CN106206559A - Modular lighting device - Google Patents

Abstract

The invention relates to a modularized light-emitting device, which comprises a first substrate, a packaging module, a second substrate and a plurality of light-emitting modules. The packaging module is used for packaging at least one driving unit and at least one circuit element on the first substrate together and is connected with the second substrate so as to drive the light-emitting module on the second substrate through the electrical connection of the first substrate and the second substrate, or the packaging module is arranged on the first substrate, the light-emitting modules are arranged on a third substrate and are electrically connected with the first substrate and the third substrate through the second substrate so as to drive the light-emitting module on the third substrate. Therefore, the light-emitting device is respectively connected with different packaging modules according to the electrical specifications of the light-emitting modules, thereby improving the configuration freedom of the light-emitting device.

Description

Modular lighting fixtures

technical field

The present invention relates to a lighting device, in particular to a modular lighting device.

Background technique

Under the increasingly miniaturized and high-brightness requirements of various lamps and lanterns, on the one hand, it is desired to have higher brightness without enlarging the overall size. Therefore, light-emitting diode (LED) lamps are widely used. For example, from general indoor lamps to road lamps, light-emitting diodes (LEDs) are used as the main light-emitting components.

A conventional LED packaging structure generally includes a substrate, electrodes formed on the substrate, and an LED chip mounted on the substrate and electrically connected to the electrodes. Usually, the range of light emission angle of one light emitting diode chip is about 120°. Therefore, in order to achieve the effect of expanding the light emission angle of the light emitting device, a plurality of light emitting diode chips are usually arranged at a certain angle, so that each light emitting diode chip emits light at different angles. Form a larger lighting range.

However, driving LEDs from the commonly available 110 volt AC line current can be challenging. For example, unlike an incandescent lamp, the intensity of an LED may be proportional to the current passed through it, not the amount of voltage applied across it. Therefore, a circuit that converts the line voltage to a constant current may be required. It may also be necessary to modulate the circuit signal so that the output signal of the dimming controller can be used to drive the LED to emit light sources with different brightness.

Moreover, if the lamps use light-emitting diodes (LEDs), they must be equipped with a driving circuit so that the light-emitting diodes can be driven through the driving circuit. Such a structure will cause the volume of the lamps using light-emitting diodes (LEDs) to have a certain size and cannot be reduced to a certain size. The volume is small, and the volume is too large, which not only takes up space during transportation, but also increases the freight cost.

Based on the problems mentioned above, the present invention provides a modular lighting device, which reduces the volume of the driving integrated circuit by modularizing the driving integrated circuit and circuit elements, and is used to drive the light emitting diodes on the lighting device.

Contents of the invention

The main purpose of the present invention is to provide a modular lighting device, which provides a driver integrated circuit and circuit elements packaged together in a single package structure, so as to reduce the area occupied by the driver integrated circuit and circuit elements.

A secondary objective of the present invention is to provide a modular lighting device, which further utilizes a packaging structure to provide a functional IC to provide multifunctional control of the lighting device.

The present invention provides a modular lighting device, characterized in that it comprises:

A first substrate provided with a connecting circuit;

A package module, which is arranged on the first substrate, the package module includes a package body, at least one drive unit and at least one circuit element, and the package body encapsulates the drive unit and the circuit component on the first substrate On, the drive unit and the circuit element are electrically connected to the connection circuit of the first substrate;

a second substrate provided with a power circuit electrically connected to the connection circuit of the first substrate; and

A light emitting module is arranged on the second substrate and is electrically connected to the encapsulation module through the electrical connection between the connecting circuit and the power circuit, the light emitting module is provided with at least one light emitting diode, and the driving unit drives the In the light emitting module, the circuit element modulates a driving voltage and a driving current of the light emitting diode.

In the modular lighting device of the present invention, the connection circuit of the first substrate is electrically connected to the power circuit of the second substrate via at least one wire.

In the modularized lighting device of the present invention, the second substrate is provided with a plurality of connection pads, and the connection circuit of the first substrate is electrically connected to the connection pads.

The modular light-emitting device of the present invention further includes a third substrate, which is provided with a transmission circuit and connected to the first substrate and the second substrate, and the transmission circuit passes through the connection circuit, the first substrate, and the second substrate. The electrical connection of the power circuit of the second substrate is electrically connected to the package module and the light emitting module.

In the modularized lighting device of the present invention, the transmission circuit of the third substrate is electrically connected to the connection circuit of the first substrate and the power supply circuit of the second substrate via a plurality of wires.

In the modular light-emitting device of the present invention, the third substrate is provided with a plurality of connection pads, the transmission circuit is electrically connected to the connection pads, the connection circuit of the first substrate and the power circuit of the second substrate The connection pads are respectively electrically connected via a first connection unit and a second connection unit.

The present invention also provides a modular lighting device, which comprises:

a substrate, provided with a connecting circuit;

A package module, which is arranged on the substrate, the package module includes a package body, at least one drive unit and at least one circuit element, the package body encapsulates the drive unit and the circuit element on the substrate, the drive The unit is electrically connected to the connection unit with the circuit element; and

A light-emitting module is arranged on the substrate and is electrically connected to the packaging module through the connection circuit, the light-emitting module is provided with at least one light-emitting diode, the driving unit drives the light-emitting module, and the circuit element modulates the light-emitting diode A drive voltage and a drive current.

In the modularized light-emitting device of the present invention, the packaging module further includes:

A functional unit, which is packaged on the first substrate together with the driving unit and the circuit element through the package body, wherein the functional unit is a dimming integrated circuit, a linear driving integrated circuit, and an infrared control integrated circuit circuit, a wireless control integrated circuit or a photosensitive control integrated circuit.

In the modular lighting device of the present invention, the material of each substrate is selected from metal, ceramic or insulating material.

In the modular lighting device of the present invention, the circuit element is a transistor or a diode or a resistor or a capacitor.

In the modularized light-emitting device of the present invention, the packaging body is a packaging glue or a cover plate.

In the modularized light-emitting device of the present invention, the supporting power of the package module is 3 watts to 100 watts, and the package module is provided with a corresponding number of the driving unit and the circuit elements according to the supporting power.

The beneficial effects of implementing the present invention are: the modularized light-emitting device of the present invention encapsulates the circuit elements and the drive unit together with the packaging module to provide different electrical package groups that can match different electrical light-emitting modules, thereby improving the light emission. degrees of freedom in configuration of the device.

Description of drawings

FIG. 1A: It is a schematic circuit diagram of a preferred embodiment of the present invention;

FIG. 1B: It is a schematic structural diagram of a packaging module in a preferred embodiment of the present invention;

Fig. 1C: It is another structural schematic diagram of the packaging module of a preferred embodiment of the present invention;

Fig. 1D: It is a schematic structural diagram of a light-emitting module in a preferred embodiment of the present invention;

Figure 1E: It is a schematic structural view of a first substrate connected to a second substrate in a preferred embodiment of the present invention;

Fig. 2: it is the schematic circuit diagram of another preferred embodiment of the present invention;

FIG. 3A: It is a schematic circuit diagram of another preferred embodiment of the present invention;

FIG. 3B: It is a schematic diagram of another preferred embodiment of the present invention where the first substrate is electrically connected to the second substrate;

FIG. 4A: It is a schematic circuit diagram of another preferred embodiment of the present invention;

FIG. 4B: It is a schematic diagram of another preferred embodiment of the present invention where the first substrate is electrically connected to the second substrate;

FIG. 5A: It is a schematic circuit diagram of another preferred embodiment of the present invention;

FIG. 5B: It is a schematic diagram of another preferred embodiment of the present invention where the first substrate is electrically connected to the second substrate;

FIG. 6A: It is a schematic circuit diagram of another preferred embodiment of the present invention; and

FIG. 6B : It is a schematic diagram of another preferred embodiment of the present invention in which the packaging module is electrically connected to the light emitting module.

[Description of drawing number comparison]

1 lighting device

2 light emitting device

3 light emitting device

4 light emitting device

5 light emitting device

10 First Substrate

102 First connection line

104 Second connecting wire

12 packaged modules

122 packages

122A encapsulant

122B Cover

124 drive units

126 circuit components

128 functional units

14 Connecting the circuit

142 First connection unit

144 First connection unit

20 Second substrate

22 light emitting modules

222 module base

224 LEDs

226 encapsulant

24 power circuit

242 connection pad

244 Second connection unit

246 Second connection unit

26 transmission circuit

30 third substrate

32 transmission circuit

34 First connection pad

36 Second connection pad

detailed description

In order to make the structural features of the present invention and the achieved effects have a further understanding and recognition, preferred embodiments and detailed descriptions are specially used, which are described as follows:

Please refer to the first figure, which is a schematic circuit diagram of a preferred embodiment of the present invention. As shown in the figure, the modular lighting device 1 of the present invention includes a first substrate 10 and a second substrate 20 , the first substrate 10 is provided with a package module 12 , and the second substrate 20 is provided with a light emitting module 22 . The packaging module 12 of this embodiment includes a package body 122, a driving unit 124 and a circuit element 126, wherein the driving unit 124 is a bare-chip integrated circuit, and the circuit element 126 can be an active element or a passive element, such as a transistor , resistors, capacitors, etc.

The encapsulation module 12 encloses the drive unit 124 and the circuit element 126 on the first substrate 10 through the encapsulation body 122 , that is to say, the drive unit 124 and the circuit element 126 are encased and encapsulated on the first substrate 10 through the encapsulation body 122 . In the packaging module 12, only the pins of the packaging module 12 are electrically connected to the external circuit, so as to connect to other components through the lines on the first substrate 10; the light emitting module 22 is arranged on the second substrate 20, and the first substrate 10 is also disposed on the second substrate 20 to be electrically connected, so the driving unit 124 and the circuit element 126 are electrically connected to the light emitting module 22 through the electrical connection between the first substrate 10 and the second substrate 20 . In this embodiment, a connection circuit 14 is further provided on the first substrate 10, and a power circuit 24 is further provided on the second substrate 20. The first substrate 10 and the second substrate 20 pass through the connection circuit 14 and the power circuit 24 are electrically connected, so that the packaging module 12 can be electrically connected to the light emitting module 22 .

Generally speaking, the materials of the first substrate 10 and the second substrate 20 are selected from metal, ceramics or insulating materials. As shown in FIG. 1B, when the packaging body 122 is a packaging glue 122A, the packaging module 12 wraps and packages the driving unit 124 and the circuit element 126 with the packaging glue 122A, or as shown in FIG. 1C, when the packaging body 122 is a cover plate 122B, the packaging module 12 combines the first substrate 10 with the cover plate 122B to cover and package the driving unit 124 and the circuit element 126 . As shown in FIG. 1D , the light-emitting module 22 is a module substrate 222 with a plurality of light-emitting diodes 224 arranged on it, and these light-emitting diodes 224 are packaged through an encapsulant 226 , and the power supply circuit 24 distributes power to each light-emitting diode 224 in the light-emitting module 22 . As shown in FIG. 1E, the first substrate 10 is connected to the second substrate 20, wherein the connection circuit 14 is connected to the power circuit 24. The power circuit 24 of this embodiment has at least one connection pad 242 for the first The substrate 10 is electrically connected to the power circuit 24 via the first connection unit 142 of the connection circuit 14 .

In addition, the supporting power of the encapsulation module 12 is from 3 watts to 100 watts, and the encapsulation module 12 is provided with a corresponding number of drive units 124 and circuit elements 126 according to its support power, for example: the encapsulation module 12 supporting a power of 3-10 watts is the drive unit 124 One is packaged with the circuit element 126 respectively, and the package module 12 supporting a power of 10-20 watts is packaged with two drive units 124 and the circuit element 126 respectively.

Please refer to FIG. 2 , which is a schematic circuit diagram of another preferred embodiment of the present invention. The difference between FIG. 1A and FIG. 2 is that the packaging module 12 is further provided with a functional unit 128 . As shown in the figure, the light-emitting device 1 of the present invention is further equipped with a functional unit 128 to provide multi-functional control through the packaging module 12. The functional unit 128 is a dimming integrated circuit, a linear drive integrated circuit, an infrared control integrated circuit, a wireless Control integrated circuit or a photosensitive control integrated circuit, that is to say, the light emitting device 1 of the present invention can provide dimming control, linear control, infrared detection control, wireless remote control or photosensitive control through the functional unit 128 to control the light emitting module 22. On or off.

Please refer to FIG. 3A , which is a schematic circuit diagram of another embodiment of the present invention. As shown in the figure, the light-emitting device 2 of the present invention can further arrange the first substrate 10 and the second substrate 20 separately, therefore, the first substrate 10 and the second substrate 20 are electrically connected through at least one first connection line 102 . Wherein, the encapsulation module 12 is connected to the power circuit 24 via the connection circuit 14 , the first connection wire 102 and the transmission circuit 26 , and thus is electrically connected to the light emitting module 22 . Therefore, by means of this arrangement, a single first substrate 10 can be connected to a plurality of second substrates 20 via a plurality of first connecting wires 102, so as to be electrically connected to a plurality of light-emitting modules 22, because the number of light-emitting modules 22 will increase. For the load of the whole circuit, more drive units 124 and circuit elements 126 must be installed in the packaging module 12 to match the load of the circuit formed by the plurality of light emitting modules 22 .

As shown in FIG. 3B , the present invention can further arrange the first substrate 10 on the second substrate 20, and connect the connection circuit 14 and the power supply circuit 24 through a plurality of first connection lines 102, whereby the The packaging module 12 packaged with the functional unit 128 controls the light emitting state of the light emitting module 22 through the first connection wire 102 .

Please refer to FIG. 4A , which is a schematic circuit diagram of another embodiment of the present invention. As shown in the figure, in the light-emitting device 3 of the present invention, a third substrate 30 is further provided between the first substrate 10 and the second substrate 20, and a transmission circuit 32 is used to connect the first substrate 10 and the second substrate 20 They are electrically connected through the third substrate 30, so the difference between the third figure and the fourth figure is that the transmission circuit 22 in the third figure is disposed on the second substrate 20, and the transmission circuit 32 in the fourth figure is disposed on the third substrate 30, However, the second substrate 20 is not provided with a transmission circuit. Therefore, when the encapsulation module 12 on the first substrate 10 is not electrically matched with the light-emitting module 22 on the second substrate 20, only the first substrate 10 needs to be removed without changing other substrates, thereby until the replacement of the first substrate 20 is completed. The substrate 10 can match the light emitting module 22 of the second substrate 20 .

As shown in FIG. 4B, the third substrate 30 is provided with a first slot 34 and a second slot 36. The first substrate 10 is electrically connected to the transmission circuit 32 of the third substrate 30 via a first connection unit 142. The second substrate 20 is connected via the second connection unit 244 of the power circuit 24 , whereby the first substrate 10 and the second substrate 20 are electrically connected via the third substrate 30 .

Please refer to FIG. 5A , which is a schematic circuit diagram of another preferred embodiment of the present invention. As shown in the figure, the light-emitting device 4 of the present invention is separated from the first substrate 10, the second substrate 20 and the third substrate 30, so the first connecting line passes through the first substrate 10 and the third substrate 30. 102 are electrically connected, and the second substrate 20 and the third substrate 30 are electrically connected through the second connecting wire 104 . In this way, the encapsulation module 12 is electrically connected to the transmission circuit 32 through the connection circuit 14 and the first connection line 102, and the light emitting module 22 is electrically connected to the second connection line 104 through the power circuit 24, so the driving unit 124 of the encapsulation module 12 uses This drives the light-emitting module, and the electrical properties of the light-emitting diode 224 of the light-emitting module are modulated by the circuit element 125, such as driving voltage and driving current. As shown in FIG. 5B , since the first substrate 10 , the second substrate 20 and the third substrate 30 are separately arranged, the first connection circuit 144 and the second connection unit are respectively connected via the first connection line 102 and the second connection line 104 246, the transmission circuit 32 of the third substrate 30 is electrically connected to the connection circuit 14 of the first substrate 10 and the power supply circuit 24 of the second substrate 20 through the first connection pad 34 and the second connection pad 36, respectively, for the driving unit 124 drives the light-emitting module 22 through the aforementioned electrical connection, and modulates the electrical property of the light-emitting diode 224 through the circuit element 126 .

Please refer to FIG. 6A , which is a schematic circuit diagram of another preferred embodiment of the present invention. The difference between FIG. 5A and FIG. 6A is that the encapsulation module 12 and the light emitting module 22 in FIG. 5A are located on different substrates, while the encapsulation module 12 and the light emitting module 22 in FIG. Referring to FIG. 6B together, there is a connection circuit 14 between the packaging module 12 and the light emitting module 22, so the packaging module 12 is directly electrically connected to the light emitting module 22 through the connection circuit 14, and there is no need to provide additional connection pads for connecting multiple connections. line or connecting unit. Therefore more lightweight.

To sum up, the modularized light emitting device of the present invention uses the packaging module to package the circuit element and the driving unit together to provide a package group with different electrical properties to match the light emitting modules with different electrical properties.

The above is only a preferred embodiment of the present invention, and is not intended to limit the implementation scope of the present invention. All equivalent changes and modifications made in accordance with the shape, structure, characteristics and spirit described in the scope of the claims of the present invention shall be included in the scope of the claims of the present invention.

Claims (12)

1. a modularized light emitting device, it is characterised in that it comprises:

One first substrate, is provided with a connection circuit；

One package module, it is arranged on this first substrate, this package module comprises a packaging body, at least one driver element and at least one component, this driver element and this component cladding is packaged on this first substrate by this packaging body, and this driver element is electrically connected with this of this first substrate and is connected circuit with this component；

One second substrate, is provided with a power circuit, and this power circuit is electrically connected with this connection circuit of this first substrate；And

One light emitting module, it is arranged on this second substrate, and it is electrically connected to this package module through this this connection circuit and the electric connection of this power circuit, this light emitting module is provided with at least one light emitting diode, this light emitting module of this drive unit drives, a driving voltage of this component this light emitting diode of modulation and drives electric current.

2. modularized light emitting device as claimed in claim 1, it is characterised in that wherein this connection circuit of this first substrate is electrically connected to this power circuit of this second substrate via at least one wire.

3. modularized light emitting device as claimed in claim 1, it is characterised in that wherein this second substrate is provided with plural number connection gasket, and this connection circuit of this first substrate is electrically connected at those connection gaskets.

4. modularized light emitting device as claimed in claim 1, it is characterized in that, further include one the 3rd substrate, it is provided with a transmission circuit connecing and sets this first substrate and this second substrate, and this transmission circuit is electrically connected to this package module and this light emitting module through this connection circuit of this first substrate, the electric connection of this power circuit of this second substrate.

5. modularized light emitting device as claimed in claim 4, it is characterised in that wherein this transmission circuit of the 3rd substrate is electrically connected to this connection circuit of this first substrate and this power circuit of this second substrate through complex lead.

6. modularized light emitting device as claimed in claim 4, it is characterized in that, wherein the 3rd substrate is provided with plural number connection gasket, this transmission circuit is electrically connected with those connection gaskets, and this connection circuit of this first substrate and this power circuit of this second substrate are connected unit and one second through one first respectively and connect unit and be electrically connected at those connection gaskets.

7. a modularized light emitting device, it is characterised in that it comprises:

One substrate, is provided with a connection circuit；

One package module, it is arranged on this substrate, this package module comprises a packaging body, at least one driver element and at least one component, and this driver element is packaged on this substrate by this packaging body with this component cladding, and this driver element is electrically connected with this with this component and is connected unit；And

One light emitting module, being arranged on this substrate, and be electrically connected to this package module through this connection circuit, this light emitting module is provided with at least one light emitting diode, this light emitting module of this drive unit drives, a driving voltage of this component this light emitting diode of modulation and drives electric current.

8. the modularized light emitting device as described in claims 1 or 4 or 7, it is characterised in that wherein this package module further includes:

One functional unit, it is packaged on this first substrate through this packaging body coats in the lump with this driver element, this component, and wherein this functional unit is an adjusting light circuit, a Linear Driving integrated circuit, an infrared control integrated circuit, a controlled in wireless integrated circuit or a photosensitive control integrated circuit.

9. the modularized light emitting device as described in claims 1 or 4 or 7, it is characterised in that the material of each of which substrate is selected from metal, pottery or insulant.

10. the modularized light emitting device as described in claims 1 or 4 or 7, it is characterised in that wherein this component is transistor or diode or resistance or electric capacity.

The 11. modularized light emitting devices as described in claims 1 or 4 or 7, it is characterised in that wherein this packaging body is a packaging plastic or is a cover plate.

The 12. modularized light emitting devices as described in claims 1 or 4 or 7, it is characterised in that wherein the support power of this package module is 3 watts to 100 watts, this package module supports this driver element and this component of power setting respective amount according to it.