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CN106163798B - Glass laminate, method for producing the same, and method for producing an electronic device - Google Patents

Glass laminate, method for producing the same, and method for producing an electronic device Download PDF

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Publication number
CN106163798B
CN106163798B CN201580019007.0A CN201580019007A CN106163798B CN 106163798 B CN106163798 B CN 106163798B CN 201580019007 A CN201580019007 A CN 201580019007A CN 106163798 B CN106163798 B CN 106163798B
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China
Prior art keywords
resin layer
silicone resin
layer
glass substrate
alkenyl
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CN201580019007.0A
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CN106163798A (en
Inventor
宫越达三
武黎如惠
照井弘敏
山内优
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AGC Inc
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AGC Inc
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Publication of CN106163798A publication Critical patent/CN106163798A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

The present invention provides a kind of glass laminate, can inhibit the raising of the peel strength of glass substrate and silicone resin layer after high-temperature heating treatment, so as to easily remove glass substrate.Glass laminate of the invention successively has the layer of supporting base material, the layer of silicone resin layer and glass substrate, the peel strength at the interface of the layer and silicone resin layer of supporting base material is higher than the peel strength at the interface of silicone resin layer and glass substrate, wherein, organic siliconresin in silicone resin layer be make there is alkenyl and the organopolysiloxane containing alkenyl (A) of number-average molecular weight 500~9000 reacted with the hydrogen polysiloxanes (B) with hydrosilyl group obtained from solidfied material, the mixing molar ratio (molal quantity/alkenyl molal quantity of hydrosilyl group) of the hydrosilyl group in alkenyl and hydrogen polysiloxanes (B) in organopolysiloxane containing alkenyl (A) is 0.7/1~1.3/1.

Description

Glass laminate and its manufacturing method, the manufacturing method of electronic device
Technical field
The present invention relates to glass laminate and its manufacturing methods, use defined number-average molecular weight more particularly to having The glass laminate and its manufacturing method for the silicone resin layer that organopolysiloxane containing alkenyl is formed.
In addition, the invention further relates to the manufacturing methods for the electronic device for having used the glass laminate.
Background technique
In recent years, the devices such as solar battery (PV), liquid crystal display panel (LCD), organic EL panel (OLED) (electricity is being carried out Sub- equipment) slimming, lightweight, and carrying out the thin plate of glass substrate used in these devices.Due to thin plate When changing and leading to the intensity deficiency of glass substrate, in the manufacturing process of device, the operability of glass substrate is reduced.
Recently, in order to cope with the above problem, following methods is proposed: preparing to obtain glass substrate and enhancing board stacking Glass laminate, the electronic devices component such as display device is formed on the glass substrate of glass laminate, then from glass Substrate separates reinforcing plate (for example, see patent document 1).
Existing technical literature
Patent document
Patent document 1: International Publication No. 2007/018028
Summary of the invention
Problem to be solved by the invention
In recent years, with the further multifunction of electronic device, electronic device itself is minimized, and requires its behaviour The property made further increases.Therefore, it is desirable to: electronic device is formed on the glass substrate in glass laminate under the high temperature conditions When then removing glass substrate from glass laminate with component, glass substrate is more easily peelable.
But for existing laminated body, the requirement that the fissility of glass substrate does not reach recent is horizontal, it is desirable that The fissility of glass substrate further increases.
The present invention completes in view of the above problems, and its purpose is to provide the glass that can easily remove glass substrate Laminated body and its manufacturing method.
In addition, the object of the invention is also to provide the manufacturing methods for the electronic device for having used the glass laminate.
The means used to solve the problem
The present inventor has made intensive studies to solve the above-mentioned problems, as a result, it has been found that, divided equally by using defined number The organopolysiloxane containing alkenyl of son amount, available desired effect, so as to complete the present invention.
That is, the 1st aspect of the present invention is a kind of glass laminate, successively have layer, the organic siliconresin of supporting base material The peel strength at the layer of layer and glass substrate, the layer of above-mentioned supporting base material and the interface of above-mentioned silicone resin layer has higher than above-mentioned The peel strength at the interface of the layer of machine silicone layer and above-mentioned glass substrate, wherein the organosilicon in above-mentioned silicone resin layer Resin be make to have alkenyl and the organopolysiloxane containing alkenyl (A) of number-average molecular weight 500~9000 with there is hydrogen monosilane It is solid obtained from hydrogen polysiloxanes (Ha イ De ロ ジ ェ Application Port リ シ ロ キ サ Application) (B) reaction of base (Ha イ De ロ シ リ Le base) Compound, the above-mentioned hydrogen monosilane in above-mentioned alkenyl and above-mentioned hydrogen polysiloxanes (B) in above-mentioned organopolysiloxane containing alkenyl (A) The mixing molar ratio (molal quantity/alkenyl molal quantity of hydrosilyl group) of base is 0.7/1~1.3/1.
In addition, in first method, preferably: above-mentioned silicone resin layer is the curable resin group as described below to coating It closes layer obtained from object and implements layer obtained from curing process, the hardening resin composition includes above-mentioned organic poly- containing alkenyl Siloxanes (A), above-mentioned hydrogen polysiloxanes (B) and Hildebrand (Hildebrand) solubility parameter (SP value) are 14.0MPa1/2Solvent below, and the above-mentioned alkenyl in above-mentioned organopolysiloxane containing alkenyl (A) and above-mentioned hydrogen polysiloxanes (B) the mixing molar ratio (molal quantity/alkenyl molal quantity of hydrosilyl group) of the above-mentioned hydrosilyl group in be 0.7/1~ 1.3/1。
In addition, in first method, preferably above-mentioned solvent is the solvent containing silicon atom.
In addition, in first method, preferably above-mentioned solvent is cyclic annular or straight-chain diakyl-polysiloxane.
In addition, in first method, preferably: above-mentioned silicone resin layer is the curable resin group as described below to coating It closes layer obtained from object and implements layer obtained from curing process, the hardening resin composition includes above-mentioned organic poly- containing alkenyl Siloxanes (A), above-mentioned hydrogen polysiloxanes (B) and boiling point are 200 DEG C of solvents below, and above-mentioned organopolysiloxane containing alkenyl (A) the mixing molar ratio of the above-mentioned hydrosilyl group in above-mentioned alkenyl and above-mentioned hydrogen polysiloxanes (B) in be (hydrosilyl group Molal quantity/alkenyl molal quantity) it is 0.7/1~1.3/1.
In addition, in first method, preferably: above-mentioned silicone resin layer is the curable resin group as described below to coating It closes layer obtained from object and implements layer obtained from curing process, the hardening resin composition includes above-mentioned organic poly- containing alkenyl Siloxanes (A), above-mentioned hydrogen polysiloxanes (B) and boiling point are more than 200 DEG C of solvent, in above-mentioned organopolysiloxane containing alkenyl (A) Above-mentioned alkenyl and above-mentioned hydrogen polysiloxanes (B) in above-mentioned hydrosilyl group mixing molar ratio (mole of hydrosilyl group The molal quantity of number/alkenyl) it is 0.7/1~1.3/1, and above-mentioned organopolysiloxane containing alkenyl (A) and above-mentioned hydrogen polysiloxanes (B) total content is 70 mass % more than and less than 100 mass %.
In addition, in first method, preferably above-mentioned silicone resin layer with a thickness of 2 μm~100 μm.
In addition, in first method, preferably above-mentioned supporting base material is glass plate.
In addition, in first method, silicone oil is preferably also contained in silicone resin layer.
The 2nd aspect of the present invention is a kind of glass laminate, successively has layer, the silicone resin layer of supporting base material It is higher than silicone resin layer and glass with the peel strength of the layer of glass substrate, the interface of the layer and silicone resin layer of supporting base material The peel strength at the interface of the layer of glass substrate, wherein contain silicone oil, and silicone resin layer and glass in silicone resin layer The peel strength at the interface of the layer of glass substrate is 0.10N/25mm or more and 1.40N/25mm or less.
The 3rd aspect of the present invention is the manufacturing method of the glass laminate of first method, wherein in the list of supporting base material Face is formed containing above-mentioned organopolysiloxane containing alkenyl (A) and above-mentioned hydrogen polysiloxanes (B) and above-mentioned organic poly- silicon containing alkenyl Mixing molar ratio (the hydrogen monosilane of the above-mentioned hydrosilyl group in above-mentioned alkenyl and above-mentioned hydrogen polysiloxanes (B) in oxygen alkane (A) Molal quantity/alkenyl molal quantity of base) it is 0.7/1~1.3/1 layer, and make on above-mentioned supporting base material face above-mentioned containing alkenyl Organopolysiloxane (A) reacts with above-mentioned hydrogen polysiloxanes (B) and forms silicone resin layer, next in above-mentioned organosilicon tree The surface laminated glass substrate of rouge layer.
The 4th aspect of the present invention is a kind of manufacturing method of electronic device comprising: component formation process, wherein Electronic device component is formed on the surface of the above-mentioned glass substrate of the glass laminate of first method or second method to obtain To the laminated body of having electronic device component；And separation process, wherein removed from the laminated body of above-mentioned having electronic device component It is upper to obtain having to go the supporting base material with silicone resin layer comprising above-mentioned supporting base material and above-mentioned silicone resin layer State the electronic device of glass substrate and above-mentioned electronic device component.
Invention effect
According to the present invention it is possible to provide the glass laminate and its manufacturing method that can easily remove glass substrate.
In addition, it is also possible according to the present invention to provide having used the manufacturing method of the electronic device of the glass laminate.
Detailed description of the invention
Fig. 1 is the schematic cross sectional views of an embodiment of glass laminate of the invention.
Fig. 2 is the embodiment that the manufacturing method of the glass substrate of band member of the invention is shown by process sequence Schematic cross sectional views.
Specific embodiment
Mode for carrying out the present invention is illustrated referring to the drawings, but the present invention is not limited to following embodiment party Formula can apply various modifications and displacement to following implementation without departing from the scope of the invention.
Glass laminate of the invention successively has the layer of the layer of supporting base material, silicone resin layer and glass substrate.That is, There is silicone resin layer, the side of silicone resin layer and supporting base material between the layer of supporting base material and the layer of glass substrate Layer contact, the other side is contacted with the layer of glass substrate.
The organic siliconresin that one of characteristic point of glass laminate of the invention can be enumerated in silicone resin layer passes through This point is formed using the organopolysiloxane containing alkenyl of defined number-average molecular weight.The present inventor is to problem of the prior art Point studied, as a result, it has been found that in silicone resin layer remaining unreacted hydrosilyl group and glass substrate removing Property it is related.That is, in the case that discovery remains a large amount of unreacted hydrosilyl groups in silicone resin layer, to glass laminated When body carries out high-temperature heating treatment, hydrosilyl group reacts with glass substrate, thus silicone resin layer and glass substrate Adhesivity improve, the result is that glass substrate becomes difficult to remove.Therefore, alkenyl is contained by using defined number-average molecular weight Organopolysiloxane forms silicone resin layer, thus reduces the residual quantity of unreacted hydrosilyl group, to make glass The fissility of substrate improves.More specifically, thus it is speculated that: this contains alkenyl organopolysiloxane has since its number-average molecular weight is low High movement property, it is therefore, high with the reactivity of the hydrosilyl group in hydrogen polysiloxanes, the result is that unreacted hydrosilyl group Amount is reduced.
It should be noted that further suppressing organosilicon when removing glass substrate by using the silicone resin layer The cohesional failure of resin layer.
In addition, as described later in the solidification using the solvent containing defined Hildebrand solubility parameter (SP value) In the case where property resin combination, the flatness of obtained silicone resin layer is more excellent, and the adherency with glass substrate Property is more excellent.
Fig. 1 is the schematic cross sectional views of an example of glass laminate of the invention.
As shown in Figure 1, glass laminate 10 be the layer of supporting base material 12, glass substrate 16 layer and be present between them Silicone resin layer 14 laminated body.For silicone resin layer 14, one face contacted with supporting base material 12 and Its another face is contacted with the first interarea 16a of glass substrate 16.In other words, the of silicone resin layer 14 and glass substrate 16 One interarea 16a contact.
In the component formation process of the manufacture electronic devices component such as liquid crystal display panel, the layer comprising supporting base material 12 and have The dual layer section reinforcing glass substrate 16 of machine silicone layer 14.It should be noted that will be pre- in order to manufacture glass laminate 10 The dual layer section of the layer comprising supporting base material 12 and silicone resin layer 14 that first manufacture is known as the support with silicone resin layer Substrate 18.
The glass laminate 10 is used until aftermentioned component formation process.That is, the glass laminate 10 is used directly To the electronic devices component such as formation liquid crystal display device on the second interarea 16b of its glass substrate 16.Then, it is formed with electricity The glass laminate of sub- device component be separated into the supporting base material 18 with silicone resin layer and electronic device (band member Glass substrate), the supporting base material 18 with silicone resin layer is not the part for constituting electronic device.It can be in band organic siliconresin New glass substrate 16 is laminated and is recycled as new glass laminate 10 in the supporting base material 18 of layer.
The interface of supporting base material 12 and silicone resin layer 14 has peel strength (x), to supporting base material 12 and organosilicon When the interface of resin layer 14 applies the stress more than the peeling direction of peel strength (x), supporting base material 12 and silicone resin layer 14 interface is peeling-off.The interface of silicone resin layer 14 and glass substrate 16 has peel strength (y), to organic siliconresin Layer 14 applies with the interface of glass substrate 16 when being more than the stress of peeling direction of peel strength (y), silicone resin layer 14 with The interface of glass substrate 16 is peeling-off.
In glass laminate 10 (laminated body for also referring to aftermentioned having electronic device component), above-mentioned peel strength (x) Higher than above-mentioned peel strength (y).Therefore, apply the direction for removing supporting base material 12 and glass substrate 16 to glass laminate 10 Stress when, glass laminate 10 of the invention is peeling-off in the interface of silicone resin layer 14 and glass substrate 16 and divides From at glass substrate 16 and the supporting base material with silicone resin layer 18.
Compared with peel strength (y), peel strength (x) is preferably sufficiently high.It improves peel strength (x) means that: raising has Machine silicone layer 14 is also able to maintain relatively the adhesive force of supporting base material 12 to glass substrate 16 after a heating treatment High adhesive force.
In order to improve silicone resin layer 14 to the adhesive force of supporting base material 12, as described later, preferably make containing being specified to Point the layer (that is, film of hardening resin composition) of hardening resin composition solidify in supporting base material 12 and (such as hand over Connection solidification) to form silicone resin layer 14.Using adhesive tension when solidifying, it is capable of forming and supporting base material 12 is combined with height The silicone resin layer 14 that power combines.
On the other hand, the solidfied material of the organopolysiloxane after solidification is usually less than above-mentioned to the binding force of glass substrate 16 Generated binding force when solidification.It is therefore preferable that: the layer of hardening resin composition is implemented at solidification in supporting base material 12 It manages and forms silicone resin layer 14, then in the surface laminated glass substrate 16 of silicone resin layer 14, thus manufacture glass Laminated body 10.
Hereinafter, firstly, to each layer (supporting base material 12, glass substrate 16, silicone resin layer for constituting glass laminate 10 14) it is described in detail, then, the manufacturing method of glass laminate and electronic device is described in detail.
<supporting base material>
The support of supporting base material 12 and reinforcing glass substrate 16, and (manufacture electronic device is used in aftermentioned component formation process The process of component) in the deformation, damage, breakage etc. of glass substrate 16 are prevented when manufacturing electronic device component.
As supporting base material 12, metal plates such as glass plate, plastic plate, SUS plate etc. can be used for example.In general, component shape At process with heat treatment, therefore, supporting base material 12 preferably by and glass substrate 16 linear expansion coefficient the small material of difference It is formed, is more preferably formed by material identical with glass substrate 16, supporting base material 12 is preferably glass plate.Especially supporting base material 12 preferably comprising the glass plate of glass material identical with glass substrate 16.
The thickness of supporting base material 12 can be thicker than glass substrate 16, can also be thinner than its.It is preferably based on glass substrate 16 The thickness of thickness, the thickness of silicone resin layer 14 and glass laminate 10 selects the thickness of supporting base material 12.For example, existing Component formation process be designed to handle the substrate of thickness 0.5mm, the thickness and organic siliconresin of glass substrate 16 When the sum of thickness of layer 14 is 0.1mm, the thickness of supporting base material 12 is set as 0.4mm.The thickness of supporting base material 12 is usual In the case where preferably 0.2mm~5.0mm.
When supporting base material 12 is glass plate, from it is easy to operate, the reasons such as be not easily broken and consider, the thickness of glass plate is preferably 0.08mm or more.In addition, for expect after electronic device is formed with component removing when in the case where not rupturing fit The reason of the rigidity of degree flexure, the thickness of glass plate is preferably 1.0mm or less.
The difference of the average linear expansion coefficient of supporting base material 12 and glass substrate 16 at 25 DEG C~300 DEG C is preferably 500 × 10-7/ DEG C hereinafter, more preferably 300 × 10-7/ DEG C hereinafter, further preferably 200 × 10-7/ DEG C or less.When difference is excessive, in structure When heating in part formation process is cooling, it is possible to the violent warpage of glass laminate 10 or supporting base material 12 and glass substrate 16 It is peeling-off.When the material of supporting base material 12 is identical as the material of glass substrate 16, it is able to suppress the generation of this problem.
<glass substrate>
For glass substrate 16, the first interarea 16a is contacted with silicone resin layer 14, with silicone resin layer 14 Electronic device component is provided on second interarea 16b of side opposite side.
The type of glass substrate 16 can be conventional glass substrate, can enumerate the use of the display device such as LCD, OLED Glass substrate etc..Glass substrate 16 also available chemical-resistant, resistance to excellent moisture permeability and the low glass of percent thermal shrinkage Substrate.As the index of percent thermal shrinkage, linear expansion coefficient specified in JIS R 3102 (nineteen ninety-five revision) can be used.
When the linear expansion coefficient of glass substrate 16 is big, since component formation process is accompanied by heat treatment more, it is easy Generate various unfavorable conditions.For example, the glass substrate 16 of TFT will be formed under heating when forming TFT on glass substrate 16 When cooling, it is possible to which the positional shift of TFT becomes excessive because of the thermal contraction of glass substrate 16.
Glass substrate 16 is obtained and melting glass raw material and moltening glass into plate.Such forming side Method can be conventional manufacturing process, can be used for example and draw method under float glass process, fusion method, discharge orifice, have slot vertical drawing (Off Le U ー Le) method, blow a (ラ バ ー ス) method etc..In addition, for especially for the thin glass substrate 16 of thickness, using will be shaped Glass for plate is heated to being able to carry out the temperature of forming and carries out extending thinning method by the means such as stretching and (draws again Method) it is formed and obtains.
The type of the glass of glass substrate 16 is not particularly limited, preferably alkali-free pyrex, pyrex, sodium calcium It is glass, high silica glass, other with silica oxide-based glass as main component.As oxide-based glass, it is preferably based on The glass that the content of the silica of oxide conversion is 40 mass of mass %~90 %.
As the glass of glass substrate 16, using being suitable for the type of electronic device component, the glass of its manufacturing process. For example, the glass substrate of liquid crystal display panel includes basic since the dissolution of alkali metal component is easy to impact liquid crystal On not alkali metal-containing component glass (alkali-free glass) (still, usually containing alkaline earth metal component).In this way, glass substrate 16 Glass can type based on applied device and its manufacturing process and suitably select.
From the viewpoint of the slimming and/or lightweight of glass substrate 16, the thickness of glass substrate 16 is preferably 0.3mm Hereinafter, more preferably 0.15mm is hereinafter, further preferably 0.10mm or less.When with a thickness of 0.3mm or less, glass can be assigned The good flexibility of substrate 16.When with a thickness of 0.15mm or less, glass substrate 16 can be wound into a roll tubular.
In addition, the reasons such as the manufacture for glass substrate 16 is easy, the processing of glass substrate 16 is easy, glass substrate 16 Thickness is preferably 0.03mm or more.
It should be noted that glass substrate 16 may include two layers or more, in this case, forming each layer of material can To be same material, it is also possible to not same material.In addition, in this case, " thickness of glass substrate 16 " refers to all layers Overall thickness.
<silicone resin layer>
Silicone resin layer 14 prevents from carrying out the glass before the isolated operation of glass substrate 16 and supporting base material 12 It the positional shift of substrate 16 and prevents glass substrate 16 etc. breakage occurs because of lock out operation.Silicone resin layer 14 and glass The surface 14a that glass substrate 16 contacts is adhered to the first interarea 16a of glass substrate 16 in a releasable manner.Silicone resin layer 14 with weak binding force in conjunction with the first interarea 16a of glass substrate 16, the peel strength (y) at interface is lower than organic siliconresin The peel strength (x) at the interface between layer 14 and supporting base material 12.
That is, when by glass substrate 16 and the separation of supporting base material 12, in the first interarea 16a and organosilicon of glass substrate 16 The interface of resin layer 14 is peeling-off, is not susceptible to remove in the interface of supporting base material 12 and silicone resin layer 14.Cause This, although silicone resin layer 14 and the first interarea 16a of glass substrate 16 are adhered to, having can be easily by glass substrate The surface characteristic of 16 removings.That is, binding force of the silicone resin layer 14 to the first interarea 16a of glass substrate 16 to some degree In conjunction with the positional shift etc. to prevent glass substrate 16, meanwhile, can be easily peeled off when removing glass substrate 16 Binding force without destroying the degree of glass substrate 16 combines.In the present invention, by 14 surface of silicone resin layer can The property being easily peeled off is known as fissility.On the other hand, the first interarea with silicone resin layer 14 of supporting base material 12 are with phase The binding force being not easily stripped is combined.
It should be noted that the binding force at the interface of silicone resin layer 14 and glass substrate 16 can be in glass laminate Electronic device component front and back is formed on the surface (the second interarea 16b) of 10 glass substrate 16 to change (that is, peel strength (x), peel strength (y) can change).But even if peel strength (y) is also low after forming electronic device component In peel strength (x).
Think the layer of silicone resin layer 14 and glass substrate 16 with weak adhesive tension, derived from the binding force knot of Van der Waals force It closes.Think after forming silicone resin layer 14 its surface laminated glass substrate 16 in the case where, silicone resin layer 14 When organic siliconresin is full cross-linked with the degree for not showing adhesive tension, to be combined derived from the binding force of Van der Waals force.But have The organic siliconresin of machine silicone layer 14 has the case where a degree of weak adhesive tension and many.Think: even if in adhesivity In the case where extremely low, after manufacturing glass laminate 10, when forming electronic device component on its laminated body, pass through heating operation Gluing, silicone resin layer 14 and glass base occurs Deng the organic siliconresin of, silicone resin layer 14 and 16 surface of glass substrate Binding force between the layer of plate 16 increases.
Can also according to circumstances the surface to the silicone resin layer 14 before stacking, the glass substrate 16 before stacking first Interarea 16a is laminated after being weakened the processing of binding force between the two.Non-sticky processing is carried out to the face being laminated Deng, then it is laminated, thus, it is possible to weaken the binding force at the interface of the layer of silicone resin layer 14 and glass substrate 16, reduction Peel strength (y).
In addition, silicone resin layer 14 is incorporated into 12 surface of supporting base material with the strong binding force such as adhesive tension, bonding force.Example Such as, as described above, by making the layer of hardening resin composition in 12 surface cure of supporting base material, thus, it is possible to will be as solid The organic siliconresin gluing of compound is in 12 surface of supporting base material, to obtain high-bond.Alternatively, it is also possible to implement to make branch support group The processing (such as processing using coupling agent) of strong binding force is generated between 12 surface of material and silicone resin layer 14 to improve Binding force between 12 surface of supporting base material and silicone resin layer 14.
Silicone resin layer 14 and the layer of supporting base material 12 with high-bond in conjunction with the peel strength at interface that both refers to (x) high.
The thickness of silicone resin layer 14 is not particularly limited, even if containing the feelings of solvent in hardening resin composition Condition, do not contain in the case where any one in the case of, the thickness for being formed by silicone resin layer 14 is preferably 2 μm~100 μ M, more preferably 3 μm~50 μm, further preferably 7 μm~20 μm.The thickness of silicone resin layer 14 within the above range when, Even if being also able to suppress glass substrate 16 there are bubble, foreign matter between silicone resin layer 14 and glass substrate 16 sometimes The generation of deformation defect.In addition, in the case where thickness is thicker, even if also being able to suppress to form bubble there are foreign matter.Separately Outside, when the thickness of silicone resin layer 14 is blocked up, time and materials are needed in order to form silicone resin layer 14, therefore be not Economical, and heat resistance reduces sometimes.In addition, when the thickness of silicone resin layer 14 is excessively thin, silicone resin layer 14 sometimes It is reduced with the adhesiveness of glass substrate 16.The thickness of silicone resin layer 14 can by the resin of hardening resin composition at Concentration, the amount for the coating fluid being coated in supporting base material divided are adjusted.
It should be noted that silicone resin layer 14 may include two layers or more.In this case, " silicone resin layer 14 thickness " refers to the overall thickness of whole layers.
Organic siliconresin contained in silicone resin layer 14 makes with alkenyl and number-average molecular weight 500~9000 Solidfied material obtained from organopolysiloxane containing alkenyl (A) is reacted with the hydrogen polysiloxanes (B) with hydrosilyl group (such as hand over Join solidfied material).The organic siliconresin is preferably formed as tridimensional network.
Organopolysiloxane containing alkenyl (A) (later also referred to as polysiloxanes (A)) refers to organic poly- silicon oxygen with alkenyl Alkane.
The number-average molecular weight of polysiloxanes (A) is 500~9000, from the viewpoint of the removing of glass substrate more easily, Preferably 1000~8000, more preferably 1500~6000.
When number-average molecular weight is less than 500, volatile ingredient becomes more, and solidification not sufficiently carries out.Number-average molecular weight is more than 9000 When, the fissility of glass substrate 16 is poor.
It as the measuring method of above-mentioned number-average molecular weight, is measured using GPC (gel permeation chromatography), and to change It is counted as number-average molecular weight when standard polystyren.
Polysiloxanes (A) can be straight-chain, branched, from the fissility of glass substrate 16 it is more excellent from the viewpoint of, Preferably straight-chain (such as linear).
Alkenyl contained in polysiloxanes (A) is not particularly limited, such as can enumerate vinyl (ethenyl), allyl Base (2- acrylic), cyclobutenyl, pentenyl, hexenyl etc., wherein from the viewpoint of excellent heat resistance, preferably vinyl.
The quantity of alkenyl contained in polysiloxanes (A) is not particularly limited, more excellent from the fissility of glass substrate 16 From the viewpoint of, preferably each molecule have at least two, more preferably have 2~120, further preferably have 2~ 3.
It should be noted that in addition, alkyl can be enumerated as the group other than alkenyl contained in polysiloxanes (A) (especially carbon atom number is 4 alkyl below).
The position of alkenyl in polysiloxanes (A) is not particularly limited, can enumerate polysiloxanes (A) end and/or Side chain.
In the case that polysiloxanes (A) is straight-chain, alkenyl be can reside in M unit and D unit as described below In any one, it can also exist in both M unit and D unit.From the viewpoint of curing rate, preferably at least it is present in M In unit, it is preferably in two M unit the two.
It should be noted that M unit and D unit are the examples of the basic structural unit of organopolysiloxane, M unit is key Mono-functional's siloxane unit there are three organic group is closed, D unit is that there are two the difunctionality silicon oxygen of organic group for bonding Alkane unit.In siloxane unit, siloxanes key is two silicon atom keys obtained from an oxygen atoms bond, therefore, The oxygen atom of each of siloxanes key silicon atom is considered as 1/2, O is expressed as in formula1/2。
It should be noted that as the M unit with alkenyl, any one in preferably above-mentioned R is alkenyl and other R are The mode of alkyl.
In addition, as the D unit with alkenyl, any one in preferably above-mentioned R is alkenyl and other R are the side of alkyl Formula.
Hydrogen polysiloxanes (B) (later also referred to as polysiloxanes (B)) are that there is hydrosilyl group (to be bonded to the hydrogen of silicon atom Atom) organopolysiloxane.
The number-average molecular weight of polysiloxanes (B) is not particularly limited, and the easier viewpoint of the removing from glass substrate 16 is examined Consider, preferably 500~9000, more preferably 1000~8000, further preferably 1500~6000.
Polysiloxanes (B) can be straight-chain, branched, from the fissility of glass substrate 16 it is more excellent from the viewpoint of, Preferably straight-chain (such as linear).
The quantity of hydrosilyl group contained in polysiloxanes (B) (hydrogen atom for being bonded to silicon atom) does not limit especially System, from the fissility of glass substrate 16 it is more excellent from the viewpoint of, preferably each molecule have at least two, more preferably have 2 It is a~120, further preferably there are 2~100.
In addition, alkyl can be enumerated (especially as the group other than hydrosilyl group contained in polysiloxanes (B) Carbon atom number is 4 alkyl below).
The position of hydrosilyl group in polysiloxanes (B) is not particularly limited, and can enumerate the end of polysiloxanes (B) And/or side chain.
In the case where polysiloxanes (B) is straight-chain, hydrosilyl group be can reside in above-mentioned M unit and D unit Any one, can also exist on both M unit and D unit.
Alkenyl and polysiloxanes about the blending ratio of polysiloxanes (A) and polysiloxanes (B), in polysiloxanes (A) (B) the mixing molar ratio (molal quantity/alkenyl molal quantity of hydrosilyl group) of the hydrosilyl group in is 0.7/1~1.3/1, From the fissility of glass substrate 16 it is more excellent from the viewpoint of, preferably 0.8/1~1.2/1.
When mixing molar ratio is more than 1.3/1, the fissility of the glass substrate 16 after heat treatment is poor.It should be noted that The reason of mixing molar ratio is when being more than 1.3/1, and the peeling force after heat treatment increases is not clear, but thinks and pass through at heating Reason is so that the unreacted hydrosilyl group in solidfied material is related with certain reaction of the silanol group of glass surface.In addition, mixed When closing molar ratio less than 0.7/1, the crosslink density of solidfied material is reduced, therefore, it is possible in terms of generate and ask Topic.In addition, the reduction of the crosslink density with solidfied material, the worry for thering is heat resistance to reduce.
Organic siliconresin contained in silicone resin layer 14 is to make above-mentioned polysiloxanes (A) and above-mentioned polysiloxanes (B) React solidfied material obtained from (such as addition reaction).
Reaction can according to need to be implemented in the presence of catalyst (such as hydrosilylation catalysts).
As the catalyst, it is preferable to use platinum metal catalysts.As platinum metal catalysts, can enumerate platinum class, The catalyst such as palladium class, rhodium class particularly preferably use platinum-type catalyst from the viewpoint of economy, reactivity.It is urged as platinum class Well known catalyst can be used in agent.Specifically, can enumerate: the chlorine such as platinum fine powder, platinum black, two chloroplatinic acids, Tetrachloroplatinate Platinic acid, platinum tetrachloride, the alcoholic compound of chloroplatinic acid, the alkene complex of aldehyde compound or platinum, alkenyl siloxane complex compound, Carbonyl complex etc..
Relative to the gross mass of polysiloxanes (A) and polysiloxanes (B), catalyst is preferably 1 matter of mass ppm~10000 Measure ppm, more preferably 10 mass of mass ppm~1000 ppm.
Silicone oil can be contained in silicone resin layer 14.Silicone oil as used herein be not with polysiloxanes (A) or poly- silicon Silicone oil that oxygen alkane (B) reacts, i.e. non-reacted silicone oil.
The type of silicone oil is not particularly limited, and may be exemplified dimethicone, the methyl phenyl silicone oil (side chain of polysiloxanes A part be phenyl silicone oil) etc. straight chains silicone oil；Polyether-based, aralkyl, fluoro-alkyl, length are introduced in the side chain of straight chain silicone oil Non-reacted modified silicon oil obtained from alkyl group, higher fatty acids ester group, high fatty acid amide base, halogen group etc.；? Two ends introduce modified silicon oil non-reacted obtained from polyether-based, methoxyl group, phenyl etc..
It should be noted that silicone oil is involatile constituent, it is different from the solvent as volatile component.
More specifically, silicone oil refers to that boiling point is 235 DEG C or more of substance, substance (such as silicon oxygen of the boiling point lower than 235 DEG C Hydride compounds) belong to solvent.Above-mentioned boiling point is the measured value under an air pressure.
The viscosity (kinematic viscosity is measured at 25 DEG C) of silicone oil is not particularly limited, from silicone resin layer 14 Contained in organic siliconresin surface be easy exudation, glass substrate fissility it is excellent from the viewpoint of, preferably 0.5 (mm2/ s)~1000000 (mm2/ s), more preferably 5 (mm2/ s)~100000 (mm2/ s), further preferably 50 (mm2/ s)~ 80000(mm2/ s), particularly preferably 100 (mm2/ s)~60000 (mm2/ s), particularly preferably 50 (mm2/ s)~10000 (mm2/ s), most preferably 100 (mm2/ s)~10000 (mm2/s)。
The content of silicone oil contained in silicone resin layer 14 is not particularly limited, by " polysiloxanes (A) and poly- silicon oxygen When the gross mass of alkane (B) " is set as 100 mass parts, preferably 0.5 mass parts~15 mass parts, more preferably 1 mass parts~15 Mass parts, further preferably 2 mass parts~10 mass parts.It is excellent in the fissility of glass substrate when to be more than 0.5 mass parts Aspect be it is preferred, be 15 below the mass when, be preferred in terms of the foaming when further suppressing heating.
Silicone oil relative to the mass ratio (polysiloxanes (A)/silicone oil) of above-mentioned polysiloxanes (A) be preferably 100/0.5~ 100/16, more preferably 100/2~100/16, further preferably 100/4~100/11.When being 100/0.5 or more, in glass The excellent aspect of the fissility of substrate is preferred, is preferred in terms of the foaming when further suppressing heating when being 100/16 or less.
The forming method of silicone resin layer 14 is not particularly limited, and can usually be listed below method: to comprising above-mentioned The layer of the composition of polysiloxanes (A) and polysiloxanes (B) implements curing process.For the forming method of silicone resin layer It is described in detail, is described in detail in [glass laminate and its manufacturing method] of aftermentioned paragraph.
[glass laminate and its manufacturing method]
As described above, glass laminate 10 of the invention is supporting base material 12, glass substrate 16 and is present between them Silicone resin layer 14 laminated body.
The manufacturing method of glass laminate 10 of the invention is not particularly limited, in order to obtain supporting base material 12 and organosilicon The peel strength (x) at the interface of resin layer 14 is higher than the peel strength (y) at the interface of silicone resin layer 14 and glass substrate 16 Laminated body, preferably react polysiloxanes (A) with polysiloxanes (B) and form organic siliconresin The method of layer 14.As following method: being formed on the surface of supporting base material 12 with above-mentioned mixing molar ratio includes polysiloxanes (A) and the layer of polysiloxanes (B) polysiloxanes (A) and polysiloxanes (B), is made to react and be formed on 12 surface of supporting base material Machine silicone layer 14 (such as layer of cross-linked silicone resin), next, on the organic siliconresin face of silicone resin layer 14 Laminated glass substrate 16, to manufacture glass laminate 10.
Think to make polysiloxanes (A) and polysiloxanes (B) when solidifying on 12 surface of supporting base material, when passing through curing reaction Gluing, the peel strength raising of organic siliconresin and 12 surface of supporting base material occur for the interaction with 12 surface of supporting base material. Therefore, even if glass substrate 16 and supporting base material 12 include same material, can also to silicone resin layer 14 between the two Difference is arranged in peel strength.
Hereinafter, the layer comprising polysiloxanes (A) and polysiloxanes (B) will be formed on the surface of supporting base material 12 and propped up Polysiloxanes (A) is set to react (such as crosslinking) with polysiloxanes (B) and form silicone resin layer 14 on 12 surface of support group material Process is known as resin layer formation process, and the laminated glass substrate 16 on the organic siliconresin face of silicone resin layer 14 is made The process of glass laminate 10 is known as lamination process, and the sequence of each process is described in detail.
(resin layer formation process)
In resin layer formation process, being formed on the surface of supporting base material 12 includes polysiloxanes (A) and polysiloxanes (B) Layer, and polysiloxanes (A) and polysiloxanes (B) is made on 12 surface of supporting base material to be crosslinked to form silicone resin layer 14.It should be noted that polysiloxanes (A) and polysiloxanes (B) are with above-mentioned defined mixing molar ratio, (hydrosilyl group is rubbed That number/alkenyl molal quantity) it is mixed for 0.7/1~1.3/1 mode.
In order to form the layer for including polysiloxanes (A) and polysiloxanes (B) in supporting base material 12, preferably: more than use It states mixing molar ratio and includes the hardening resin composition of polysiloxanes (A) and polysiloxanes (B), and the composition is coated on The layer of composition is formed in supporting base material 12.Pass through the concentration of polysiloxanes (A) and polysiloxanes (B) in regulation composition Deng capableing of the thickness of the layer of control composition.
It should be noted that from the coating of composition become it is good, can with viewpoint that higher speed is coated, can Form the viewpoint of the silicone resin layer of more film, viscosity reduces the viewpoint for the raising for causing levelability and improves coated film From the viewpoint of flatness, solvent is preferably comprised in hardening resin composition.
The type of solvent is not particularly limited, such as can enumerate butyl acetate, heptane, 2-HEPTANONE, 1- methoxyl group -2- third Alcohol acetic ester, toluene, dimethylbenzene, THF, chloroform, diakyl-polysiloxane, saturated hydrocarbons etc..
The kinematic viscosity of solvent is not particularly limited, from the flatness of silicone resin layer 14 it is more excellent from the viewpoint of, Preferably 23mm2/ s is hereinafter, more preferably 12mm2/ s is hereinafter, further preferably 6mm2/ s or less.Lower limit is not particularly limited, It is in most cases 0.1mm2/ s or more.
In order not to make dissolvent residual on the surface for being formed by silicone resin layer, preferably it is dried at 100 DEG C or more, It is preferred that being heated more than the boiling point of solvent.But, it is assumed that even if the solvent for remaining in resin layer surface is transferred to and resin The surface for the glass substrate removed after layer stackup also can implement atmospheric pressure plasma jet treatment etc. by the surface to glass substrate To change the character on surface water contact angle is reduced.
In addition, the boiling point of solvent is not particularly limited, from the flatness of silicone resin layer 14 it is more excellent from the viewpoint of, Preferably 30 DEG C~280 DEG C, more preferably 50 DEG C~230 DEG C.It should be noted that boiling point refers to the value under atmospheric pressure.
Wherein, more easily glass substrate can be removed from implementing after high-temperature heating treatment to glass laminate From the viewpoint of, the boiling point of solvent is preferably 200 DEG C or less.
In addition, even if the boiling point of solvent be higher than 200 DEG C when, if containing such solvent composition in polysiloxanes (A) and the toatl proportion (total content) of polysiloxanes (B) relative to composition all-mass be 70 mass % more than and less than 100 matter % is measured, then can more easily be removed glass substrate implementing after high-temperature heating treatment to glass laminate.It needs Bright, in this approach, the content of the solvent in composition is preferably greater than 0 mass % and is 30 mass % or less.In addition, If it is which, it is easy to remove solvent from silicone resin layer, productivity is also excellent.
The solubility parameter of used solvent, i.e. Hildebrand solubility parameter (SP value) (are also referred to as " uncommon later The SP value of your De Bulande ") it is not particularly limited, such as 18MPa can be enumerated1/2Solvent below, from obtained organosilicon , it is preferable to use the SP value of Hildebrand is 14.0MPa from the viewpoint of the flatness of resin layer 14 is more excellent1/2It is below Solvent.For the solvent, polysiloxanes (A) is excellent in compatibility with polysiloxanes (B), when forming the layer of composition, It will not make the rough surface of this layer, and can volatilize, the result is that the flatness of silicone resin layer 14 is more excellent.
The SP value of the Hildebrand of the solvent is preferably 14.0MPa1/2Hereinafter, more preferably 13.5MPa1/2Hereinafter, Further preferably 13.0MPa1/2Below.Lower limit is not particularly limited, from the compatibility of polysiloxanes (A) and polysiloxanes (B) From the viewpoint of, preferably 10.0MPa1/2More than.
The SP value [δ D, δ P, δ H] of Hansen (Hansen) can be used in above-mentioned Hildebrand solubility parameter (SP value) It is following to indicate.
The SP value of Hildebrand=" (δ D2+δP2+δH2) square root "
Hansen (Hansen) solubility parameter is the solubility parameter that will be imported by Hildebrand (Hildebrand) It is divided into dispersion term δ D, polarity item δ P, tri- kinds of ingredients of hydrogen bond item δ H and the parameter for being expressed as three-dimensional space.Dispersion term δ D is indicated by color Power bring effect is dissipated, polarity item δ P indicates that, by power bring effect between dipole, hydrogen bond item δ H indicates the effect of hydrogen bond force.It needs It is noted that the definition and calculating of Hansen Solubility Parameter are recorded in Charles M.Hansen work, Hansen Solubility Parameter: User's manual (Hansen Solubility Parameters:A Users Handbook) (CRC publishing house, 2007).Separately Outside, by using computer software practice in Hansen Solubility Parameter (Hansen Solubility Parameters in Practice) (HSPiP) can easily extrapolate Hansen Solubility Parameter.It should be noted that in the present invention, in reality When border calculates SP value [δ D, δ P, the δ H] of Hansen, using by software HSPiP 4.1 editions of the production such as Hansen.
It should be noted that as concrete example, for example, according to SP value [δ D, δ P, the δ of the Hansen of octamethylcy-clotetrasiloxane H=12.8,1.3,1], Hildebrand solubility parameter (SP value) is 12.9.
As the solvent of the SP value with above-mentioned Hildebrand, from the phase to polysiloxanes (A) and polysiloxanes (B) From the viewpoint of capacitive is more excellent, silicone resin layer 14 flatness is more excellent, the solvent of silicon atom is preferably comprised, preferably Diakyl-polysiloxane (preferably dimethyl polysiloxane (polydimethylpolysiloxane)).
Can be any one of straight-chain, branched and ring-type as diakyl-polysiloxane, preferably straight-chain or Ring-type, more preferably cyclic annular (such as cyclic dialkyl polysiloxanes).In addition, diakyl-polysiloxane is preferably in above-mentioned viscosity Or in the range of boiling point.
As the concrete example of diakyl-polysiloxane, such as cyclic annular dimethyl represented by following formula (1) can be enumerated and gathered Straight-chain dimethyl polysiloxane represented by siloxanes, formula (2) etc..
In above-mentioned formula (1), n indicates 3~9 integer.
In above-mentioned formula (2), m indicates 3~9 integer.
As compound represented by above-mentioned formula, for example, can enumerate octamethylcy-clotetrasiloxane (Hildebrand , hexamethyl cyclotrisiloxane, decamethylcyclopentaandoxane (the SP value of Hildebrand: 11.5), prestox SP value: 12.9) Trisiloxanes, decamethyl tetrasiloxane (the SP value of Hildebrand: 12.9) etc..
In the case where containing solvent in hardening resin composition, from the viewpoint of coating, polysiloxanes (A) It relative to composition all-mass is preferably 10 mass %~95 mass % with the toatl proportion of polysiloxanes (B), more preferably 20 The mass % of quality %~90, the further preferably 30 mass % of mass %~70, more preferably 30 mass of mass %~50 %.
It is can according to need in hardening resin composition containing in addition to polysiloxanes (A), polysiloxanes (B) and solvent Ingredient in addition.
For example, above-mentioned catalyst, silicone oil can be contained.
In addition, will preferably further have inhibition in hardening resin composition for the purpose for adjusting catalytic activity The activity inhibitor (the also referred to as compound of reaction suppressor, retarding agent etc.) of the effect of catalyst activity is together with catalyst It is used in combination.As activity inhibitor, for example various organonitrogen compounds, organic phosphorus compound, acetylene compound, oxime can be enumerated Compound, organochlorine compound etc..Furthermore it can according to need and contain various dioxies within the scope of the effect of the invention Inorganic fillers such as SiClx, calcium carbonate, iron oxide etc..
Coating contains the hardening resin composition of polysiloxane (A) and polysiloxanes (B) on 12 surface of supporting base material Method be not particularly limited, well known method can be used.Can enumerate for example spray coating method, mouth die coating method, spin-coating method, Dip coating, rolling method, scraper rubbing method, silk screen print method, gravure coating process etc..
It is then possible to implement the drying process for removing solvent as needed.The method of drying process does not limit especially System, can enumerate for example remove at reduced pressure conditions solvent method, polysiloxanes (A) and polysiloxanes (B) solidification not The method etc. heated at a temperature of carrying out.
Next, the layer to the hardening resin composition in supporting base material 12 implements curing process, make the poly- silicon in layer Oxygen alkane (A) is reacted with polysiloxanes (B) and (is specifically crosslinked), to form silicone resin layer 14.More specifically, such as Shown in Fig. 2 (A), silicone resin layer 14 is formed on the surface of at least single side of supporting base material 12 in this process.
As the method for solidification (such as crosslinking), heat cure is generallyd use.
Make polysiloxanes (A) with polysiloxanes (B) as long as temperature condition when reacting is improving silicone resin layer 14 Heat resistance, can control as described above glass substrate 16 and stacking after peel strength (y) in the range of be then not particularly limited, Preferably 80 DEG C~250 DEG C, more preferably 120 DEG C~230 DEG C.In addition, heating time is preferably generally 10 minutes~120 points Clock, more preferably 30 minutes~60 minutes.
It should be noted that the layer of composition can solidify (formally after having carried out precuring (preparation solidification) and having carried out afterwards Solidification) and make its solidification.By carrying out precuring, the available superior silicone resin layer 14 of heat resistance.
(lamination process)
Lamination process is on the organic siliconresin face of the silicone resin layer 14 obtained in above-mentioned resin layer formation process Laminated glass substrate 16 is to successively be had the layer of the layer of supporting base material 12, silicone resin layer 14 and glass substrate 16 The process of glass laminate 10.It more specifically, is following process: as shown in Fig. 2 (B), by silicone resin layer 14 and branch The surface 14a of 12 side opposite side of support group material and the first interarea of the glass substrate 16 with the first interarea 16a and the second interarea 16b Silicone resin layer 14 and glass substrate 16 are laminated as lamination surface by 16a, to obtain glass laminate 10.
The method that glass substrate 16 is laminated on silicone resin layer 14 is not particularly limited, well known side can be used Method.
The method for being overlapped glass substrate 16 on the surface of silicone resin layer 14 for example under atmospheric pressure environment can be enumerated. It should be noted that also can according to need the overlapping glass substrate 16 on the surface of silicone resin layer 14, roller is then used Or press is crimped on glass substrate 16 on silicone resin layer 14.By the crimping using roller or press, relatively easily remove Mixed bubble between silicone resin layer 14 and the layer of glass substrate 16 is removed, therefore preferably.
When being crimped silicone resin layer 14 and glass substrate 16 by vacuum layer platen press or vacuum pressing, it can inhibit Bubble is mixed into, ensures good adherency, therefore more preferably.By being crimped under vacuum, have the further advantage that even if In the case where remaining micro-bubble, bubble will not grow up because of heating, not easily lead to the deformation defect of glass substrate 16.
When glass substrate 16 is laminated, preferably the surface of the glass substrate 16 contacted with silicone resin layer 14 is filled It distinguishes and washes and be laminated under the high environment of cleanliness.The flatness of the more high then glass substrate 16 of cleanliness is the better, therefore It is preferred that.
It should be noted that can according to need after glass substrate 16 is laminated and carry out pre-anneal treatment (such as at heating Reason).By carrying out the pre-anneal treatment, glass substrate 16 after stacking improves the adhesiveness of silicone resin layer 14, can be with Peel strength (y) appropriate is formed, the positional shift of electronic device component is not likely to produce in aftermentioned component formation process Deng the productivity raising of electronic device.
The condition of pre-anneal treatment suitably selects most suitable item according to the type of used silicone resin layer 14 Part preferably exists from the viewpoint of becoming more appropriate from the peel strength (y) made between glass substrate 16 and silicone resin layer 14 200 DEG C or more (preferably 200 DEG C~400 DEG C) carry out heat treatment in above (preferably 5 minutes~30 minutes) in 5 minutes.
It should be noted that the formation of silicone resin layer 14 is not limited to the above method.
For example, in the supporting base material 12 using the material higher than glass substrate 16 to the adhesiveness of surface of silicone resin In the case of, the above-mentioned hardening resin composition containing polysiloxanes (A) and polysiloxanes (B) can be made on certain fissility surface Upper solidify and the film for manufacturing organic siliconresin, and while being present in the film between glass substrate 16 and supporting base material 12 into Row stacking.
In addition, in and its adhesivity sufficiently low to glass substrate 16 by organic siliconresin bring adhesivity to branch support group In the sufficiently high situation of material 12, the above-mentioned hardening resin composition containing polysiloxanes (A) and polysiloxanes (B) can be made Layer is solidified to form silicone resin layer 14 between glass substrate 16 and supporting base material 12.
In addition, even if can also lead in the case where supporting base material 12 includes with 16 same glass material of glass substrate The processing for the adhesivity for implementing to improve 12 surface of supporting base material is crossed to improve the peel strength to silicone resin layer 14.It can example Example is such as: silane coupling agent chemically improves the chemically method (primary coat processing) of fixed force, flame (fire is scorching) processing etc. Increase the physical methods of surface active groups, blasting treatment etc. hook is increased by the roughness on increase surface and (draws っ か か り) mechanicalness processing method etc..
(glass laminate)
Glass laminate 10 of the invention can be used for various uses, can enumerate and for example manufacture aftermentioned display device use Panel, thin-film secondary battery, on surface is formed with the purposes of the electronic components such as the semiconductor wafer of circuit at solar battery (PV) Deng.It should be noted that this is on the way, in most cases glass laminate 10 be exposed to hot conditions (such as 350 DEG C with On) under (such as 1 hour or more).
Here, display device panel include LCD, OLED, Electronic Paper, plasm display panel, field emission panel, Quantum dot LED panel, MEMS (Micro Electro Mechanical Systems, microelectromechanical systems) shutter face plate Deng.
It should be noted that in the case where containing silicone oil in silicone resin layer in glass laminate, organosilicon tree The peel strength at the interface of the layer of rouge layer and glass substrate further decreases, therefore preferably.Specifically, silicone resin layer with The peel strength at the interface of the layer of glass substrate is preferably 0.10N/25mm or more and 1.40N/25mm or less.
[electronic device and its manufacturing method]
In the present invention, the electronic device comprising glass substrate and electronic device component is manufactured using above-mentioned laminated body (being also properly termed as " glass substrate of band member " later).
The manufacturing method of electronic device is not particularly limited, from the productivity of electronic device it is excellent from the viewpoint of, preferably Following method: electronic device component is formed on the glass substrate in above-mentioned glass laminate and manufactures having electronic device structure The laminated body of part, using the glass substrate side interface of silicone resin layer as release surface, from obtained having electronic device component Laminated body be separated into electronic device (glass substrate of band member) and the supporting base material with silicone resin layer.
Hereinafter, manufacturing having electronic device with component for electronic device is formed on the glass substrate in above-mentioned glass laminate The process of the laminated body of part component is known as component formation process, will be removing with the glass substrate side interface of silicone resin layer Face and be separated into the glass substrate of band member and branch support group with silicone resin layer from the laminated body of having electronic device component The process of material is known as separation process.
Hereinafter, being described in detail to material used in each process and sequence.
(component formation process)
Component formation process is formed on glass substrate 16 in the glass laminate 10 obtained in above-mentioned lamination process The process of electronic device component.More specifically, as shown in Fig. 2 (C), (expose table in the second interarea 16b of glass substrate 16 Face) on form electronic device component 20, to obtain the laminated body 22 of having electronic device component.
Firstly, being said in detail to electronic device used in this process with component (also referred to as functional element) 20 It is bright, the sequence of process is described in detail later.
(electronic device component)
Electronic device component 20 is formed on the glass substrate 16 in glass laminate 10, is to constitute electronic device extremely At least part of component.More specifically, it as electronic device component 20, can enumerate for display device panel, too It is positive can battery, thin-film secondary battery or the component that is formed with electronic components such as the semiconductor wafer of circuit etc. on surface it is (such as aobvious Showing device component, component used for solar batteries, thin-film secondary battery component, electronic component-use circuit).
For example, for silicon type, the transparent electricity such as the tin oxide of anode can be enumerated as component used for solar batteries Pole, with p layers/metal of silicon layer and cathode that i layers/n-layer indicates etc., in addition to this, can enumerate quick with compound type, pigment Corresponding various components such as change type, quantum point type etc..
In addition, for type lithium ion, the metal of anode and cathode can be enumerated as thin-film secondary battery component Or the transparent electrodes such as metal oxide, the lithium compound of electrolyte layer, current collection layer metal, as resin of sealant etc., remove Other than this, various components corresponding with ni-mh type, polymer-type, ceramic electrolyte type etc. etc. can be enumerated.
In addition, for CCD, CMOS, metal, the insulation division of conductive part can be enumerated as electronic component-use circuit Silica, silicon nitride etc. can enumerate and the various sensors, rigidity such as pressure sensor, acceleration transducer in addition to this Corresponding various components such as printed base plate, flexible printed board, rigid and flexible printed base plate etc..
(sequence of process)
The manufacturing method of the laminated body 22 of above-mentioned having electronic device component is not particularly limited, according to electronic device structure The type of the member of formation of part simultaneously uses conventionally known method in the second interarea 16b of the glass substrate 16 of glass laminate 10 Upper formation electronic device component 20.
It should be noted that electronic device component 20 can not be on the second interarea 16b of glass substrate 16 finally The whole (hereinafter referred to as " whole components ") of the component of formation, but a part (hereinafter referred to as " part structure of whole components Part ").It is full band can also to be made in the glass substrate for the band part component removed from silicone resin layer 14 in subsequent process The glass substrate (being equivalent to aftermentioned electronic device) of portion's component.
In addition, for the glass substrate with whole components removed from silicone resin layer 14, it can be in its removing Other electronic device components are formed on face (the first interarea 16a).Alternatively, it is also possible to assemble the laminated body with whole components, so Supporting base material 12 is removed from the laminated body with whole components afterwards, to manufacture electronic device.In addition it is also possible to complete using two panels band The laminated body of portion's component is simultaneously assembled, and then two panels supporting base material 12 is removed from the laminated body with whole components, to manufacture The glass substrate of band member with two panels glass substrate.
For example, when in case where manufacturing OLED, in order to the glass substrate 16 of glass laminate 10 and organosilicon (the second interarea 16b for being equivalent to glass substrate 16) forms organic EL structural body and carries out on the surface of 14 side opposite side of resin layer Below various layers formed, the process of processing: the process for forming transparent electrode；Further it is deposited on the face for be formed with transparent electrode The process of hole injection layer, hole transmission layer, luminescent layer, electron transfer layer etc.；The process for forming rear electrode；Use sealing plate The process etc. being sealed.As these layers formed, processing, specifically, can enumerate for example film process, vapor deposition treatment, Gluing processing of sealing plate etc..
In addition, for example, when manufacturing TFT-LCD, including following various processes: TFT formation process, wherein in glassy layer On second interarea 16b of the glass substrate 16 of stack 10, using anti-corrosion liquid to passing through the conventional membrane formation process such as CVD method and sputtering method institute Metal film and metal oxide film of formation etc. carry out pattern formation and form thin film transistor (TFT) (TFT)；CF formation process, wherein On the second interarea 16b of the glass substrate 16 of another glass laminate 10, anti-corrosion liquid is used for pattern and is formed to form filter Color device (CF)；And bonding process, wherein by obtained in TFT formation process with TFT laminated body and CF formation process in obtain With CF laminated body stacking；Deng.
In TFT formation process, CF formation process, using well known photoetching technique, etching technique etc. in glass substrate 16 The second interarea 16b on form TFT, CF.At this point, the coating fluid as pattern formation, can be used anti-corrosion liquid.
It should be noted that can according to need the second interarea 16b progress to glass substrate 16 before forming TFT, CF Cleaning.As cleaning method, well known dry clean, wet-cleaned can be used.
In bonding process, make the thin film transistor (TFT) forming face of the laminated body with TFT and the colour filter of the laminated body with CF Forming face is opposite, is bonded using sealant (such as unit (セ Le) forms ultraviolet hardening sealant).Then, to Liquid crystal material is injected in the unit formed by the laminated body with TFT and the laminated body with CF.As injection liquid crystal material method, Such as there is decompression injection method, injection method is added dropwise.
(separation process)
As shown in Fig. 2 (D), separation process is process as described below: with silicone resin layer 14 and glass substrate 16 Interface is release surface, and the laminated body 22 of the having electronic device component obtained in the above-mentioned component formation process, which is separated into, to be laminated with The glass substrate 16 (glass substrate of band member) and supporting base material 12 of electronic device component 20, to obtain comprising electronics device The glass substrate (electronic device) 24 of part component 20 and the band member of glass substrate 16.
The electronic device component 20 on glass substrate 16 when removing is one of whole member of formation needed for being formed Timesharing can also form remaining member of formation on glass substrate 16 after isolation.
The method removed to glass substrate 16 and supporting base material 12 is not particularly limited.Specifically, for example, can be with It is inserted into the object of sharp cutter shape at the interface of glass substrate 16 and silicone resin layer 14, forms the starting point of removing, then The fluid-mixing of water and compressed air is blown to be removed.Preferably: with the laminated body 22 of having electronic device component Supporting base material 12 be upside, electronic device with 20 side of component be downside mode be arranged on platform, by electronic device component 20 side vacuum suctions make cutter (two-sided be laminated with supporting base material in the case where successively carry out) on platform first in this state Into 14 interface of glass substrate 16- silicone resin layer.Moreover, then with multiple 12 sides of vacuum chuck adsorbent support substrate, from The near sites for inserting cutter successively rise vacuum chuck.In this way, on the boundary of silicone resin layer 14 and glass substrate 16 Face, silicone resin layer 14 cohesional failure face form air layer, which extends to the whole face at interface, cohesional failure face, So as to which easily supporting base material 12 is removed.
In addition, supporting base material 12 can be laminated to manufacture glass laminate 10 of the invention with new glass substrate.
It should be noted that when from the glass substrate 24 of the laminated body 22 of having electronic device component separation band member, By being blown using ion generator, controlling humidity, the fragment electrostatic that can further suppress silicone resin layer 14 is inhaled Invest the glass substrate 24 of band member.
The manufacturing method of the glass substrate 24 of above-mentioned band member is suitable for manufacturing used in the mobile terminals such as mobile phone, PDA Compact display apparatus.Display device is mainly LCD or OLED, as LCD, including TN type, STN type, FE type, TFT type, mim type, IPS type, VA type etc..It can be applied in the case where any display device substantially in passive driving types, active-drive.
It as the glass substrate 24 of the band member using above method manufacture, can enumerate: there is glass substrate and display The display device panel of device component, has glass at the solar battery with glass substrate and component used for solar batteries The thin-film secondary battery of glass substrate and thin-film secondary battery component, the ministry of electronics industry with glass substrate and electronic device component Part etc..As display device panel, including liquid crystal display panel, organic EL panel, plasm display panel, field emission panel Deng.
Embodiment
Hereinafter, the present invention is concretely demonstrated by embodiment etc., but the present invention is not limited to these Examples.
In following Examples 1 to 25, comparative example 1~2, as supporting base material, use comprising alkali-free borosilicic acid glass Glass plate (long 240mm, wide 240mm, plate thickness 0.5mm, the linear expansion coefficient 38 × 10 of glass-7/ DEG C, Asahi Glass company manufacture quotient The name of an article " AN100 ").
<embodiment 1>
Firstly, the supporting base material that plate thickness is 0.5mm is carried out pure water cleaning, then further progress UV is cleaned, thus clean Purification.
Next, alkenyl organopolysiloxane (number-average molecular weight: the 2000, quantity of alkenyl: 2 or more) (100 matter will be contained Measure part) cooperate with hydrogen polysiloxanes (number-average molecular weight: the 2000, quantity of hydrosilyl group: 2 or more) (15 mass parts).It needs It is noted that the mixing molar ratio of the hydrosilyl group in the alkenyl and hydrogen polysiloxanes in organopolysiloxane containing alkenyl (molal quantity/alkenyl molal quantity of hydrosilyl group) is 0.9/1.In addition, poly- relative to organopolysiloxane containing alkenyl and hydrogen The gross mass of siloxanes adds 300ppm catalyst (platinum catalyst).Using the liquid as hardening resin composition X.Use mouth Hardening resin composition X is coated on the first interarea of supporting base material by coater, to set in supporting base material The layer containing uncured organopolysiloxane containing alkenyl and hydrogen polysiloxanes is set.
Next, be heating and curing within 10 minutes at 230 DEG C, in atmosphere, thus on the first interarea of supporting base material Form the silicone resin layer with a thickness of 10 μm.It should be noted that the flatness of silicone resin layer is good.
Then, glass substrate is bonded by vacuum compacting at room temperature with the organic siliconresin level of supporting base material, from And glass laminate A is obtained.
At this point, having used glass plate (long 200mm, width 200mm, plate comprising alkali-free pyrex as glass substrate Thick 0.2mm, linear expansion coefficient 38 × 10-7/ DEG C, Asahi Glass company manufacture trade name " AN100 ").
In obtained glass laminate A, supporting base material and glass substrate in the case where not generating bubble with organosilicon Resin layer adherency, and also without becoming shape defect.In addition, in glass laminate A, silicone resin layer and supporting base material The peel strength at the interface of layer is greater than the peel strength of the layer of glass substrate and the interface of silicone resin layer.
Next, glass laminate A is carried out heating for 60 minutes in 350 DEG C under nitrogen atmosphere, and it is cooled to room temperature, As a result it is outer that the supporting base material of glass laminate A and the separation of glass substrate, the foaming of silicone resin layer, albefaction etc. are not confirmed Variation in sight.
Then, it to the following disbonded tests of the progress of the glass laminate A after heat treatment in 60 minutes are carried out at 350 DEG C, measures The peel strength of glass substrate (N/25mm).Peel strength at this time is 1.49N/25mm.
(measuring method of peel strength)
The measuring method of peel strength is to prepare width to be 25mm, the glass laminate A that length is 70mm and use The removing of Autograph AG-20/50kNXDplus (Shimadzu Seisakusho Ltd.) progress glass substrate.
At this point, to the interface inserting thickness of glass substrate and silicone resin layer be 0.1mm stainless steel cutter and shape At the notch of removing, then glass substrate is completely fixed, lifts supporting base material, thus carries out the measurement of intensity.It needs Bright, peeling rate is 30mm/ minutes.The position that will test load is set as 0, and the position of 2.0mm will be lifted from the position The peel strength at place is as measured value.
<embodiment 2>
It replaces containing alkenyl using organopolysiloxane containing alkenyl (number-average molecular weight: the 5000, quantity of alkenyl: 2 or more) Organopolysiloxane (number-average molecular weight: 2000), in addition to this, has been obtained glass laminated by method similarly to Example 1 Body B.It should be noted that adjusting the usage amount of the organopolysiloxane containing alkenyl so that alkenyl in organopolysiloxane containing alkenyl It is same as Example 1 with the mixing molar ratio of the hydrosilyl group in hydrogen polysiloxanes.
The flatness of obtained silicone resin layer is good.
In addition, in obtained glass laminate B, supporting base material and glass substrate in the case where not generating bubble with have The adherency of machine silicone layer, and also without becoming shape defect.In addition, in glass laminate B, silicone resin layer and branch support group The peel strength at the interface of the layer of material is greater than the peel strength of the layer of glass substrate and the interface of silicone resin layer.
Next, carrying out heat treatment similarly to Example 1 to glass laminate B, as a result do not confirm glass laminated The apparent variation such as the supporting base material of body B and the separation of glass substrate, the foaming of silicone resin layer, albefaction.
In addition, the peel strength after heat treatment is 1.51N/25mm.
<embodiment 3>
It replaces containing alkenyl using organopolysiloxane containing alkenyl (number-average molecular weight: the 8000, quantity of alkenyl: 2 or more) Organopolysiloxane (number-average molecular weight: 2000), in addition to this, has been obtained glass laminated by method similarly to Example 1 Body C.It should be noted that adjusting the usage amount of the organopolysiloxane containing alkenyl so that alkenyl in organopolysiloxane containing alkenyl It is same as Example 1 with the mixing molar ratio of the hydrosilyl group in hydrogen polysiloxanes.
The flatness of obtained silicone resin layer is good.
In addition, in obtained glass laminate C, supporting base material and glass substrate in the case where not generating bubble with have The adherency of machine silicone layer, and also without becoming shape defect.In addition, in glass laminate C, silicone resin layer and branch support group The peel strength at the interface of the layer of material is greater than the peel strength of the layer of glass substrate and the interface of silicone resin layer.
Next, carrying out heat treatment similarly to Example 1 to glass laminate C, as a result do not confirm glass laminated The apparent variation such as the supporting base material of body C and the separation of glass substrate, the foaming of silicone resin layer, albefaction.
In addition, the peel strength after heat treatment is 1.56N/25mm.
<embodiment 4>
Further added into hardening resin composition X octamethylcy-clotetrasiloxane (chemical industrial company, SHIN-ETSU HANTOTAI manufacture, KF-994.Kinematic viscosity (25 DEG C): 2.3mm2/ s, boiling point: 175 DEG C, SP value: 12.9MPa1/2) it is used as solvent, in addition to this, lead to The method crossed similarly to Example 1 has obtained glass laminate D.
It should be noted that the usage amount of octamethylcy-clotetrasiloxane is set as organopolysiloxane containing alkenyl and hydrogen gathers The amount that the total amount of siloxanes is 80 mass % relative to composition whole amount.
It should be noted that compared with Example 1, the coating speed of die coater at this time can be with 2 times of speed Degree is coated.In addition, at this point, spray volume about hardening resin composition X, is adjusted to form 10 μm of organosilicon Resin layer.
The flatness of obtained silicone resin layer is good.
In addition, in obtained glass laminate D, supporting base material and glass substrate in the case where not generating bubble with have The adherency of machine silicone layer, and also without becoming shape defect.In addition, in glass laminate D, silicone resin layer and branch support group The peel strength at the interface of the layer of material is greater than the peel strength of the layer of glass substrate and the interface of silicone resin layer.
Next, carrying out heat treatment similarly to Example 1 to glass laminate D, as a result do not confirm glass laminated The apparent variation such as the supporting base material of body D and the separation of glass substrate, the foaming of silicone resin layer, albefaction.
In addition, the peel strength after heat treatment is 1.46N/25mm.
<embodiment 5>
Using IP SOLVENT 2028, (Chu Guangxingchan company is manufactured.Kinematic viscosity (40 DEG C): 2.53mm2/ s, boiling point: 216 DEG C~262 DEG C, SP value: 14.5MPa1/2~16.3MPa1/2) replace octamethylcy-clotetrasiloxane (chemical industrial company, SHIN-ETSU HANTOTAI Manufacture, KF-994) it is used as solvent to obtain glass laminate E by method similarly to Example 4 in addition to this.
It should be noted that compared with Example 1, the coating speed of die coater at this time can be with 2 times of speed Degree is coated.In addition, at this point, spray volume about hardening resin composition X, is adjusted to form 10 μm of organosilicon Resin layer.
In glass laminate E, the peel strength at the interface of the layer of silicone resin layer and supporting base material is greater than glass base The peel strength at the interface of the layer and silicone resin layer of plate.
Next, glass laminate E carries out heat treatment similarly to Example 1, glass laminate E is not as a result confirmed Supporting base material and the apparent variation such as the separation of glass substrate, the foaming of silicone resin layer, albefaction.
In addition, the peel strength after heat treatment is 1.49N/25mm.
It should be noted that supporting base material and glass substrate are in the feelings for not generating bubble in obtained glass laminate E It is adhered under condition with silicone resin layer, and also without becoming shape defect, but the flatness of silicone resin layer is slightly poor.
<embodiment 6>
The glass comprising alkali-free pyrex is replaced using the glass plate (plate thickness 0.1mm) comprising alkali-free pyrex Plate (plate thickness 0.2mm) has obtained glass laminate F by method similarly to Example 1 in addition to this as glass substrate.
In obtained glass laminate F, supporting base material and glass substrate in the case where not generating bubble with organosilicon Resin layer adherency, and also without becoming shape defect.In addition, in glass laminate F, silicone resin layer and supporting base material The peel strength at the interface of layer is greater than the peel strength of the layer of glass substrate and the interface of silicone resin layer.
Next, carrying out heat treatment similarly to Example 1 to glass laminate F, as a result do not confirm glass laminated The apparent variation such as the supporting base material of body F and the separation of glass substrate, the foaming of silicone resin layer, albefaction.
In addition, the peel strength after heat treatment is 1.48N/25mm.
<comparative example 1>
It replaces containing alkenyl using organopolysiloxane containing alkenyl (number-average molecular weight: the 10000, quantity of alkenyl: 2 or more) Organopolysiloxane (number-average molecular weight: 2000), in addition to this, has been obtained glass laminated by method similarly to Example 1 Body G.It should be noted that adjusting the usage amount of the organopolysiloxane containing alkenyl so that alkenyl in organopolysiloxane containing alkenyl It is same as Example 1 with the mixing molar ratio of the hydrosilyl group in hydrogen polysiloxanes.
The flatness of obtained silicone resin layer is good.
In addition, in obtained glass laminate G, supporting base material and glass substrate in the case where not generating bubble with have The adherency of machine silicone layer, and also without becoming shape defect.In addition, in glass laminate G, silicone resin layer and branch support group The peel strength at the interface of the layer of material is greater than the peel strength of the layer of glass substrate and the interface of silicone resin layer.
Next, carrying out heat treatment similarly to Example 1 to glass laminate G, as a result do not confirm glass laminated The apparent variation such as the supporting base material of body G and the separation of glass substrate, the foaming of silicone resin layer, albefaction.
In addition, the peel strength after heat treatment is 1.75N/25mm.
<comparative example 2>
It replaces containing alkenyl using organopolysiloxane containing alkenyl (number-average molecular weight: the 15000, quantity of alkenyl: 2 or more) Organopolysiloxane (number-average molecular weight: 10000), has been obtained by method same as comparative example 1 glass laminated in addition to this Body H.It should be noted that adjusting the usage amount of the organopolysiloxane containing alkenyl so that alkenyl in organopolysiloxane containing alkenyl It is same as Example 1 with the mixing molar ratio of the hydrosilyl group in hydrogen polysiloxanes.
The flatness of obtained silicone resin layer is good.
In addition, in obtained glass laminate H, supporting base material and glass substrate in the case where not generating bubble with have The adherency of machine silicone layer, and also without becoming shape defect.In addition, in glass laminate H, silicone resin layer and branch support group The peel strength at the interface of the layer of material is greater than the peel strength of the layer of glass substrate and the interface of silicone resin layer.
Next, carrying out heat treatment similarly to Example 1 to glass laminate H, as a result do not confirm glass laminated The apparent variation such as the supporting base material of body H and the separation of glass substrate, the foaming of silicone resin layer, albefaction.
In addition, the peel strength after heat treatment is 1.78N/25mm.
<operational evaluation>
The operation of each glass laminate of the above embodiments 1~6 and Comparative Examples 1 and 2 and aftermentioned embodiment 7~25 The evaluation of property carries out as described below.
The silicone resin layer in glass laminate (width 25mm, length 70mm) obtained in embodiment and comparative example In be inserted into the stainless steel cutter of 5mm with the one end at the interface of glass substrate, and move stainless steel cutter along its length Dynamic 50mm.It will be denoted as "○" in the situation for not causing the rupture of glass substrate and moving stainless steel cutter successfully, it will not Rust steel cutter mobile difficult and the case where causing the rupture of glass substrate is denoted as "×".For as a result, remembering in table 1~3 Table in operability column in.
The mobile easy degree and silicone resin layer of above-mentioned stainless steel cutter are related to the peel strength of glass substrate, When peel strength is big, stainless steel cutter is difficult to move.
<evaluation of peel strength>
The removing of each glass laminate of the above embodiments 1~6 and Comparative Examples 1 and 2 and aftermentioned embodiment 7~25 Obtained from the evaluation of intensity is measured using the method as shown in the project of above-mentioned (measuring method of peel strength) Numerical value.
The specification and evaluation result of above-described embodiment 1~6 and Comparative Examples 1 and 2 are summarized and are shown below as table 1.
It should be noted that in tables 1 and 2, the unit of SP value (the SP value of Hildebrand) is MPa1/2。
In tables 1 and 2, " polysiloxanes (A) " refers to organopolysiloxane containing alkenyl.
In table 1, about " flatness ", the good situation of flatness is denoted as "○", will practical upper there is no problem but bad Good situation is denoted as " △ ", the practical situation of problems of flatness difference is denoted as "×".
Table 1
When as shown in table 1, using polysiloxanes (A) of the number-average molecular weight in the range of 500~9000, peel strength It is low, it is easy to remove glass substrate.Due to the fissility of the glass substrate, productivity is also excellent.
In addition, in the case where hardening resin composition contains solvent, being confirmed according to embodiment 4 compared with 5: SP value by using Hildebrand is 14.0MPa1/2The flatness of solvent below, silicone resin layer is more excellent.
On the other hand, using number-average molecular weight not polysiloxanes in the range of 500~9000 (A) when, peel strength Increase, the result is that operability is also poor.
<embodiment 7>
Further added into hardening resin composition X octamethylcy-clotetrasiloxane (chemical industrial company, SHIN-ETSU HANTOTAI manufacture, KF-994.Kinematic viscosity (25 DEG C): 2.3mm2/ s, boiling point: 175 DEG C, SP value: 12.9MPa1/2) it is used as solvent, in addition to this, lead to The method crossed similarly to Example 1 has obtained glass laminate I.
It should be noted that the usage amount of octamethylcy-clotetrasiloxane is set as organopolysiloxane containing alkenyl and hydrogen gathers The amount that the total amount of siloxanes is 40 mass % relative to composition whole amount.
<embodiment 8>
Further added into hardening resin composition X decamethylcyclopentaandoxane (chemical industrial company, SHIN-ETSU HANTOTAI manufacture, KF-995.Kinematic viscosity (25 DEG C): 4mm2/ s, boiling point: 210 DEG C, SP value: 11.5MPa1/2) pass through in addition to this as solvent Method similarly to Example 1 has obtained glass laminate J.
It should be noted that the usage amount of decamethylcyclopentaandoxane is set as organopolysiloxane containing alkenyl and hydrogen gathers The amount that the total amount of siloxanes is 40 mass % relative to composition whole amount.
<embodiment 9>
Further added into hardening resin composition X decamethylcyclopentaandoxane (chemical industrial company, SHIN-ETSU HANTOTAI manufacture, KF-995.Kinematic viscosity (25 DEG C): 4mm2/ s, boiling point: 210 DEG C, SP value: 11.5MPa1/2) pass through in addition to this as solvent Method similarly to Example 1 has obtained glass laminate K.
It should be noted that the usage amount of decamethylcyclopentaandoxane is set as organopolysiloxane containing alkenyl and hydrogen gathers The amount that the total amount of siloxanes is 60 mass % relative to composition whole amount.
<embodiment 10>
Further added into hardening resin composition X decamethylcyclopentaandoxane (chemical industrial company, SHIN-ETSU HANTOTAI manufacture, KF-995.Kinematic viscosity (25 DEG C): 4mm2/ s, boiling point: 210 DEG C, SP value: 11.5MPa1/2) pass through in addition to this as solvent Method similarly to Example 1 has obtained glass laminate L.
It should be noted that the usage amount of decamethylcyclopentaandoxane is set as organopolysiloxane containing alkenyl and hydrogen gathers The amount that the total amount of siloxanes is 70 mass % relative to composition whole amount.
<embodiment 11>
Further added into hardening resin composition X decamethylcyclopentaandoxane (chemical industrial company, SHIN-ETSU HANTOTAI manufacture, KF-995.Kinematic viscosity (25 DEG C): 4mm2/ s, boiling point: 210 DEG C, SP value: 11.5MPa1/2) pass through in addition to this as solvent Method similarly to Example 1 has obtained glass laminate M.
It should be noted that the usage amount of decamethylcyclopentaandoxane is set as organopolysiloxane containing alkenyl and hydrogen gathers The amount that the total amount of siloxanes is 80 mass % relative to composition whole amount.
<embodiment 12>
Further added into hardening resin composition X octamethylcy-clotetrasiloxane (chemical industrial company, SHIN-ETSU HANTOTAI manufacture, KF-994.Kinematic viscosity (25 DEG C): 2.3mm2/ s, boiling point: 175 DEG C, SP value: 12.9MPa1/2) it is used as solvent, in addition to this, lead to The method crossed similarly to Example 1 has obtained glass laminate N.
It should be noted that the usage amount of octamethylcy-clotetrasiloxane is set as organopolysiloxane containing alkenyl and hydrogen gathers The amount that the total amount of siloxanes is 50 mass % relative to composition whole amount.
By the specification of above-described embodiment 1,4,5,7~12 and peel strength, operability and the evaluation result of stackability again Summarize and is shown below as table 2.
It should be noted that the evaluation of stackability is carried out by following methods again shown in table 2 and table 3.
<evaluation method of stackability again>
After the high-temperature process of glass laminate, glass substrate is removed from glass laminate and obtains the branch support group of resin layer Material the supporting base material of same resin layer is laminated with new glass substrate again in use, being by following methods evaluation It is no to be easy to be adsorbed and be easy stacking (using the evaluation as " evaluation of stackability again ").
Glass laminate A is carried out heating for 60 minutes in 350 DEG C under nitrogen atmosphere, and is cooled to room temperature.Then, from Glass substrate is removed in the glass laminate A that 350 DEG C carry out after heat treatment in 60 minutes, to obtain the branch of resin layer Support group material.
Make the supporting base material of the resin layer obtained by the removing relative to the peace and quiet glass substrate newly prepared normal Pressure carries out roll-type and (ロ ー Le lamination is laminated).
It should be noted that using glass laminate I, N replace glass laminate A and by as described above the step of into The stacking of row roll-type.It should be noted that the stackability again in table 3 is replaced using from glass laminate O to glass laminate AA Glass laminate A simultaneously carries out by as described above the step of obtaining and roll-type stacking.
As evaluation criteria, bubble is not on the basis of glass laminate A (embodiment 1), when will be laminated compared with Example 1 Easily residual the case where be denoted as " ◎ ", the situation same with embodiment 1 be denoted as to "○", will compared with Example 1 bubble be easy it is residual The case where staying is denoted as "×", by its result note in table 2 and 3.
Table 2
As shown in table 2, used boiling point be 200 DEG C of solvents below embodiment 4,7 and 12 in, no matter polysiloxanes (A) and the total content of polysiloxanes (B) how, peel strength is all low, be easy glass substrate is removed.
In addition, the comparison of the embodiment 5,8~11 by having used solvent of the boiling point higher than 200 DEG C is it is found that polysiloxanes (A) When total content with polysiloxanes (B) is 70 mass % or more, peel strength is lower, it is easier to remove glass substrate.
<embodiment 13>
When the gross mass of " polysiloxanes (A) and polysiloxanes (B) " is set as 100 mass parts, to curable resin Dimethyl polysiloxane (manufacture of chemical industrial company, SHIN-ETSU HANTOTAI, KF-96-200cs of 1 mass parts are further added in composition X. Kinematic viscosity (25 DEG C): 200mm2/ s) be used as silicone oil, in addition to this according to similarly to Example 1 the step of obtained glassy layer Stack O.
<embodiment 14>
The usage amount of dimethyl polysiloxane is become into 4 mass parts from 1 mass parts, in addition to this, according to embodiment 13 Same step has obtained glass laminate P.
<embodiment 15>
Eight first as solvent are further added into hardening resin composition X together with above-mentioned dimethyl polysiloxane Basic ring tetrasiloxane (manufacture of chemical industrial company, SHIN-ETSU HANTOTAI, KF-994.Kinematic viscosity (25 DEG C): 2.3mm2/ s, boiling point: 175 DEG C, SP value: 12.9MPa1/2), in addition to this, according to similarly to Example 13 the step of obtained glass laminate Q.
It should be noted that the usage amount of octamethylcy-clotetrasiloxane is set as organopolysiloxane containing alkenyl and hydrogen gathers The amount that the total amount of siloxanes is 40 mass % relative to composition whole amount.
<embodiment 16>
The usage amount of dimethyl polysiloxane is become into 2 mass parts from 1 mass parts, in addition to this, according to embodiment 15 Same step has obtained glass laminate R.
<embodiment 17>
By dimethyl polysiloxane (manufacture of chemical industrial company, SHIN-ETSU HANTOTAI, KF-96-200cs.Kinematic viscosity (25 DEG C): 200mm2/ s) become dimethyl polysiloxane (manufacture of chemical industrial company, SHIN-ETSU HANTOTAI, KF-96-50cs.Kinematic viscosity (25 DEG C): 50mm2/ s) be used as silicone oil, change as solvent octamethylcy-clotetrasiloxane usage amount, in addition to this, according to embodiment 16 same steps have obtained glass laminate S.
It should be noted that the usage amount of octamethylcy-clotetrasiloxane is set as organopolysiloxane containing alkenyl and hydrogen gathers The amount that the total amount of siloxanes is 50 mass % relative to composition whole amount.
<embodiment 18>
By dimethyl polysiloxane (manufacture of chemical industrial company, SHIN-ETSU HANTOTAI, KF-96-50cs.Kinematic viscosity (25 DEG C): 50mm2/ s) become dimethyl polysiloxane (manufacture of chemical industrial company, SHIN-ETSU HANTOTAI, KF-96-200cs.Kinematic viscosity (25 DEG C): 200mm2/ s), in addition to this, according to similarly to Example 17 the step of obtained glass laminate T.
<embodiment 19>
By dimethyl polysiloxane (manufacture of chemical industrial company, SHIN-ETSU HANTOTAI, KF-96-50cs.Kinematic viscosity (25 DEG C): 50mm2/ s) become dimethyl polysiloxane (manufacture of chemical industrial company, SHIN-ETSU HANTOTAI, KF-96-1000cs.Kinematic viscosity (25 DEG C): 1000mm2/ s), in addition to this, according to similarly to Example 17 the step of obtained glass laminate U.
<embodiment 20>
By dimethyl polysiloxane (manufacture of chemical industrial company, SHIN-ETSU HANTOTAI, KF-96-50cs.Kinematic viscosity (25 DEG C): 50mm2/ s) become dimethyl polysiloxane (manufacture of chemical industrial company, SHIN-ETSU HANTOTAI, KF-96H-10000cs.Kinematic viscosity (25 DEG C): 10000mm2/ s), in addition to this, according to similarly to Example 17 the step of obtained glass laminate V.
<embodiment 21>
Eight first as solvent are further added into hardening resin composition X together with above-mentioned dimethyl polysiloxane Basic ring tetrasiloxane (manufacture of chemical industrial company, SHIN-ETSU HANTOTAI, KF-994.Kinematic viscosity (25 DEG C): 2.3mm2/ s, boiling point: 175 DEG C, SP value: 12.9MPa1/2), in addition to this, according to similarly to Example 14 the step of obtained glass laminate W.
It should be noted that the usage amount of octamethylcy-clotetrasiloxane is set as organopolysiloxane containing alkenyl and hydrogen gathers The amount that the total amount of siloxanes is 50 mass % relative to composition whole amount.
<embodiment 22>
The usage amount of dimethyl polysiloxane is become into 6 mass parts from 4 mass parts, in addition to this, according to embodiment 21 Same step has obtained glass laminate X.
<embodiment 23>
The usage amount of dimethyl polysiloxane is become into 8 mass parts from 4 mass parts, in addition to this, according to embodiment 21 Same step has obtained glass laminate Y.
<embodiment 24>
The usage amount of dimethyl polysiloxane is become into 10 mass parts from 4 mass parts, in addition to this, according to embodiment 21 Same step has obtained glass laminate Z.
<embodiment 25>
The usage amount of dimethyl polysiloxane is become into 15 mass parts from 4 mass parts, in addition to this, according to embodiment 21 Same step has obtained glass laminate AA.
Silicone resin layer in glass laminate obtained in above-described embodiment 7~25 (glass laminate I~AA) Flatness is good.
In addition, supporting base material and glass substrate are not generating in obtained glass laminate (glass laminate I~AA) It is adhered in the case where bubble with silicone resin layer, and also without becoming shape defect.In addition, in glass laminate (glassy layer Stack I~AA) in, the peel strength at the interface of the layer of silicone resin layer and supporting base material be greater than the layer of glass substrate with it is organic The peel strength at the interface of silicone layer.
Next, carrying out heat treatment similarly to Example 1 to glass laminate (glass laminate I~AA), as a result, The separation, organic of supporting base material and glass substrate is not all confirmed in any glass laminate (glass laminate I~AA) The apparent variation such as foaming, the albefaction of silicone layer.
2 He of table is shown in addition, the peel strength after the heat treatment of glass laminate (glass laminate I~AA) is summarized In table 3.The measuring method of peel strength is similarly to Example 1.
By each specification and peel strength of above-described embodiment 13~25, operability and again the evaluation result of stackability summarizes It is shown below as table 3.
It should be noted that " content " in table 3 indicates " polysiloxanes (A) " and " polysiloxanes (B) " in composition Total content (quality %) relative to composition all-mass.
Table 3
As shown in table 3, compared with the embodiment 1,7,12 for being not added with silicone oil shown in table 2, it is added to the embodiment of silicone oil The peel strength of 13 to embodiment 25 reduces, and re-workability is also excellent.
<embodiment 26>
In this example, OLED is manufactured using glass laminate A obtained in embodiment 1.
Firstly, successively will nitridation by plasma CVD method on the second interarea of the glass substrate of glass laminate A Silicon, silica, amorphous silicon film forming.Next, the boron of low concentration is injected into amorphous silicon layer by ion doping apparatus, in nitrogen Heated under atmosphere and carry out Dehydroepiandrosterone derivative.Next, being carried out by laser anneal device at the crystallization of amorphous silicon layer Reason.Next, the phosphorus of low concentration is injected into amorphous silicon layer using photolithographic etching and ion doping apparatus is used, thus Form the TFT zone of N-type and p-type.Next, the second main surface side in glass substrate forms oxidation by plasma CVD method Silicon fiml and form gate insulating film, then molybdenum is formed a film by sputtering method, and by using it is photolithographic etching form grid Electrode.Next, by photoetching process and ion doping apparatus, to the boron of N-type, the respective desired region injection high concentration of p-type And phosphorus, to form source region and drain region.Next, in the second main surface side of glass substrate, by being based on plasma The film forming of the silica of body CVD method forms interlayer dielectric, passes through the film forming and the photolithographic erosion of use of the aluminium based on sputtering method Form TFT electrode quarter.Next, being heated under a hydrogen atmosphere and carrying out hydrogenation treatment, then using based on plasma The film forming of the nitrogen silicon of body CVD method forms passivation layer.Next, in the second main surface side coated UV line curability tree of glass substrate Rouge forms planarization layer and contact hole by photoetching process.Next, tin indium oxide is formed a film by sputtering method, and by using Photolithographic etching forms pixel electrode.
Next, 4 as hole injection layer are sequentially formed in the second main surface side of glass substrate by vapour deposition method, 4 ', 4 "-three (3- methylphenylphenyl amino) triphenylamine films, bis- [(N- naphthalene)-N- phenyl] biphenyl as hole transmission layer Amine film, as luminescent layer in 8-hydroxyquinoline aluminium complex (Alq3) in be mixed with the bis- [4- [N- (4- of 2,6- of 40 volume % Methoxyphenyl)-N- phenyl] aminostyryl] and naphthalene -1,5- dintrile (BSN-BCN) blend films, as electron transfer layer Alq3Film.Next, by sputtering method by aluminium film, by using photolithographic etching shape paired electrode.Next, Second main surface side of glass substrate is bonded another sheet glass substrate across the adhesive layer of ultraviolet hardening and is sealed.Pass through Above-mentioned steps form organic EL structural body on the glass substrate.It is glass laminated with organic EL structural body on the glass substrate Body A (hereinafter referred to as panel A) is the laminated body of having electronic device component of the invention.
Next, make the sealing side vacuum suction of panel A in platform, then to the corner of panel A glass substrate with The interface inserting thickness of resin layer is the stainless steel cutter of 0.1mm, forms removing at the interface of glass substrate and resin layer Starting point.Then, using the supporting base material surface of vacuum chuck absorption panel A, then increase sucker.Here, being sent out from ion Raw device (manufacture of Keyemce company) carries out the insertion of cutter while removing electronic fluids to interface blowing.Next, from ion Generator is to while being formed by gap and continue blowing except electronic fluids, and lifting while making water logging to removing forward position Vacuum chuck.As a result, the glass substrate for being formed with organic EL structural body can be remained on platform and by the branch of resin layer The removing of support group material.
Next, using laser cutting machine or or scribing line-splitting up method cutting separation after glass substrate, and be divided into multiple Then the glass substrate for being formed with organic EL structural body and opposite substrate are assembled, implement module formation process, to make by unit Make OLED.The obtained OLED is characteristically without leading to the problem of.
Industrial applicability
It can inhibit glass substrate and silicone resin layer after high-temperature heating treatment according to the present invention it is possible to provide Peel strength raising, so as to easily by glass substrate remove glass laminate and its manufacturing method, the glass Component when laminated body is as manufacture electronic device is useful.
It should be noted that Japanese patent application No. 2014-081190 and 2014 11 that on April 10th, 2014 is proposed Japanese patent application 2014-236275 specification months 21 days proposing, claims, drawings and abstract full content It is incorporated in this, is introduced as the disclosure.
Appended drawing reference
10: glass laminate
12: supporting base material
14: silicone resin layer
14a: the first interarea of silicone resin layer
16: glass substrate
16a: the first interarea of glass substrate
16b: the second interarea of glass substrate
18: the supporting base material with silicone resin layer
20: electronic device component
22: the laminated body of having electronic device component
24: the glass substrate of band member

Claims (12)

1. a kind of glass laminate successively has the layer of supporting base material, the layer of silicone resin layer and glass substrate, the branch The peel strength at the interface of the layer of support group material and the silicone resin layer is higher than the silicone resin layer and the glass base The peel strength at the interface of the layer of plate, wherein
Organic siliconresin in the silicone resin layer be make to have alkenyl and number-average molecular weight 500~9000 containing alkenyl Organopolysiloxane (A) is implemented to react to obtain in the presence of a catalyst with the hydrogen polysiloxanes (B) with hydrosilyl group Solidfied material, relative to the gross mass of polysiloxanes (A) and polysiloxanes (B), the catalyst is 1 matter of mass ppm~1000 It measures ppm but does not include 1000 mass ppm,
With molal quantity/alkenyl molal quantity of hydrosilyl group indicate described in it is described in organopolysiloxane containing alkenyl (A) The mixing molar ratio of alkenyl and the hydrosilyl group in the hydrogen polysiloxanes (B) is 0.7/1~1.3/1.
2. glass laminate as described in claim 1, wherein the silicone resin layer is the solidification as described below to coating Property resin combination obtained from layer implement curing process obtained from layer,
The hardening resin composition includes the organopolysiloxane containing alkenyl (A), the hydrogen polysiloxanes (B) He Xier De Bulande solubility parameter (SP value) is 14.0MPa1/2Solvent below, and with molal quantity/alkenyl of hydrosilyl group Molal quantity indicate the organopolysiloxane containing alkenyl (A) in the alkenyl with it is described in the hydrogen polysiloxanes (B) The mixing molar ratio of hydrosilyl group is 0.7/1~1.3/1.
3. glass laminate as claimed in claim 2, wherein the solvent is the solvent containing silicon atom.
4. glass laminate as claimed in claim 2 or claim 3, wherein the solvent is cyclic annular or straight-chain the poly- silicon of dialkyl group Oxygen alkane.
5. glass laminate as described in claim 1, wherein the silicone resin layer is the solidification as described below to coating Property resin combination obtained from layer implement curing process obtained from layer,
The hardening resin composition includes the organopolysiloxane containing alkenyl (A), the hydrogen polysiloxanes (B) and boiling point For 200 DEG C of solvents below, and with molal quantity/alkenyl molal quantity of hydrosilyl group indicate described in it is organic poly- containing alkenyl The mixing molar ratio of the hydrosilyl group in the alkenyl and the hydrogen polysiloxanes (B) in siloxanes (A) is 0.7/1 ~1.3/1.
6. glass laminate as described in claim 1, wherein the silicone resin layer is the solidification as described below to coating Property resin combination obtained from layer implement curing process obtained from layer,
The hardening resin composition includes the organopolysiloxane containing alkenyl (A), the hydrogen polysiloxanes (B) and boiling point Solvent more than 200 DEG C, with molal quantity/alkenyl molal quantity of hydrosilyl group indicate described in organopolysiloxane containing alkenyl (A) the mixing molar ratio of the hydrosilyl group in the alkenyl and the hydrogen polysiloxanes (B) in is 0.7/1~1.3/ 1, and the total content of the organopolysiloxane containing alkenyl (A) and the hydrogen polysiloxanes (B) is 70 mass % or more and small In 100 mass %.
7. glass laminate as claimed in claim 1 or 2, wherein the silicone resin layer with a thickness of 2 μm~100 μm.
8. glass laminate as claimed in claim 1 or 2, wherein the supporting base material is glass plate.
9. glass laminate as claimed in claim 1 or 2, wherein also contain silicone oil in the silicone resin layer.
10. a kind of glass laminate successively has the layer of supporting base material, the layer of silicone resin layer and glass substrate, described The peel strength at the interface of the layer of supporting base material and the silicone resin layer is higher than the silicone resin layer and the glass The peel strength at the interface of the layer of substrate, wherein
Organic siliconresin in the silicone resin layer be make to have alkenyl and number-average molecular weight 500~9000 containing alkenyl Organopolysiloxane (A) is implemented to react to obtain in the presence of a catalyst with the hydrogen polysiloxanes (B) with hydrosilyl group Solidfied material,
Contain silicone oil in the silicone resin layer, the content of the silicone oil is total polysiloxanes (A) and polysiloxanes (B) It is 6 mass parts~15 mass parts when quality settings are 100 mass parts,
And
The peel strength at the interface of the layer of the silicone resin layer and the glass substrate be 0.10N/25mm or more and 1.40N/25mm following.
11. a kind of manufacturing method of glass laminate according to any one of claims 1 to 9, wherein
Formed containing the organopolysiloxane containing alkenyl (A) and the hydrogen polysiloxanes (B) in the single side of supporting base material and With molal quantity/alkenyl molal quantity of hydrosilyl group indicate described in the alkenyl in organopolysiloxane containing alkenyl (A) The layer that mixing molar ratio with the hydrosilyl group in the hydrogen polysiloxanes (B) is 0.7/1~1.3/1, and in institute Stating makes the organopolysiloxane containing alkenyl (A) react with the hydrogen polysiloxanes (B) and form organosilicon on supporting base material face Resin layer, next in the surface laminated glass substrate of the silicone resin layer.
12. a kind of manufacturing method of electronic device comprising:
Component formation process, wherein the glass base of the glass laminate described in any one of claim 1~9 and 10 Electronic device component is formed on the surface of plate to obtain the laminated body of having electronic device component；With
Separation process, wherein remove from the laminated body of the having electronic device component comprising the supporting base material and described The supporting base material with silicone resin layer of silicone resin layer is to obtain having the glass substrate and the electronic device With the electronic device of component.
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Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
TWI617437B (en) 2012-12-13 2018-03-11 康寧公司 Facilitated processing for controlling bonding between sheet and carrier
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
US10046542B2 (en) 2014-01-27 2018-08-14 Corning Incorporated Articles and methods for controlled bonding of thin sheets with carriers
EP3129221A1 (en) 2014-04-09 2017-02-15 Corning Incorporated Device modified substrate article and methods for making
KR102573207B1 (en) 2015-05-19 2023-08-31 코닝 인코포레이티드 Articles and methods for bonding sheets and carriers
EP3313799B1 (en) 2015-06-26 2022-09-07 Corning Incorporated Methods and articles including a sheet and a carrier
EP3442244B1 (en) 2016-04-05 2020-04-15 Agc Inc. Glass sheet composite
JP2017201600A (en) * 2016-05-06 2017-11-09 株式会社カネカ Organic el panel manufacturing method
TW201825623A (en) 2016-08-30 2018-07-16 美商康寧公司 Peptide plasma polymer for sheet bonding
TWI821867B (en) 2016-08-31 2023-11-11 美商康寧公司 Articles of controllably bonded sheets and methods for making same
TWI610392B (en) * 2016-09-05 2018-01-01 Daxin Mat Corp Method for preparing photovoltaic element
KR102659516B1 (en) 2017-08-18 2024-04-23 코닝 인코포레이티드 glass laminate
US11331692B2 (en) 2017-12-15 2022-05-17 Corning Incorporated Methods for treating a substrate and method for making articles comprising bonded sheets
JP7102899B2 (en) * 2018-04-24 2022-07-20 Ａｇｃ株式会社 Manufacturing method of laminates and electronic devices
JP7258280B2 (en) * 2019-02-08 2023-04-17 Ａｇｃ株式会社 GLASS RESIN LAMINATED PRODUCT AND METHOD FOR MANUFACTURING SAME
JP2023088514A (en) * 2021-12-15 2023-06-27 株式会社東海理化電機製作所 Organic EL element sealing method, organic EL element, organic EL device, and vehicle device
JP7538825B2 (en) 2022-02-09 2024-08-22 三菱電線工業株式会社 Manufacturing method of granular rubber material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1417841A (en) * 2001-10-30 2003-05-14 株式会社半导体能源研究所 Semiconductor device and its manufacture
CN101242951A (en) * 2005-08-09 2008-08-13 旭硝子株式会社 Sheet glass laminate and method of manufacturing display device using the sheet glass laminate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6908682B2 (en) * 2002-09-12 2005-06-21 3M Innovative Properties Company Photocured silicone sealant having improved adhesion to plastic
KR20090110878A (en) * 2007-02-22 2009-10-22 다우 코닝 코포레이션 Composite article with excellent fire resistance
WO2011142280A1 (en) * 2010-05-11 2011-11-17 旭硝子株式会社 Process for producing laminate, and laminate
JP2015232053A (en) * 2012-09-27 2015-12-24 旭硝子株式会社 Organopolysiloxane, crosslinked organopolysiloxane and composition for coating
KR20150073976A (en) * 2012-10-17 2015-07-01 아사히 가라스 가부시키가이샤 Glass laminate and manufacturing method therefor, and support base with silicone resin layer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1417841A (en) * 2001-10-30 2003-05-14 株式会社半导体能源研究所 Semiconductor device and its manufacture
CN101242951A (en) * 2005-08-09 2008-08-13 旭硝子株式会社 Sheet glass laminate and method of manufacturing display device using the sheet glass laminate

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