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CN106132071A - Printed circuit board and mobile terminal - Google Patents

Printed circuit board and mobile terminal Download PDF

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Publication number
CN106132071A
CN106132071A CN201610508984.3A CN201610508984A CN106132071A CN 106132071 A CN106132071 A CN 106132071A CN 201610508984 A CN201610508984 A CN 201610508984A CN 106132071 A CN106132071 A CN 106132071A
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China
Prior art keywords
circuit board
printed circuit
component
test point
board body
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Granted
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CN201610508984.3A
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CN106132071B (en
Inventor
曾元清
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201610508984.3A priority Critical patent/CN106132071B/en
Publication of CN106132071A publication Critical patent/CN106132071A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本申请提供一种印制电路板及终端设备,其中,印制电路板包括:印制电路板本体、设置在所述印制电路板本体上的至少一个元器件和至少一个测试点;其中,当所述至少一个元器件安装在所述印制电路板本体上时,所述至少一个测试点被所述至少一个元器件覆盖,当所述至少一个元器件未安装在所述印制电路板本体上时,可利用所述至少一个测试点进行测试。由此,减少了测试点占用印制电路板的面积,节省了印制电路板的布板空间,进而为减小印制电路板的尺寸提供了条件。

The present application provides a printed circuit board and a terminal device, wherein the printed circuit board comprises: a printed circuit board body, at least one component and at least one test point arranged on the printed circuit board body; wherein, when the at least one component is mounted on the printed circuit board body, the at least one test point is covered by the at least one component, and when the at least one component is not mounted on the printed circuit board body, the at least one test point can be used for testing. Thus, the area occupied by the test point on the printed circuit board is reduced, the layout space of the printed circuit board is saved, and conditions are provided for reducing the size of the printed circuit board.

Description

印制电路板及移动终端Printed circuit boards and mobile terminals

技术领域technical field

本发明涉及电子技术领域,特别涉及一种印制电路板及移动终端。The invention relates to the field of electronic technology, in particular to a printed circuit board and a mobile terminal.

背景技术Background technique

通常,为了便于对电路的性能进行调试和测量,在根据电路制作PCB(PrintedCircuit Board印制电路)时,通常会在PCB板中,以预留与各个信号连接的空焊盘的形式,布置一些测试点,以便于研发或测试人员对电路进行测试。Usually, in order to facilitate the debugging and measurement of the performance of the circuit, when making a PCB (Printed Circuit Board printed circuit) according to the circuit, it is usually arranged in the PCB board in the form of an empty pad connected to each signal. Test points, so that R&D or testers can test the circuit.

但是,在PCB板中布置测试点会占用PCB板的布板空间,增加PCB板的面积。However, arranging test points on the PCB board will occupy the layout space of the PCB board and increase the area of the PCB board.

发明内容Contents of the invention

本发明旨在至少在一定程度上解决相关技术中的技术问题之一。为此,本发明的一个目的在于提出一种印制电路板,通过在印制电路板本体上的元器件下方设置测试点,减少了测试点占用印制电路板的面积,节省了印制电路板的布板空间,进而为减小印制电路板的尺寸提供了条件。The present invention aims to solve one of the technical problems in the related art at least to a certain extent. For this reason, an object of the present invention is to propose a printed circuit board, by setting test points below the components on the printed circuit board body, the area occupied by the test points is reduced, and the printed circuit board is saved. The layout space of the board provides conditions for reducing the size of the printed circuit board.

本发明的第二个目的在于提出一种移动终端。A second object of the present invention is to propose a mobile terminal.

本发明的第三个目的在于提出一种移动终端。The third object of the present invention is to provide a mobile terminal.

为达到上述目的,本发明实施例提出的一种印制电路板,包括:印制电路板本体、设置在所述印制电路板本体上的至少一个元器件和至少一个测试点;In order to achieve the above purpose, a printed circuit board proposed by an embodiment of the present invention includes: a printed circuit board body, at least one component and at least one test point arranged on the printed circuit board body;

其中,当所述至少一个元器件安装在所述印制电路板本体上时,所述至少一个测试点被所述至少一个元器件覆盖,当所述至少一个元器件未安装在所述印制电路板本体上时,可利用所述至少一个测试点进行测试。Wherein, when the at least one component is mounted on the printed circuit board body, the at least one test point is covered by the at least one component, and when the at least one component is not mounted on the printed circuit board body When on the circuit board body, the at least one test point can be used for testing.

本申请实施例提供的印制电路板,在印制电路板本体上的至少一个元器件的下方设置至少一个测试点。由此,减少了测试点占用印制电路板的面积,节省了印制电路板的布板空间,进而为减小印制电路板的尺寸提供了条件。In the printed circuit board provided by the embodiment of the present application, at least one test point is provided under at least one component on the printed circuit board body. Thus, the area of the printed circuit board occupied by the test points is reduced, the layout space of the printed circuit board is saved, and conditions are provided for reducing the size of the printed circuit board.

根据本发明的一个实施例,所述至少一个元器件包括至少两个焊盘;According to an embodiment of the present invention, the at least one component includes at least two pads;

所述至少一个测试点设置在所述至少一个元器件的至少两个焊盘之间,且与所述至少两个焊盘非电连接。The at least one test point is arranged between at least two pads of the at least one component and is not electrically connected to the at least two pads.

根据本发明的一个实施例,所述至少一个元器件的至少两个焊盘之间的距离大于或等于预设的值。According to an embodiment of the present invention, the distance between at least two pads of the at least one component is greater than or equal to a preset value.

根据本发明的一个实施例,所述预设的值为0.8毫米。According to an embodiment of the present invention, the preset value is 0.8 mm.

根据本发明的一个实施例,所述至少一个测试点与所述至少一个元器件的各个焊盘之间的距离相等。According to an embodiment of the present invention, the distance between the at least one test point and each pad of the at least one component is equal.

根据本发明的一个实施例,所述至少一个元器件的本体靠近所述电路板本体的一侧由非导电材料组成。According to an embodiment of the present invention, the side of the body of the at least one component close to the body of the circuit board is made of non-conductive material.

根据本发明的一个实施例,所述至少一个测试点的直径大于或等于0.4毫米;According to an embodiment of the present invention, the diameter of the at least one test point is greater than or equal to 0.4 mm;

或者,至少一个测试点的边长大于或等于0.4毫米。Alternatively, the side length of at least one test point is greater than or equal to 0.4 mm.

此外,本发明实施例还提出了一种移动终端,其包括上述的印制电路板。In addition, an embodiment of the present invention also provides a mobile terminal, which includes the above-mentioned printed circuit board.

本申请实施例提供的终端设备,在印制电路板本体上的至少一个元器件的下方设置至少一个测试点。由此,减少了测试点占用印制电路板的面积,节省了印制电路板的布板空间,进而为减小印制电路板的尺寸提供了条件。In the terminal device provided in the embodiment of the present application, at least one test point is arranged under at least one component on the printed circuit board body. Thus, the area of the printed circuit board occupied by the test points is reduced, the layout space of the printed circuit board is saved, and conditions are provided for reducing the size of the printed circuit board.

为达上述目的,本申请第三方面实施例提出了一种终端设备,包括以下一个或多个组件:印制电路板、壳体、处理器,存储器,电源电路,多媒体组件,音频组件,输入/输出(I/O)的接口,传感器组件,以及通信组件;其中,所述印制电路板安置在所述壳体围成的空间内部,所述处理器和所述存储器设置在所述印制电路板上;所述电源电路,用于为所述移动终端的各个电路或器件供电;所述存储器用于存储可执行程序代码;所述处理器通过读取所述存储器中存储的可执行程序代码来运行与所述可执行程序代码对应的程序;To achieve the above purpose, the embodiment of the third aspect of the present application proposes a terminal device, including one or more of the following components: printed circuit board, housing, processor, memory, power supply circuit, multimedia component, audio component, input I/O (I/O) interfaces, sensor components, and communication components; wherein, the printed circuit board is placed inside the space enclosed by the housing, and the processor and the memory are arranged on the printed circuit board on the printed circuit board; the power supply circuit is used to supply power to each circuit or device of the mobile terminal; the memory is used to store executable program code; the processor reads the executable program code stored in the memory program code to run a program corresponding to said executable program code;

其中,印制电路板包括:印制电路板本体、设置在所述印制电路板本体上的至少一个元器件和至少一个测试点;Wherein, the printed circuit board includes: a printed circuit board body, at least one component and at least one test point arranged on the printed circuit board body;

当所述至少一个元器件安装在所述印制电路板本体上时,所述至少一个测试点被所述至少一个元器件覆盖,当所述至少一个元器件未安装在所述印制电路板本体上时,可利用所述至少一个测试点进行测试。When the at least one component is mounted on the printed circuit board body, the at least one test point is covered by the at least one component, and when the at least one component is not mounted on the printed circuit board When on the body, the at least one test point can be used for testing.

本申请实施例提供的终端设备,在印制电路板本体上的至少一个元器件的下方设置至少一个测试点。由此,减少了测试点占用印制电路板的面积,节省了印制电路板的布板空间,进而为减小印制电路板的尺寸提供了条件。In the terminal device provided in the embodiment of the present application, at least one test point is arranged under at least one component on the printed circuit board body. Thus, the area of the printed circuit board occupied by the test points is reduced, the layout space of the printed circuit board is saved, and conditions are provided for reducing the size of the printed circuit board.

附图说明Description of drawings

图1为本申请一个实施例的印制电路板的一种状态结构示意图;FIG. 1 is a schematic diagram of a state structure of a printed circuit board according to an embodiment of the present application;

图2为本申请一个实施例的印制电路板的另一种状态结构示意图;FIG. 2 is a schematic structural diagram of another state of a printed circuit board according to an embodiment of the present application;

图3为本申请一个实施例的终端设备的结构示意图;FIG. 3 is a schematic structural diagram of a terminal device according to an embodiment of the present application;

图4为本申请另一个实施例的终端设备的结构示意图。Fig. 4 is a schematic structural diagram of a terminal device according to another embodiment of the present application.

附图标记说明:Explanation of reference signs:

印制电路板本体-1; 至少一个元器件-2; 至少一个测试点-3;Printed circuit board body-1; at least one component-2; at least one test point-3;

焊盘-21; 焊盘-22; 终端设备-30;Pad-21; Pad-22; Terminal-Equipment-30;

印制电路板-31; 壳体-402; 处理器-403;printed circuit board-31; housing-402; processor-403;

存储器404; 电源电路-405; 多媒体组件406;memory 404; power circuit-405; multimedia component 406;

音频组件407; 输入/输出(I/O)的接口-408;Audio component 407; Interface-408 for input/output (I/O);

传感器组件409; 通信组件410。sensor component 409; communication component 410.

具体实施方式detailed description

下面详细描述本发明的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,旨在用于解释本发明,而不能理解为对本发明的限制。Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

下面参照附图来描述根据本发明实施例提出的印制电路板及移动终端。The following describes the printed circuit board and the mobile terminal according to the embodiments of the present invention with reference to the accompanying drawings.

图1为本申请一个实施例的印制电路板的一种状态结构示意图,图2为本申请一个实施例的印制电路板的另一种状态结构示意图。FIG. 1 is a schematic structural diagram of a state of a printed circuit board according to an embodiment of the present application, and FIG. 2 is a schematic structural diagram of another state of a printed circuit board according to an embodiment of the present application.

如图1和图2所示,印制电路板,包括:印制电路板本体1、设置在所述印制电路板本体上1的至少一个元器件2和至少一个测试点3;As shown in Figures 1 and 2, the printed circuit board includes: a printed circuit board body 1, at least one component 2 and at least one test point 3 arranged on the printed circuit board body 1;

其中,当所述至少一个元器件2安装在所述印制电路板本体1上时,所述至少一个测试点3被所述至少一个元器件2覆盖,当所述至少一个元器件2未安装在所述印制电路板本体1上时,可利用所述至少一个测试点3进行测试。Wherein, when the at least one component 2 is installed on the printed circuit board body 1, the at least one test point 3 is covered by the at least one component 2, and when the at least one component 2 is not installed When on the printed circuit board body 1 , the at least one test point 3 can be used for testing.

其中,需要说明的是,图1和图2中的至少一个元器件2的形状和结构,仅是示意说明。Wherein, it should be noted that the shape and structure of at least one component 2 in FIGS. 1 and 2 are only schematic illustrations.

具体的,如图1所示,当至少一个元器件2安装在印制电路板本体1上时,至少一个测试点3被覆盖,此时用户无法看到测试点3,也无法进行测试。而当需要利于至少一个测试点3对印制电路板进行测试时,可以将至少一个元器件2从印制电路板板本体1上取下来,从而再利用测试仪器,比如电压表、电流表、示波器等的测试探针点触至少一个测试点3,来完成对印制电路板的测试。通过这种方式,使得测试点无需占用布板空间,节省了印制电路板的布局空间。Specifically, as shown in FIG. 1 , when at least one component 2 is installed on the printed circuit board body 1 , at least one test point 3 is covered, and the user cannot see the test point 3 at this time, and cannot perform a test. And when at least one test point 3 needs to be beneficial to test the printed circuit board, at least one component 2 can be taken off from the printed circuit board body 1, so as to reuse testing instruments, such as voltmeter, ammeter, oscilloscope and other test probes touch at least one test point 3 to complete the test of the printed circuit board. In this way, the test point does not need to occupy the layout space, which saves the layout space of the printed circuit board.

进一步地,由图2可知,至少一个元器件2包括至少两个焊盘21和22;Further, it can be seen from FIG. 2 that at least one component 2 includes at least two pads 21 and 22;

所述至少一个测试点3设置在所述至少一个元器件2的至少两个焊盘21和22之间,且与所述至少两个焊盘21和22非电连接。The at least one test point 3 is arranged between the at least two pads 21 and 22 of the at least one component 2 and is not electrically connected to the at least two pads 21 and 22 .

具体的,将至少一个元器件2从印制电路板1上取下后,与至少一个元器件2的引脚连接的电路可能会无法正常工作,相应的与至少一个元器件2连接的电路信号也会出现异常,因此,为了保证将至少一个元器件2取下时,利于至少一个测试点3测试的电路信号能准确反映电路的工作特点,设置在至少一个元器件2的至少两个焊盘21和22之间的至少一个测试点3,与至少两个焊盘21和22需要非电连接,即至少一个元器件2被从印制电路板本体1上取下后,不影响至少一个测试点3所在的电路的正常工作。Specifically, after the at least one component 2 is removed from the printed circuit board 1, the circuit connected to the pin of the at least one component 2 may not work normally, and the corresponding circuit signal connected to the at least one component 2 There will also be abnormalities. Therefore, in order to ensure that when at least one component 2 is removed, the circuit signal that is beneficial to at least one test point 3 can accurately reflect the working characteristics of the circuit. At least one test point 3 between 21 and 22 needs to be non-electrically connected to at least two pads 21 and 22, that is, after at least one component 2 is removed from the printed circuit board body 1, at least one test point will not be affected Point 3 is the normal operation of the circuit.

通常,为了简化制版工艺,至少一个测试点通常可设置为圆形或者方形,且为了保证测试工具可以与至少一个测试点3可靠接触,至少一个测试点3的直径需要大于或等于0.4毫米(mm),或者,至少一个测试点3的边长大于或等于0.4mm。Usually, in order to simplify the plate-making process, at least one test point can usually be set to a circle or a square, and in order to ensure that the test tool can be reliably contacted with at least one test point 3, the diameter of at least one test point 3 needs to be greater than or equal to 0.4 millimeters (mm ), or, the side length of at least one test point 3 is greater than or equal to 0.4mm.

另外,在选择至少一个元器件2时,还需要考虑元器件的焊盘之间的距离,保证至少一个测试点3设置在至少一个元器件2的至少两个焊盘之间时,至少一个测试点3与至少两个焊盘之间满足电气安全要求,即所述至少一个元器件的至少两个焊盘之间的距离大于或等于预设的值,其中,预设的值为0.8mm。In addition, when selecting at least one component 2, it is also necessary to consider the distance between the pads of the component to ensure that at least one test point 3 is set between at least two pads of at least one component 2, at least one test The electrical safety requirement is met between the point 3 and the at least two pads, that is, the distance between the at least two pads of the at least one component is greater than or equal to a preset value, wherein the preset value is 0.8mm.

在一种可能的实现形式中,若至少一个元器件2的至少两个焊盘21和22之间的距离较小,必如为0.8mm、0.9mm或1mm等,此时,为了保证至少一个测试点3与至少一个元器件2的任一焊盘之间的距离都满足电气安全要求,需要将至少一个测试点3设置在至少一个元器件2的下方、正中心的位置,或者,若至少一个元器件2的焊盘非对称分布,则需要保证至少一个测试点3与至少一个元器件2的各个焊盘之间的距离相等。In a possible implementation form, if the distance between at least two pads 21 and 22 of at least one component 2 is small, such as 0.8mm, 0.9mm or 1mm, etc., at this time, in order to ensure at least one The distance between the test point 3 and any pad of at least one component 2 meets the electrical safety requirements, and at least one test point 3 needs to be set at the bottom of at least one component 2 and at the center, or, if at least If the pads of a component 2 are distributed asymmetrically, it is necessary to ensure that the distance between at least one test point 3 and each pad of at least one component 2 is equal.

进一步地,若至少一个元器件2的各个引脚较短,比如至少一个元器件2为多引脚芯片时,当其被安装到印制电路板本体1上时,至少一个元器件2的本体可能会与设置在其下方的至少一个测试点3接触,此时,为了防止损坏至少一个元器件2,或者对与至少一个测试点3连接的电路造成影响,需要保证至少一个元器件的本体靠近所述电路板本体的一侧由非导电材料组成,比如。Further, if each pin of at least one component 2 is relatively short, such as when at least one component 2 is a multi-pin chip, when it is installed on the printed circuit board body 1, the body of at least one component 2 It may be in contact with at least one test point 3 arranged below it. At this time, in order to prevent damage to at least one component 2 or affect the circuit connected to at least one test point 3, it is necessary to ensure that the body of at least one component is close to One side of the circuit board body is composed of a non-conductive material, eg.

本领域技术人员可以理解的是,印制电路板本体1上,可以设置多个形状、结构和功能不同的元器件,且所有或者部分元器件下方都可以设置测试点,从而节省了布板空间。Those skilled in the art can understand that on the printed circuit board body 1, multiple components with different shapes, structures and functions can be arranged, and test points can be set under all or part of the components, thereby saving layout space .

需要说明的是,若至少一个元器件的本体面积较大,还可以在至少一个元器件的下方设置多个测试点,本实施例对此不做限定。It should be noted that, if the body area of at least one component is relatively large, multiple test points may also be set under at least one component, which is not limited in this embodiment.

本申请实施例提供的印制电路板,在印制电路板的至少一个元器件的下方设置至少一个测试点。由此,减少了测试点占用印制电路板的面积,节省了印制电路板的布板空间,进而为减小印制电路板的尺寸提供了条件。In the printed circuit board provided by the embodiment of the present application, at least one test point is arranged under at least one component of the printed circuit board. Thus, the area of the printed circuit board occupied by the test points is reduced, the layout space of the printed circuit board is saved, and conditions are provided for reducing the size of the printed circuit board.

图3是本申请一个实施例的终端设备的结构示意图。Fig. 3 is a schematic structural diagram of a terminal device according to an embodiment of the present application.

如图3所示,该终端设备30包括:印制电路板31,其中,印制电路板31可以采用本发明上述图1所示的实施例提供的形式。As shown in FIG. 3 , the terminal device 30 includes: a printed circuit board 31 , wherein the printed circuit board 31 can adopt the form provided by the above-mentioned embodiment shown in FIG. 1 of the present invention.

其中,所述终端设备30包括:手机或平板电脑。Wherein, the terminal device 30 includes: a mobile phone or a tablet computer.

本申请实施例提供的终端设备,在印制电路板的至少一个元器件的下方设置至少一个测试点。由此,减少了测试点占用印制电路板的面积,节省了印制电路板的布板空间,进而为减小印制电路板的尺寸提供了条件。In the terminal device provided in the embodiment of the present application, at least one test point is arranged under at least one component of the printed circuit board. Thus, the area of the printed circuit board occupied by the test points is reduced, the layout space of the printed circuit board is saved, and conditions are provided for reducing the size of the printed circuit board.

图4是本申请另一个实施例的终端设备的结构示意图。例如,终端设备可以是移动电话等。Fig. 4 is a schematic structural diagram of a terminal device according to another embodiment of the present application. For example, the terminal device may be a mobile phone or the like.

参见图4,终端设备可以包括以下一个或多个组件:印制电路板31、壳体402、处理器403,存储器404,电源电路405,多媒体组件406,音频组件407,输入/输出(I/O)的接口408,传感器组件409,以及通信组件410;其中,所述印制电路板31安置在所述壳体402围成的空间内部,所述处理器403和所述存储器404设置在所述电路板31上;所述电源电路405,用于为所述移动终端的各个电路或器件供电;所述存储器404用于存储可执行程序代码;所述处理器403通过读取所述存储器404中存储的可执行程序代码来运行与所述可执行程序代码对应的程序;Referring to FIG. 4, the terminal device may include one or more of the following components: a printed circuit board 31, a housing 402, a processor 403, a memory 404, a power supply circuit 405, a multimedia component 406, an audio component 407, an input/output (I/O O) the interface 408, the sensor assembly 409, and the communication assembly 410; wherein, the printed circuit board 31 is placed inside the space enclosed by the housing 402, and the processor 403 and the memory 404 are arranged in the space on the circuit board 31; the power supply circuit 405 is used to supply power to each circuit or device of the mobile terminal; the memory 404 is used to store executable program codes; the processor 403 reads the memory 404 Executable program code stored in to run the program corresponding to the executable program code;

其中,印制电路板包括31:印制电路板本体1、设置在所述印制电路板本体上的至少一个元器件2和至少一个测试点3;Wherein, the printed circuit board includes 31: a printed circuit board body 1, at least one component 2 and at least one test point 3 arranged on the printed circuit board body;

其中,当所述至少一个元器件2安装在所述印制电路板本体1上时,所述至少一个测试点3被所述至少一个元器件2覆盖,当所述至少一个元器件2未安装在所述印制电路板本体1上时,可利用所述至少一个测试点3进行测试。Wherein, when the at least one component 2 is installed on the printed circuit board body 1, the at least one test point 3 is covered by the at least one component 2, and when the at least one component 2 is not installed When on the printed circuit board body 1 , the at least one test point 3 can be used for testing.

本申请实施例提供的终端设备,在印制电路板的至少一个元器件的下方设置至少一个测试点。由此,减少了测试点占用印制电路板的面积,节省了印制电路板的布板空间,进而为减小印制电路板的尺寸提供了条件。In the terminal device provided in the embodiment of the present application, at least one test point is arranged under at least one component of the printed circuit board. Thus, the area of the printed circuit board occupied by the test points is reduced, the layout space of the printed circuit board is saved, and conditions are provided for reducing the size of the printed circuit board.

在本发明的描述中,需要理解的是,术语“之间”、“连接”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "between", "connection", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description , rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus should not be construed as limiting the invention.

在本发明中,除非另有明确的规定和限定,术语“设置”、“连接”等术语应做广义理解,例如,可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the present invention, unless otherwise clearly specified and limited, the terms "arrangement", "connection" and other terms should be understood in a broad sense, for example, it can be mechanical connection or electrical connection; it can be directly connected or through An indirect connection through an intermediary may be an internal communication between two elements or an interaction relationship between two elements, unless otherwise clearly defined. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structures, materials or features are included in the embodiments or examples of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

尽管上面已经示出和描述了本发明的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本发明的限制,本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.

Claims (9)

1.一种印制电路板,其特征在于,包括:印制电路板本体、设置在所述印制电路板本体上的至少一个元器件和至少一个测试点;1. A printed circuit board, characterized in that it comprises: a printed circuit board body, at least one component and at least one test point arranged on the printed circuit board body; 其中,当所述至少一个元器件安装在所述印制电路板本体上时,所述至少一个测试点被所述至少一个元器件覆盖,当所述至少一个元器件未安装在所述印制电路板本体上时,可利用所述至少一个测试点进行测试。Wherein, when the at least one component is mounted on the printed circuit board body, the at least one test point is covered by the at least one component, and when the at least one component is not mounted on the printed circuit board body When on the circuit board body, the at least one test point can be used for testing. 2.如权利要求1所述的印制电路板,其特征在于,所述至少一个元器件包括至少两个焊盘;2. The printed circuit board of claim 1, wherein the at least one component comprises at least two pads; 所述至少一个测试点设置在所述至少一个元器件的至少两个焊盘之间,且与所述至少两个焊盘非电连接。The at least one test point is arranged between at least two pads of the at least one component and is not electrically connected to the at least two pads. 3.如权利要求2所述的印制电路板,其特征在于,所述至少一个元器件的至少两个焊盘之间的距离大于或等于预设的值。3. The printed circuit board according to claim 2, wherein the distance between at least two pads of the at least one component is greater than or equal to a preset value. 4.如权利要求3所述的印制电路板,其特征在于,所述预设的值为0.8毫米。4. The printed circuit board according to claim 3, wherein the preset value is 0.8 mm. 5.如权利要求2-4任一所述的印制电路板,其特征在于,所述至少一个测试点与所述至少一个元器件的各个焊盘之间的距离相等。5. The printed circuit board according to any one of claims 2-4, wherein the distance between the at least one test point and each pad of the at least one component is equal. 6.如权利要求2所述的印制电路板,其特征在于,所述至少一个元器件的本体靠近所述电路板本体的一侧由非导电材料组成。6 . The printed circuit board according to claim 2 , wherein the side of the body of the at least one component close to the body of the circuit board is made of non-conductive material. 7.如权利要求1所述的印制电路板,其特征在于,所述至少一个测试点的直径大于或等于0.4毫米;7. The printed circuit board according to claim 1, wherein the diameter of the at least one test point is greater than or equal to 0.4 mm; 或者,至少一个测试点的边长大于或等于0.4毫米。Alternatively, the side length of at least one test point is greater than or equal to 0.4 mm. 8.一种移动终端,其特征在于,包括根据权利要求1-7中任一项所述的印制电路板。8. A mobile terminal, comprising the printed circuit board according to any one of claims 1-7. 9.一种移动终端,其特征在于,包括以下一个或多个组件:印制电路板、壳体、处理器,存储器,电源电路,多媒体组件,音频组件,输入/输出(I/O)的接口,传感器组件,以及通信组件;其中,所述印制电路板安置在所述壳体围成的空间内部,所述处理器和所述存储器设置在所述印制电路板上;所述电源电路,用于为所述移动终端的各个电路或器件供电;所述存储器用于存储可执行程序代码;所述处理器通过读取所述存储器中存储的可执行程序代码来运行与所述可执行程序代码对应的程序;9. A mobile terminal, characterized in that it comprises one or more of the following components: a printed circuit board, a housing, a processor, a memory, a power supply circuit, a multimedia component, an audio component, an input/output (I/O) interface, sensor components, and communication components; wherein, the printed circuit board is placed inside the space enclosed by the housing, and the processor and the memory are arranged on the printed circuit board; the power supply The circuit is used to supply power to each circuit or device of the mobile terminal; the memory is used to store executable program code; the processor reads the executable program code stored in the memory to run and the executable Execute the program corresponding to the program code; 其中,印制电路板包括:印制电路板本体、设置在所述印制电路板本体上的至少一个元器件和至少一个测试点;Wherein, the printed circuit board includes: a printed circuit board body, at least one component and at least one test point arranged on the printed circuit board body; 当所述至少一个元器件安装在所述印制电路板本体上时,所述至少一个测试点被所述至少一个元器件覆盖,当所述至少一个元器件未安装在所述印制电路板本体上时,可利用所述至少一个测试点进行测试。When the at least one component is mounted on the printed circuit board body, the at least one test point is covered by the at least one component, and when the at least one component is not mounted on the printed circuit board When on the body, the at least one test point can be used for testing.
CN201610508984.3A 2016-06-28 2016-06-28 Printed circuit board and mobile terminal Expired - Fee Related CN106132071B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108196179A (en) * 2017-12-05 2018-06-22 广东欧珀移动通信有限公司 Printed circuit board, terminal and circuit testing method based on common test point
CN111447729A (en) * 2020-04-17 2020-07-24 Oppo广东移动通信有限公司 Circuit board assembly, electronic device and test method
CN117135819A (en) * 2023-04-11 2023-11-28 荣耀终端有限公司 terminal

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1330508A (en) * 2000-06-23 2002-01-09 英业达股份有限公司 Method for detecting missing parts of electronic components on printed circuit board
EP1751798A1 (en) * 2004-04-08 2007-02-14 W.L. GORE & ASSOCIATES (UK) LTD Tamper respondent covering
CN203706116U (en) * 2013-12-27 2014-07-09 昆达电脑科技(昆山)有限公司 Cooling fin fixing device
CN105700808A (en) * 2016-02-18 2016-06-22 广东欧珀移动通信有限公司 Music playing method, device and terminal equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1330508A (en) * 2000-06-23 2002-01-09 英业达股份有限公司 Method for detecting missing parts of electronic components on printed circuit board
EP1751798A1 (en) * 2004-04-08 2007-02-14 W.L. GORE & ASSOCIATES (UK) LTD Tamper respondent covering
CN203706116U (en) * 2013-12-27 2014-07-09 昆达电脑科技(昆山)有限公司 Cooling fin fixing device
CN105700808A (en) * 2016-02-18 2016-06-22 广东欧珀移动通信有限公司 Music playing method, device and terminal equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108196179A (en) * 2017-12-05 2018-06-22 广东欧珀移动通信有限公司 Printed circuit board, terminal and circuit testing method based on common test point
CN111447729A (en) * 2020-04-17 2020-07-24 Oppo广东移动通信有限公司 Circuit board assembly, electronic device and test method
CN117135819A (en) * 2023-04-11 2023-11-28 荣耀终端有限公司 terminal
CN117135819B (en) * 2023-04-11 2024-06-11 荣耀终端有限公司 terminal

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