CN106119794A - A kind of containing niobium NiTi system marmem and its preparation method and application - Google Patents
A kind of containing niobium NiTi system marmem and its preparation method and application Download PDFInfo
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- CN106119794A CN106119794A CN201610536650.7A CN201610536650A CN106119794A CN 106119794 A CN106119794 A CN 106119794A CN 201610536650 A CN201610536650 A CN 201610536650A CN 106119794 A CN106119794 A CN 106119794A
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- marmem
- containing niobium
- niobium
- niti system
- niti
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- 239000010955 niobium Substances 0.000 title claims abstract description 42
- 229910052758 niobium Inorganic materials 0.000 title claims abstract description 41
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 229910001000 nickel titanium Inorganic materials 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims description 15
- 239000000956 alloy Substances 0.000 claims abstract description 39
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 29
- 239000010936 titanium Substances 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 23
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 17
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 15
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910009972 Ti2Ni Inorganic materials 0.000 claims abstract description 11
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 11
- 239000010937 tungsten Substances 0.000 claims abstract description 11
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 10
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 20
- 238000000137 annealing Methods 0.000 claims description 11
- 229910052786 argon Inorganic materials 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000004062 sedimentation Methods 0.000 claims description 7
- 238000004544 sputter deposition Methods 0.000 claims description 7
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 5
- 229910009601 Ti2Cu Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 10
- 238000013021 overheating Methods 0.000 abstract 1
- 229910002070 thin film alloy Inorganic materials 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 13
- 239000011572 manganese Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000003723 Smelting Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 239000003708 ampul Substances 0.000 description 1
- 229910001566 austenite Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910000734 martensite Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C14/00—Alloys based on titanium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of containing niobium NiTi system marmem, this alloy is made up of titanium, nickel, copper, niobium, tungsten, yttrium；Following component is included: atomic percent titanium content is 45 52%, the atom percentage content of nickel is 39 43% by atomic percent；The atom percentage content of copper is 5 10%；The atomic ratio content of niobium is 1 2%；The atomic ratio content of tungsten is 1%；Surplus is yttrium.Then the method using magnetron sputtering prepares thin film alloys, then forms through Overheating Treatment.Nanometer Ti is comprised in this alloy2Cu and Ti2Ni phase, cycle life is high.
Description
Technical field
The present invention relates to shape memory alloy material field, be specifically related to a kind of containing niobium NiTi system's marmem and
Preparation method and application.
Background technology
Marmem has higher restorability deformation because of it, it has also become a kind of important functional material.China
Patent of invention CN103741003A relates to a kind of Novel high-temperature magnetic shape memory alloy and preparation method thereof, specifically refers to novel
High-temperature magnetic shape memory alloy and preparation method thereof.This invention alloy preparation process is: 1) take 42.5 according to molfraction ratio
Ga, the Mn of 29 parts, 28.5 parts of Ni and the Ga of 42.5 parts, the Mn of 29 parts, 27.5 parts of Ni and 1 part of Co of part, puts into vacuum non-consumable
In electrode arc stove, simultaneously because the saturated vapor pressure of Mn element is relatively low, the fusing point of Ga is relatively low, in order to avoid segregation occurs in alloy
Phenomenon, the process in dispensing supplements the Mn element of 3%-5%, 1.5%-3%Ga element, placement order be followed successively by from top to bottom Ni, Co,
Ga、Mn、Ni；2) in inert gas shielding, electric arc melting 8-14 minute under conditions of 1400 ~ 1700 DEG C, noble gas is argon；
3) by the metal blocks after acetone wash heat；4) put in the quartz ampoule that vacuum is 10-1PaPa under conditions of 600 DEG C
Cool to 400 DEG C after being incubated 48 hours again and be incubated 24 hours；5) quench in water, obtain Novel high-temperature magnetic shape memory alloy.
Chinese invention patent CN103509988A proposes one and has hyperelastic polycrystalline Fe-Ni-Co-Al-Nb-B shape
Memorial alloy, it is characterised in that this alloy have following composition and atomic percentage conc: Fe30～50%, Ni28～40%,
Co10～30%, Al8～15%, Nb1～4%, B0.1～3%.The preparation technology of this alloy mainly includes using smelting technology, solid solution
Process technique and aging treatment process.Described smelting technology is that dispensing uses vacuum non-consumable arc furnace under argon shield
Carrying out melting, melting electric current density is 220～280A/cm2, molten alloy is stood up melting 3～5 times.Described solution treatment
Technique is, at temperature 1000～1300 DEG C, solution treatment 20～50min, is cold rolled to thin plate, then by light sheet material after shrend
At temperature is 1150～1350 DEG C, solution treatment 20～50min, the most quickly cool down, and rate of cooling is more than 138 DEG C/s.Described
The temperature of aging treatment process at 550～750 DEG C, aging time 45～70h.
Chinese invention patent CN105296800A provides a kind of TiNiCuNb memorial alloy and preparation method thereof.Should
The chemical formula of TiNiCuNb memorial alloy is (Ti50Ni50-xCux) 100-yNby, wherein, x=1-15, y=3-20, Ti, Ni,
The atomic percentage sum of tetra-kinds of elements of Cu and Nb is 100%.This invention additionally provides the system of above-mentioned TiNiCuNb memorial alloy
Preparation Method.The TiNiCuNb memorial alloy that this invention provides is through plastic working (such as cold-drawn obtains silk material), high annealing
After can obtain the adjustable less temperature lag of transition temperature range through different temperatures timeliness；And carry out after cold deformation is processed
Process annealing then become nano wire Nb/TiNiCu matrix in-situ composite, composite have big linear elasticity strain,
The feature of low elastic modulus.Its preparation method comprises the following steps: choose purity by the composition proportion of TiNiCuNb memorial alloy
At the simple substance titanium of more than 99wt.%, nickel, copper, niobium；Simple substance titanium, nickel, copper, niobium are put into vacuum higher than 10-1Pa or indifferent gas
In the smelting furnace of body protection, it is smelted into TiNiCuNb memorial alloy.
Summary of the invention
Goal of the invention: in order to improve the cycle life of marmem, the technical problem to be solved is to carry
Supply a kind of containing niobium NiTi system marmem.
The present invention also to solve the technical problem that and there is provided a kind of preparation method containing niobium NiTi system marmem.
The present invention also to solve the technical problem that and there is provided a kind of application containing niobium NiTi system marmem.
Conventional alloy material deformation will be ruptured for thousand of times, and the method that the present invention uses magnetron sputtering, preparation contains
Unique component and microstructural alloy film material, it is possible to the cycle-index of this alloy is brought up to more than several ten million times.Should
The thickness of alloy firm is 2-50 micron, comprises Ti2Cu with Ti2Ni phase in its microstructure, and they are nanocrystalline, are smaller in size than
500 nanometers.
For achieving the above object, the technical solution used in the present invention is: a kind of containing niobium NiTi system marmem, this conjunction
Gold is made up of titanium, nickel, copper, niobium, tungsten, yttrium.
As preferably, include following component by atomic percent: atomic percent titanium content is 45-52%, the atom hundred of nickel
Proportion by subtraction content is 39-43%；The atom percentage content of copper is 5-10%；The atomic ratio content of niobium is 1-2%；The atomic ratio of tungsten contains
Amount is 1%；Surplus is yttrium.
As preferably, the described thickness containing niobium NiTi system marmem is 2-50 micron.
As preferably, the described microstructure containing niobium NiTi system marmem comprises Ti2Cu and Ti2Ni phase.
As preferably, described containing the Ti in niobium NiTi system marmem2Cu and Ti2Being smaller in size than of Ni phase 500 is received
Rice.
The above-mentioned preparation method containing niobium NiTi system marmem, comprises the following steps:
1) target is prepared according to above-mentioned alloy material；
2) use magnetron sputtering to prepare the marmem of film like, be evacuated to 10-3More than Pa, is filled with argon, the most again
It is evacuated to 10-3Pa, adjustment running voltage is 500V, sputters dutycycle 60-70%, proceeds by sputtering sedimentation, controls thickness and is
2-50 micron obtains the marmem of film like；
3) to step 2) marmem that obtains carries out annealing and is thermally treated resulting in containing niobium NiTi system marmem.
Above-mentioned annealing heat treatment temperature is 650-720 degree Celsius.
Above-mentioned containing niobium NiTi system marmem in the application of the aspect such as Industry Control, medical apparatus and instruments.
Beneficial effect: the invention have the advantages that and use the method for the present invention can prepare a kind of high-performance shape note
Recalling alloy, cycle-index is up to more than several ten million times, far above thousand of times of current alloy.This is because current most of shape
When memorial alloy changes under two kinds of crystal lattice states, biphase between conversion incomplete, meeting in metallic high temperature phase (austenite)
Increasing low-temperature phase (martensite) crystal structure occurs, arises that crackle, eventually result in alloy fracture for thousand of times.?
In the present invention, nanometer phase Ti that can be formed2Cu phase and Ti2Ni phase, its size is below 500 nanometers.Work as Ti2Cu phase is at B2 and B19
In two kinds of structures during conversion, the conversion between them is completely, there is not residual, therefore, it is possible to be greatly improved cycle life.
Additionally, this alloy also can produce rare-earth phase strengthening, it is possible to increase the strength character of alloy.
Detailed description of the invention
Below in conjunction with detailed description of the invention, the present invention is further illustrated.
Embodiment 1:
1, according to titanium: nickel: copper: niobium: yttrium: the atomic ratio of tungsten is that the ratio of 49:43:5:1:1:1 prepares target；
2, use magnetron sputtering to prepare the marmem of film like, be evacuated to 10-3More than Pa, is filled with argon, the most again
It is evacuated to 10-3Pa, adjustment running voltage is 500V, sputters dutycycle 60%, proceeds by sputtering sedimentation, and controlling thickness is 12
Micron；
3, above alloy carrying out heat treatment of annealing, temperature is 650 degrees Celsius.
It is circulated life test, after sample carries out 2,000 ten thousand tests, the most unbroken.
Nanometer Ti is comprised in this alloy2Cu and Ti2Ni phase, its a size of 30-100 nanometer.
Embodiment 2:
1. according to titanium: nickel: copper: niobium: yttrium: the atomic ratio of tungsten is that the ratio of 52:39:6:1.5:0.5:1 prepares target；
2. use magnetron sputtering to prepare the marmem of film like, be evacuated to 10-3More than Pa, is filled with argon, the most again
It is evacuated to 10-3Pa, adjustment running voltage is 500V, sputters dutycycle 60%, proceeds by sputtering sedimentation, and controlling thickness is 32
Micron；
3. more than pair, alloy carries out heat treatment of annealing, and temperature is 680 degrees Celsius.
It is circulated life test, after sample carries out 2,000 ten thousand tests, the most unbroken.
Nanometer Ti is comprised in this alloy2Cu and Ti2Ni phase, its a size of 55-300 nanometer.
Embodiment 3:
1. according to titanium: nickel: copper: niobium: yttrium: the atomic ratio of tungsten is that the ratio of 45:41:10:2:1:1 prepares target；
2. use magnetron sputtering to prepare the marmem of film like, be evacuated to 10-3More than Pa, is filled with argon, the most again
It is evacuated to 10-3Pa, adjustment running voltage is 500V, sputters dutycycle 70%, proceeds by sputtering sedimentation, and controlling thickness is 47
Micron；
3. more than pair, alloy carries out heat treatment of annealing, and temperature is 720 degrees Celsius.
It is circulated life test, after sample carries out 2,000 ten thousand tests, the most unbroken.
Nanometer Ti is comprised in this alloy2Cu and Ti2Ni phase, its a size of 50-250 nanometer.
Embodiment 4
1. according to titanium: nickel: copper: niobium: yttrium: the atomic ratio of tungsten is that the ratio of 48.5:43:5:1.5:1:1 prepares target；
2. use magnetron sputtering to prepare the marmem of film like, be evacuated to 10-3More than Pa, is filled with argon, the most again
It is evacuated to 10-3Pa, adjustment running voltage is 500V, sputters dutycycle 65%, proceeds by sputtering sedimentation, and it is 2 micro-for controlling thickness
Rice；
3. more than pair, alloy carries out heat treatment of annealing, and temperature is 685 degrees Celsius.
It is circulated life test, after sample carries out 2,000 ten thousand tests, the most unbroken.
Nanometer Ti is comprised in this alloy2Cu and Ti2Ni phase, its a size of 40-180 nanometer.
Embodiment 5
1. according to titanium: nickel: copper: niobium: yttrium: the atomic ratio of tungsten is that the ratio of 47:40:7.5:2:2.5:1 prepares target；
2. use magnetron sputtering to prepare the marmem of film like, be evacuated to 10-3More than Pa, is filled with argon, the most again
It is evacuated to 10-3Pa, adjustment running voltage is 500V, sputters dutycycle 67%, proceeds by sputtering sedimentation, and controlling thickness is 50
Micron；
3. more than pair, alloy carries out heat treatment of annealing, and temperature is 690 degrees Celsius.
It is circulated life test, after sample carries out 2,000 ten thousand tests, the most unbroken.
Nanometer Ti is comprised in this alloy2Cu and Ti2Ni phase, its a size of 60-300 nanometer.
Comparative example 1
Experimental example:
1. according to 1at% manganese, 0.4at% neodymium, 51at% titanium, 44at% nickel, the proportional arrangement raw material of 3.6at% ferrum；
2. by raw material mix homogeneously, put into non-consumable arc furnace, be evacuated down to 5*10-4Pa, be filled with high-purity argon gas, so
Rear melting 5 times；
3. in vacuum heat treatment furnace, carry out heat treatment: carry out timeliness 2 hours at 500 degree, then 450 degree of timeliness 5 hours.
4. cooling, thus obtains marmem.
Testing result: be circulated life test, sample carries out 8636 test fractures.
What the embodiment of the present invention 1～5 prepared closes containing niobium NiTi system's marmem alloy and the common of comparative example 1
Gold carries out the memory response rate after 1000 deformation
The above is only the preferred embodiment of the present invention, it is noted that come for those skilled in the art
Saying, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (8)
1. one kind containing niobium NiTi system marmem, it is characterised in that this alloy is by titanium, nickel, copper, niobium, tungsten, yttrium structure
Become.
One the most according to claim 1 is containing niobium NiTi system marmem, it is characterised in that by atomic percent bag
Include following component: atomic percent titanium content is 45-52%, the atom percentage content of nickel is 39-43%；The atomic percent of copper
Content is 5-10%；The atomic ratio content of niobium is 1-2%；The atomic ratio content of tungsten is 1%；Surplus is yttrium.
One the most according to claim 1 is containing niobium NiTi system marmem, it is characterised in that described containing niobium NiTi system
The thickness of marmem is 2-50 micron.
One the most according to claim 1 is containing niobium NiTi system marmem, it is characterised in that described containing niobium NiTi system
The microstructure of marmem comprises Ti2Cu and Ti2Ni phase.
One the most according to claim 4 is containing niobium NiTi system marmem, it is characterised in that described containing niobium NiTi system
Ti in marmem2Cu and Ti2Ni phase be smaller in size than 500 nanometers.
6. the preparation method containing niobium NiTi system marmem described in any one of claim 1 ~ 5, it is characterised in that include
Following steps:
1) target is prepared according to above-mentioned alloy material；
2) use magnetron sputtering to prepare the marmem of film like, be evacuated to 10-3More than Pa, is filled with argon, the most again
It is evacuated to 10-3Pa, adjustment running voltage is 500V, sputters dutycycle 60-70%, proceeds by sputtering sedimentation, controls thickness and is
2-50 micron obtains the marmem of film like；
3) to step 2) marmem of film like that obtains carries out annealing and is thermally treated resulting in containing niobium NiTi system shape memory
Alloy.
Preparation method containing niobium NiTi system marmem the most according to claim 6, it is characterised in that described annealing
Heat treatment temperature is 650-720 degree Celsius.
8. the marmem containing niobium NiTi system described in any one of claim 1 ~ 5 is at the aspect such as Industry Control, medical apparatus and instruments
Application.
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| Application Number | Priority Date | Filing Date | Title |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108486539A (en) * | 2018-04-30 | 2018-09-04 | 苏州诺弘添恒材料科技有限公司 | A kind of preparation method of titanium vanadium cobalt memorial alloy film |
| CN113166854A (en) * | 2020-06-08 | 2021-07-23 | 南京江东工贸有限公司 | Metal material and preparation method and application thereof |
| WO2022089845A1 (en) * | 2020-10-30 | 2022-05-05 | Gebr. Brasseler Gmbh & Co. Kg | Root canal instrument |
| CN113444948A (en) * | 2021-06-30 | 2021-09-28 | 西北工业大学 | Niobium-nickel metal compound material and preparation method thereof |
| CN113444948B (en) * | 2021-06-30 | 2022-12-06 | 西北工业大学 | A kind of niobium-nickel metal compound material and preparation method thereof |
| CN113637942A (en) * | 2021-08-16 | 2021-11-12 | 陕西理工大学 | Metal W/amorphous NiTiNbFe nano-multilayer film and preparation method |
| CN116752099A (en) * | 2023-08-15 | 2023-09-15 | 北京航空航天大学宁波创新研究院 | NiTiAl-X multi-element alloy coating and preparation method and application thereof |
| CN116752099B (en) * | 2023-08-15 | 2023-10-24 | 北京航空航天大学宁波创新研究院 | A NiTiAl-X multi-component alloy coating and its preparation method and application |
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