CN106098896A - A kind of all-round smooth COB module of LED printing opacity circuit board and manufacture method - Google Patents
A kind of all-round smooth COB module of LED printing opacity circuit board and manufacture method Download PDFInfo
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- CN106098896A CN106098896A CN201610416036.7A CN201610416036A CN106098896A CN 106098896 A CN106098896 A CN 106098896A CN 201610416036 A CN201610416036 A CN 201610416036A CN 106098896 A CN106098896 A CN 106098896A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 70
- 229910052751 metal Inorganic materials 0.000 claims abstract description 70
- 239000003292 glue Substances 0.000 claims abstract description 35
- 238000004806 packaging method and process Methods 0.000 claims abstract description 20
- 239000011888 foil Substances 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 239000010410 layer Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 238000004021 metal welding Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 claims description 2
- 239000010980 sapphire Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000004020 luminiscence type Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
本发明涉及一种LED透光电路板全周光COB模组及制造方法，具体而言，在金属箔的一面上施加一层胶粘剂，用模具冲切出带有预断连接点的多个封装电路板的电路雏形，然后将预先已切割好的无机透光板对位贴到有胶的电路上，粘合在一起，在透光线路板上将LED芯片全部固晶在无机透光板表面，在焊线机上，用金属线将芯片和芯片之间，芯片和电路板电路之间焊接导通，封装胶水分别施加在电路板的两面和侧面，并且露出与外界电路连通的导通点，在未粘接无机透光板的金属连接处分切，形成单片LED电路板全周光COB模组，本发明用一种透光电路板通过封装制成全周光COB模组，结构简洁，加工简单，制作成本低，实现了360度全周发光。
The invention relates to a full-circumference light COB module of an LED light-transmitting circuit board and a manufacturing method. Specifically, a layer of adhesive is applied on one side of a metal foil, and a plurality of packaged circuits with pre-broken connection points are punched out with a mold The circuit prototype of the board, and then the pre-cut inorganic light-transmitting board is pasted on the glued circuit, glued together, and all the LED chips are solidified on the surface of the inorganic light-transmitting board on the light-transmitting circuit board. On the wire bonding machine, metal wires are used to weld the chip and the chip, and between the chip and the circuit board circuit. The packaging glue is applied to the two sides and the side of the circuit board respectively, and the conduction point connected with the external circuit is exposed. The metal connection of the unbonded inorganic light-transmitting board is cut to form a single-chip LED circuit board full-circumference light COB module. The invention uses a light-transmitting circuit board to make a full-circle light COB module through packaging. The structure is simple and easy to process. It is simple, low in production cost, and realizes 360-degree full-circle luminescence.
Description
技术领域technical field
本发明涉及线路板及LED应用领域，具体涉及一种LED透光电路板全周光COB模组及制造方法。The invention relates to the application fields of circuit boards and LEDs, in particular to an LED light-transmitting circuit board full-circumference light COB module and a manufacturing method.
背景技术Background technique
传统的LED灯泡的光源组件部分，通常都将LED发光二极管装在一个平面不透光的基板上，然后组装在LED灯泡里、或者是用多个围成一个立体的结构，这样前者只有一个面发光，发光角度小，后者组装成灯泡时要把多个基板通过多次焊接连接在一起，非常繁杂，效率低，并且发光最多也是几个面发光，而且发光面与面之间也不能连续均匀发光。The light source components of traditional LED light bulbs usually install LED light-emitting diodes on a flat and opaque substrate, and then assemble them in LED light bulbs, or use a plurality of them to form a three-dimensional structure, so that the former has only one surface. Lighting, the light angle is small, and when the latter is assembled into a light bulb, multiple substrates must be connected together by multiple welding, which is very complicated and inefficient, and the light is emitted from several surfaces at most, and the light-emitting surfaces cannot be continuous Uniform glow.
如何实现360度全周发光，一直是本领域始终研究的技术问题和持续改进的目标，本发明用一种透光电路板通过封装制成全周光COB模组，结构简洁，加工及组装简单，制作成本低，易实现自动化装备，实现了360度全周发光的COB模组。How to achieve 360-degree full-circle lighting has always been a technical problem and the goal of continuous improvement in this field. The present invention uses a light-transmitting circuit board to make a full-circle light COB module through packaging, which has a simple structure and is easy to process and assemble. , low production cost, easy to realize automatic equipment, and realize the COB module with 360-degree full-circle light.
发明内容Contents of the invention
本发明涉及一种LED透光电路板全周光COB模组及制造方法，具体而言，在金属箔或者金属带的一面上施加一层胶粘剂，用模具冲切出带有预断连接点的多个封装电路板的电路雏形，然后将预先已切割好的无机透光板对位贴到有胶的电路上，牢固粘合在一起，在透光线路板上封装LED芯片，将LED芯片全部固晶在无机透光板表面、或者一部分固晶在无机透光板表面，另一部分固在金属电路表面，用焊线机焊接金属线将芯片和芯片之间，芯片和电路板电路之间形成导通，封装胶水分别施加在电路板的两面、或者是施加在电路板的两面和侧面，并且露出与外界电路连通的导通点，固化胶水，在未粘接无机透光板的金属连接处分切，形成单片LED电路板全周光COB模组，本发明用一种透光电路板通过封装制成全周光COB模组，结构简洁，加工及组装简单，制作成本低，易实现自动化装备，实现了360度全周发光的COB模组。The invention relates to a full-circumference light COB module of an LED light-transmitting circuit board and a manufacturing method thereof. Specifically, a layer of adhesive is applied on one side of a metal foil or a metal strip, and a plurality of pre-broken connection points are punched out with a mold. A circuit prototype of a packaged circuit board, and then attach the pre-cut inorganic light-transmitting board to the glued circuit, and stick them together firmly, package the LED chip on the light-transmitting circuit board, and fix all the LED chips. The crystal is on the surface of the inorganic light-transmitting plate, or part of the crystal is fixed on the surface of the inorganic light-transmitting plate, and the other part is fixed on the surface of the metal circuit. Use a wire bonding machine to weld the metal wire to form a conductive line between the chip and the chip, and between the chip and the circuit board circuit. Through, the encapsulation glue is applied on both sides of the circuit board, or on both sides and sides of the circuit board, and exposes the conduction point connected with the external circuit, the glue is cured, and the metal connection of the inorganic light-transmitting board is not bonded. , to form a single-chip LED circuit board full-circle light COB module. The present invention uses a light-transmitting circuit board to make a full-circle light COB module through packaging. The structure is simple, the processing and assembly are simple, the production cost is low, and it is easy to realize automatic equipment. , to achieve a 360-degree full-circle luminous COB module.
根据本发明提供了一种LED透光电路板全周光COB模组的制造方法，包括：金属箔或者金属带；施加在金属箔或者金属带上的胶粘剂；无机透光板；LED芯片；金属焊线；封装胶水；其中，胶粘剂施加在金属箔或者金属带的一面上，用模具冲切成带有预断连接点的多个封装电路板的电路雏形，将预先切割好的无机透光板对位贴到电路板的电路雏形有胶的哪一面上，牢固粘合在一起，LED芯片全部固晶在无机透光板表面、或者一部分固晶在无机透光板表面，另一部分固在金属电路表面，用金属线将芯片和芯片之间，芯片和电路板电路之间焊接导通，封装胶水分别施加在电路板的两面、或者是施加在电路板的两面和侧面，并且露出与外界电路连通的导通焊点或者和外界连接的导通焊点已焊上连接导体，固化胶水，在未粘接无机透光板的金属连接处分切，形成单片LED电路板全周光COB模组。According to the present invention, there is provided a method for manufacturing an LED light-transmitting circuit board full-circumference light COB module, including: metal foil or metal strip; adhesive applied on the metal foil or metal strip; inorganic light-transmitting plate; LED chip; metal Welding wire; packaging glue; wherein, the adhesive is applied on one side of the metal foil or metal strip, and the circuit prototype of a plurality of packaged circuit boards with pre-broken connection points is punched out with a mold, and the pre-cut inorganic light-transmitting board is placed on the Stick to the side of the circuit prototype with glue on the circuit board, and firmly bond them together. All LED chips are solidified on the surface of the inorganic light-transmitting board, or part of the crystal is fixed on the surface of the inorganic light-transmitting board, and the other part is fixed on the metal circuit. On the surface, use metal wires to solder and conduct between the chip and the chip, and between the chip and the circuit board circuit. The packaging glue is applied to the two sides of the circuit board, or to the two sides and the side of the circuit board, and is exposed to communicate with the external circuit. The conduction solder joints or the conduction solder joints connected to the outside world have been welded with connecting conductors, the glue is cured, and the metal connection of the inorganic light-transmitting board is not bonded, and the metal connection is cut to form a single-chip LED circuit board full-circumference light COB module.
根据本发明还提供了一种LED透光电路板全周光COB模组的制造方法，包括：金属箔或者金属带；施加在金属箔或者金属带上的胶粘剂；无机透光板；LED芯片；金属焊线；封装胶水；其中，用金属箔或者金属带通过蚀刻方式制成电路雏形，在电路雏形的一面施加胶粘剂，将预先切割好的无机透光板对位贴到电路板的电路雏形有胶的哪一面上，牢固粘合在一起，LED芯片全部固晶在无机透光板表面、或者一部分固晶在无机透光板表面，另一部分固在金属电路表面，用金属线将芯片和芯片之间，芯片和电路板电路之间焊接导通，封装胶水分别施加在电路板的两面、或者是施加在电路板的两面和侧面，并且露出与外界电路连通的导通焊点或者与外界连接的导通焊点已焊上连接导体，固化胶水，在未粘接无机透光板的金属连接处分切，形成单片LED电路板全周光COB模组。According to the present invention, there is also provided a method for manufacturing an LED light-transmitting circuit board full-circumference light COB module, including: metal foil or metal strip; adhesive applied on the metal foil or metal strip; inorganic light-transmitting board; LED chip; Metal bonding wire; packaging glue; among them, the prototype of the circuit is made by etching with metal foil or metal strip, and the adhesive is applied to one side of the prototype of the circuit, and the prototype of the circuit that attaches the pre-cut inorganic light-transmitting board to the circuit board has Which side of the glue is firmly bonded together. All LED chips are solidified on the surface of the inorganic light-transmitting plate, or part of the crystal is fixed on the surface of the inorganic light-transmitting plate, and the other part is fixed on the surface of the metal circuit. Between the chip and the circuit board circuit, the soldering conduction between the chip and the circuit board circuit, the packaging glue is applied on both sides of the circuit board, or on the two sides and the side of the circuit board, and exposes the conductive solder joints connected with the external circuit or connected with the outside world Connecting conductors have been welded on the conduction solder joints, the glue is cured, and the metal connection of the unbonded inorganic light-transmitting board is cut to form a single-chip LED circuit board full-circumference COB module.
根据本发明的一个优选实施例，所述的金属箔或者金属带是铁镀银、或者是铜镀银。According to a preferred embodiment of the present invention, the metal foil or metal strip is iron plated with silver or copper plated with silver.
根据本发明的一个优选实施例，所述的无机透光板为陶瓷、或者玻璃、或者蓝宝石。According to a preferred embodiment of the present invention, the inorganic light-transmitting plate is ceramic, or glass, or sapphire.
根据本发明的一个优选实施例，所述的封装胶水是加有荧光粉的胶水。According to a preferred embodiment of the present invention, the packaging glue is glue added with fluorescent powder.
根据本发明还提供了一种LED透光电路板全周光COB模组，包括：金属线路层；胶粘层；无机透光板；LED芯片；金属焊线；封装胶水；其中，所述的胶粘剂将金属线路层和无机透光板牢固粘合在一起，所述的无机透光板起作绝缘承载作用，同时将LED发出的部分光从背面透射出去，LED芯片设置在无机透光板上、或者一部分设置在无机透光板上，另一部分设置在金属线路层上，金属线将芯片和芯片之间，芯片和金属线路之间连接导通，封装胶水分别设置在电路板的两面、或者是设置在电路板的两面和侧面，封装胶水后，保留电路板上和外界连接的电极焊点露出、或者电极焊点已焊有连接导体，即形成LED电路板全周光COB模组。According to the present invention, there is also provided a LED light-transmitting circuit board full-circumference COB module, including: metal circuit layer; adhesive layer; inorganic light-transmitting board; LED chip; metal bonding wire; packaging glue; wherein, the The adhesive firmly bonds the metal circuit layer and the inorganic light-transmitting plate together. The inorganic light-transmitting plate acts as an insulating load bearing, and at the same time transmits part of the light emitted by the LED from the back. The LED chip is set on the inorganic light-transmitting plate , or one part is arranged on the inorganic light-transmitting board, and the other part is arranged on the metal circuit layer, the metal wire connects and conducts between the chip and the chip, and the chip and the metal circuit, and the packaging glue is respectively arranged on both sides of the circuit board, or It is installed on both sides and sides of the circuit board. After the glue is packaged, the electrode solder joints connected to the outside world on the circuit board are left exposed, or the electrode solder joints have been welded with connecting conductors, that is, the LED circuit board full-circumference COB module is formed.
根据本发明的一个优选实施例，所述的LED透光电路板全周光COB模组用于制作LED蜡烛灯、或者LED球泡灯。According to a preferred embodiment of the present invention, the LED transparent circuit board omnidirectional light COB module is used to make LED candle lamps or LED bulb lamps.
根据本发明的一个优选实施例，COB模组与外界连接的焊点，设置在电路板和无机透光板粘接处的金属表面上、或者设置在未有无机透光板粘接的悬空金属电路处。According to a preferred embodiment of the present invention, the solder joints connecting the COB module to the outside world are set on the metal surface where the circuit board and the inorganic light-transmitting plate are bonded, or on the suspended metal surface where the inorganic light-transmitting plate is not bonded. circuit.
根据本发明的一个优选实施例，所述的LED蜡烛灯或者LED球泡灯，在灯泡内充有气体，采用密封的气体传导散热。According to a preferred embodiment of the present invention, the LED candle lamp or LED bulb lamp is filled with gas in the bulb, and uses sealed gas conduction to dissipate heat.
根据本发明的一个优选实施例，所述的LED蜡烛灯或者LED球泡灯，其LED透光电路板全周光COB模组是通过散热体支撑，并通过散热体传导散热。According to a preferred embodiment of the present invention, in the LED candle lamp or LED bulb lamp, the full-circumference light COB module of the LED light-transmitting circuit board is supported by a heat sink, and conducts heat dissipation through the heat sink.
在以下对附图和具体实施方式的描述中，将阐述本发明的一个或多个实施例的细节。The details of one or more embodiments of the invention are set forth in the following description of the accompanying drawings and the detailed description.
附图说明Description of drawings
通过结合以下附图阅读本说明书，本发明的特征、目的和优点将变得更加显而易见，对附图的简要说明如下。The features, objects and advantages of the present invention will become more apparent by reading this specification in conjunction with the following drawings, a brief description of which follows.
图1为本发明一实施例用金属带制作的带有预断连接点的多个封装电路板的电路雏形的示意图。FIG. 1 is a schematic diagram of a circuit prototype of a plurality of packaged circuit boards with pre-broken connection points made of metal strips according to an embodiment of the present invention.
图2为本发明一实施例用金属带制作的带有预断连接点的多个封装电路板的另一种电路雏形的示意图。Fig. 2 is a schematic diagram of another circuit prototype of a plurality of packaged circuit boards with pre-broken connection points made of metal strips according to an embodiment of the present invention.
图3为将已切割好的无机透光板对位贴到有胶一面的雏形电路上的示意图。Fig. 3 is a schematic diagram of attaching the cut inorganic light-transmitting plate to the prototype circuit on the glued side.
图4为将LED芯片全部固晶在无机透光板上的示意图。FIG. 4 is a schematic diagram of bonding all LED chips on an inorganic light-transmitting plate.
图5为将LED芯片一部分固晶在无机透光板上，一部分固在金属电路上的示意图。Fig. 5 is a schematic diagram of a part of the LED chip being solidified on the inorganic light-transmitting board and a part on the metal circuit.
图6为金属焊线将多个LED芯片和芯片之间，芯片和电路板电路之间焊接连通的示意图。FIG. 6 is a schematic diagram of metal bonding wires connecting a plurality of LED chips to each other, and between chips and a circuit board circuit.
图7为焊有LED芯片的透光电路板的两面和侧面均匀滴上荧光粉封装胶水后的示意图。Fig. 7 is a schematic diagram of the phosphor powder encapsulating glue evenly dripped on both sides and sides of the light-transmitting circuit board soldered with LED chips.
图8为LED芯片全部固晶在无机透光板上的单片LED电路板全周光COB模组示意图。Figure 8 is a schematic diagram of a single-chip LED circuit board full-circumference COB module in which all LED chips are solidified on an inorganic light-transmitting board.
图9是一部分LED芯片固晶在无机透光板上，一部分LED芯片固晶在金属电路上的单片LED电路板全周光COB模组示意图。Figure 9 is a schematic diagram of a single-chip LED circuit board full-circumference COB module in which a part of the LED chip is crystal-bonded on an inorganic light-transmitting board, and a part of the LED chip is crystal-bonded on a metal circuit.
具体实施方式detailed description
下面将以优选实施例为例来对本发明进行详细的描述。The present invention will be described in detail below by taking preferred embodiments as examples.
但是本领域技术人员应当理解，以下所述仅仅是举例说明和描述一些优选实施方式，对本发明的权利要求并不具有任何限制。However, those skilled in the art should understand that the following descriptions are only examples and descriptions of some preferred implementations, and do not have any limitations on the claims of the present invention.
在金属箔的一面上涂上一层胶粘剂，用预先根据设计制作好的模具冲切，除去不需要的金属(1.4)，留下预断连接点(1.2)和导通连接点(1.3)，制成一种有雏形电路(1.1)的电路板(1)(如图1所示)、或者根据后序封装LED芯片的需求，用上述同样的方法，制作成如图2所示的有雏形电路(2.1)的电路板(2)，图2中，标示2.2是预断连接点，标示2.3是导通连接点，标示2.4是用模模具冲切除去的不需要的金属。Apply a layer of adhesive on one side of the metal foil, punch out with a pre-made mold according to the design, remove unnecessary metal (1.4), leave the pre-break connection point (1.2) and conduction connection point (1.3), and make Form a circuit board (1) with a prototype circuit (1.1) (as shown in Figure 1), or according to the requirements of subsequent packaging of LED chips, use the same method as above to make a prototype circuit as shown in Figure 2 The circuit board (2) of (2.1), among Fig. 2, mark 2.2 is the pre-break connection point, and mark 2.3 is the conduction connection point, and mark 2.4 is the unnecessary metal that punches out with die die.
然后将预先已切割好的无机透光板(3)对位贴到电路(1.1)有胶的哪一面上，烘烤固化，无机透光板(3)与电路(1.1)牢固粘合在一起(如图3所示)。Then attach the pre-cut inorganic light-transmitting plate (3) to the glued side of the circuit (1.1), bake and cure, and the inorganic light-transmitting plate (3) and the circuit (1.1) are firmly bonded together (As shown in Figure 3).
当然上述的电路板(1)和电路板(2)也可以是用印制线路板传统蚀刻法的方法制作，然后再涂胶与无机透光板(3)粘合在一起，在此不多作细述。Of course, the above-mentioned circuit board (1) and circuit board (2) can also be made by the traditional etching method of printed circuit boards, and then glued together with the inorganic light-transmitting board (3). For details.
将LED芯片(4)全部固晶在无机透光板(3)上(如图4所示)、或者是将LED芯片(4)一部分固晶在无机透光板(3)上，一部分固在金属电路(2.1)上(如图5所示)，然后在焊线机上用金属线(5)将多个LED芯片(4)和芯片之间，芯片和电路板电路(1.1)之间焊接连通(如图6所示)，接下来分别在在电路板的两面滴混有荧光粉的封装胶水(6)，使混有荧光粉的封装胶水(6)均匀地包覆在焊有LED芯片的透光电路板的两面和侧面，并且露出与外界电路连通的导通点(1.3)，例如，可在导通点(1.3)的周围先滴上围坝胶，使其混有荧光粉的封装胶水(6)不流到导通点(1.3)上、或者是后序用刀片剥除/刮除覆盖在导通点(1.3)处的封装胶水，露出与外界电路连通的导通点(1.3)，烘烤将荧光粉封装胶水(6)固化(如图7所示)，用模具在未粘接无机透光板的金属连接处进行分切，制作成成单片的LED电路板全周光COB模组(如图8所示)，图9是一部分LED芯片固晶在无机透光板上，一部分LED芯片固晶在金属电路上的单片LED电路板全周光COB模组示意图。All the LED chips (4) are crystal-bonded on the inorganic light-transmitting plate (3) (as shown in Figure 4), or a part of the LED chip (4) is crystal-bonded on the inorganic light-transmitting plate (3), and a part is fixed on the inorganic light-transmitting plate (3). On the metal circuit (2.1) (as shown in Figure 5), then use metal wires (5) on the wire bonding machine to connect multiple LED chips (4) and the chips, and between the chips and the circuit board circuit (1.1) (as shown in Figure 6), then drop the encapsulation glue (6) that is mixed with phosphor powder on the two sides of the circuit board respectively, so that the encapsulation glue (6) that is mixed with phosphor powder is evenly coated on the soldered LED chip. The two sides and sides of the light-transmitting circuit board, and expose the conduction point (1.3) connected with the external circuit. For example, the dam glue can be dripped around the conduction point (1.3) to make it mixed with phosphor powder. The glue (6) does not flow to the conduction point (1.3), or the package glue covering the conduction point (1.3) is peeled off/scraped with a blade in the subsequent sequence, exposing the conduction point (1.3) that is connected to the external circuit ), bake and solidify the fluorescent powder encapsulation glue (6) (as shown in Figure 7), use a mold to cut the metal connection of the unbonded inorganic light-transmitting plate, and make it into a single piece of LED circuit board. Optical COB module (as shown in Figure 8), Figure 9 is a schematic diagram of a single-chip LED circuit board full-circumference optical COB module in which part of the LED chip is bonded to the inorganic light-transmitting plate and a part of the LED chip is bonded to the metal circuit.
本发明的LED电路板全周光COB模组，一种透光电路板通过封装制成全周光COB模组，结构简洁，加工及组装简单，制作成本低，易实现自动化装备，实现了360度全周发光的COB模组。The LED circuit board full-circle light COB module of the present invention is a full-circle light COB module made of a light-transmitting circuit board through packaging. A COB module with full-circle light.
以上结合附图将一种LED透光电路板全周光COB模组及制造方法的具体实施例对本发明进行了详细的描述。但是，本领域技术人员应当理解，以上所述仅仅是举例说明和描述一些具体实施方式，对本用新型的范围，尤其是权利要求的范围，并不具有任何限制。The present invention has been described in detail above with reference to the accompanying drawings for a specific embodiment of an LED light-transmitting circuit board full-circumference light COB module and its manufacturing method. However, those skilled in the art should understand that the above descriptions are only examples and descriptions of some specific implementations, and do not limit the scope of the present invention, especially the scope of the claims.
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| US20100140634A1 (en) * | 2009-11-09 | 2010-06-10 | Cree Led Lighting Solutions, Inc. | Solid state emitter package including red and blue emitters |
| CN202712177U (en) * | 2012-05-25 | 2013-01-30 | 苏州晶品光电科技有限公司 | Two-sided light emitting plane sheet type LED package structure |
| CN203367275U (en) * | 2013-06-03 | 2013-12-25 | 福建泉州世光照明科技有限公司 | Single-sided light emitting LED light source and double-sided light emitting LED light source |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100140634A1 (en) * | 2009-11-09 | 2010-06-10 | Cree Led Lighting Solutions, Inc. | Solid state emitter package including red and blue emitters |
| CN202712177U (en) * | 2012-05-25 | 2013-01-30 | 苏州晶品光电科技有限公司 | Two-sided light emitting plane sheet type LED package structure |
| CN203367275U (en) * | 2013-06-03 | 2013-12-25 | 福建泉州世光照明科技有限公司 | Single-sided light emitting LED light source and double-sided light emitting LED light source |
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