CN106102429B - Electronic product - Google Patents
Electronic product Download PDFInfo
- Publication number
- CN106102429B CN106102429B CN201610505453.9A CN201610505453A CN106102429B CN 106102429 B CN106102429 B CN 106102429B CN 201610505453 A CN201610505453 A CN 201610505453A CN 106102429 B CN106102429 B CN 106102429B
- Authority
- CN
- China
- Prior art keywords
- component
- radome
- circuit board
- electronic product
- secondary shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000009434 installation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a kind of electronic product, including：Circuit board, the first radome and secondary shielding cover.Circuit board is provided with the first component and the second component, and the height of the second component is more than the height of the first component.First radome is located on circuit board, and the first component is located in the first radome, wherein, the first radome is provided with breach, and the top of the second component is stretched out out of breach.Secondary shielding cover is located on breach, and the second component is located in secondary shielding cover.According to the electronic product of the present invention, it can prevent the second higher component from being contacted with radome and short-circuit, and can prevents component by external interference, while only sets secondary shielding cover in the second higher component upper cover, is advantageous to the thickness of control electronic product complete machine.
Description
Technical field
The present invention relates to electronics field.
Background technology
The higher element on PCB, radome can not set it is too high because setting the too high thickness for influencing whether complete machine
Degree.But if radome is designed to relatively low, it is easy to cause short circuit with high element again.
The content of the invention
The application is intended at least solve one of technical problem present in prior art.Therefore, the present invention is intended to provide one
Electronic product is planted, elements on circuit board is not easy short circuit in the electronic product.
Electronic product according to embodiments of the present invention, including：Circuit board, the circuit board are provided with the first component and the
Binary devices, the height of second component are more than the height of first component；First radome, first shielding
It is located on the circuit board, first component is located in first radome, wherein, on first radome
Provided with breach, the top of second component is stretched out out of described breach；Secondary shielding cover, the secondary shielding cover are located at
On the breach, and second component is located in the secondary shielding cover.
Electronic product according to embodiments of the present invention, the first shorter component is set by using the first radome cover, and
Breach is set at the higher secondary shielding cover of the correspondence of the first radome, secondary shielding cover is set on breach, so as to prevent
The second higher component contacts and short-circuit with radome, and and can prevents component by external interference, while only higher
Second component upper cover sets secondary shielding cover, is advantageous to control the thickness of electronic product complete machine.
Specifically, first component is multiple that second component is located at least two first components
Between.
In certain embodiments, the secondary shielding is located on first radome.
Alternatively, first radome is integrated part with the secondary shielding cover.
In other specific embodiments, the secondary shielding is located on the circuit board.
In certain embodiments, the circuit board is provided with the 3rd component, and the housing of the electronic product is metal-back
Body, and the housing is provided with annular rib, the annular rib is pressed on the dew copper region of the circuit board, and the annular
Rib is around the 3rd component.Thus, the housing of electronic product can also serve as radome, realize and shield in annular rib
The purpose of 3rd component.
Specifically, the annular rib is integrally formed on the housing.So as to convenient processing, assembling.
In certain embodiments, the surface of the circuit board is provided with groove, and the circuit board is provided with the 4th component, institute
The 4th component is stated to be located in the groove.It can so make the thickness of complete machine thinning, improve Consumer's Experience.
Specifically, the 4th component is located in first radome or the secondary shielding cover.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment
Substantially and it is readily appreciated that, wherein：
Fig. 1 is the cut-away view of the side-looking direction of electronic product according to an embodiment of the invention.
Reference：
Electronic product 10,
Housing 1, annular rib 13,
Circuit board 2, groove 21,
First component 51, the second component 52, the 3rd component 53, the 4th component 54,
First radome 6, breach 61, secondary shielding cover 7.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
Electronic product 10 according to embodiments of the present invention is described below with reference to Fig. 1, electronic product 10 can be mobile phone etc., electronics
Other electronic equipments such as product 10 or palm PC, are not especially limited here.
Electronic product 10 according to embodiments of the present invention, as shown in figure 1, including：Circuit board 2, the first radome 6 and second
Radome 7.Specifically, electronic product 10 also includes housing 1, and circuit board 2 is located in housing 1, the first radome 6 and secondary shielding
Cover 7 is also provided in housing 1.
Circuit board 2 is provided with the first component 51 and the second component 52, and the height of the second component 52 is more than first yuan
The height of device 51.First radome 6 is located on circuit board 2, and the first component 51 is located in the first radome 6, wherein, the
One radome 6 is provided with breach 61, and the top of the second component 52 is stretched out out of breach 61.Secondary shielding cover 7 is located at breach
On 61, and the second component 52 is located in secondary shielding cover 7.
That is, circuit board 2 is provided with radome, radome is located on component, so as to control board 2
EMI (Electro Magnetic Interference, electromagnetic interference), that is, prevent the component in radome by extraneous electricity
The interference of magnetic.
It is understood that difference of the electronic product because of function, the component of species various kinds can be assembled on its circuit board, such as
Various resistance, electric capacity, inductance, diode etc., and for example various chips, deck etc., these component sizes are different, and area occupied is not
Together, on circuit boards height is also different.
On circuit boards for the component for needing to be electromagnetically shielded, if the radome set is with height highest component
On the basis of set, then the height of radome is excessive, and the thickness of electronic product can be excessive.And if using highly relatively low component as
Benchmark sets radome, it is clear that the higher component of some height can not be located in radome.Illustrate to simplify, under
The component that text refers to will refer to need the component being electromagnetically shielded.
And in the embodiment of the present invention, to solve the above problems, radome is divided into first for height different component
Radome 6 and secondary shielding cover 7.The first radome 6, and if the first screen are set in the highly relatively low upper cover of the first component 51
Cover and the second component 52 that height is more than the first component 51 is covered with cover 6, be then located at the second component in the first radome 6
52 upper sections are emptied to form breach 61, i.e. the first radome 6 is avoided by breach 61 and drives the second component 52.Then in breach
Covered again at 61 and set secondary shielding cover 7, be located at secondary shielding cover 7 on the second component 52.
So, electronic product 10 according to embodiments of the present invention, shorter first yuan is set by using the first radome 6 cover
Device 51, and breach 61 is set at the higher secondary shielding cover 7 of the correspondence of the first radome 6, second screen is set on breach 61
Cover 7 is covered, short-circuit so as to prevent the second higher component 52 from being contacted with radome, and can prevents that component is dry by the external world
Disturb, while only set secondary shielding cover 7 in the higher upper cover of the second component 52, be advantageous to control the thickness of the complete machine of electronic product 10
Degree.
It is understood that " thickness " that is referred in illustrating herein refers to thickness of the electronic product 10 in circuit board 2
Size on direction (direction shown in arrow B in Fig. 1), i.e. thickness refer to macroscopically complete machine thickness." height " refers to
The size of component or radome on the thickness direction (direction shown in arrow B in Fig. 1) of circuit board 2, with respect to package size
For, the size highly for microcosmic upper machine body internals.
In addition, the top of component refers to one end farthest apart from circuit board 2 of component herein, if component
The top of circuit board 2 is located at, the top of component is top.Certainly, if circuit board 2 is rotated into 180 degree, now component is set
Below circuit board 2, the top of component is still one end farthest apart from circuit board 2 of component, is located at above-mentioned component
Situation during 2 top of circuit board not contradiction.The roof of radome understands also referring to described above, repeats no more here.
Herein, the component type that the first component 51 and the second component 52 do not refer in particular to, in the reality shown in Fig. 1
Apply for convenience of understanding in example, component of the height less than or equal to preset value h is referred to as the first component 51, and the second component
52 height is greater than preset value h.
So, when setting radome, preset value h and prepsetting gap n additive value turn into high in the cover of the first radome 6
Degree, i.e., after the first radome 6 is covered on the first component 51, the top of the roof of the first radome 6 and the first component 51 it
Between at least between be separated with prepsetting gap n.Wherein, preset value h and prepsetting gap n value can be set according to actual conditions, not made here
Limit.
And if the second component 52 under the first radome 6, the top of the roof of the first radome 6 and the second component 52
End interval is less than prepsetting gap n, or even cover does not live the second component 52, then needs to set breach 61 here and according to this second yuan
The height of device 52 and preset clearance set secondary shielding cover 7.
It is understood that being not only provided with the component on circuit board 2 and circuit board 2 in housing 1, can also be set in housing 1
There is miscellaneous part.And covered on circuit board 2 with the first shorter radome 6, then it is spaced apart between the radome 6 of housing 1 and first
Gap it is larger, these space of components of arranging will increase, and these parts can bypass the second screen when running into secondary shielding cover 7
Cover 7 is covered, can thus control the complete machine thickness of electronic product 10 to greatest extent.
In certain embodiments, as shown in figure 1, the first component 51 is multiple, the second component 52 is located at least two
Between first component 51, the scheme for being combined secondary shielding cover 7 using the first radome 6 in this case can be avoided preferably
The second higher component 52, the height of the first radome 6 is without setting too high.
Certainly, the position relationship not limited to this of the first component 51 and the second component 52 in the embodiment of the present invention, such as
Region shared by multiple first components 51 is substantially rectangular in cross section, and when the corner of the rectangle is provided with second component 52,
If making the first radome according to the arrangement shape of the first component 51, the shape of the first radome is more complicated, is unfavorable for adding
Work.And if the first radome is made into rectangular cover, then set breach 61 and secondary shielding cover at corresponding second component 52
7, difficulty of processing can be reduced moderately.
Setting more in the quantity of the first component 51 and in blocks, second yuan of device is sporadically provided between multiple first components 51
During part 52, multiple first components 51 can be covered with first radome 6, will be corresponded to when then running into the second component 52
Place sets breach 61 and secondary shielding cover 7, can save the quantity and area of the first radome 6.Obviously, this scheme advantage can reach
To maximum, facilitate the installation settings of radome.
In embodiments of the present invention, the setting form of secondary shielding cover 7 has a variety of, such as in certain embodiments,
Secondary shielding cover 7 is located on the first radome 6, or even the first radome 6 is integrated part with secondary shielding cover 7, by the first shielding
Cover 6 and secondary shielding cover 7 are integrally machined, and can reduce the processing cost of radome.
In other specific embodiments, secondary shielding cover 7 is set on the circuit board 2, i.e., secondary shielding cover 7 and first shields
Cover 6 is separately separately machined, and such machining accuracy can be improved.
In certain embodiments, circuit board 2 is provided with the 4th component 54, and circuit board 2 is provided with groove 21, quaternary device
Part 54 is located in groove 21.
Alternatively, the 4th component 54 may be provided in the first radome 6, and the 4th component 54 may be alternatively provided at secondary shielding cover
In 7, certainly, the 4th component 54 may be alternatively provided in independent radome, be not especially limited here.
If it is appreciated that the excessive height of component, or even can not cover in secondary shielding cover 7, the component can shadow
Ring the thickness to complete machine.Therefore when design, several layers of PCB can be emptied on the circuit board 2, the 4th component 54
Pad design in PCB internal layer, allow the 4th component 54 to assist in the groove 21 of circuit board 2, can so make complete machine
Thickness is thinning, improves Consumer's Experience.
In certain embodiments, the housing 1 of electronic product 10 is metal-back, and housing 1 is provided with annular rib 13, annular
Rib 13 is pressed on the dew copper region of circuit board 2.Circuit board 2 is provided with the 3rd component 53, and annular rib 13 is around the 3rd
Component 53.Wherein, annular rib 13 is bonding jumper, and so, the housing 1 of electronic product 10 can also serve as radome, realize screen
Cover the purpose of the 3rd component 53 in annular rib 13.
Specifically, housing 1 is made into annular rib 13 according to the size of radome, the ring after mobile phone installation on metal-back
Shape rib 13 is pressed in the dew copper region on PCB.
More specifically, annular rib 13 is integrally formed on housing 1, so as to convenient processing, assembling.
In embodiment also, component, and circuit board 2 are equipped with the opposing sides on the thickness direction of circuit board 2
Opposing sides on be covered with radome, with the mode of two-sided laying component, fabric swatch space on circuit board 2 can be increased, subtracted
The small gross area of circuit board 2, reduce the cost of circuit board 2.
Optionally, the first component 51 and the second component 52 are equipped with the opposing sides of circuit board 2, in circuit board 2
Opposing sides on be covered with the first radome 6 and secondary shielding cover 7, so, control the EMI of whole circuit board 2, simultaneously
Also the thickness of complete machine is controlled.
In the description of the invention, it is to be understood that term " " center ", " height ", " thickness ", " on ", " under ",
The orientation or position relationship of the instruction such as " top ", " bottom ", " interior ", " outer " are based on orientation shown in the drawings or position relationship, are only
Described for the ease of description is of the invention with simplified, rather than the device or element of instruction or hint meaning must be with specifically sides
Position, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the invention, unless otherwise indicated, " multiple " are meant that two
Individual or two or more.
In the description of the invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ",
" fixation " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be machinery
Connection or electrical connection；Can be joined directly together, can also be indirectly connected by intermediary, can be two elements
Internal connection or the interaction relationship of two elements.For the ordinary skill in the art, can be with concrete condition
Understand the concrete meaning of above-mentioned term in the present invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
In the description of this specification, the description of reference term " embodiment ", " example " etc. mean to combine the embodiment or
Specific features, structure, material or the feature of example description are contained at least one embodiment or example of the present invention.At this
In specification, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, description is specific
Feature, structure, material or feature can combine in an appropriate manner in any one or more embodiments or example.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
In the case of departing from the principle and objective of the present invention a variety of change, modification, replacement and modification can be carried out to these embodiments, this
The scope of invention is limited by claim and its equivalent.
Claims (6)
- A kind of 1. electronic product, it is characterised in that including：Circuit board, the circuit board are provided with the first component and the second component, and the height of second component is more than institute State the height of the first component；First radome, first radome are located on the circuit board, and first component is located at first screen Cover in cover, wherein, first radome is provided with breach, and the top of second component is stretched out out of described breach；Secondary shielding cover, the secondary shielding cover are located on the breach, and second component is located at second screen Cover in cover, wherein, the secondary shielding is located on the circuit board, and the secondary shielding cover separates with first radome It is separately machined.
- 2. electronic product according to claim 1, it is characterised in that first component is multiple, described second yuan Device is located between at least two first components.
- 3. electronic product according to claim 1, it is characterised in that the circuit board is provided with the 3rd component, described The housing of electronic product is metal shell, and the housing is provided with annular rib, and the annular rib is pressed in the circuit board Dew copper region on, and the annular rib is around the 3rd component.
- 4. electronic product according to claim 3, it is characterised in that the annular rib is integrally formed in the housing On.
- 5. according to the electronic product any one of claim 1-4, it is characterised in that the surface of the circuit board is provided with recessed Groove, the circuit board are provided with the 4th component, and the 4th component is located in the groove.
- 6. electronic product according to claim 5, it is characterised in that the 4th component is located at first radome Or in the secondary shielding cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610505453.9A CN106102429B (en) | 2016-06-28 | 2016-06-28 | Electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610505453.9A CN106102429B (en) | 2016-06-28 | 2016-06-28 | Electronic product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106102429A CN106102429A (en) | 2016-11-09 |
| CN106102429B true CN106102429B (en) | 2018-01-19 |
Family
ID=57214213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610505453.9A Expired - Fee Related CN106102429B (en) | 2016-06-28 | 2016-06-28 | Electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106102429B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535603B (en) * | 2016-11-28 | 2019-03-22 | Oppo广东移动通信有限公司 | A kind of printed circuit board and mobile terminal |
| CN109561644B (en) * | 2018-11-28 | 2020-10-30 | 维沃移动通信有限公司 | Preparation method of circuit board assembly, circuit board assembly and mobile terminal |
| CN110648695B (en) * | 2019-09-23 | 2024-05-03 | 深圳市德明利技术股份有限公司 | Structure compatible with mobile solid state disk and mobile solid state disk |
| CN113825381B (en) * | 2021-10-20 | 2024-12-13 | 重庆金山医疗机器人有限公司 | Shielding device and minimally invasive surgical robot |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101212866A (en) * | 2006-12-28 | 2008-07-02 | 松下电器产业株式会社 | Module |
| CN103326190A (en) * | 2013-06-03 | 2013-09-25 | 华为终端有限公司 | Shielding structure for radio frequency coaxial connector and set top box provided with shielding structure |
| CN105629552A (en) * | 2016-03-30 | 2016-06-01 | 努比亚技术有限公司 | LCD connector and mobile terminal |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201243435Y (en) * | 2008-07-30 | 2009-05-20 | 比亚迪股份有限公司 | Shielding cover for circuit board |
| CN102280732B (en) * | 2010-06-10 | 2014-01-29 | 上海莫仕连接器有限公司 | Electric connector |
| CN201830551U (en) * | 2010-10-21 | 2011-05-11 | 中兴通讯股份有限公司 | PCB (printed circuit board), communication module and communication device |
| CN102791119A (en) * | 2012-07-26 | 2012-11-21 | 中兴通讯股份有限公司 | Mobile terminal |
-
2016
- 2016-06-28 CN CN201610505453.9A patent/CN106102429B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101212866A (en) * | 2006-12-28 | 2008-07-02 | 松下电器产业株式会社 | Module |
| CN103326190A (en) * | 2013-06-03 | 2013-09-25 | 华为终端有限公司 | Shielding structure for radio frequency coaxial connector and set top box provided with shielding structure |
| CN105629552A (en) * | 2016-03-30 | 2016-06-01 | 努比亚技术有限公司 | LCD connector and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106102429A (en) | 2016-11-09 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523859 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180119 |