CN106088517A - A kind of insulation insulated compound floor panel structure - Google Patents
A kind of insulation insulated compound floor panel structure Download PDFInfo
- Publication number
- CN106088517A CN106088517A CN201610390593.6A CN201610390593A CN106088517A CN 106088517 A CN106088517 A CN 106088517A CN 201610390593 A CN201610390593 A CN 201610390593A CN 106088517 A CN106088517 A CN 106088517A
- Authority
- CN
- China
- Prior art keywords
- layer
- panel structure
- insulated compound
- floor panel
- floor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000001875 compounds Chemical class 0.000 title claims abstract description 12
- 238000009413 insulation Methods 0.000 title claims abstract description 10
- 239000002023 wood Substances 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 8
- 230000004888 barrier function Effects 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims abstract description 3
- 239000011347 resin Substances 0.000 claims abstract description 3
- 229920005989 resin Polymers 0.000 claims abstract description 3
- 239000005439 thermosphere Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
- E04F15/041—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
- E04F15/041—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material
- E04F15/043—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material the lower layer being of organic plastic with or without reinforcements or filling materials
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
- E04F15/181—Insulating layers integrally formed with the flooring or the flooring elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D13/00—Electric heating systems
- F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
- F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
- F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
- E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Floor Finish (AREA)
Abstract
The invention provides one insulation insulated compound floor panel structure, it is characterised in that: include compoiste wood floor layer, heat conduction layer, zone of heating, waterproof layer, insulating barrier, interface adhesive；Described zone of heating uses the one in PTC thermal sensitive ceramics or resistance wire, and compoiste wood floor layer is monoblock type floor, and described waterproof layer material is resin material.A kind of insulation insulated compound floor panel structure of the invention, these product energy-conserving and environment-protective, production technology is simple, and good energy-conserving effect is substantially reduced production cost, saves the energy.
Description
Technical field
The invention belongs to architectural electricity ground connection field, especially relates to a kind of insulation insulated compound floor panel structure.
Background technology
Insulated compound floor is widely used to building field, and the production cost on insulated compound floor is higher, prior art
In in order to reduce the production cost of compoiste wood floor, although designing hollow compoiste wood floor to reduce the life of compoiste wood floor
Produce cost, but in use, during footwear and floor contact, produce the bigger sound, cause greatly to life at home
Noise pollution.
Innovation and creation content
For the drawbacks described above overcoming prior art to exist, the problem that the invention is to be solved is to provide a kind of guarantor
Temperature composite floor board, solves prior art and produces the technical problem of noise while reducing cost.
For solving above-mentioned technical problem, the invention is hardened with the technical scheme is that a kind of insulation insulated compound
Structure, it is characterised in that: include compoiste wood floor layer (1), heat conduction layer (2), zone of heating (3), waterproof layer (4), insulating barrier (6),
Interface adhesive (7)；Described zone of heating (3) uses the one in PTC thermal sensitive ceramics or resistance wire, and compoiste wood floor layer (1) is
Monoblock type floor, described waterproof layer (4) material is resin material.
The invention has the advantage that with good effect: in actual production process, described in the invention
Plant insulation insulated compound floor panel structure, solve prior art while reducing cost, produce the technical problem of noise.
Accompanying drawing explanation
Fig. 1 is a kind of insulation insulated compound floor panel structure；
In figure: 1 is compoiste wood floor layer, 2 is heat conduction layer, and 3 is zone of heating, and 4 is waterproof layer, and 6 is insulating barrier, and 7 is boundary
Face binding agent.
Detailed description of the invention
Below in conjunction with the accompanying drawings presently preferred embodiments of the present invention is described in detail, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, thus protection scope of the present invention is made apparent clear and definite defining.
Embodiment 1
As it is shown in figure 1, a kind of insulation insulated compound floor panel structure, it is characterised in that: include compoiste wood floor layer (1), heat
Conducting shell (2), zone of heating (3), waterproof layer (4), insulating barrier (6), interface adhesive (7)；Described zone of heating (3) uses PTC heat
One in quick pottery or resistance wire, compoiste wood floor layer (1) is monoblock type floor, and described waterproof layer (4) material is resinous wood
Material.
Above the embodiment of the invention is described in detail, but described content has been only the preferable of the invention
Embodiment, it is impossible to be considered the practical range for limiting the invention.All impartial changes made according to the invention scope
Change and improvement etc., within all should still belonging to this patent covering scope.
Claims (1)
1. an insulation insulated compound floor panel structure, it is characterised in that: include compoiste wood floor layer (1), heat conduction layer (2), add
Thermosphere (3), waterproof layer (4), insulating barrier (6), interface adhesive (7)；Described zone of heating (3) uses PTC thermal sensitive ceramics or resistance
One in Si, compoiste wood floor layer (1) is monoblock type floor, and described waterproof layer (4) material is resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610390593.6A CN106088517A (en) | 2016-06-03 | 2016-06-03 | A kind of insulation insulated compound floor panel structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610390593.6A CN106088517A (en) | 2016-06-03 | 2016-06-03 | A kind of insulation insulated compound floor panel structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106088517A true CN106088517A (en) | 2016-11-09 |
Family
ID=57447380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610390593.6A Pending CN106088517A (en) | 2016-06-03 | 2016-06-03 | A kind of insulation insulated compound floor panel structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106088517A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108999373A (en) * | 2018-09-11 | 2018-12-14 | 湖州市南浔三亚家私有限公司 | Anti-vibration noise reducing timber floor |
| CN110553306A (en) * | 2019-09-28 | 2019-12-10 | 浙江罗奇泰克科技股份有限公司 | Energy-conserving efficient board that generates heat |
-
2016
- 2016-06-03 CN CN201610390593.6A patent/CN106088517A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108999373A (en) * | 2018-09-11 | 2018-12-14 | 湖州市南浔三亚家私有限公司 | Anti-vibration noise reducing timber floor |
| CN110553306A (en) * | 2019-09-28 | 2019-12-10 | 浙江罗奇泰克科技股份有限公司 | Energy-conserving efficient board that generates heat |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161109 |
|
| WD01 | Invention patent application deemed withdrawn after publication |