CN106154609A - Liquid crystal display panel preparation method - Google Patents

Abstract

A method for manufacturing a liquid crystal display panel, comprising: forming a plurality of spacers and frames on the surfaces of a first transfer board and a second transfer board; A substrate group, absorbing the second transfer board and the second substrate to form a second substrate group; forming a thin film transistor array on the first substrate, forming a color filter layer on the second substrate; reversing the first substrate group The TFT array is placed opposite to the color filter layer, and a frame glue and a liquid crystal filling are arranged between the first substrate group and the second substrate group, and the two are bonded together; the first frame is cut by a laser so that the first The transfer board is separated from the first substrate, the second frame is cut to separate the first transfer board from the second substrate, and the first transfer board and the second transfer board are removed.

Description

Liquid crystal display panel manufacturing method

technical field

The invention relates to a method for manufacturing a liquid crystal display panel.

Background technique

In the manufacturing process of the existing liquid crystal display panel, liquid crystal molecules are poured into the glass substrate forming the TFT array and between the glass substrates with the color filter layer to form the liquid crystal display panel. However, in order to meet users' demands for lighter and thinner products, how to make liquid crystal display devices thinner and lighter is still one of the important research topics in the industry at present.

In the prior art, a chemical reaction between hydrofluoric acid (HF) and glass is used to reduce the thickness of the glass substrate, so as to realize the thinning of the glass substrate. Since hydrofluoric acid is an irritating liquid, it is easy to affect the environment. At the same time, the smoothness of the surface of the glass substrate cannot be guaranteed during the processing process, which reduces the yield of the product and increases the cost.

Contents of the invention

In view of this, it is necessary to provide a method for manufacturing a liquid crystal display panel that reduces the complexity of the manufacturing process and is conducive to light and thin.

A method for manufacturing a liquid crystal display panel, comprising the steps of:

a) A plurality of first spacers and a first frame are formed on the surface of the first transfer board, and a plurality of second spacers and a second frame are formed on the surface of the second transfer board;

b) Adsorbing the first transfer board and the first substrate into one body in the vacuum chamber to form a first substrate group, and adsorbing the second transfer board and the second substrate into one body in the vacuum chamber to form a second substrate group;

c) forming a thin film transistor array on the side of the first substrate away from the first transfer board, and forming a color filter layer on the side of the second substrate away from the second transfer board;

d) Reversing the first substrate group forming the TFT array so that the TFT array and the color filter layer are placed opposite each other, and setting a frame glue and filling liquid crystal between the first substrate group and the second substrate group, and laminating the two into a One;

e) Cutting the first frame with a laser to separate the first transfer board from the first substrate, cutting the second frame with a laser to separate the first transfer board from the second substrate, and removing the first transfer board and the second transfer board Two transfer plates to form LCD panels.

Compared with the prior art, this application directly adopts the first substrate and the second substrate with a thickness of 0.2mm to manufacture the liquid crystal display panel, and the first substrate is carried on the first transfer board and the second substrate is carried on the second transfer board to strengthen the first substrate. The strength of the substrate and the second substrate prevents the first substrate and the second substrate from being damaged during the manufacturing process, ensures the surface flatness of the first substrate and the second substrate and reduces the complexity of the manufacturing process.

Description of drawings

FIG. 1 is a flow chart of a method for manufacturing a liquid crystal display panel according to a first embodiment.

2 to 4 are schematic diagrams of structures corresponding to each step in FIG. 1 .

FIG. 5 is a cross-sectional view along the V-V direction of the first substrate group and the second substrate group in FIG. 4 .

FIG. 6 is a schematic diagram of the spacer structure of the second embodiment in FIG. 2 .

FIG. 7 is a schematic diagram of the spacer structure of the third embodiment in FIG. 2 .

FIG. 8 is a flow chart of the manufacturing method of the liquid crystal display panel in the second embodiment.

9 to 11 are schematic diagrams of structures corresponding to each step in FIG. 8 .

FIG. 12 is a cross-sectional view along the XI-XI direction of the first substrate group and the second substrate group in FIG. 11 .

Description of main component symbols Liquid crystal display panel manufacturing method S11~S15, S81-S87 LCD panel 10, 70 first reprint board 11, 71 first spacer 12, 52, 62, 72 first frame 13, 73 second transfer board 21, 81 second spacer 22,82 second frame 23,83 first substrate 14, 74 second substrate 24,84 first substrate group 16, 76 second substrate group 26, 86 thin film transistor array 17,77 color filter layer 27,87 first bonding frame 78 Second bonding frame 88

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

detailed description

Please refer to FIG. 1 to FIG. 5 , which are flow charts of a method for manufacturing a liquid crystal display panel 10 in a preferred embodiment. 2-4 are schematic structural diagrams corresponding to each process step shown in FIG. 1 , and FIG. 5 is a cross-sectional view along the V-V direction of the first substrate group 16 and the second substrate group 26 in FIG. 4 . In this embodiment, the liquid crystal display panel 10 is a thin film transistor (TFT-LCD) panel. In other alternative implementations, the liquid crystal display panel 10 can also be an active matrix organic light emitting diode (AMOLED) panel.

Step S11, forming a plurality of first spacers 12 and a first frame body 13 on the surface of the first transfer board 11, and forming a plurality of second spacers 22 and a second frame body on the surface of the second transfer board 21 twenty three. A plurality of first spacers 12 are located in the first frame body 13 and are arranged in a matrix; a plurality of second spacers 22 are located in the second frame body 23 and are arranged in a matrix. Wherein, the first spacer 12 and the first frame body 13 are integrally formed by photolithography using a mask; the second spacer 22 and the second frame body 23 are integrally formed by photolithography using a mask. The surface of the first frame body 13 away from the first transfer board 11 is a smooth and flat surface, and the surface of the second frame body 23 away from the second transfer board 21 is a smooth and flat surface. Both the first spacer 12 and the second spacer 22 are substantially cuboid solid structures. The first frame body 13 and the second frame body 23 have the same structure, and the first spacer 12 and the second spacer 22 have the same structure. In this embodiment, the first transfer plate 11 and the second transfer plate 21 are transparent glass plates. In other alternative embodiments, the shapes of the first spacer 12 and the second spacer 22 may be different; the first spacer 12 and the second spacer 22 may be arranged in a non-matrix manner.

Step S12, in the vacuum cavity, the first transfer board 11 and the first substrate 14 are adsorbed into one body to form the first substrate group 16, and in the vacuum chamber, the second transfer board 21 and the second substrate 24 are adsorbed into one body to form a The second substrate group 26 is formed. Preferably, the thickness of the first substrate 14 and the second substrate 24 is 0.1-0.3 mm. In this embodiment, the thicknesses of the first substrate 14 and the second substrate 24 are both 0.2 mm.

Specifically, the first transfer plate 11 and the first substrate 14 are aligned in the cavity, and the cavity is evacuated so that the first transfer plate 11 and the first substrate 14 are mutually adsorbed as one to form the first substrate group 16, The second transfer plate 21 and the second substrate 24 are aligned in the cavity, and the cavity is evacuated so that the second transfer plate 21 and the second substrate 24 are adsorbed together to form a second substrate group 26 . Among them, the first frame body 13 is used to cooperate with the first transfer plate 11 and the first substrate 14 to form a vacuum in the first substrate group 16; the first spacer 12 is used to adsorb the first transfer plate 11 and the first substrate 14 Provide uniform supporting force for the first substrate 14 when integrated. The second frame body 23 is used to cooperate with the second transfer plate 21 and the second substrate 24 to form a vacuum in the second substrate group 26 . The second spacer 22 is used to provide a uniform supporting force for the second substrate 24 when the second transfer board 21 and the second substrate 24 are absorbed into one body. The air pressure outside the first substrate group 16 is greater than the air pressure inside the first substrate group 16, so that the first transfer plate 11 and the first substrate 14 are absorbed as one; the air pressure outside the second substrate group 26 is greater than that inside the second substrate group 26 Atmospheric pressure, so that the second transfer plate 21 and the second substrate 24 are absorbed into one body. In this embodiment, the first substrate group 16 and the second substrate group 26 complete alignment bonding in two different cavities respectively. In other alternative embodiments, the first substrate group 16 and the second substrate group 26 can complete alignment bonding in the same cavity.

Step S13, forming a thin film transistor (thin film transistor, TFT) array 17 on the side of the first substrate 14 away from the first transfer board 11, and forming a color filter (color filter) on the side of the second substrate 24 away from the second transfer board 21. filter, CF) layer 27.

Step S14, the first substrate 14 group forming the TFT array 17 is reversed so that the TFT array 17 is placed opposite to the color filter layer 27 on the second substrate 24, and between the first substrate group 16 and the second substrate group 26 The frame glue and liquid crystal filling are provided and bonded together to obtain the liquid crystal display panel 10 located between the first transfer board 11 and the second transfer board 21 .

Step S15, using a laser to cut the first frame body 13 to allow air to enter the first substrate group 16 so that the first transfer plate 11 is separated from the first substrate 14, and to use a laser to cut the second frame body 23 to allow air to enter the second substrate group 26 to separate the first transfer board 11 from the second substrate 24 , remove the first transfer board 11 and the second transfer board 21 to obtain the liquid crystal display panel 10 . In this embodiment, the position where the first frame body 13 is opposite to the gap between any two adjacent first spacers 12 is cut by laser; the position between the second frame body 23 and any two adjacent second spacers is cut by laser. The relative position of the gap between 22.

As shown in FIG. 6 , it is the structure of the first spacer 52 of the second embodiment. Wherein, the first spacer 52 is a circular solid structure.

As shown in FIG. 7 , it is the first spacer 62 structure of the third embodiment. Wherein, the first spacer 62 is a hollow ring structure.

Please refer to FIG. 8 to FIG. 12 , which are flowcharts of the manufacturing method of the liquid crystal display panel 70 according to the second embodiment. 9-11 are schematic structural diagrams corresponding to each process step shown in FIG. 8 , and FIG. 12 is a cross-sectional view along the XI-XI direction of the first substrate group 76 and the second substrate group 86 in FIG. 11 . In this embodiment, the liquid crystal display panel 70 is a thin film transistor (TFT-LCD) panel. In other alternative implementations, the liquid crystal display panel 70 can also be an active matrix organic light emitting diode (AMOLED) panel.

Step S81, forming a plurality of first spacers 72 and a first frame body 73 on the surface of the first transfer board 71, and forming a plurality of second spacers 82 and a second frame body on the surface of the second transfer board 81 83. A plurality of first spacers 72 are located in the first frame body 73 and arranged in a matrix; a plurality of second spacers 82 are located in the second frame body 83 and arranged in a matrix. Wherein, the first spacer 72 and the first frame body 73 are integrally formed by photolithography using a mask; the second spacer 82 and the second frame body 83 are integrally formed by photolithography using a mask. The surface of the first frame body 73 away from the first transfer board 71 is a smooth and flat surface, and the surface of the second frame body 83 away from the second transfer board 81 is a smooth and flat surface. Both the first spacer 72 and the second spacer 82 are substantially cuboid solid structures. In this embodiment, the first transfer plate 71 and the second transfer plate 81 are transparent glass plates. In other alternative embodiments, the shapes of the first spacer 12 and the second spacer 22 may be different; the first spacer 12 and the second spacer 22 may be arranged in a non-matrix manner.

Step S82 , forming a first bonding frame 78 around the first frame body 73 , and forming a second bonding frame 88 around the second frame body 83 . In this embodiment, the first adhesive frame 78 and the second adhesive frame 88 are high temperature resistant adhesives, which can be cured under high temperature or ultraviolet light.

In step S83, the first transfer board 71 and the first substrate 74 are adsorbed into one body in the vacuum chamber to form the first substrate group 76, and the second transfer board 81 and the second substrate 84 are adsorbed into one body in the vacuum chamber. A second substrate group 86 is formed. Preferably, the thickness of the first substrate 14 and the second substrate 24 is 0.1-0.3 mm. In this embodiment, the thickness of the first substrate 74 and the second substrate 84 is 0.2 mm.

Specifically, the first transfer plate 71 and the first substrate 74 are aligned and combined in the cavity, and the cavity is evacuated so that the first transfer plate 71 and the first substrate 74 are mutually adsorbed as one to form the first substrate group 76 , and align the second transfer plate 81 and the second substrate 84 in the cavity, and evacuate the cavity so that the second transfer plate 81 and the second substrate 84 are mutually adsorbed to form a second substrate group 86 . Wherein, the first frame body 73 is used to cooperate with the first transfer plate 71 and the first substrate 74 to form a vacuum in the first substrate group 76 . The first spacer 72 is used to provide a uniform supporting force for the first substrate 74 when the first transfer board 71 and the first substrate 74 are absorbed into one body. The second frame body 83 is used to cooperate with the second transfer plate 81 and the second substrate 84 to form a vacuum in the second substrate group 86 . The second spacer 82 is used to provide a uniform supporting force for the second substrate 84 when the second transfer board 81 and the second substrate 84 are absorbed into one body. After the cavity is evacuated, the air pressure outside the first substrate group 76 is greater than the atmospheric pressure inside the first substrate group 76, so that the first transfer plate 71 and the first substrate 74 are absorbed into one body, while the outside of the second substrate group 86 The air pressure is greater than the air pressure inside the second substrate group 86, so that the second transfer plate 81 and the second substrate 84 are absorbed into one body. Then, the first substrate group 76 and the second substrate group 86 are irradiated by high temperature or ultraviolet light, so that the first adhesive frame 78 is cured to improve the adhesion between the first transfer plate 71 and the first substrate 74; the second The adhesive frame 88 is cured to improve the attachment tightness between the second transfer board 81 and the second substrate 84 . In this embodiment, the first substrate group 76 and the second substrate group 86 complete alignment bonding in two different cavities respectively. In other alternative embodiments, the first substrate group 76 and the second substrate group 86 can complete alignment bonding in the same cavity.

In step S84, a thin film transistor (thin film transistor, TFT) array 77 is formed on the side of the first substrate 74 away from the first transfer board 71, and a color filter (color filter) is formed on the side of the second substrate 84 away from the second transfer board 81. filter, CF) layer 87.

Step S85, inverting the first substrate group 76 forming the TFT array 77 so that the TFT array 77 is placed opposite to the color filter layer 87 on the second substrate group 86, between the first substrate group 76 and the second substrate group 86 Set the frame glue and fill the liquid crystal and bond the two together.

Step S86, cutting the first frame body 73 with a laser to allow air to enter the first substrate group 76 so that the first transfer plate 71 is separated from the first substrate 74, and cutting the second frame body 83 with a laser to allow air to enter the second substrate group 86 so that the second transfer plate 81 is separated from the second substrate 84 . In this embodiment, the first frame body 73 is cut with a laser at the position opposite to the gap between any two adjacent first spacers 72; The relative position of the gap between them.

In step S87 , cutting the first adhesive frame 78 and the second adhesive frame 88 with a laser, removing the first transfer board 71 and the second transfer board 81 to form the liquid crystal display panel 70 . In other alternative embodiments, the entire first adhesive frame 78 and second adhesive frame 88 may be removed with a laser.

The liquid crystal panel manufacturing method provided by the present invention directly adopts the first substrate 14, 74 and the second substrate 24, 84 with a thickness of 0.2mm, and carries the first substrate 14, 74 and the second substrate 14, 74 and the second by the first transfer board 11, 71. The transfer plate 21, 81 carries the second substrate 24, 84 to enhance the bearing capacity of the first substrate 14, 74 and the second substrate 24, 84, avoiding the surface flatness of the first substrate 14, 74 and the second substrate 24, 84 and The complexity of the manufacturing process is reduced.

Those of ordinary skill in the art should recognize that the above embodiments are only used to illustrate the present invention, rather than to limit the present invention. Alterations and variations are within the scope of the claimed invention.

Claims (11)

1. A method for manufacturing a liquid crystal display panel, comprising the steps of: a) A plurality of first spacers and a first frame are formed on the surface of the first transfer board, and a plurality of second spacers and a second frame are formed on the surface of the second transfer board; b) Adsorbing the first transfer board and the first substrate into one body in the vacuum chamber to form a first substrate group, and adsorbing the second transfer board and the second substrate into one body in the vacuum chamber to form a second substrate group; c) forming a thin film transistor array on the side of the first substrate away from the first transfer board, and forming a color filter layer on the side of the second substrate away from the second transfer board; d) Reversing the first substrate group forming the TFT array so that the TFT array and the color filter layer are placed opposite each other, and setting a frame glue and filling liquid crystal between the first substrate group and the second substrate group, and bonding the two together; e) Cutting the first frame with a laser to separate the first transfer board from the first substrate, cutting the second frame with a laser to separate the first transfer board from the second substrate, and removing the first transfer board and the second transfer board Two transfer plates to form LCD panels. 2. The method of manufacturing a liquid crystal display panel according to claim 1, wherein the first frame is used to cooperate with the first transfer plate and the first substrate to form a closed space; the second frame is used to cooperate with the second The transfer plate and the second base plate cooperate to form a closed space. 3. The method for manufacturing a liquid crystal display panel according to claim 1, wherein the first spacer is used to provide a uniform supporting force for the first substrate when the first transfer plate and the first substrate are absorbed into one body; The two spacers are used to provide uniform supporting force for the second substrate when the second transfer board and the second substrate are absorbed into one body. 4 . The method for manufacturing a liquid crystal display panel as claimed in claim 1 , wherein the first spacer has a solid rectangular parallelepiped structure. 5 . 5. The method for manufacturing a liquid crystal display panel as claimed in claim 1, wherein the first spacer is a circular solid structure. 6. The method for manufacturing a liquid crystal display panel as claimed in claim 1, wherein the first spacer is a hollow ring structure. 7. The method for manufacturing a liquid crystal display panel as claimed in claim 1, wherein: the first spacer and the first frame are integrally formed by photolithography using a mask; the second spacer and the second frame are formed using The mask is integrally molded by photolithography. 8. The method for manufacturing a liquid crystal display panel as claimed in claim 1, further comprising: before step b): A first bonding frame is formed around the first frame body, and a second bonding frame is formed around the first frame body. 9 . The method for manufacturing a liquid crystal display panel as claimed in claim 8 , wherein the first adhesive frame and the second adhesive frame are high temperature resistant adhesives that can be cured under high temperature or ultraviolet light. 10. The method for manufacturing a liquid crystal display panel as claimed in claim 8, wherein step e) further comprises: The first bonding frame and the second bonding frame are cut by using a laser. 11 . The method for manufacturing a liquid crystal display panel as claimed in claim 1 , wherein the thickness of the first substrate and the second substrate ranges from 0.1 mm to 0.3 mm.