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CN106118540B - 低硬度的单组分导电胶水及其制备、使用方法 - Google Patents

低硬度的单组分导电胶水及其制备、使用方法 Download PDF

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CN106118540B
CN106118540B CN201610578899.4A CN201610578899A CN106118540B CN 106118540 B CN106118540 B CN 106118540B CN 201610578899 A CN201610578899 A CN 201610578899A CN 106118540 B CN106118540 B CN 106118540B
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刘红阳
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Abstract

本发明提供了低硬度的单组分导电胶水及其制备、使用方法，该导电胶水由以下组分组成：树脂组成物、有机溶剂和镍包石墨导电粉，所述的树脂组成物由以下比重构成：乙烯基封端的聚二甲基硅氧烷20—40%，氢硅键聚硅氧烷油5—15%，阻聚剂0.05—0.15%，以及胶囊包覆铂络合物0.1%—1%；树脂组成物与镍包石墨导电粉的重量比为20‑40/80‑60；所述的有机溶剂重量为树脂组成物重量的20%—40%。本发明可用以点涂在金属基板或结构复杂的外壳等结构件上，固化后的导电衬垫具有优良的弹性，导电性和粘附性，起到优良的电磁屏蔽，接地和环境密封效能，且该低硬度的单组分导电胶水在压缩过程中可以用最轻便的压力，即可使得胶条贴合在塑料或金属的基材表面。

Description

低硬度的单组分导电胶水及其制备、使用方法
技术领域
本发明涉及电磁屏蔽材料领域，具体涉及一种导电胶水及其制造方法。
背景技术
导电胶是一种固化或干燥后具有一定导电性能的胶黏剂，它通常以基体树脂和导电填料即导电粒子为主要组成成分，通过基体树脂的粘接作用把导电粒子结合在一起而形成导电通路。由于导电胶的基体树脂是一种胶黏剂，可以选择适宜的固化温度进行粘接，其主要都是用于附着在基材表面上，但现有的产品具有以下局限：1、由于经过了硫化，胶条的硬度得到了加强，却不利于产品的压缩操作，而且其弹性性能很弱，胶条在受到不规则的施力时，易发生变形以及断裂。2.电阻偏大，由于外部环境的不确定因素，在规定的制作标准下，产品的使用寿命有一定影响。3.在产品的锁紧过程中，外部螺丝所承受的力加大时，其受到的阻力也变大，此时基材存在变形的潜在风险；由于胶条的硬度加强，锁紧过程需经常检查材料是否变形，影响施工的效率。专利号为200810203319.9公开了有机硅导电胶，其组成上主要是树脂组成物、有机溶剂和银粉，该银粉的导电性能佳，但是其在物理特性上，特别是用于包覆外层基材时无法有效突出弹性的需求，当添加量较多时，在受力不规则、弯曲度过大时容易导致变形甚至断裂现象。
发明内容
本发明的目的主要是针对现有技术中的问题，提供一种具备低硬度以及高屏蔽性能的导电胶水。
为实现本发明的目的，本发明提供了以下技术方案：
低硬度的单组分导电胶水，由以下组分组成：树脂组成物、有机溶剂和镍包石墨导电粉，所述的树脂组成物由以下比重构成：乙烯基封端的聚二甲基硅氧烷20-40％，氢硅键聚硅氧烷油5-15％，阻聚剂0.05-0.15％，胶囊包覆铂络合物0.1％-1％；树脂组成物与镍包石墨导电粉的重量比为20-40/80-60；所述的有机溶剂重量为树脂组成物重量的20％-40％。
作为对上述低硬度的单组分导电胶水的进一步描述，所述的镍包石墨导电粉为50-150μm的非规则圆形或椭圆形粉体。
一种制得所述低硬度的单组分导电胶水的方法，其步骤为：把树脂组成物和有机溶剂盛入密封的搅拌设备中，将搅拌设备恒定在23±5℃温度范围内，以200转/分钟的速度搅拌混合5-10min，且搅拌过程中搅拌设备内保持大气压强小于0.08Mpa，混合均匀后加入镍包石墨导电粉再搅拌5-10min，即制得上述的低硬度高屏蔽效能的导电胶水。
作为对上述低硬度的单组分导电胶水制备方法的进一步描述，加入镍包石墨导电粉时将总量分为多次加入，每次加入后分别搅拌5-10min。
一种使用所述低硬度的单组分导电胶水的方法，其存储温度范围为-30到-10℃，在存储温度范围内存储期限为6个月；热固化条件为保持温度150℃状态，持续热固化时间为30Min。
本发明的优点在于：可用以点涂在金属基板结构复杂或外壳等结构件上，固化后的导电衬垫具有优良的弹性，导电性和粘附性，起到优良的电磁屏蔽，接地和环境密封之效能。该低硬度的单组分导电胶水在压缩过程中可以用最轻便的压力，即可使得胶条贴合在塑料或金属的基材表面。
具体实施方式
为了更详细地说明本发明，给出下述制备实例。但本发明的范围并不局限于此。
实施例1
本实施例作为优选的方案。该低硬度的单组分导电胶水，由以下组分组成：树脂组成物、有机溶剂和镍包石墨导电粉，所述的树脂组成物由以下比重构成：乙烯基封端的聚二甲基硅氧烷25％，氢硅键聚硅氧烷油5％，阻聚剂0.1％，以及胶囊包覆铂络合物1％；树脂组成物与镍包石墨导电粉的重量比为31/62；所述的有机溶剂重量为树脂组成物重量的22％。在上述胶囊包覆铂络合物中，其使用微胶囊技术，用各种天然的或合成的高分子化合物连续薄膜完全包覆内部的铂络合物，防止在常温的情况下直接和氢硅键聚硅氧烷油反应，而在特定的温度下才将包覆物化掉进行反应，同时，上述的胶囊材质能和硅胶相容。
作为对上述低硬度的单组分导电胶水的进一步描述，所述的镍包石墨导电粉为50-150μm的非规则圆形或椭圆形粉体。
一种制得所述低硬度的单组分导电胶水的方法，其步骤为：把树脂组成物和有机溶剂盛入密封的搅拌设备中，将搅拌设备恒定在23±5℃温度范围内，以200转/分钟的速度搅拌混合5-10min，且搅拌过程中搅拌设备内保持大气压强小于0.07Mpa，混合均匀后加入镍包石墨导电粉再搅拌5-10min，即制得上述的低硬度高屏蔽效能的导电胶水。
作为对上述低硬度的单组分导电胶水制备方法的进一步描述，加入镍包石墨导电粉时将总量分为多次加入，每次加入后分别搅拌5-10min。
实施例2
低硬度的单组分导电胶水，由以下组分组成：树脂组成物、有机溶剂和镍包石墨导电粉，所述的树脂组成物由以下比重构成：乙烯基封端的聚二甲基硅氧烷20％，氢硅键聚硅氧烷油10％，阻聚剂0.1％，以及胶囊包覆铂络合物0.5％；树脂组成物与镍包石墨导电粉的重量比为31/60；所述的有机溶剂重量为树脂组成物重量的30％。
作为对上述低硬度的单组分导电胶水的进一步描述，所述的镍包石墨导电粉为50-150μm的非规则圆形或椭圆形粉体。
一种制得所述低硬度的单组分导电胶水的方法，其步骤为：把树脂组成物和有机溶剂盛入密封的搅拌设备中，将搅拌设备恒定在23±5℃温度范围内，以200转/分钟的速度搅拌混合5-10min，且搅拌过程中搅拌设备内保持大气压强小于0.07Mpa，混合均匀后加入镍包石墨导电粉再搅拌5-10min，即制得权利要求1-2任一项所述的低硬度高屏蔽效能的导电胶水。
作为对上述低硬度的单组分导电胶水制备方法的进一步描述，加入镍包石墨导电粉时将总量分为多次加入，每次加入后分别搅拌5-10min。
实施例3
低硬度的单组分导电胶水，由以下组分组成：树脂组成物、有机溶剂和镍包石墨导电粉，所述的树脂组成物由以下比重构成：乙烯基封端的聚二甲基硅氧烷40％，氢硅键聚硅氧烷油15％，阻聚剂0.15％，以及胶囊包覆铂络合物1％；树脂组成物与镍包石墨导电粉的重量比为56/40；所述的有机溶剂重量为树脂组成物重量的7％。
作为对上述低硬度的单组分导电胶水的进一步描述，所述的镍包石墨导电粉为50-150μm的非规则圆形或椭圆形粉体。
一种制得所述低硬度的单组分导电胶水的方法，其步骤为：把树脂组成物和有机溶剂盛入密封的搅拌设备中，将搅拌设备恒定在23±5℃温度范围内，以200转/分钟的速度搅拌混合5-10min，且搅拌过程中搅拌设备内保持大气压强小于0.07Mpa，混合均匀后加入镍包石墨导电粉再搅拌5-10min，即制得上述的低硬度高屏蔽效能的导电胶水。
作为对上述低硬度的单组分导电胶水制备方法的进一步描述，加入镍包石墨导电粉时将总量分为多次加入，每次加入后分别搅拌5-10min。
实施例4
低硬度的单组分导电胶水，由以下组分组成：树脂组成物、有机溶剂和镍包石墨导电粉，所述的树脂组成物由以下比重构成：乙烯基封端的聚二甲基硅氧烷25％，氢硅键聚硅氧烷油5％，阻聚剂0.1％，以及胶囊包覆铂络合物0.1％；树脂组成物与镍包石墨导电粉的重量比为30/60；所述的有机溶剂重量为树脂组成物重量的33％。在上述胶囊包覆铂络合物中，其使用微胶囊技术，用各种天然的或合成的高分子化合物连续薄膜完全包覆内部的铂络合物，防止在常温的情况下直接和氢硅键聚硅氧烷油反应，而在特定的温度下才将包覆物化掉进行反应，同时，上述的胶囊材质能和硅胶相容。
作为对上述低硬度的单组分导电胶水的进一步描述，所述的镍包石墨导电粉为50-150μm的非规则圆形或椭圆形粉体。
一种制得所述低硬度的单组分导电胶水的方法，其步骤为：把树脂组成物和有机溶剂盛入密封的搅拌设备中，将搅拌设备恒定在23±5℃温度范围内，以200转/分钟的速度搅拌混合5-10min，且搅拌过程中搅拌设备内保持大气压强小于0.07Mpa，混合均匀后加入镍包石墨导电粉再搅拌5-10min，即制得上述的低硬度高屏蔽效能的导电胶水。
作为对上述低硬度的单组分导电胶水制备方法的进一步描述，加入镍包石墨导电粉时将总量分为多次加入，每次加入后分别搅拌5-10min。
本发明还提供了一种使用上述低硬度的单组分导电胶水的方法，其存储温度范围为-30到-10℃，在存储温度范围内存储期限为6个月；在进行使用时，将热固化环境设为：保持温度150℃状态，持续热固化时间为30Min即可。
以下提供本发明的测试数据：
将实施例1-4所获得的导电胶水分别对应为3组，每组测试3次；
测试项目：表面电阻/体积电阻率、拉伸强度/伸长率/撕裂强度、压缩变形率、附着力。
测试结果如下：
实施例1
实施例2
实施例3
实施例4
从以上可见，实施例1/3之间为乙烯基封端的聚二甲基硅氧烷、氢硅键聚硅氧烷油变化量较大，而再结合实施例2的数据，可以大概得出增加聚二甲基硅氧烷、氢硅键聚硅氧烷油的总比重时，电性能、压缩变形率有一定的增加，但同时测试的变化值幅度较大，也表明上述量的增加对胶水整体带来电性能、物理特性上的不稳定，因而对于阻聚剂以及胶囊包覆铂络合物的加入可以提高稳定性。
对于铂络合物的选量，实施例1/4比重具有较大的差别，由数据可以看到，其在附着力、压缩变形率等方面有较大幅度的变化，但各参数之间的变化并非都是同向的，对于选用铂络合物的量时，实施例1可以看出是较为合适的。同时，各实施例所获得的邵氏硬度分别为42/47/37/41，邵氏硬度较小时更为合适，实施例3虽硬度较小，但其他参数却不是最优，特别在电性能方面。
以上所述，仅为本发明较佳的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本领域的技术人员在本发明揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应该以权利要求的保护范围为准。

Claims (4)

1.低硬度的单组分导电胶水，其特征在于，由以下组分组成：树脂组成物、有机溶剂和镍包石墨导电粉，所述的树脂组成物由以下比重构成：乙烯基封端的聚二甲基硅氧烷20—40%，氢硅键聚硅氧烷油5-15% ，阻聚剂0 .05-0 .15%，以及胶囊包覆铂络合物0 .1%—1%，上述百分比均以导电胶水为基准；树脂组成物与镍包石墨导电粉的重量比为20-40/80-60；所述的有机溶剂重量为树脂组成物重量的20%-40%；所述的镍包石墨导电粉为50-150μm 的非规则圆形或椭圆形粉体。
2.一种制得低硬度的单组分导电胶水的方法，其特征在于：把树脂组成物和有机溶剂盛入密封的搅拌设备中，将搅拌设备恒定在23±5℃温度范围内，以200 转/分钟的速度搅拌混合5-10min，且搅拌过程中搅拌设备内保持大气压强小于0 .07MPa，混合均匀后加入镍包石墨导电粉再搅拌5-10min，即制得权利要求1 所述的低硬度的单组分导电胶水。
3.根据权利要求2 所述的制得低硬度的单组分导电胶水的方法，其特征在于：加入镍包石墨导电粉时将总量分为多次加入，每次加入后分别搅拌5-10min。
4.一种使用权利要求1 所述的低硬度的单组分导电胶水的方法，其特征在于：存储温度范围为-30 到-10℃，在存储温度范围内存储期限为6 个月；热固化条件为保持温度150℃状态，持续热固化时间为30min。
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