CN106200269A - Photosensitive resin composition and application thereof - Google Patents

Abstract

The invention provides a photosensitive resin composition and its application. The photosensitive resin composition is a photosensitive resin composition for a black matrix, and the invention also provides a color filter and a liquid crystal display component formed by using the black matrix. The above-mentioned photosensitive resin composition comprises alkali-soluble resin (A), compound (B) containing ethylenically unsaturated group, photoinitiator (C), solvent (D), black pigment (E), formula (a) Compound (F) and polyester modified silicone resin (G) shown. The photosensitive resin composition for black matrix of the present invention has the advantages of reducing film shrinkage and reducing roughness.

Description

Photosensitive resin composition and its application

technical field

The invention relates to a photosensitive resin composition for a black matrix, a color filter and a liquid crystal display component formed by using the black matrix. In particular, it relates to a photosensitive resin composition for a black matrix that reduces film shrinkage and roughness, and a color filter and a liquid crystal display component formed using the black matrix.

Background technique

In recent years, various liquid crystal display technologies have developed vigorously. In order to improve the contrast and display quality of current liquid crystal displays, black matrixes are generally placed in the stripes and dots of the color filters in the display. . The above-mentioned black matrix can prevent problems such as a decrease in contrast and a decrease in color purity caused by light leakage between pixels. In the past, the materials used in the black matrix are mainly evaporated films containing chromium or chromium oxide. However, when the above-mentioned evaporated films are used as the material of the black matrix, there are disadvantages such as complicated process and expensive materials. In order to solve this problem, a technique of forming a black matrix by using a photosensitive resin composition in a photolithographic manner has been previously proposed.

At present, the industry has increasing requirements for the light-shielding properties of the black matrix. One of the solutions is to increase the amount of black pigment used to improve the light-shielding properties of the black matrix. For example, Japanese Patent Laid-Open No. 2006-259716 discloses a photosensitive resin composition for a black matrix, which includes a high amount of black pigment, an alkali-soluble resin, a photopolymerization initiator, and a difunctional group reactive monomers and organic solvents. Among them, a reactive monomer having a difunctional group can improve the reaction between compounds to form a high-definition pattern. In this way, in the photosensitive resin composition, while increasing the light-shielding property by increasing the usage amount of the black pigment, the sensitivity of the photosensitive resin composition can be maintained.

In addition, Japanese Patent Laid-Open No. 2008-268854 discloses a photosensitive resin composition for a black matrix. The photosensitive resin composition comprises an alkali-soluble resin having a carboxylic acid group and an unsaturated group, a photopolymerizable monomer containing an ethylenically unsaturated group, a photopolymerization initiator and a high amount of black pigment. In this photosensitive resin composition for black matrices, resolution of the photosensitive resin composition of the high usage-amount black pigment is improved by using specific alkali-soluble resin.

Although in the prior art, the photosensitive resin composition that has increased the amount of black pigment used can increase the light-shielding properties, etc., but after the photosensitive resin composition of the above-mentioned previous proposals is baked, the black matrix produces serious film shrinkage, and Its roughness has not been accepted by the industry. In view of this, there is still a need to develop a photosensitive resin composition for a black matrix that can reduce film shrinkage and roughness.

Contents of the invention

The invention obtains the photosensitive resin composition for black matrix which can reduce film shrinkage and roughness by providing alkali-soluble resin and compound components.

Therefore, the present invention provides a kind of photosensitive resin composition, comprises:

Alkali-soluble resin (A); Compound (B) containing ethylenically unsaturated group; Photoinitiator (C); Solvent (D); Black pigment (E); Compound (F) represented by formula (a); And, polyester modified silicone resin (G);

Wherein, the alkali-soluble resin (A) includes a resin (A-1) with an unsaturated group, and the resin (A-1) with an unsaturated group is prepared by a polymerization reaction of a mixture, and the mixture contains An epoxy compound (i) having at least two epoxy groups, and a compound (ii) having at least one carboxylic acid group and at least one ethylenically unsaturated group;

In formula (a), R ^a , R ^b and R ^c each independently represent a trialkoxysilyl group combined with an alkylene group or an arylene group.

In the photosensitive resin composition provided by the present invention, preferably, the epoxy compound (i) having at least two epoxy groups used has a structure shown in the following formula (I):

Wherein, R ¹ , R ² , R ³ and R ⁴ each independently represent a hydrogen atom, a halogen atom, a C ₁ to C ₅ alkyl group, a C ₁ to C ₅ alkoxy group, a C ₆ to C ₁₂ aryl group or C ₆ to C ₁₂ aralkyl.

In the photosensitive resin composition provided by the present invention, preferably, the epoxy compound (i) having at least two epoxy groups has a structure shown in the following formula (II):

Wherein, R ⁵ to R ¹⁸ each independently represent a hydrogen atom, a halogen atom, a C ₁ to C ₈ alkyl group or a C ₆ to C ₁₅ aryl group; and, n represents an integer of 0 to 10.

In the photosensitive resin composition provided by the present invention, preferably, based on the amount of the alkali-soluble resin (A) being 100 parts by weight, the amount of the resin (A-1) having an unsaturated group is 30 to 100 parts by weight share.

In the photosensitive resin composition provided by the present invention, preferably, based on the amount of the alkali-soluble resin (A) being 100 parts by weight, the amount of the ethylenically unsaturated group-containing compound (B) is 10 to 100 parts by weight; The amount of photoinitiator (C) is 5 to 50 parts by weight; the amount of solvent (D) is 300 to 2700 parts by weight; the amount of black pigment (E) is 40 to 400 parts by weight; formula (a) The compound (F) is used in an amount of 1 to 15 parts by weight; the polyester modified silicone resin (G) is used in an amount of 3 to 30 parts by weight.

In the photosensitive resin composition provided by the present invention, preferably, the photosensitive resin composition further comprises an epoxy resin (H) having a fluorene skeleton represented by formula (b),

In formula (b), R ²¹ represents a cyano group, a C ₁ to C ₅ alkyl group or a halogen atom; R ²² represents a C ₁ to C ₁₃ alkylene group;

R ²³ represents a hydrogen atom or a methyl group; R ²⁴ represents a C ₁ to C ₅ alkyl group, a C ₆ to C ₁₂ aryl group or a C ₆ to C ₁₂ aralkyl group; p represents an integer from 0 to 4; q represents an integer of 1 to 10; and, r represents an integer of 0 to 4.

In the photosensitive resin composition provided by the present invention, preferably, based on the use amount of the alkali-soluble resin (A) being 100 parts by weight, the use of the epoxy resin (H) having a fluorene skeleton represented by formula (b) The amount is 4 to 35 parts by weight.

The present invention also provides a black matrix formed from the aforementioned photosensitive resin composition.

The present invention further provides a color filter comprising the aforementioned black matrix.

The present invention further provides a liquid crystal display component, which includes the aforementioned color filter.

detailed description

The invention provides a photosensitive resin composition, comprising:

Alkali-soluble resin (A);

Compound (B) containing an ethylenically unsaturated group;

Photoinitiator (C);

solvent (D);

black pigment (E);

compound (F) represented by formula (a); and

Polyester modified silicone resin (G);

Wherein, the alkali-soluble resin (A) includes a resin (A-1) with an unsaturated group, and the resin (A-1) with an unsaturated group is prepared by a polymerization reaction of a mixture, and the mixture contains An epoxy compound (i) having at least two epoxy groups, and a compound (ii) having at least one carboxylic acid group and at least one ethylenically unsaturated group;

In formula (a), R ^a , R ^b and R ^c each independently represent a trialkoxysilyl group combined with an alkylene group or an arylene group.

The epoxy compound (i) having at least two epoxy groups according to the present invention may have a structure represented by the following formula (I) or the following formula (II). Here, the statement that "the epoxy compound (i) may have the structure shown in the following formula (I) or the following formula (II)" also covers the compound having the structure shown in the following formula (I) and the compound having the following formula The compound of the structure shown by (II) exists at the same time as the epoxy compound (i). Specifically, the aforementioned epoxy compound (i) having at least two epoxy groups has, for example, the structure shown in the following formula (I):

in,

R ¹ , R ² , R ³ and R ⁴ each independently represent a hydrogen atom, a halogen atom, a C ₁ to C ₅ alkyl group, a C ₁ to C ₅ alkoxy group, a C ₆ to C ₁₂ aryl group or a C _{6 Aralkyl} to C12.

The epoxy compound (i) having at least two epoxy groups having the structure of formula (I) may include epoxy group-containing epoxy compound obtained by reacting bisphenol fluorene with epihalohydrin. Bisphenol fluorene type compounds, but not limited thereto.

Specific examples of the above-mentioned bisphenol fluorene-type compounds are: 9,9-bis(4-hydroxyphenyl)fluorene[9,9-bis(4-hydroxyphenyl)fluorene], 9,9-bis(4-hydroxy-3 -Methylphenyl)fluorene[9,9-bis(4-hydroxy-3-methylphenyl)fluorene], 9,9-bis(4-hydroxy-3-chlorophenyl)fluorene[9,9-bis(4 -hydroxy-3-chlorophenyl)fluorene], 9,9-bis(4-hydroxy-3-bromophenyl)fluorene[9,9-bis(4-hydroxy-3-bromophenyl)fluorene], 9,9-bis (4-hydroxy-3-fluorophenyl)fluorene[9,9-bis(4-hydroxy-3-fluorophenyl)fluorene], 9,9-bis(4-hydroxy-3-methoxyphenyl)fluorene[ 9,9-bis(4-hydroxy-3-methoxyphenyl)fluorene], 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene[9,9-bis(4-hydroxy-3 ,5-dimethylphenyl)fluorene], 9,9-bis(4-hydroxy-3,5-dichlorophenyl)fluorene[9,9-bis(4-hydroxy-3,5-dichlorophenyl)fluorene], 9, 9-bis(4-hydroxy-3,5-dibromophenyl)fluorene[9,9-bis(4-hydroxy-3,5-dibromophenyl)fluorene] and other compounds.

The above-mentioned epihalohydrin may include but not limited to 3-chloro-1,2-epoxypropylene (epichlorohydrin) or 3-bromo-1,2-epoxypropylene (epibromohydrin) and the like.

The above-mentioned epoxy-containing bisphenol fluorene compounds obtained by reacting bisphenol fluorene compounds with halogenated propylene oxide include but are not limited to: (1) Products manufactured by Nippon Steel Chemical Co., Ltd. : such as ESF-300, etc.; (2) Products manufactured by Osaka Gas Co., Ltd: such as EG-210, etc.; (3) Products manufactured by S.M.S Technology Co., Ltd: such as SMS-F9PhPG, SMS-F9CrG, SMS-F914PG, etc.

In another specific example of the present invention, the epoxy compound (i) having at least two epoxy groups has the structure shown in the following formula (II):

Wherein, R ⁵ to R ¹⁸ each independently represent a hydrogen atom, a halogen atom, a C ₁ to C ₈ alkyl group or a C ₆ to C ₁₅ aryl group; and, n represents an integer of 0 to 10.

The epoxy compound (i) having at least two epoxy groups with the structure of formula (II) is, for example, made by making the compound with the structure of the following formula (II-1) and halogenated propylene oxide in the presence of an alkali metal hydroxide react to get:

In formula (II-1), the definitions of R ⁵ to R ¹⁸ and n are the same as the definitions of R ⁵ to R ¹⁸ and n in formula (II), and will not be repeated here.

Moreover, the epoxy compound (i) having at least two epoxy groups having a structure of formula (II) is, for example, carried out using a compound having a structure of the following formula (II-2) and phenols (phenols) in the presence of an acid catalyst After the condensation reaction, a compound having the structure of formula (II-1) is formed. Then, carry out dehydrohalogenation reaction (dehydrohalogenation) by adding excessive halogenated propylene oxide, and obtain the epoxy compound (i) having at least two epoxy groups shown in the structure of formula (II):

In the above formula (II-2), R ¹⁹ and R ²⁰ are the same or different hydrogen atoms, halogen atoms, C ₁ to C ₈ alkyl groups or C ₆ to C ₁₅ aryl groups; X ¹ and X ² Respectively the same or different halogen atoms, C ₁ to C ₆ alkyl groups or C ₁ to C ₆ alkoxy groups. Preferably, the above-mentioned halogen atom may be, for example, chlorine or bromine, the above-mentioned alkyl group may be, for example, methyl, ethyl or tert-butyl, and the above-mentioned alkoxy group may be, for example, methoxy or ethoxy.

Specific examples of the above-mentioned phenols include: phenol, cresol, ethylphenol, n-propylphenol, isobutylphenol, t-butylphenol butylphenol), octylphenol, nonylphenol, xylenol, methylbutylphenol, di-t-butylphenol, vinylphenol , propenylphenol, ethinylphenol, cyclopentylphenol, cyclohexylphenol, or cyclohexylcresol. The above-mentioned phenols can generally be used alone or in combination.

Based on the amount of the compound having the structure of formula (II-2) being 1 mole, the amount of phenols used is 0.5 moles to 20 moles, preferably 2 moles to 15 moles.

Specific examples of the acid catalyst include hydrochloric acid, sulfuric acid, p-toluenesulfonic acid, oxalic acid, boron trifluoride, aluminum chlorideanhydrous, Zinc chloride, etc., among which p-toluenesulfonic acid, sulfuric acid or hydrochloric acid is preferred. The above-mentioned acid catalysts can be used alone or in combination.

In addition, although the usage amount of the above-mentioned acid catalyst is not particularly limited, based on the usage amount of the above-mentioned compound having the structure of formula (II-2) being 100 weight percent (wt%), the usage amount of the acid catalyst is preferably 0.1 wt% to 30 wt%.

The above condensation reaction can be performed without a solvent or in the presence of an organic solvent. Next, specific examples of the above-mentioned organic solvent include toluene, xylene, methyl isobutyl ketone, and the like. The above-mentioned organic solvents can be used alone or in combination.

Based on 100wt% of the total weight of the compound having the structure of formula (II-2) and phenols, the amount of the organic solvent is 50wt% to 300wt%, preferably 100wt% to 250wt%. In addition, the operation temperature of the above condensation reaction is 40° C. to 180° C., and the operation time of the condensation reaction is 1 hour to 8 hours.

After the above-mentioned condensation reaction is completed, neutralization treatment or water washing treatment may be performed. The above neutralization treatment is to adjust the pH value of the reacted solution to pH=3 to pH=7, among which pH=5 to pH=7 is preferred. The above-mentioned water washing treatment can be carried out using a neutralizing agent, and the neutralizing agent is an alkaline substance, and its specific examples include: alkali metal hydroxides such as sodium hydroxide (sodium hydroxide) and potassium hydroxide (potassium hydroxide); Calcium hydroxide, magnesium hydroxide and other alkaline earth metal hydroxides; diethylene triamine, triethylenetetramine, aniline, phenylenediamine diamine) and other organic amines; and ammonia (ammonia), sodium dihydrogen phosphate (sodium dihydrogenphosphate), etc. The above-mentioned water washing treatment can be carried out by existing methods, for example, adding an aqueous solution containing a neutralizing agent to the reacted solution, and then repeatedly extracting. After neutralization or water washing, heat treatment under reduced pressure, unreacted phenols and solvents are distilled off, and concentrated to obtain the compound with the structure of formula (II-1).

Specific examples of the above-mentioned halogenated propylene oxide include: 3-chloro-1,2-epoxypropane (3-chloro-1,2-epoxypropane), 3-bromo-1,2-epoxypropane (3 -bromo-1,2-epoxypropane) or any combination of the above. Before carrying out the above-mentioned dehydrohalogenation reaction, alkali metal hydroxides such as sodium hydroxide and potassium hydroxide may be added in advance or during the reaction. The operating temperature of the above dehydrohalogenation reaction is 20° C. to 120° C., and the operating time ranges from 1 hour to 10 hours.

In one embodiment, the aqueous solution of the alkali metal hydroxide added in the above dehydrohalogenation reaction can also be used. In this example, while continuously adding the above-mentioned alkali metal hydroxide aqueous solution to the dehydrohalogenation reaction system, water and halogenated propylene oxide can be continuously distilled out under reduced pressure or normal pressure, thereby separating and removing water. , and at the same time, the halogenated propylene oxide can be continuously refluxed into the reaction system.

Before the above-mentioned dehydrohalogenation reaction is carried out, it is also possible to add tetramethyl ammonium chloride (tetramethyl ammonium chloride), tetramethyl ammonium bromide (tetramethyl ammonium bromide), trimethyl benzyl ammonium chloride (trimethyl benzylammonium chloride), etc. Ammonium salt as a catalyst, and react at 50°C to 150°C for 1 hour to 5 hours, then add alkali metal hydroxide or its aqueous solution, and react at 20°C to 120°C for 1 hour to 10 hours , for the dehydrohalogenation reaction.

Based on the total equivalent of hydroxyl groups in the compound having the structure of formula (II-1) being 1 equivalent, the amount of the above-mentioned halogenated propylene oxide can be 1 equivalent to 20 equivalents, preferably 2 equivalents to 10 equivalents. Based on the total equivalent of the hydroxyl groups in the above-mentioned compound having the structure of formula (II-1) being 1 equivalent, the usage amount of the alkali metal hydroxide added in the above-mentioned dehydrohalogenation reaction can be 0.8 equivalent to 15 equivalents, wherein 0.9 equivalent to 11 equivalent is better.

In addition, in order to make the above-mentioned dehydrohalogenation reaction proceed smoothly, in addition to alcohols such as methanol and ethanol, aprotic (aprotic) substances such as dimethyl sulfone and dimethyl sulfoxide can also be added. polar solvents, etc. to carry out the reaction. In the case of using alcohols, based on 100 wt% of the above-mentioned halogenated propylene oxide, the usage amount of alcohols may be 2wt% to 20wt%, preferably 4wt% to 15wt%. In the example of using the aprotic polar solvent, based on the usage amount of the halogenated propylene oxide is 100wt%, the usage amount of the aprotic polar solvent can be 5wt% to 100wt%, wherein, the usage amount is 10wt% to 90wt%. % better.

After the dehydrohalogenation reaction is completed, a water washing treatment may be optionally performed. Afterwards, the halogenated propylene oxide, alcohols, and aprotic polar solvents are removed by heating and reducing pressure. The above-mentioned heating and depressurization is performed, for example, in an environment where the temperature is 110° C. to 250° C. and the pressure is 1.3 kPa (10 mmHg) or less.

In order to prevent the formed epoxy resin from containing hydrolytic halogen, the solution after the dehydrohalogenation reaction can be added to solvents such as toluene, methyl isobutyl ketone (methyl isobutyl ketone), and alkalis such as sodium hydroxide and potassium hydroxide can be added. Aqueous metal hydroxide solution, dehydrohalogenation reaction again. In the dehydrohalogenation reaction, based on the total equivalent of hydroxyl groups in the compound having the structure of formula (II-1) as 1 equivalent, the amount of alkali metal hydroxide used is 0.01 mole to 0.3 mole, wherein, 0.05 mole to 0.2 mole Moore is better. In addition, the operating temperature of the above-mentioned dehydrohalogenation reaction is 50° C. to 120° C., and the operating time is 0.5 hours to 2 hours.

After the dehydrohalogenation reaction is completed, the salts are removed through steps such as filtration and water washing. In addition, solvents such as toluene and methyl isobutyl ketone can also be distilled off by heating and depressurizing to obtain epoxy compounds (i) having at least two epoxy groups as shown in formula (II) ). The epoxy compound (i) having at least two epoxy groups of the above-mentioned formula (II) may include but not limited to such Japanese chemical medicines (Nippon Products manufactured by Kayaku Co.Ltd.).

The compound (ii) according to the present invention having at least one carboxylic acid group and at least one ethylenically unsaturated group is, for example, selected from the group consisting of the following (1) to (3): (1) acrylic acid, methacrylic acid, 2-methacryloyloxyethylbutanedioic acid, 2-methacryloyloxyethylbutanedioic acid, 2-methacryloyloxyethylbutanedioic acid, 2-methacryloyloxyethylbutanedioic acid Acyloxybutyl adipic acid, 2-methacryloyloxyethyl hexahydrophthalic acid, 2-methacryloyloxyethylmaleic acid, 2-methacryloyloxypropylmaleic acid, 2-Methacryloyloxybutyl maleic acid, 2-methacryloyloxypropyl succinic acid, 2-methacryloyloxypropyl adipic acid, 2-methacryloyloxypropyl tetrahydro phthalic acid, 2-methacryloxypropylphthalic acid, 2-methacryloyloxybutylphthalic acid, or 2-methacryloyloxybutylhydrophthalic acid; (2) composed of Compounds obtained by reacting hydroxyl (meth)acrylates with dicarboxylic acid compounds, wherein dicarboxylic acid compounds include but not limited to adipic acid, succinic acid, maleic acid, and phthalic acid; (3) A half-ester compound obtained by reacting a hydroxyl-containing (meth)acrylate with a carboxylic anhydride compound (iii), wherein the hydroxyl-containing (meth)acrylate includes but is not limited to 2-hydroxyethyl acrylate [(2- hydroxyethyl)acrylate], 2-hydroxyethyl methacrylate [(2-hydroxyethyl)methacrylate], 2-hydroxypropyl acrylate [(2-hydroxypropyl)acrylate], 2-hydroxypropyl methacrylate [( 2-hydroxypropyl)methacrylate], 4-hydroxybutyl acrylate [(4-hydroxybutyl)acrylate], 4-hydroxybutyl methacrylate [(4-hydroxybutyl)methacrylate], or pentaerythritol trimethacrylate, etc. In addition, the carboxylic anhydride compound described here may be the same as the carboxylic anhydride compound (iii) contained in the mixture of the resin (A-1) having an unsaturated group, so it will not be described again.

The mixture of the unsaturated resin (A-1) according to the present invention may further optionally include a carboxylic anhydride compound (iii) and/or an epoxy-containing compound (iv). The above-mentioned carboxylic acid anhydride compound (iii) may be selected from the group consisting of the following (1) to (2): (1) butanedioic anhydride, maleic anhydride, itaconic anhydride anhydride), phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride Hydrophthalic anhydride, methylendo-methylene tetrahydrophthalic anhydride, chlorendic anhydride, glutaric anhydride, or trimetolic anhydride (1,3 -dioxoisobenzofuran-5-carboxylic anhydride) and other dibasic carboxylic acid anhydride compounds; and other tetravalent carboxylic acid anhydride compounds.

The above epoxy group-containing compound (iv) is, for example, selected from glycidyl methacrylate, 3,4-epoxycyclohexyl methacrylate, unsaturated group-containing glycidyl ether compounds, epoxy group-containing A group consisting of unsaturated compounds or any combination of the above. The aforementioned glycidyl ether compounds containing unsaturated groups include but are not limited to trade names Denacol EX-111, EX-121 Denacol, Denacol EX-141, Denacol EX-145, Denacol EX-146, Denacol EX-171, Denacol EX-192 and other compounds (the above are products of Nagase Chemical Industry Co., Ltd.).

In a specific example of the present invention, the aforesaid resin (A-1) with unsaturated groups can be composed of epoxy compound (i) with at least two epoxy groups of formula (I) and epoxy compound (i) with at least one carboxylic acid group and at least A compound (ii) with an ethylenically unsaturated group undergoes a polymerization reaction to form a reaction product containing a hydroxyl group, followed by adding a carboxylic acid anhydride compound (iii) for reaction. Based on the total hydroxyl equivalent of the above-mentioned hydroxyl-containing reaction product being 1 equivalent, the equivalent of the acid anhydride group contained in the carboxylic acid anhydride compound (iii) is preferably 0.4 to 1 equivalent, more preferably 0.75 to 1 equivalent. When a plurality of carboxylic anhydride compounds (iii) are used, they may be added sequentially or simultaneously during the reaction. When using a dibasic carboxylic anhydride compound and a tetrabasic carboxylic anhydride compound as the carboxylic anhydride compound (iii), the molar ratio of the dibasic carboxylic anhydride compound and the tetrabasic carboxylic anhydride compound is preferably 1/99 to 90/10, more preferably 5/95 to 80/20. In addition, the operating temperature of the above reaction is, for example, in the range of 50°C to 130°C.

In another specific example of the present invention, the aforesaid resin (A-1) with unsaturated groups can be composed of epoxy compound (i) with at least two epoxy groups of formula (II) and at least one carboxylic acid group and At least one ethylenically unsaturated compound (ii) is reacted to form a hydroxyl-containing reaction product, and then, by adding carboxylic anhydride compound (iii) and/or epoxy-containing compound (iv) for polymerization reaction. have to. The total equivalent weight of epoxy groups on the epoxy compound (i) with at least two epoxy groups based on formula (II) is 1 equivalent, and the above-mentioned compound (ii) with at least one carboxylic acid group and at least one ethylenically unsaturated group ) has an acid value equivalent of preferably 0.8 to 1.5 equivalents, more preferably 0.9 to 1.1 equivalents. Based on the hydroxyl group usage of the above-mentioned hydroxyl group-containing reaction product being 100 mole percent (mol %), the usage amount of the carboxylic anhydride compound (iii) is preferably 10 mole % to 100 mole %, more preferably 20 mole % to 100 mole % , preferably 30 mol% to 100 mol%.

When preparing the above-mentioned resin (A-1) having an unsaturated group, in order to accelerate the reaction, a basic compound is usually added to the reaction solution as a reaction catalyst. The above-mentioned reaction catalysts can be used alone or in combination, and the above-mentioned reaction catalysts include but are not limited to: triphenyl phosphine (triphenyl phosphine), triphenyl antimony (triphenyl stibine), triethylamine (triethylamine), triethanolamine (triethanolamine), chlorine Tetramethylammonium chloride, benzyltriethylammonium chloride, etc. Based on the total weight of 100 parts by weight of the above-mentioned epoxy compound (i) having at least two epoxy groups and the compound (ii) having at least one carboxylic acid group and at least one ethylenically unsaturated group, the usage amount of the reaction catalyst is relatively Preferably it is 0.01 to 10 parts by weight, more preferably 0.3 to 5 parts by weight.

In addition, in order to control the degree of polymerization, a polymerization inhibitor (polymerization inhibitor) is usually added to the reaction solution. The above-mentioned polymerization inhibitors may include, but are not limited to: methoxyphenol (methoxyphenol), methylhydroquinone (methylhydroquinone), hydroquinone (hydroquinone), 2,6-di-tert-butyl-p-cresol (2,6-di- t-butyl-p-cresol) or phenothiazine (phenothiazine), etc. In general, the above-mentioned polymerization inhibitors can be used alone or in combination. Based on the total weight of the above-mentioned epoxy compound (i) having at least two epoxy groups and the compound (ii) having at least one carboxylic acid group and at least one ethylenically unsaturated group being 100 parts by weight, the amount of polymerization inhibitor used Preferably it is 0.01 to 10 parts by weight, more preferably 0.1 to 5 parts by weight.

When preparing the resin (A-1) having an unsaturated group, a polymerization reaction solvent may be used as necessary. As a specific example of the above-mentioned polymerization reaction solvent, for example, alcohol compounds such as ethanol, propanol, isopropanol, butanol, isobutanol, 2-butanol, hexanol or ethylene glycol; methyl ethyl ketone or cyclohexanone ketones such as toluene or xylene; aromatic hydrocarbons such as toluene or xylene; cellosolve such as cellosolve or butyl cellosolve; carbitol or butyl carbit Carbital compounds such as butyl carbitol; propylene glycol alkyl ether compounds such as propylene glycol monomethyl ether; polypropylene glycol alkyl ethers such as di(propylene glycol) methyl ether] (propylene glycol)alkyl ether] compounds; acetate compounds such as ethyl acetate, butyl acetate, ethylene glycol monoethyl ether acetate or propylene glycol methyl ether acetate; Alkyl lactate compounds such as ethyl lactate or butyl lactate; or dialkyl glycol ethers. The above-mentioned polymerization reaction solvents can generally be used alone or in combination. In addition, the acid value of the resin (A-1) having an unsaturated group is preferably from 50 mgKOH/g to 200 mgKOH/g, more preferably from 60 mgKOH/g to 150 mgKOH/g.

Based on 100 parts by weight of the alkali-soluble resin (A), the amount of the resin (A-1) with unsaturated groups is preferably 30 parts by weight to 100 parts by weight, more preferably 50 parts by weight to 100 parts by weight Parts, preferably 70 to 100 parts by weight. If no unsaturated group-containing resin (A-1) is used at all, the resulting photosensitive resin composition will have severe film shrinkage.

The alkali-soluble resin (A) according to the present invention may optionally include other alkali-soluble resins (A-2). Other alkali-soluble resins (A-2) include, but are not limited to, resins containing carboxylic acid groups or hydroxyl groups, specifically, acrylic resins other than resins (A-1) having unsaturated groups, urethane (urethane) Resin and novolak type (novolac) resin, etc.

Based on 100 parts by weight of the alkali-soluble resin (A), the usage-amount of other alkali-soluble resins (A-2) is preferably 0 parts by weight to 70 parts by weight, more preferably 0 parts by weight to 50 parts by weight, especially Preferably, it is 0 to 30 parts by weight.

The photosensitive resin composition according to the present invention includes an ethylenically unsaturated group-containing compound (B).

The ethylenically unsaturated group-containing compound (B) according to the present invention may be selected from compounds having one ethylenically unsaturated group or compounds having two or more (including 2) ethylenically unsaturated groups.

The aforementioned compounds with one ethylenically unsaturated group may include, but are not limited to (meth)acrylamide (meth)acrylamide, (meth)acryloylmorpholine, (meth)acrylic acid-7-amino- 3,7-Dimethyloctyl, Isobutoxymethyl (meth)acrylamide, Isobornyloxyethyl (meth)acrylate, Isobornyl (meth)acrylate, (Meth)acrylate- 2-ethylhexyl ester, ethyl diethylene glycol (meth)acrylate, tert-octyl (meth)acrylamide, diacetone (meth)acrylamide, dimethylaminoethyl (meth)acrylate ester, lauryl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, dicyclopentenyl (meth)acrylate, nitrogen, nitrogen-dimethyl(meth)propylene Amide, tetrachlorophenyl(meth)acrylate, 2-tetrachlorophenoxyethyl(meth)acrylate, tetrahydrofurfuryl(meth)acrylate], (meth)acrylic acid Tetrabromophenyl ester, 2-tetrabromophenoxyethyl (meth)acrylate, 2-trichlorophenoxyethyl (meth)acrylate, tribromophenyl (meth)acrylate, (methyl) ) 2-tribromophenoxyethyl acrylate, 2-hydroxy-(meth)ethyl acrylate, 2-hydroxy-(meth)propyl acrylate, vinyl caprolactam, nitrogen-vinylpyrrolidone, (methyl ) phenoxyethyl acrylate, pentachlorophenyl (meth)acrylate, pentabromophenyl (meth)acrylate, polyethylene mono(meth)acrylate, polypropylene mono(meth)acrylate, Bornyl (meth)acrylate, etc. The aforementioned compound (B-1) having one ethylenically unsaturated group can generally be used alone or in combination.

The aforementioned compounds having more than 2 (including 2) ethylenically unsaturated groups include, but are not limited to, ethylene glycol di(meth)acrylate, dicyclopentenyl di(meth)acrylate, triethylene glycol di(meth)acrylate, (meth)acrylate, tetraethylene glycol di(meth)acrylate, tris(2-hydroxyethyl)isocyanate di(meth)acrylate, tris(2-hydroxyethyl)isocyanate tris (Meth)acrylate, caprolactone-modified tris(2-hydroxyethyl)isocyanate tri(meth)acrylate, trimethylolpropyl tri(meth)acrylate, ethylene oxide ( Trimethylolpropyl tri(meth)acrylate modified by EO for short, trimethylolpropyl trimethylolacrylate modified by propylene oxide (PO for short), tripropylene glycol di(meth)acrylic acid ester, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, pentaerythritol tri(meth)acrylate Acrylates, pentaerythritol tetra(meth)acrylate, polyester di(meth)acrylate, polyethylene glycol di(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate ) acrylate, dipentaerythritol tetra(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, caprolactone-modified dipentaerythritol penta(meth)acrylate, tetra(methyl) ) di(trimethylolpropane)tetra(meth)acrylate], bisphenol A di(meth)acrylate modified with ethylene oxide, bisphenol A modified with propylene oxide Di(meth)acrylate, hydrogenated bisphenol A di(meth)acrylate modified with ethylene oxide, hydrogenated bisphenol A di(meth)acrylate modified with propylene oxide, Propane-modified glycerin tri(meth)acrylate, ethylene oxide-modified bisphenol F di(meth)acrylate, novolac polyglycidyl ether (meth)acrylate, etc. The aforementioned compounds (B) having two or more (including two) ethylenically unsaturated groups can generally be used alone or in combination.

Specific examples of the aforementioned ethylenically unsaturated group-containing compound (B) include: trimethylolpropyl triacrylate, trimethylolpropyl triacrylate modified with ethylene oxide, epoxy-modified trimethylolpropyl Propane modified trimethylolpropyl triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, dipentaerythritol pentaacrylate, dipentaerythritol tetraacrylate, caprolactone modified dipentaerythritol hexaacrylate Acrylate, ditrimethylolpropyl tetraacrylate, glycerin triacrylate modified with propylene oxide, or any combination of the above.

Based on the aforementioned alkali-soluble resin (A) used in an amount of 100 parts by weight, the used amount of the ethylenically unsaturated group-containing compound (B) is preferably 10 parts by weight to 100 parts by weight, more preferably 15 parts by weight to 85 parts by weight. Parts by weight, preferably 20 to 70 parts by weight.

The photoinitiator (C) according to the present invention is not particularly limited, and it may include but not limited to: O-acyl oxime compounds, triazine benzene compounds, acetophenone compounds, diimidazole compounds, di Benzophenone compounds, α-diketone compounds, ketone alcohol compounds, ketone alcohol ether compounds, acylphosphine oxide compounds, quinone compounds, halogen-containing compounds, peroxides, etc.

Specific examples of the above-mentioned O-acyl oxime compounds are: 1-[4-(phenylthio)phenyl]-heptane-1,2-dione 2-(O-benzoyl oxime), 1-[4 -(phenylthio)phenyl]-octane-1,2-dione 2-(O-benzoyl oxime), 1-[4-(benzoyl)phenyl]-heptane-1,2- Diketone 2-(O-benzoyl oxime), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-substituent]-ethanone 1-(O -acetyl oxime), 1-[9-ethyl-6-(3-methylbenzoyl)-9H-carbazole-3-substituent]-ethanone 1-(O-acetyl oxime), 1 -[9-Ethyl-6-benzoyl-9H-carbazole-3-substituent]-ethanone 1-(O-acetyl oxime), ethanone-1-[9-ethyl-6- (2-Methyl-4-tetrahydrofurylbenzoyl)-9H-carbazole-3-substituent]-1-(O-acetyl oxime), Ethanone-1-[9-ethyl-6-( 2-Methyl-5-tetrahydropyranylbenzoyl)-9H-carbazole-3-substituent]-1-(O-acetyl oxime), Ethanone-1-[9-Ethyl-6 -(2-Methyl-5-tetrahydrofurylbenzoyl)-9H-carbazole-3-substituent]-1-(O-acetyl oxime), Ethanone-1-[9-ethyl-6- (2-Methyl-4-tetrahydrofurylmethoxybenzoyl)-9H-carbazole-3-substituent]-1-(O-acetyl oxime), Ethanone-1-[9-Ethyl- 6-(2-methyl-4-tetrahydropyranylmethoxybenzoyl)-9H-carbazole-3-substituent]-1-(O-acetyl oxime), ethyl ketone-1-[ 9-ethyl-6-(2-methyl-5-tetrahydrofurylmethoxybenzoyl)-9H-carbazole-3-substituent]-1-(O-acetyl oxime), ethyl ketone-1 -[9-Ethyl-6-(2-methyl-5-tetrahydropyranylmethoxybenzoyl)-9H-carbazole-3-substituent]-1-(O-acetyl oxime), Ethanone-1-[9-ethyl-6-{2-methyl-4-(2,2-dimethyl-1,3-dioxolanyl)benzoyl}-9H-carbazole -3-Substituent]-1-(O-acetyl oxime), Ethanone-1-[9-ethyl-6-{2-methyl-4-(2,2-dimethyl-1, 3-dioxolanyl)methoxybenzoyl}-9H-carbazole-3-substituent]-1-(O-acetyloxime) and the like.

The above-mentioned O-acyl oxime compound is preferably 1-[4-(phenylthio)phenyl]-octane-1,2-dione 2-(O-benzoyl oxime) (such as Ciba Specialty Chemical Co., Ltd. OXE 01), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-substituent]-ethanone 1-( O-acetyl oxime) (such as OXE 02 manufactured by Ciba Specialty Chemical Co., Ltd.), Ethanone-1-[9-ethyl-6-(2-methyl-4-tetrahydrofuranmethoxybenzoyl) -9H-carbazole-3-substituent]-1-(O-acetyl oxime), ethyl ketone-1-[9-ethyl-6-{2-methyl-4-(2,2-di Methyl-1,3-dioxolanyl)methoxybenzoyl}-9H-carbazole-3-substituent]-1-(O-acetyloxime) and the like. The above-mentioned O-acyl oxime compounds can be used alone or in combination, depending on actual needs.

The above-mentioned triazine compounds may include, but are not limited to, vinyl-halomethyl-s-triazine compounds, 2-(naphtho-1-substituent)-4,6-bis-halomethyl -s-triazepine compound and 4-(p-aminophenyl)-2,6-di-halomethyl-s-triazepine compound, etc.

The specific example of the above-mentioned vinyl-halomethyl-s-triazine compound is: 2,4-bis(trichloromethyl)-6-p-methoxystyryl-s-triazine , 2,4-bis(trichloromethyl)-3-(1-p-dimethylaminophenyl-1,3-butadienyl)-s-triazepine, 2-trichloromethane Base-3-amino-6-p-methoxystyryl-s-triazine, etc.

The specific example of the above-mentioned 2-(naphtho-1-substituent)-4,6-bis-halomethyl-s-triazine compound is: 2-(naphtho-1-substituent)-4, 6-bis-trichloromethyl-s-triazepine, 2-(4-methoxy-naphtho-1-substituent)-4,6-bis-trichloromethyl-s-triazepine Benzene, 2-(4-ethoxy-naphtho-1-substituent)-4,6-bis-trichloromethyl-s-triazepine, 2-(4-butoxy-naphtho- 1-substituent)-4,6-bis-trichloromethyl-s-triazine, 2-[4-(2-methoxyethyl)-naphtho-1-substituent]-4, 6-bis-trichloromethyl-s-triazine, 2-[4-(2-ethoxyethyl)-naphtho-1-substituent]-4,6-bis-trichloromethyl -s-triazepine, 2-[4-(2-butoxyethyl)-naphtho-1-substituent]-4,6-bis-trichloromethyl-s-triazepine, 2-(2-methoxy-naphtho-1-substituent)-4,6-bis-trichloromethyl-s-triazabenzene, 2-(6-methoxy-5-methyl- Naphtho-2-substituent)-4,6-bis-trichloromethyl-s-triazine, 2-(6-methoxy-naphtho-2-substituent)-4,6-bis -Trichloromethyl-s-triazepine, 2-(5-methoxy-naphtho-1-substituent)-4,6-bis-trichloromethyl-s-triazepine, 2 -(4,7-dimethoxy-naphtho-1-substituent)-4,6-bis-trichloromethyl-s-triazine, 2-(6-ethoxy-naphtho- 2-substituent)-4,6-bis-trichloromethyl-s-triazine, 2-(4,5-dimethoxy-naphtho-1-substituent)-4,6-bis -trichloromethyl-s-triazine, etc.

A specific example of the above-mentioned 4-(p-aminophenyl)-2,6-bis-halomethyl-s-triazepine compound is: 4-[p-N,N-bis(ethoxycarbonyl Methyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[o-methyl-p-N,N-bis(ethoxycarbonylmethyl) )aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[p-N,N-bis(chloroethyl)aminophenyl]-2,6 -Bis(trichloromethyl)-s-triazine, 4-[o-methyl-p-N,N-bis(chloroethyl)aminophenyl]-2,6-bis(trichloro Methyl)-s-triazepine, 4-(p-N-chloroethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazepine, 4-(p -N-ethoxycarbonylmethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazepine, 4-[p-N,N-bis(phenyl)amino Phenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-(p-N-chloroethylcarbonylaminophenyl)-2,6-bis(trichloromethyl )-s-triazepine, 4-[p-N-(p-methoxyphenyl)carbonylaminophenyl]-2,6-bis(trichloromethyl)-s-triazepine , 4-[m-N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[m-bromo -P-N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazepine, 4-[m-chloro-p- N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[m-fluoro-p-N,N -bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[o-bromo-p-N,N-bis( Ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazepine, 4-[o-chloro-p-N,N-bis(ethoxy Carbonylmethyl)aminophenyl-2,6-bis(trichloromethyl)-s-triazabenzene, 4-[o-fluoro-p-N,N-bis(ethoxycarbonylmethyl) Aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[o-bromo-p-N,N-bis(chloroethyl)aminophenyl]- 2,6-bis(trichloromethyl)-s-triazepine, 4-[o-chloro-p-N,N-bis(chloroethyl)aminophenyl]-2,6-bis( Trichloromethyl)-s-triazine, 4-[o-fluoro-p-N,N-bis(chloroethyl)aminophenyl]-2,6-bis(trichloromethyl)- s-Triazapine, 4-[m-bromo-p-N,N-bis(chloroethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazepine , 4-[m-chloro-p-N,N-bis(chloroethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[m- Fluoro-p-N,N-bis(chloroethyl)aminophenyl]-2,6-bis(trichloromethyl)-s- Triazine, 4-(m-bromo-p-N-ethoxycarbonylmethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-( m-chloro-p-N-ethoxycarbonylmethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazepine, 4-(m-fluoro-p-N- Ethoxycarbonylmethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazepine, 4-(o-bromo-p-N-ethoxycarbonylmethylamino Phenyl)-2,6-bis(trichloromethyl)-s-triazepine, 4-(o-chloro-p-N-ethoxycarbonylmethylaminophenyl)-2,6- Bis(trichloromethyl)-s-triazine, 4-(o-fluoro-p-N-ethoxycarbonylmethylaminophenyl)-2,6-bis(trichloromethyl)- s-triazepine, 4-(m-bromo-p-N-chloroethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazepine, 4-(m -Chloro-p-N-chloroethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-(m-fluoro-p-N-chloroethylamine phenyl)-2,6-bis(trichloromethyl)-s-triazepine, 4-(o-bromo-p-N-chloroethylaminophenyl)-2,6-bis( Trichloromethyl)-s-triazepine, 4-(o-chloro-p-N-chloroethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazepine Benzene, 4-(o-fluoro-p-N-chloroethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethane base)-6-[3-bromo-4-[N,N-bis(ethoxycarbonylmethyl)amino]phenyl]-1,3,5-triazepine, etc.

The above-mentioned triazine series compound is preferably 4-[m-bromo-p-N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)- s-triazepine, 2,4-bis(trichloromethyl)-6-p-methoxystyryl-s-triazepine, etc. The above-mentioned triazine-based compounds can be used alone or in combination, depending on actual needs.

Specific examples of the above-mentioned acetophenone compounds are: p-dimethylaminoacetophenone, α,α'-dimethoxy azoacetophenone oxide, 2,2'-dimethyl-2-benzene Acetophenone, p-methoxyacetophenone, 2-methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone (trade name IRGACURE 907; vapor Ba Jing Chemical Co., Ltd.), 2-benzyl-2-N,N-dimethylamine-1-(4-morpholinophenyl)-1-butanone, etc. The above-mentioned acetophenone compounds are 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-1-propanone, 2-benzyl-2-N,N-di Methylamine-1-(4-morpholinophenyl)-1-butanone and the like are preferred. The above-mentioned acetophenone compounds can be used alone or in combination, depending on actual needs.

Specific examples of the above-mentioned diimidazole compounds are: 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(o-chlorophenyl) Phenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(o-methylphenyl)-4,4',5,5'-tetraphenyldiimidazole , 2,2'-bis(o-methoxyphenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(o-ethylphenyl)-4, 4',5,5'-tetraphenyldiimidazole, 2,2'-bis(p-methoxyphenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2' -Bis(2,2',4,4'-tetramethoxyphenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(2-chlorophenyl) -4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyldiimidazole, etc. . The aforementioned diimidazole compound is preferably 2,2'-bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyldiimidazole. The above-mentioned diimidazole compounds can be used alone or in combination, depending on actual needs.

Specific examples of the above-mentioned benzophenone compounds are: thioxanthone, 2,4-diethylthioxanthone, thioxanthone-4-sulfone, benzophenone, 4,4'-bis(dimethylamine ) benzophenone, 4,4'-bis(diethylamine) benzophenone, etc. The above-mentioned benzophenone compound is preferably 4,4'-bis(diethylamine)benzophenone. The above-mentioned benzophenone compounds can be used alone or in combination, depending on actual needs.

Specific examples of the aforementioned α-diketone compounds include benzil, acetyl and the like. Examples of the above-mentioned ketone-alcohol compounds include benzylethanolone. Examples of the above-mentioned ketone alcohol ether compound include benzoethanol ketone methyl ether, benzobethanol ketone ethyl ether, benzobethanol ketone isopropyl ether, and the like. The above-mentioned acylphosphine oxide compounds include: 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis-(2,6-dimethoxybenzoyl)-2,4,4-tri Methylphenylphosphine oxide, etc. Examples of the above-mentioned quinone compound include anthraquinone, 1,4-naphthoquinone, and the like. Examples of the above-mentioned halogen-containing compounds include phenacyl chloride, tribromomethylphenyl sulfone, tris(trichloromethyl)-s-triazepine, and the like. As said peroxide, di-t-butyl peroxide etc. are mentioned. The above-mentioned α-diketone compounds, ketone alcohol compounds, ketone alcohol ether compounds, acylphosphine oxide compounds, quinone compounds, halogen-containing compounds, peroxides, etc. can be used alone or in combination, depending on actual needs depends.

The usage amount of the photoinitiator (C) according to the present invention can be formulated as needed, based on 100 parts by weight of the alkali-soluble resin (A), the usage amount of the photoinitiator (C) is preferably 5 parts by weight to 50 parts by weight Parts, more preferably 7 parts by weight to 40 parts by weight, especially preferably 9 parts by weight to 30 parts by weight.

The solvent (D) according to the present invention is preferably a soluble alkali-soluble resin (A), a compound (F) represented by formula (a), a polyester modified silicone resin (G) and a photoinitiator (C), It does not interact with the above ingredients and has appropriate volatility.

Specific examples of the above-mentioned solvent (D) are: ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethyl Glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, tripropylene glycol mono Alkyl glycol monoalkyl ether compounds such as methyl ether or tripropylene glycol monoethyl ether; alkyl glycol monoalkanes such as ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate or propylene glycol methyl ether acetate or propylene glycol ethyl ether acetate Ether acetate compounds; other ether compounds such as diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether or tetrahydrofuran; methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone or diacetone alcohol and other ketone compounds; lactate alkyl ester compounds such as methyl lactate or ethyl lactate; 2-hydroxy-2-methyl propionate, 2-hydroxy-2-methyl propionate, 3 - Methyl methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl ethoxyacetate, ethyl hydroxyacetate , 2-Hydroxy-3-methylbutyrate methyl ester, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl propionate, ethyl acetate, acetic acid n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl acetate, isoamyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate ester, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, n-propyl pyruvate, methyl acetoacetate, ethyl acetoacetate or ethyl 2-oxybutyrate and other ester compounds; toluene or Aromatic hydrocarbon compounds such as xylene; carboxylic acid amine compounds such as N-methylpyrrolidone, N,N-dimethylformamide or N,N-dimethylacetamide; or any combination of the above. The above-mentioned solvents (D) can generally be used alone or in combination.

Based on 100 parts by weight of the above-mentioned alkali-soluble resin (A), the usage amount of the solvent (D) is preferably 300 parts by weight to 2700 parts by weight, more preferably 400 parts by weight to 2400 parts by weight, and especially preferably 500 parts by weight Parts to 2000 parts by weight.

The black pigment (E) suitable for the present invention is preferably a black pigment having heat resistance, optical resistance and solvent resistance.

Specific examples of the above-mentioned black pigment (E) are: black organic pigments such as perylene black, cyanine black, and aniline black; red, blue, green, purple, Yellow, cyanine (cyanine), magenta (magenta) and other pigments, choose two or more kinds of pigments to mix and mix similar black color organic pigments; carbon black (carbon black), chromium oxide, iron oxide, Light-shielding materials such as titanium black (titanium black), graphite, etc., wherein, the above-mentioned carbon black can include but not limited to C.I.pigment black 7 etc., can enumerate such as Mitsubishi Chemical (Mitsubishi Chemical Co.). MA230, MA8, #970, #1000, #2350, #2650). The above-mentioned black pigments (E) can generally be used alone or in combination.

Based on 100 parts by weight of the above-mentioned alkali-soluble resin (A), the usage amount of the black pigment (E) is preferably 40 parts by weight to 400 parts by weight, more preferably 50 parts by weight to 300 parts by weight, especially 60 parts by weight. Parts by weight to 200 parts by weight.

The photosensitive resin composition for black matrix according to the present invention comprises the compound (F) represented by formula (a);

In the formula (a), R ^a , R ^b and R ^c each independently represent a trialkoxysilyl group combined with an alkylene group or an arylene group.

Wherein the alkylene or arylene group may have a substituent, and the substituent may be an amino group, a hydroxyl group, an alkoxy group or a halogen atom.

Specific examples of the alkylene group according to the present invention are carbon such as methylene, ethylene, propylene, butylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, etc. An alkylene group having 1 to 10 atoms. Specific examples of the arylene group according to the present invention are phenylene or naphthylene.

Specific examples of the compound (F) represented by the formula (a) according to the present invention are compounds represented by the following formulas (a-1) to (a-9):

Among the compounds (F) represented by the above formula (a), formulas (a-1), (a-4), (a-7) and (a-9) are preferable.

Based on 100 parts by weight of the above-mentioned alkali-soluble resin (A), the usage amount of the compound (F) represented by the formula (a) is preferably 1 to 15 parts by weight, more preferably 1 to 13 parts by weight Part by weight, preferably 1 to 10 parts by weight.

When the compound (F) represented by the formula (a) is not used at all, severe film shrinkage occurs. Although not wishing to be limited by theory, it is believed that the compound (F) represented by the formula (a) cross-links with the composition of the black photoresist to reduce film shrinkage.

The synthesis method of the polyester modified silicone resin (G) of the present invention, for example, in the presence of polyester resin, carries out hydrolysis condensation reaction with organosilicon compounds such as chlorosilane and alkoxysilane, and then passes polyester resin and organic It is obtained by dehydration and dealcoholization condensation reaction between silicone resin and metal catalysts such as titanium.

Due to the poor compatibility between the silicon atom combined with a large number of methyl groups and the polyester resin, if it is prepared by the condensation reaction of the polyester resin and the silicone resin in the presence of the silicone resin, the reaction is not easy to carry out, and it is not easy to obtain transparency. solution. Therefore, in the presence of the polyester resin, if the polyester-modified silicone resin is to be obtained, it is preferably prepared by hydrolysis and condensation.

In this production method, the polyester resin used has at least two hydroxyl groups in one molecule. Polyester resins are usually prepared by the esterification reaction of saturated polyacids and polyols. The saturated polyacids used in this reaction, such as: isophthalic acid, terephthalic acid, phthalic anhydride, tetrahydrophthalic acid Formic anhydride, adipic acid and trimellitic anhydride, etc., the above-mentioned saturated polyacids can be used alone or in combination; in addition, the polyols are ethylene glycol, diethylene glycol, propylene glycol, glycerin, neopentyl glycol, trimethylol Ethane, trimethylolpropane, etc., and the above-mentioned polyhydric alcohols can be used alone or in combination.

In addition, based on the aforementioned silicon atoms combined with a large number of methyl groups, the compatibility with polyester resins is poor. Compounds of polyester resins that react easily with silicone resins.

Among them, specific examples of alkoxysilanes used in the hydrolysis condensation reaction of the polyester resin and silicone resin are methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltrimethoxysilane, and phenyltrimethoxysilane. Ethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane and diphenyldimethoxy, etc.

Therefore, use polyester resin and silicone resin to react in the reaction that obtains polyester modified silicone resin, commonly used silicone resin is the denaturation silicone resin that has functional groups such as hydrocarbon group, alkoxy group, and the equivalent of this functional group is 100 to 1000 is better. Specific examples of the silicone resin for denaturation: Commercial items such as trade names TSR-160, TSR-165 (manufactured by Toshiba Silicone Co., Ltd.), KR-211, and KR-212 (manufactured by Shin-Etsu Chemical Co., Ltd.).

Preferred specific examples of the polyester-modified silicone resin (G): trade names XR-32-A5775, XR-32-A1612 (manufactured by Toshiba Silicone Co., Ltd.), KR-5221, KR-5235 (Shin-Etsu Chemical Co., Ltd. Manufactured) and other commercial items; more preferably, KR-5235 manufactured by Shin-Etsu Chemical Co., Ltd.

Based on 100 parts by weight of the above-mentioned alkali-soluble resin (A), the usage amount of the polyester modified silicone resin (G) is preferably 3 parts by weight to 30 parts by weight, more preferably 4 parts by weight to 25 parts by weight , preferably 5 to 20 parts by weight.

When the polyester-modified silicone resin (G) is not used at all, there will be poor roughness and severe film shrinkage.

In a preferred embodiment of the present invention, the photosensitive resin composition further includes an epoxy resin (H) having a fluorene skeleton represented by formula (b), wherein:

In formula (b),

R ²¹ represents cyano, C ₁ to C ₅ alkyl or halogen atom;

R ²² represents C ₁ to C ₁₃ alkylene;

R ²³ represents a hydrogen atom or a methyl group;

R ²⁴ represents C ₁ to C ₅ alkyl, C ₆ to C ₁₂ aryl or C ₆ to C ₁₂ aralkyl;

p represents an integer from 0 to 4;

q represents an integer from 1 to 10; and

r represents an integer of 0 to 4.

The synthetic method of the epoxy resin (H) with fluorene skeleton shown in formula (b), for example, in the presence of alkali metal hydroxide, with epihalohydrin (epihalohydrin), such as epichlorohydrin (epichlorohydrin), alcohol or Phenol, obtained by reacting with fluorene skeleton.

A specific example of the epoxy resin (H) having a fluorene skeleton represented by formula (b) is 9,9-bis[4-(2-glycidyloxyethoxy)phenyl]fluorene (9,9-bis[ 4-(2-glycidyloxyethoxy)phenyl]fluorene), 9,9-bis(glycidyloxyphenyl(poly)alkoxyphenyl) compound (9,9-bis(glycidyloxyphenyl(poly)alkoxyphenyl), 9, 9-bis[4-(2-glycidyloxyethoxy)-3-methylphenyl)fluorene (9,9-bis[4-(2-glycidyloxyethoxy)-3-methylphenyl]fluorene), 9, 9-bis[4-(2-glycidyloxyethoxy)-3,5-dimethylphenyl]fluorene (9,9-bis[4-(2-glycidyloxyethoxy)-3,5-dimethylphenyl] fluorene), 9,9-bis (alkyl-glycidyloxyphenyl (poly) alkoxyphenyl) fluorene compound (9,9-bis (alkyl-glycidyloxyphenyl (poly) alkoxyphenyl) fluorene), 9,9 -bis[4-(2-glycidyloxyethoxy)-3-phenylphenyl]fluorene (9,9-bis[4-(2-glycidyloxyethoxy)-3-phenylphenyl]fluorene), 9,9 - Bis(aryl-glycidyloxyphenyl(poly)alkoxyphenyl)fluorene compound (9,9-bis(aryl-glycidyloxyphenyl(poly)alkoxyphenyl)fluorene) and the like.

Specific examples of the epoxy resin (H) having a fluorene skeleton represented by the formula (b) are EG-200, EG-250, and PG-100 manufactured by Osaka Gas Chemical Co., Ltd.

Based on 100 parts by weight of the above-mentioned alkali-soluble resin (A), the usage amount of the epoxy resin (H) having a fluorene skeleton represented by formula (b) is preferably 4 parts by weight to 35 parts by weight, more preferably 5 parts by weight. Parts by weight to 30 parts by weight, preferably 6 parts by weight to 25 parts by weight.

When the epoxy resin (H) which has a fluorene skeleton represented by formula (b) is used, roughness can be further improved.

On the premise of not affecting the effect of the present invention, the photosensitive resin composition of the present invention may optionally further add an additive (I). Additives (I) include but are not limited to: surfactants, fillers, adhesion promoters, bridging agents, antioxidants, anti-coagulation agents, or other polymers that can improve various properties (such as mechanical properties).

The above-mentioned surfactant can be selected from cationic, anionic, non-ionic, amphoteric, polysiloxane, fluorosurfactant or the group formed by any combination of the above. The above-mentioned surfactants may include, but are not limited to: polyethoxyalkyl ethers such as polyethoxylauryl ether, polyethoxystearyl ether or polyethoxyl oleyl ether; polyethoxyoctyl Polyethoxyalkylphenyl ethers such as polyethoxylated phenyl ether or polyethoxynonylphenyl ether; polyethylene glycol diesters such as polyethylene glycol dilaurate or polyethylene glycol distearate sorbitan fatty acid esters; fatty acid modified polyesters; and tertiary amine modified polyurethanes. The above-mentioned surfactants may be used alone or in combination.

Specific examples of the surfactant include: KP (manufactured by Shin-Etsu Chemical Co., Ltd.), SF-8427 (Toray Dow Corning Silicone Co., Ltd. ), Polyflow (manufactured by Kyoeisha Oil Chemical Co., Ltd.), F-Top (manufactured by Tochem Product Co., Ltd.), Megafac (manufactured by Dainippon Ink Chemical Industry (manufactured by Dainippon Ink and Chemicals (DIC) Co., Ltd.), Fluorade (manufactured by Sumitomo 3M, Ltd.), AsahiGuard (manufactured by Asahi Glass Co., Ltd.), Surflon (manufactured by Asahi Glass Co., Ltd.) (manufactured by Sino-Japan Chemical Co., Ltd.) or SINOPOL E8008 (manufactured by Sino-Japan Chemical Co., Ltd.), etc.

As a filler, glass, aluminum, etc. are mentioned, but it is not limited to this.

Specific examples of the adhesion promoter are: vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3 -Aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-epoxy Propyloxypropanoltrimethoxysilane, 3-Glycidylpropylmethyldiethoxysilane, 2-(3,4-Epoxycyclohexyl)ethyltrimethoxysilane, 3-Chloropropylmethylsilane Dimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methylpropionyloxypropyltrimethoxysilane or 3-mercaptopropyltrimethoxysilane, etc.

Specific examples of antioxidants include 2,2-thiobis(4-methyl-6-tert-butylphenol), 2,6-di-tert-butylphenol, and the like.

Specific examples of the anti-coagulation agent include sodium polyacrylate and the like.

Specific examples of the bridging agent are epoxy compounds or resins such as 1031S and 157S-70 manufactured by Nippon Epoxy Resin Co., Ltd.

Based on the use amount of the above-mentioned alkali-soluble resin (A) being 100 parts by weight, the use amount range of the filler, adhesion promoter, antioxidant, anti-agglomeration agent or polymer other than the alkali-soluble resin (A) in the additive (I) It is preferably at most 10 parts by weight, more preferably at most 6 parts by weight.

Based on 100 parts by weight of the alkali-soluble resin (A), the amount of the surfactant in the additive (I) is preferably not more than 6 parts by weight, more preferably not more than 4 parts by weight.

Based on the amount of the alkali-soluble resin (A) being 100 parts by weight, the amount of the bridging agent in the additive (I) is preferably less than 100 parts by weight, more preferably less than 80 parts by weight.

The photosensitive resin composition example of the present invention is by the above-mentioned alkali-soluble resin (A), the compound (B) containing ethylenically unsaturated group, photoinitiator (C), solvent (D), black pigment (E) . The compound (F) represented by the formula (a) and the polyester denatured silicone resin (G) are placed in a stirrer and stirred to make them uniformly mixed into a solution state. If necessary, additives (I) such as epoxy resin (H), surfactant, filler, adhesion promoter, bridging agent, antioxidant, anti-agglomeration agent, etc., shown in formula (b) can be added therein , after uniform mixing, a photosensitive resin composition in a solution state can be obtained.

The preparation method of the photosensitive resin composition of the present invention is not particularly limited, for example, the black pigment (E) can be directly added into the photosensitive resin composition to disperse, and a part of the black pigment (E) can also be dispersed in advance In a part of the catalyst (medium) containing the alkali-soluble resin (A) and the solvent (D), after the pigment dispersion liquid is formed, the compound (F) represented by the formula (a) and the polyester modified silicone resin (G) , the photoinitiator (C) and the rest of the solvent (D) are mixed. The step of dispersing the above-mentioned black pigment (E) can be carried out by mixing the above-mentioned components with a mixer such as a bead mill or a roll mill.

The present invention also provides a black matrix formed from the aforementioned photosensitive resin composition.

The black matrix according to the present invention can be prepared by sequentially applying pre-baking, exposure, development and post exposure baking (PEB) to the above-mentioned photosensitive resin composition. The film thickness of the prepared black matrix can vary according to the application. Specifically, when the black matrix is intended to be applied to LCD, the film thickness is, for example, in the range of 0.8 μm to 1.2 μm, and the black matrix is intended to be When applied to a touch panel, the film thickness is, for example, in the range of 1.5 to 2.5 μm, but not limited thereto. Wherein, when the film thickness is 1 μm, the optical density range of the black matrix is preferably above 3.0, more preferably from 3.2 to 5.5, and most preferably from 3.5 to 5.5.

More specifically, the black matrix of the present invention can be coated with the above-mentioned photosensitive resin composition on the substrate by coating methods such as spin coating or casting coating, and the solvent can be removed by drying under reduced pressure and pre-baking. , and then form a pre-baked coating film on the substrate. The aforementioned conditions for drying under reduced pressure and pre-baking may depend on the type of ingredients and the blending ratio. Generally speaking, the above-mentioned vacuum drying can be performed at a pressure of less than 200 mmHg for 1 second to 20 seconds, and the pre-baking treatment can be performed at a temperature of 70° C. to 110° C. for 1 minute to 15 minutes. After the pre-bake treatment, expose the above-mentioned coating film through a specified mask (mask), and then immerse the exposed coating film in a developer solution for 15 seconds to 5 minutes at a temperature of 23±2°C, so as to Unnecessary parts are removed to form a specific pattern. The light used in the above exposure step is preferably ultraviolet light such as g-line, h-line or i-line, and the ultraviolet irradiation device used may be (ultra)high pressure mercury lamp or metal halide lamp.

Specific examples of the developer include: sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, potassium carbonate, potassium bicarbonate, sodium silicate, sodium methyl silicate, ammonia water, ethylamine, diethylamine, Amine, dimethylethanolamine, tetramethylamine hydroxide, tetraethylamine hydroxide, choline, pyrrole, piperidine or 1,8-diazabicyclo-[5,4,0]-7-undecene and other basic compounds. The concentration of the developer is generally 0.001 wt% to 10 wt%, preferably 0.005 wt% to 5 wt%, more preferably 0.01 wt% to 1 wt%.

Generally speaking, after processing with a developer, the pattern is washed with water first, and then the pattern is air-dried with compressed air or nitrogen, and then post-baked by a heating device such as a hot plate or an oven. The post-baking temperature is generally in the range of 150°C to 250°C, wherein, if a hot plate is used, the heating time is about 5 minutes to 60 minutes; if an oven is used, the heating time is about 15 minutes to 150 minutes. After the above processing steps, a black matrix can be formed on the substrate.

Specific examples of the above-mentioned substrate include: alkali-free glass, soda-lime glass, hard glass (such as: Pyrex glass), quartz glass used in liquid crystal display devices, etc., and those with a transparent conductive film attached to the above-mentioned glass; Or a photoelectric conversion device substrate (such as a silicon substrate) for a solid-state imaging device or the like.

The present invention further provides a color filter comprising the aforementioned black matrix.

The method for forming a color filter according to the present invention can provide coating methods such as spin coating, casting coating, or roll coating, and the above-mentioned photosensitive composition for a color filter mixed into a solution state is coated on on the substrate. Wherein, the black matrix for isolating the colored layers of each pixel has been formed on the substrate in advance by using the photosensitive resin composition. After coating, most of the solvent is removed by drying under reduced pressure, and then the solvent is removed by pre-baking to form a pre-baked coating film.

The aforementioned conditions for drying under reduced pressure and pre-baking can be determined according to the types and blending ratios of the ingredients. Generally speaking, vacuum drying can be performed at a pressure of 0 mmHg to 200 mmHg for 1 second to 60 seconds, and pre-baking can be performed at a temperature of 70° C. to 110° C. for 1 minute to 15 minutes. After pre-baking, expose the coating film through a designated photomask, and at a temperature of 23±2°C, immerse the exposed coating film in a developer solution for 15 seconds to 5 minutes for development to remove unnecessary parts , forming a specific pattern. The light used in the above exposure step is preferably ultraviolet light such as g-line, h-line, i-line, etc., and the ultraviolet irradiation device used may be (ultra) high pressure mercury lamp or metal halide lamp.

After development, the pattern can be washed with water first, and then air-dried with compressed air or compressed nitrogen. Next, a post-baking treatment can be performed using a heating device such as a hot plate or an oven. The post-baking treatment conditions are as mentioned above. I won't repeat them here.

The photosensitive composition of each color (mainly including red, green and blue) repeats the above steps in sequence to prepare the pixel layer of the color filter. Next, an indium tin oxide (ITO) evaporated film is formed on the pixel layer in a vacuum environment within a temperature range of 220° C. to 250° C. If necessary, after the ITO coating is etched or wired, the polyimide for liquid crystal alignment film can be coated, and then fired to obtain a color filter that can be used as a liquid crystal display component.

The present invention further provides a liquid crystal display component, which includes the aforementioned color filter.

The liquid crystal display module according to the present invention can be formed by making the color filter substrate formed by the above-mentioned color filter manufacturing method and the drive substrate provided with thin film transistors (thin film transistors; TFT) in two There is a gap (cell gap) between them and they are arranged facing each other. The surrounding parts of the above two substrates are bonded with a sealant, and the substrate surface and the gap separated by the sealant are filled. The liquid crystal forms a liquid crystal cell by sealing the injection hole. Then, on the outer surface of the liquid crystal unit cell, that is, on the other side surfaces of each substrate constituting the liquid crystal unit cell, a polarizing plate is pasted, thereby producing a liquid crystal display module.

The liquid crystal mentioned above can be a liquid crystal compound or a liquid crystal composition, and its specific composition is not particularly limited, and any liquid crystal compound and liquid crystal composition known to those skilled in the art of the present invention can be used.

Furthermore, the aforementioned liquid crystal alignment film is used to restrict the alignment of liquid crystal molecules, and its type is not particularly limited, and may be either inorganic or organic. In addition, the technology of forming the liquid crystal alignment film is well known to those skilled in the art to which the present invention belongs, so it will not be repeated here.

The following examples are used to describe the present invention in detail, which does not mean that the present invention is limited to the contents disclosed in these examples.

Synthesis example

Synthesis of Alkali-Soluble Resin (A)

Synthesis example 1: Production method of resin (A-1-1) having an unsaturated group

With 100 parts by weight of fluorene epoxy compound (model ESF-300, manufactured by Nippon Steel Chemical; epoxy equivalent 231), 30 parts by weight of acrylic acid, 0.3 parts by weight of benzyltriethylammonium chloride, 0.1 parts by weight of 2,6-di-tert-butyl-p-cresol and 130 parts by weight of propylene glycol methyl ether acetate were continuously added to a 500mL four-necked flask, and the feeding rate was controlled at 25 parts by weight/minute, and the temperature was maintained at 100°C to Within the range of 110° C., after 15 hours of reaction, a light yellow transparent mixed solution with a solid content concentration of 50 wt % can be obtained.

Then, 100 parts by weight of the above-mentioned mixed solution was dissolved in 25 parts by weight of ethylene glycol ether acetate, while adding 6 parts by weight of tetrahydrophthalic anhydride and 13 parts by weight of benzophenone tetracarboxylic dianhydride , and heated to 110° C. to 115° C., and reacted for 2 hours, a resin (A-1-1) having an unsaturated group with an acid value of 98.0 mgKOH/g can be obtained.

Synthesis example 2: Manufacturing method of resin (A-1-2) having an unsaturated group

With 100 parts by weight of fluorene epoxy compound (model ESF-300, manufactured by Nippon Steel Chemical; epoxy equivalent 231), 30 parts by weight of acrylic acid, 0.3 parts by weight of benzyltriethylammonium chloride, 0.1 parts by weight of 2,6-di-tert-butyl-p-cresol and 130 parts by weight of propylene glycol methyl ether acetate were continuously added to a 500mL four-necked flask, and the feeding rate was controlled at 25 parts by weight/minute, and the temperature was maintained at 100°C to Within the range of 110° C., after 15 hours of reaction, a light yellow transparent mixed liquid with a solid content concentration of 50 wt % can be obtained.

Next, 100 parts by weight of the above mixed solution was dissolved in 25 parts by weight of ethylene glycol ether acetate, and 13 parts by weight of benzophenone tetracarboxylic dianhydride was added at the same time, and reacted at 90°C to 95°C for 2 hours, Then, add 6 parts by weight of tetrahydrophthalic anhydride and react at 90°C to 95°C for 4 hours to obtain a resin with an unsaturated group having an acid value of 99.0mgKOH/g (A-1-2 ).

Synthesis Example 3: Production method of resin (A-1-3) having unsaturated groups

With 400 parts by weight of epoxy compound (model NC-3000, Nippon Kayaku (Co., Ltd.) system; epoxy equivalent 288), 102 parts by weight of acrylic acid, 0.3 parts by weight of methoxyphenol (methoxyphenol), 5 parts by weight of Triphenylphosphine and 264 parts by weight of propylene glycol methyl ether acetate were placed in a reaction flask, and the temperature was maintained at 95° C. After 9 hours of reaction, an intermediate product with an acid value of 2.2 mgKOH/g was obtained. Next, add 151 parts by weight of tetrahydrophthalic anhydride and react at 95°C for 4 hours to obtain a resin with an unsaturated group with an acid value of 102 mgKOH/g and a weight average molecular weight of 3,200 (A-1-3).

Synthesis Example 4: Production method of other alkali-soluble resin (A-2-1)

1 part by weight of 2,2'-azobisisobutyronitrile, 240 parts by weight of propylene glycol methyl ether acetate, 20 parts by weight of methacrylic acid, 15 parts by weight of styrene, 35 parts by weight of styrene methacrylate Methyl ester, 10 parts by weight of glycerol monomethacrylate and 20 parts by weight of N-phenylmaleimide were placed in a round bottom flask equipped with a stirrer and a condenser, and the inside of the flask was filled with nitrogen. Afterwards, the mixture was stirred slowly and the temperature was raised to 80° C. to uniformly mix the reactants and carry out a polymerization reaction for 4 hours. Afterwards, the reactant was heated up to 100°C, and 0.5 parts by weight of 2,2'-azobisisobutyronitrile was added, and after polymerization for 1 hour, after devolatilization and drying, the alkali-soluble resin (A -2-1).

Synthesis Example 5: Production method of other alkali-soluble resin (A-2-2)

2 parts by weight of 2,2'-azobisisobutyronitrile, 300 parts by weight of dipropylene glycol monomethyl ether, 15 parts by weight of methacrylic acid, 15 parts by weight of 2-hydroxyethyl acrylate and 70 parts by weight of Benzyl methacrylate was placed in a round bottom flask equipped with a stirrer and a condenser, and the inside of the flask was filled with nitrogen. Afterwards, the mixture was stirred slowly and the temperature was raised to 80° C., so that the reactants were uniformly mixed and polymerized for 3 hours. Afterwards, it was heated up to 100°C, and 0.5 parts by weight of 2,2'-azobisisobutyronitrile was added. After polymerization for 1 hour, after devolatilization and drying, the alkali-soluble resin (A- 2-2).

Formation of black matrix

The components of the photosensitive resin composition examples and comparative examples for black matrices described in Table 1 and Table 2 were put into a coating machine (the model is MS-A150; purchased from Shin Kong Trading), and the The method is to coat on a glass substrate of 100mm×100mm, then dry under reduced pressure at 100mmHg for 5 seconds, and then pre-bake in an oven at 100°C for 2 minutes to form a pre-baked coating film. Then, irradiate the prebaked coating film with ultraviolet light (exposure machine model is AG500-4N; manufactured by M&R Nano Technology) 100mJ/cm ² , and then soak in developer solution (0.04% potassium hydroxide) at 23°C for 2 minutes to Rinse with pure water, and then bake in an oven at 240° C. for 30 minutes to form a light-shielding film on the glass substrate.

Film shrinkage evaluation method

Measure a film thickness (δd1) at any measuring point on the aforementioned exposed coating film, and then place it in an oven at 240°C for 30 minutes (that is, the post-baking step above), and measure the thickness of another film at the same measuring point. Thick (δd2). Finally, the film shrinkage rate can be obtained through formula (III) calculation.

Film shrinkage (%)=[(δd1-δd2)/(δd1)]×100 Formula (III)

"○": film shrinkage rate≦10%

"△": 10%<film shrinkage rate≦15%

"X": 15%<film shrinkage

Surface Roughness Evaluation Method

Use a non-contact white light interferometer (manufactured by BMT; model WLILAB) to measure the surface of the black matrix, and the surface roughness (Ra) can be measured, and the unit is nm.

"◎": Ra≦40nm

"○": 40nm<Ra≦70nm

"△": 70nm<Ra≦100nm

"X": 100nm<Ra

Table 1

Table 2

In Table 1 and Table 2:

B-1 Trimethylol Propyl Triacrylate

B-2 Dipentaerythritol tetraacrylate

B-3 Dipentaerythritol hexaacrylate

C-1 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-substituent]-ethanone 1-(O-acetyl

Oxime) (trade name OXE-02; manufactured by Ciba Specialty Chemical Co., Ltd.)

C-2 1-[4-(phenylthio)phenyl]-octane-1,2-dione 2-(O-benzoyl oxime)

(Product name OXE-01; manufactured by Ciba Specialty Chemical Co., Ltd.)

C-3 2-methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone

(trade name IRGACURE 907; manufactured by Ciba Specialty Chemical Co., Ltd.)

D-1 Propylene glycol methyl ether acetate

D-2 Cyclohexanone

E-1 Trade name MA100 (manufactured by Mitsubishi Chemical)

E-2 Trade name MA230 (manufactured by Mitsubishi Chemical)

Compounds represented by F-1 (a-1)

Compound shown in F-2 (a-4)

Compound shown in F-3 (a-7)

G-1 XR-32-A5775 (manufactured by Toshiba Silicone Co., Ltd.)

G-2 KR-5221 (manufactured by Shin-Etsu Chemical Co., Ltd.)

G-3 KR-5235 (manufactured by Shin-Etsu Chemical Co., Ltd.)

H-1 9,9-bis[4-(2-glycidyloxyethoxy)phenyl]fluorene

H-2 9,9-bis[4-(2-glycidyloxyethoxy)-3,5-dimethylphenyl]fluorene

H-3 9,9-bis[4-(2-glycidyloxyethoxy)-3-phenylphenyl]fluorene

The above-mentioned embodiments are only to illustrate the principles and effects of the present invention, but not to limit the present invention. Modifications and changes made by those skilled in the art to the above embodiments still do not violate the spirit of the present invention. The scope of rights of the present invention should be listed in the claims.

Claims (10)

1. A photosensitive resin composition comprising:

an alkali-soluble resin A;

a compound B containing an ethylenically unsaturated group;

a photoinitiator C;

a solvent D;

a black pigment E;

a compound F represented by formula a; and

polyester-modified silicone resin G;

wherein,

the alkali-soluble resin A comprises a resin A-1 with unsaturated groups, and the resin A-1 with unsaturated groups is prepared by polymerization of a mixture, wherein the mixture contains an epoxy compound i with at least two epoxy groups and a compound ii with at least one carboxylic acid group and at least one ethylene unsaturated group;

in formula a: r^a、R^bAnd R^cEach independently represents a trialkoxysilyl group bonded to an alkylene or arylene group.

2. The photosensitive resin composition according to claim 1, wherein the epoxy compound I having at least two epoxy groups has a structure represented by the following formula I:

wherein,

R¹、R²、R³and R⁴Each independently represents a hydrogen atom, a halogen atom, C₁To C₅Alkyl of (C)₁To C₅Alkoxy group of (C)₆To C₁₂Aryl or C of₆To C₁₂An aralkyl group of (2).

3. The photosensitive resin composition according to claim 1, wherein the epoxy compound i having at least two epoxy groups has a structure represented by the following formula II:

wherein,

R⁵to R¹⁸Each independently represents a hydrogen atom, a halogen atom, C₁To C₈Alkyl or C₆To C₁₅An aromatic group of (a); and

n represents an integer of 0 to 10.

4. The photosensitive resin composition according to claim 1, wherein the resin a-1 having an unsaturated group is used in an amount of 30 to 100 parts by weight based on 100 parts by weight of the alkali-soluble resin a.

5. The photosensitive resin composition according to claim 1, wherein the amount of the ethylenically unsaturated group-containing compound B is 10 to 100 parts by weight based on 100 parts by weight of the alkali-soluble resin A; the photoinitiator C is used in an amount of 5 to 50 parts by weight; the amount of the solvent D is 300 to 2700 parts by weight; the black pigment E is used in an amount of 40 to 400 parts by weight; the compound F represented by the formula a is used in an amount of 1 to 15 parts by weight; the amount of the polyester-denatured silicone resin G used is 3 to 30 parts by weight.

6. The photosensitive resin composition according to claim 1, further comprising an epoxy resin H having a fluorene skeleton represented by formula b,

in the formula (b), the reaction mixture is,

R²¹represents cyano, C₁To C₅Alkyl or halogen atom of (a);

R²²is represented by C₁To C₁₃An alkylene group of (a);

R²³represents a hydrogen atom or a methyl group;

R²⁴is represented by C₁To C₅Alkyl of (C)₆To C₁₂Aryl or C of₆To C₁₂Aralkyl group of (1);

p represents an integer of 0 to 4;

q represents an integer of 1 to 10; and

r represents an integer of 0 to 4.

7. The photosensitive resin composition according to claim 6, wherein the amount of the epoxy resin H having a fluorene skeleton represented by formula b is 4 to 35 parts by weight based on 100 parts by weight of the alkali-soluble resin A.

8. A black matrix formed from the photosensitive resin composition of any one of claims 1 to 7.

9. A color filter comprising the black matrix of claim 8.

10. A liquid crystal display device comprising the color filter of claim 9.