap area a is in the side perpendicular to first flexible substrate 20
Upward thickness D4。
In the specific embodiment, after first flexible substrate surface forms first structure layer 30, in first structure layer 30
Surface forms the second structure sheaf 31, then performs etching to the central tap area a of the second structure sheaf 31, to form central tap area
A thickness is less than the pin configuration of side lead district b1 and b2.Since the second structure sheaf 31 is conductive layer, and cover first structure layer
Therefore 30 whole surface can be mentioned with the contact area of relative increase lead 234 and binding chip pin so as to opposite
Height binding performance.
Wherein, in the structure shown in Fig. 8 a to Fig. 8 b and Fig. 9 a to Fig. 9 d, first structure layer 30 includes at least one layer
Conductive layer, the second structure sheaf 31 include at least one layer of conductive layer and/or at least one layer of insulating layer.It is this with reference to Figure 11 a, Figure 11 a
The schematic diagram of the section structure for another lead 234 that inventive embodiments provide, first structure layer 30 include 301 He of two conductive layers
302, optionally, conductive layer 301 is metal layer, and conductive layer 302 is ITO (Indium Tin Oxides, tin indium oxide) layer.Ginseng
Figure 11 b is examined, Figure 11 b is the schematic diagram of the section structure of another lead 234 provided in an embodiment of the present invention, the second structure sheaf 31 packet
Double-layer structure layer 310 and 311 is included, optionally, structure sheaf 310 is conductive layer, structure sheaf 311 is insulating layer, alternatively, structure sheaf
310 and 311 be all insulating layer, alternatively, structure sheaf 310 and 311 is all conductive layer.Wherein, the material of conductive layer can be metal
Or ITO etc., the material of insulating layer can be silicon nitride etc..Based on this, the second structure sheaf 31 can use a variety of different materials
It is made, so that the production of the second structure sheaf 31 is more simple, while can also be made of lower-cost material
Two structure sheafs 31 reduce the cost of manufacture of lead 234.
In the structure shown in Figure 10 a to Figure 10 d, first structure layer 30 includes at least one layer of conductive layer；Second structure sheaf
31 include at least one layer of conductive layer.With reference to Figure 11 c, Figure 11 c is the section knot of another lead 234 provided in an embodiment of the present invention
Structure schematic diagram, first structure layer 30 include two conductive layers 301 and 302, and with reference to Figure 11 d, Figure 11 d provides for the embodiment of the present invention
Another lead 234 the schematic diagram of the section structure, the second structure sheaf 31 include two conductive layers 310 and 311 optionally lead
Electric layer 301 is metal layer, and conductive layer 302 is ITO layer；Conductive layer 310 is metal layer, and conductive layer 311 is ITO layer.Although second
Structure sheaf 31 can only be made using conductive material, still, since the second structure sheaf 31 covers the entire of first structure layer 30
Therefore surface can improve binding performance with the contact area of relative increase lead 234 and binding chip pin.
On the basis of any of the above-described specific embodiment, the second structure sheaf 31 can be continuous structure sheaf, can also be with
For discontinuous structure sheaf.With reference to Figure 12 a, Figure 12 a is that the plan structure of another lead 234 provided in an embodiment of the present invention is shown
It is intended to, the second structure sheaf 31 has multiple hollowed out areas 312, that is to say, that the second structure sheaf 30 of side lead district is not by connecting
Continuous block structure composition.Alternatively, Figure 12 b is the section of another lead 234 provided in an embodiment of the present invention with reference to Figure 12 b
Structural schematic diagram, the second structure sheaf 31 have multiple grooves 313.Wherein, hollowed out area 312 and groove 313 are all to pass through etching
What the second structure sheaf 30 was formed.Above-mentioned non-enclosed hollowed out area 312 and groove 313 can be gathered in center to avoid conducting resinl
Lead district a is conducive to the discharge of lead 234 Yu binding chip pin contact surface conducting resinl.
On the basis of any of the above-described specific embodiment, the second structure sheaf 31 can be located at all sides of lead 134
Lead district, with reference to Figure 13, Figure 13 is the schematic diagram of the section structure of another lead 234 provided in an embodiment of the present invention, the second knot
Structure layer 31 can be located at lead 234 side lead district b1, b2, b3 and b4, to form closed region, be conducive to conducting resinl with
It lead 234 and is come into full contact with binding chip pin.
Below shown in Fig. 9 a and Fig. 9 b for 234 structure of lead, to flexible base board 20 and display driver chip 235
Binding structure is illustrated, and with reference to Figure 14, Figure 14 is flexible base board 20 provided in an embodiment of the present invention and display driver chip 235
Binding structural schematic diagram, the first pin 2350 on display driver chip 235 passes through on conducting resinl 210 and flexible base board 20
Lead 234 connects one to one, wherein the first pin 2350 can pass through the first structure layer 30 of conducting resinl 210 and lead 234
Connection, can also connect with the second structure sheaf 31 of lead 234.
Although the bottom of flexible base board 20 has PSA glue 211 and PET film 212, due to side lead district b1 and b2
Padded relative to central tap area a, therefore, during binding, i.e., display driver chip 235 is pressed to flexible base board 20
During, the second structure sheaf 31 of 30 surface two sides of first structure layer direction shown in arrow under by pressure first along Figure 14
It is heavy, the excessive glue and depressed deformation of central tap area a are alleviated, to ensure that the pressing of lead and driving chip connecting line is uniform
Property, improve binding switching performance.
The embodiment of the invention also provides a kind of flexible display apparatus, which includes any of the above-described embodiment
The flexible display panels of offer.
Flexible display panels and flexible display apparatus provided by the embodiment of the present invention, the binding area of first flexible substrate
Lead includes central tap area and multiple side lead district positioned at central tap area periphery, due to lead extending direction phase
With thickness of two side lead district on the direction perpendicular to first flexible substrate be greater than central tap area perpendicular to the
Thickness on the direction of one flexible base board, therefore, during binding, two side leads identical with lead extending direction
Area is pressurized, and the depressed deformation in central tap area is alleviated, to ensure that the pressing of lead and driving chip connecting line is equal
Even property, improves binding switching performance.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.To the upper of the disclosed embodiments
It states bright, enables those skilled in the art to implement or use the present invention.Various modifications to these embodiments are to ability
Will be apparent for the professional technician in domain, the general principles defined herein can not depart from it is of the invention
In the case where spirit or scope, realize in other embodiments.Therefore, the present invention be not intended to be limited to it is shown in this article these
Embodiment, and it is to fit to the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610727014.2A CN106206614B (en) | 2016-08-25 | 2016-08-25 | Flexible display panel and flexible display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610727014.2A CN106206614B (en) | 2016-08-25 | 2016-08-25 | Flexible display panel and flexible display device |
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| Publication Number | Publication Date |
|---|---|
| CN106206614A CN106206614A (en) | 2016-12-07 |
| CN106206614B true CN106206614B (en) | 2019-03-12 |
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| CN201610727014.2A Active CN106206614B (en) | 2016-08-25 | 2016-08-25 | Flexible display panel and flexible display device |
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| CN106952887B (en) * | 2017-03-27 | 2019-02-22 | 武汉华星光电技术有限公司 | Flexible display panels and its manufacturing method |
| CN107749239B (en) * | 2017-10-31 | 2020-08-25 | 武汉天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN109036155A (en) * | 2018-07-26 | 2018-12-18 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN109188790B (en) * | 2018-09-13 | 2022-04-15 | 京东方科技集团股份有限公司 | Substrate, manufacturing method thereof and display device |
| US11398505B2 (en) | 2019-06-27 | 2022-07-26 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate and manufacturing method thereof, display panel, and display device |
| CN111341826B (en) * | 2020-05-21 | 2020-08-25 | 京东方科技集团股份有限公司 | Display panels and display devices |
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