CN106131386A - Photographic head module and electronic equipment - Google Patents
Photographic head module and electronic equipment Download PDFInfo
- Publication number
- CN106131386A CN106131386A CN201610653700.XA CN201610653700A CN106131386A CN 106131386 A CN106131386 A CN 106131386A CN 201610653700 A CN201610653700 A CN 201610653700A CN 106131386 A CN106131386 A CN 106131386A
- Authority
- CN
- China
- Prior art keywords
- photographic head
- head module
- circuit board
- chip
- lens assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The disclosure is directed to a kind of photographic head module and electronic equipment, belong to electronic device field.Described photographic head module at least includes circuit board, chip, circuit component and lens assembly；Described chip is arranged at the first side of described circuit board, and described circuit component is arranged at the second side of described circuit board；Described lens assembly is installed on the first side of described circuit board, and is correspondingly arranged with described chip；It is separated by predeterminable range between described lens assembly and described chip.The disclosure by being arranged at the not homonymy of circuit board by chip and circuit component, can be in the case of ensureing that not interfering with chip normally works, reduce the size of circuit board, reduce the distance between lens assembly and chip, thus reduce the size of photographic head module, save the space that photographic head module takies.
Description
Technical field
The disclosure is directed to electronic device field, specifically about a kind of photographic head module and electronic equipment.
Background technology
Along with the development of electronic technology, the electronic equipment such as mobile phone, panel computer is widely used in the daily life of people
In work, it is possible to provide the user diversified function.And deeply liked by users in view of camera function, current is big
Part electronic equipment all can configure photographic head module, is imaged by photographic head module.
The structure of photographic head module is usual as it is shown in figure 1, this photographic head module includes circuit board 101 and lens assembly 102,
It is provided with chip 1011 and the circuit component such as electric capacity, resistance 1012, chip 1011 and circuit component 1012 on circuit board 101 to arrange
In the same side of circuit board 101, chip 1011 is fixed on circuit board 101, and circuit component 1012 is positioned at the outside of chip 1011,
Lens assembly 102 is arranged on circuit board 101, and is positioned at the outside of circuit component 1012.Between different elements
Influence each other, be separated by certain safe distance, circuit component 1012 and lens group between chip 1011 and circuit component 1012
Certain safe distance it is also separated by between part 102.
Summary of the invention
In order to solve problem present in correlation technique, present disclose provides a kind of photographic head module and electronic equipment.Institute
State technical scheme as follows:
First aspect according to disclosure embodiment, it is provided that a kind of photographic head module, described photographic head module at least wraps
Include circuit board, chip, circuit component and lens assembly；
Described chip is arranged at the first side of described circuit board, and described circuit component is arranged at the second of described circuit board
Side；
Described lens assembly is installed on the first side of described circuit board, and is correspondingly arranged with described chip；
It is separated by predeterminable range between described lens assembly and described chip.
In alternatively possible implementation, described lens assembly at least includes camera lens and microscope base, described camera lens and institute
Stating microscope base threaded, described microscope base is fixed on the first side of described circuit board.
In alternatively possible implementation, the second side of described circuit board is provided with protection block, described protection block position
Outside in described circuit component.
In alternatively possible implementation, described lens assembly at least includes camera lens, microscope base and base, described camera lens
Structure integrated with described mirror seat set, described integral structure is fixed on described base, and described base is fixed on described electricity
On first side of road plate.
In alternatively possible implementation, described lens assembly also includes that glue layer, described integral structure pass through
Described glue layer is fixed on described base.
In alternatively possible implementation, described lens assembly at least includes camera lens and motor, the of described motor
A part is fixed on the first side of described circuit board, and the Part II of described motor bonds with described camera lens, described second
Demultiplexing moves in driving the described camera lens inside at described motor in focus process.
In alternatively possible implementation, the central shaft of described chip and the optical axis coincidence of described camera lens.
Second aspect according to disclosure embodiment, it is provided that a kind of electronic equipment, described electronic equipment at least include as
Photographic head module described in first aspect.
Embodiment of the disclosure that the technical scheme of offer can include following beneficial effect:
The photographic head module that the present embodiment provides, by chip and circuit component being arranged at the not homonymy of circuit board, can
To ensure not interfere with in the case of chip normally works, reduce the size of circuit board, reduce lens assembly and chip it
Between distance, thus reduce the size of photographic head module, save the space that photographic head module takies.
It should be appreciated that it is only exemplary that above general description and details hereinafter describe, can not be limited this
Open.
Accompanying drawing explanation
Accompanying drawing herein is merged in description and constitutes the part of this specification, it is shown that meet the enforcement of the disclosure
Example, and for explaining the principle of the disclosure together with description.
Fig. 1 is the generalized section according to a kind of photographic head module shown in correlation technique；
Fig. 2 is the generalized section according to a kind of photographic head module shown in an exemplary embodiment；
Fig. 3 is the generalized section according to a kind of photographic head module shown in an exemplary embodiment；
Fig. 4 is the generalized section according to a kind of photographic head module shown in an exemplary embodiment；
Fig. 5 is the generalized section according to a kind of photographic head module shown in an exemplary embodiment；
Fig. 6 is the generalized section according to a kind of photographic head module shown in an exemplary embodiment；
Fig. 7 is the generalized section according to a kind of photographic head module shown in an exemplary embodiment；
Fig. 8 is the schematic top plan view according to a kind of photographic head module shown in an exemplary embodiment.
Detailed description of the invention
For making the purpose of the disclosure, technical scheme and advantage clearer, below in conjunction with embodiment and accompanying drawing, right
The disclosure is described in further details.Here, the exemplary embodiment of the disclosure and explanation thereof are used for explaining the disclosure, but also
Not as restriction of this disclosure.
Disclosure embodiment provides a kind of photographic head module and electronic equipment, carries out the disclosure in detail below in conjunction with accompanying drawing
Explanation.
Fig. 2 is the generalized section according to a kind of photographic head module shown in an exemplary embodiment, as in figure 2 it is shown, should
Photographic head module includes circuit board 201 and lens assembly 202, and circuit board 201 is provided with chip 2011 and circuit component 2012,
Chip 2011 is arranged at the first side of circuit board 201, and circuit component 2012 is arranged at the second side of circuit board 201, lens assembly
202 are installed on the first side of circuit board 201, and are correspondingly arranged with chip 2011, between lens assembly 202 and chip 2011
It is separated by predeterminable range.
Wherein, this photographic head module can be to focus module, auto-focusing module or mechanical optics zoom module, this reality
Execute example the type of this photographic head module is not limited.
This circuit board 201 can be PCB (Printed Circuit Board, printed circuit board), FPC (Flexible
Printed Circuit) flexible circuit board, it is also possible to can transmit between chip 2011 and the electronic equipment at place for other
The circuit board of the signal of telecommunication, this is not limited by the present embodiment.
This chip 2011 can be CCD (Charge Couple Device, the charge-coupled image sensor) chip of material, CMOS
The chip of (Complepentary Metal Oxide Semiconductir, complementary metal oxide semiconductors (CMOS)) material, it is possible to
Thinking the chip of other materials, it is fixed that the present embodiment not material to this chip 2011 is carried out.This circuit component 2012 can include
One or more in electric capacity, resistance, inductance, diode or other kinds of circuit component, the present embodiment is not to circuit zero
Kind and the quantity of part 2012 are defined.
In the present embodiment, this lens assembly 202 is correspondingly arranged, with this chip 2011, the position root referring to this lens assembly 202
Determine according to the position of this chip 2011, according to this chip 2011 difference of position on this circuit board 201, this lens assembly 202
Position the most different.
Such as, this lens assembly 202 can reserve accommodation space in inside, and the housing of this lens assembly 202 is installed on this
First side of circuit board 201, it is possible to make this chip 2011 be positioned at this accommodation space, and lens assembly 202 and chip 2011 phase
Right, thus avoid this chip 2011 to fall upper dust or extruded by other circuit component.
In correlation technique, chip and circuit component are positioned on the same side of circuit board, in order to ensure that chip normally works, and electricity
Need separated by a distance between road part and chip, also separated by a distance between lens assembly and circuit component.
Chip 2011 is arranged at the first side of circuit board 201 by the present embodiment, and circuit component 2012 is arranged at electricity
Second side of road plate 201, that is to say and circuit component 2012 be arranged on the back side of chip 2011 rather than be arranged on chip
The side of 2011, then, after circuit component 2012 being removed, do not interfere with, in guarantee, the situation that chip 2011 normally works
Under, the size of circuit board 201 can reduce, the distance between lens assembly 202 and chip 2011 can also be reduced to preset away from
From, thus reduce the size of photographic head module, save space.
Wherein, this circuit board 201 includes multiple side, and this first side and this second side can be on this circuit board 201
Any two different sides, this first side and this second side are not limited by the present embodiment.
See Fig. 1, in correlation technique, owing to chip 1011 and circuit component 1012 are arranged at the same side of circuit board 201,
In order to avoid having influence on chip 1011, the distance between circuit component 1012 and chip 1011 is 0.35mm, and in order to avoid shadow
Ringing to circuit component 1012, the distance between circuit component 1012 and lens assembly 102 inwall is 0.1mm, that is to say lens group
Distance between inwall and the chip 1011 of part 102 is at least 0.45mm.And in the present embodiment, only chip 2011 and lens group
Part 202 is arranged on the first side of circuit board 201, then the predeterminable range being separated by between chip 2011 and lens assembly 202 is
0.35mm, reduces the size of photographic head module.
It should be noted is that, this predeterminable range can be 0.35mm, 0.25mm etc., specifically can be according to chip 2011
Demand determine, no matter the concrete numerical value of this predeterminable range is how many, use the present embodiment provide photographic head module all can protect
Card chip 2011 reduces the size of photographic head module in the case of normally working.
Need explanation on the other hand, in order to ensure that chip 2011, circuit component 2012 and lens assembly 202 connect, protect
The normal work of card photographic head module, chip 2011 can pass through COB (Chip On Board, chip on board) technique and be attached at
On first side of circuit board 201, circuit component 2012 can pass through surface-assembled SMT (Surface Mount Technology,
Electronic circuit surface installation technique) technology is welded on the second side of circuit board 201.Lens assembly 202 can pass through COB technique
It is attached on the first side of circuit board 201.For chip 2011, circuit component 2012 and lens assembly 202, it would however also be possible to employ its
His mode is fixed on circuit board 201, and the present embodiment does not limits.
The photographic head module that the present embodiment provides, by chip and circuit component being arranged at the not homonymy of circuit board, can
To ensure not interfere with in the case of chip normally works, reduce the size of circuit board, reduce lens assembly and chip it
Between distance, thus reduce the size of photographic head module, save the space that photographic head module takies.
Fig. 3 is the generalized section according to a kind of photographic head module shown in an exemplary embodiment, sees Fig. 3, camera lens
Assembly 202 includes camera lens 2021 and microscope base 2022, and camera lens 2021 is threadeded with microscope base 2022 (screw thread is shown in dash area), and solid
On the first side of circuit board 201, it is possible to keep the position of camera lens to fix.
In a kind of possible implementation, the central shaft of chip 2011 and the optical axis coincidence of camera lens 2021 so that camera lens
2021 light collected may map to chip 2011, thus forms picture, it is achieved the function of shooting.
Fig. 4 is the generalized section according to a kind of photographic head module shown in an exemplary embodiment, sees Fig. 4, camera lens
Assembly 202 at least includes camera lens 2021, microscope base 2022 and the integrated structure of base 2023, camera lens and mirror seat set, and integral type is tied
Structure is fixed on base 2023, and base 2023 is fixed on the first side of circuit board 201.
Compared with threaded, camera lens 2021 and microscope base 2022 formed integral structure and can reduce the chi of lens assembly
Very little, and then reduce the size of photographic head module.
In a kind of possible implementation, seeing Fig. 5, lens assembly 202 also includes glue layer 2024, integral structure
It is fixed on base 2023 by glue layer 2024.
The present embodiment can use active alignment technique, generate glue layer 2024, and integral structure is passed through glue
Layer 2024 is fixed on base 2023, now can ensure that the optical axis of camera lens 2021 and the central shaft of chip 2011 overlap more accurate
Really, so that the scenery of shooting becomes apparent from.
It addition, base 2023 can be attached on circuit board 201 by COB technique, it would however also be possible to employ other fixed form,
Do not limit at this.
Fig. 6 is the generalized section according to a kind of photographic head module shown in an exemplary embodiment, sees Fig. 6, camera lens
Assembly 202 includes camera lens 2021 and motor 2025.Wherein, motor 2025 includes Part I 20251 and Part II 20252.
Part I 20251 is fixed on the first side of circuit board 201, and the Part II 20252 of motor bonds with camera lens 2021, and second
Part 20252 moves in the inside of motor 2025 for driving camera lens 2021 during shooting, it is achieved that the function of focusing.
Wherein, motor 2025 can be stepper motor, can be ultrasonic motor, can be voice coil motor, it is also possible to for
Other kinds of motor, this is not limited by the present embodiment.
Fig. 7 is the generalized section according to a kind of photographic head module shown in an exemplary embodiment, and Fig. 8 is to show according to this
The schematic top plan view of a kind of photographic head module shown in example embodiment, sees Fig. 7 and Fig. 8, and the second side of this circuit board 201 sets
Being equipped with protection block 203 (dash area), protection block 203 is positioned at the outside of circuit component 2012, for protection circuit part 2012,
Prevent circuit component 3012 from falling upper dust or be squeezed.
Protection block 203 can or coating circuit part 2012 separated by a distance with circuit component 2012, can be golden
Belong to material, isolation material or other materials, can be square configuration, round-shaped or other shapes, and the 203 of protection block
Size can determine according to the size of photographic head module.Protection block 203 can be to be bonded in the first of circuit board 301 by glue
On side, it is also possible to be fixed on by other means on circuit board 301, the present embodiment is to the particular location of this protection block, material, shape
Shape, size, fixed form do not limit.
The embodiment of the present invention additionally provides a kind of electronic equipment, and this electronic equipment includes the shooting as shown in above-described embodiment
Head mould group.In addition to this photographic head module, this electronic equipment can also include the device such as processor, display screen, the present embodiment
This is not limited.
This electronic equipment can be the various electronic such as mobile phone, panel computer, notebook computer, TV, video camera, this
This is not limited by inventive embodiments.
Such as, the electronic equipment such as mobile phone, panel computer can shoot photo or video by photographic head module, or,
The electronic equipments such as video camera can by photographic head module shooting photo or video, and with other mobile phone, panel computer etc.
Electronic equipment is connected by data wire or wireless network, and now, video camera can send shooting to the electronic equipment connected
Photo or video.The working method of this electronic equipment is not limited by the present embodiment.
Those skilled in the art, after considering description and putting into practice invention disclosed herein, will readily occur to its of the disclosure
Its embodiment.The application is intended to any modification, purposes or the adaptations of the disclosure, these modification, purposes or
Person's adaptations is followed the general principle of the disclosure and includes the undocumented common knowledge in the art of the disclosure
Or conventional techniques means.Description and embodiments is considered only as exemplary, and the true scope of the disclosure and spirit are by following
Claim is pointed out.
It should be appreciated that the disclosure is not limited to precision architecture described above and illustrated in the accompanying drawings, and
And various modifications and changes can carried out without departing from the scope.The scope of the present disclosure is only limited by appended claim.
Claims (9)
1. a photographic head module, it is characterised in that described photographic head module at least include circuit board, chip, circuit component and
Lens assembly；
Described chip is arranged at the first side of described circuit board, and described circuit component is arranged at the second side of described circuit board；
Described lens assembly is installed on the first side of described circuit board, and is correspondingly arranged with described chip；
It is separated by predeterminable range between described lens assembly and described chip.
Photographic head module the most according to claim 1, it is characterised in that described lens assembly at least includes camera lens and mirror
Seat, described camera lens and described microscope base are threaded, and described microscope base is fixed on the first side of described circuit board.
Photographic head module the most according to claim 1, it is characterised in that described lens assembly at least includes camera lens, microscope base
And base, described camera lens and the integrated structure of described mirror seat set, described integral structure is fixed on described base, the described end
Seat is fixed on the first side of described circuit board.
Photographic head module the most according to claim 3, it is characterised in that described lens assembly also includes glue layer, described
Integral structure is fixed on described base by described glue layer.
Photographic head module the most according to claim 1, it is characterised in that described lens assembly at least includes camera lens and horse
Reaching, the Part I of described motor is fixed on the first side of described circuit board, the Part II of described motor and described camera lens
Bonding, described Part II is for driving described camera lens to move in the inside of described motor in focus process.
6. according to the photographic head module described in any one of claim 2-5, it is characterised in that the central shaft of described chip is with described
The optical axis coincidence of camera lens.
Photographic head module the most according to claim 1, it is characterised in that the second side of described circuit board is provided with protection
Block, described protection block is positioned at the outside of described circuit component.
8. according to the photographic head module described in any one of claim 1-7, it is characterised in that described circuit component at least includes electricity
Perhaps resistance.
9. an electronic equipment, it is characterised in that described electronic equipment at least includes as described in any one of the claims 1-8
Photographic head module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610653700.XA CN106131386A (en) | 2016-08-10 | 2016-08-10 | Photographic head module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610653700.XA CN106131386A (en) | 2016-08-10 | 2016-08-10 | Photographic head module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106131386A true CN106131386A (en) | 2016-11-16 |
Family
ID=57258402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610653700.XA Pending CN106131386A (en) | 2016-08-10 | 2016-08-10 | Photographic head module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106131386A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107277332A (en) * | 2017-07-31 | 2017-10-20 | 广东欧珀移动通信有限公司 | A kind of camera module and electronic equipment |
| CN107302610A (en) * | 2017-08-09 | 2017-10-27 | 信利光电股份有限公司 | A kind of camera module and electronic equipment |
| CN107864319A (en) * | 2017-11-16 | 2018-03-30 | 信利光电股份有限公司 | A kind of camera module and electronic equipment |
| CN108243300A (en) * | 2016-12-23 | 2018-07-03 | 宁波舜宇光电信息有限公司 | Array camera module and its application |
| WO2019029450A1 (en) * | 2017-08-05 | 2019-02-14 | 宁波舜宇光电信息有限公司 | Camera module and electronic device having same, and method for manufacturing camera module. |
| WO2019179353A1 (en) * | 2018-03-20 | 2019-09-26 | 维沃移动通信有限公司 | Camera module and mobile terminal |
| CN110602363A (en) * | 2019-09-23 | 2019-12-20 | Oppo广东移动通信有限公司 | Camera module and electronic equipment |
| CN110620863A (en) * | 2019-09-29 | 2019-12-27 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
| CN111601020A (en) * | 2020-04-29 | 2020-08-28 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN114157783A (en) * | 2021-11-23 | 2022-03-08 | 信利光电股份有限公司 | Camera module with TLENS, manufacturing method and electronic equipment thereof |
| US11652132B2 (en) | 2017-04-01 | 2023-05-16 | Ningbo Sunny Opotech Co., Ltd. | Systems and methods for manufacturing semiconductor modules |
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| CN110326280B (en) * | 2016-12-23 | 2022-02-22 | 宁波舜宇光电信息有限公司 | Array camera module and application thereof |
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| CN107302610B (en) * | 2017-08-09 | 2024-01-19 | 信利光电股份有限公司 | Camera module and electronic equipment |
| CN107864319A (en) * | 2017-11-16 | 2018-03-30 | 信利光电股份有限公司 | A kind of camera module and electronic equipment |
| US11272088B2 (en) | 2018-03-20 | 2022-03-08 | Vivo Mobile Communication Co., Ltd. | Camera module and mobile terminal |
| WO2019179353A1 (en) * | 2018-03-20 | 2019-09-26 | 维沃移动通信有限公司 | Camera module and mobile terminal |
| CN110602363A (en) * | 2019-09-23 | 2019-12-20 | Oppo广东移动通信有限公司 | Camera module and electronic equipment |
| CN110620863B (en) * | 2019-09-29 | 2021-02-23 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
| CN110620863A (en) * | 2019-09-29 | 2019-12-27 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
| CN111601020B (en) * | 2020-04-29 | 2022-02-08 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN111601020A (en) * | 2020-04-29 | 2020-08-28 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN114157783A (en) * | 2021-11-23 | 2022-03-08 | 信利光电股份有限公司 | Camera module with TLENS, manufacturing method and electronic equipment thereof |
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Application publication date: 20161116 |
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