CN106086948A - A kind of high temperature resistant type electroplate liquid additive - Google Patents
A kind of high temperature resistant type electroplate liquid additive Download PDFInfo
- Publication number
- CN106086948A CN106086948A CN201610653364.9A CN201610653364A CN106086948A CN 106086948 A CN106086948 A CN 106086948A CN 201610653364 A CN201610653364 A CN 201610653364A CN 106086948 A CN106086948 A CN 106086948A
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- Prior art keywords
- sodium
- additive
- high temperature
- temperature resistant
- electroplate liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000654 additive Substances 0.000 title claims abstract description 26
- 230000000996 additive effect Effects 0.000 title claims abstract description 26
- 239000007788 liquid Substances 0.000 title claims abstract description 11
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims abstract description 28
- -1 polyoxyethylene Polymers 0.000 claims abstract description 19
- 239000002253 acid Substances 0.000 claims abstract description 16
- FTLYMKDSHNWQKD-UHFFFAOYSA-N (2,4,5-trichlorophenyl)boronic acid Chemical compound OB(O)C1=CC(Cl)=C(Cl)C=C1Cl FTLYMKDSHNWQKD-UHFFFAOYSA-N 0.000 claims abstract description 15
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims abstract description 15
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims abstract description 15
- OFSGLWDPPRJBSM-UHFFFAOYSA-N S(=O)(=O)(O)O.C(C)C(CCCCC)([Na])CC Chemical compound S(=O)(=O)(O)O.C(C)C(CCCCC)([Na])CC OFSGLWDPPRJBSM-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 15
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229940085605 saccharin sodium Drugs 0.000 claims abstract description 15
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims abstract description 15
- MWOOGOJBHIARFG-UHFFFAOYSA-N vanillin Chemical compound COC1=CC(C=O)=CC=C1O MWOOGOJBHIARFG-UHFFFAOYSA-N 0.000 claims abstract description 15
- FGQOOHJZONJGDT-UHFFFAOYSA-N vanillin Natural products COC1=CC(O)=CC(C=O)=C1 FGQOOHJZONJGDT-UHFFFAOYSA-N 0.000 claims abstract description 15
- 235000012141 vanillin Nutrition 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000004411 aluminium Substances 0.000 claims abstract description 14
- 238000005660 chlorination reaction Methods 0.000 claims abstract description 14
- 239000008367 deionised water Substances 0.000 claims abstract description 14
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 14
- 235000010265 sodium sulphite Nutrition 0.000 claims abstract description 14
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims abstract description 12
- 239000004141 Sodium laurylsulphate Substances 0.000 claims abstract description 12
- 229920002401 polyacrylamide Polymers 0.000 claims abstract description 12
- 235000019333 sodium laurylsulphate Nutrition 0.000 claims abstract description 12
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 12
- 239000012965 benzophenone Substances 0.000 claims description 12
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 150000001408 amides Chemical class 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- OTEKOJQFKOIXMU-UHFFFAOYSA-N 1,4-bis(trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=C(C(Cl)(Cl)Cl)C=C1 OTEKOJQFKOIXMU-UHFFFAOYSA-N 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- MJVGBKJNTFCUJM-UHFFFAOYSA-N mexenone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=C(C)C=C1 MJVGBKJNTFCUJM-UHFFFAOYSA-N 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 4
- 238000005457 optimization Methods 0.000 description 4
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052938 sodium sulfate Inorganic materials 0.000 description 3
- 235000011152 sodium sulphate Nutrition 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- MOTZDAYCYVMXPC-UHFFFAOYSA-N dodecyl hydrogen sulfate Chemical compound CCCCCCCCCCCCOS(O)(=O)=O MOTZDAYCYVMXPC-UHFFFAOYSA-N 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coloring (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Abstract
The invention discloses a kind of high temperature resistant type electroplate liquid additive, every kilogram of additive is containing following component: tetren 30 60g, diethanolamine 1 5g, pyrovinic acid 20 30g, vanillin 0.1 1g, saccharin sodium 1 3g, polyacrylamide 20 30g, diethylhexyl sodium sulfate 10 20g, sodium sulfite 1 5g, sodium lauryl sulphate 20 30g, aluminium polychlorid 15 25g, benzophenone 10 20g, polyoxyethylene 10 20g, tri-chlorination ammonium 10 20g, remaining is deionized water.
Description
Technical field
The invention belongs to spare parts processing machinery technical field, be specifically related to a kind of high temperature resistant type electroplate liquid additive.
Background technology
Plating utilizes electrolysis principle to plate the process of other metal or alloy of a thin layer on some metal surface exactly, is
Utilize electrolysis to make the technique thus play of surface attachment layer of metal film of metal or other materials product prevent corrosion, carry
High-wearing feature, electric conductivity, reflective and having improved aesthetic appearance etc. act on.
Electrolysis is utilized to deposit attachment on machinework good, but the metal coating that performance is different with matrix material
Technology, electrodeposited coating is more uniform than hot dipping layer, and the most all ratios are relatively thin, from several microns to tens micron.By plating, can
To obtain decoration protectiveness and various functional surface layer on machinework, it is also possible to repair abrasion and the work of processing error
Part.
But at present, there is serious pollution problem in electroplating technology.
Summary of the invention
Goal of the invention: the problem and shortage existed for above-mentioned prior art, it is an object of the invention to provide a kind of resistance to height
Warm type electroplate liquid additive.
Technical scheme: the invention discloses a kind of high temperature resistant type electroplate liquid additive, every kilogram of additive is containing following component:
Tetren 30-60g, diethanolamine 1-5g, pyrovinic acid 20-30g, vanillin 0.1-1g, saccharin sodium 1-3g, polypropylene
Amide 20-30g, diethylhexyl sodium sulfate 10-20g, sodium sulfite 1-5g, sodium lauryl sulphate 20-30g, polyaluminium
Aluminum 15-25g, benzophenone 10-20g, polyoxyethylene 10-20g, tri-chlorination ammonium 10-20g, remaining is deionized water.
As the further optimization of the present invention, the present invention every kilogram additive is containing following component: tetren 30g,
Diethanolamine 1g, pyrovinic acid 20g, vanillin 0.1g, saccharin sodium 1g, polyacrylamide 20g, diethylhexyl sodium sulfate 10g,
Sodium sulfite 1g, sodium lauryl sulphate 20g, aluminium polychlorid 15g, benzophenone 10g, polyoxyethylene 10g, tri-chlorination ammonium
10g, remaining is deionized water.
As the further optimization of the present invention, the present invention every kilogram additive is containing following component: tetren 60g,
Diethanolamine 5g, pyrovinic acid 30g, vanillin 1g, saccharin sodium 3g, polyacrylamide 30g, diethylhexyl sodium sulfate 20g, Asia
Sodium sulfate 5g, sodium lauryl sulphate 30g, aluminium polychlorid 25g, benzophenone 20g, polyoxyethylene 20g, tri-chlorination ammonium
20g, remaining is deionized water.
As the further optimization of the present invention, the present invention every kilogram additive is containing following component: tetren 46g,
Diethanolamine 3.8g, pyrovinic acid 22g, vanillin 0.6g, saccharin sodium 2.7g, polyacrylamide 26g, diethylhexyl sodium sulfate
19g, sodium sulfite 4g, sodium lauryl sulphate 24g, aluminium polychlorid 19g, benzophenone 14g, polyoxyethylene 14g, trichlorine
Changing ammonium 14g, remaining is deionized water.
As the further optimization of the present invention, the present invention every kilogram additive is containing following component: tetren 52g,
Diethanolamine 4.8g, pyrovinic acid 27g, vanillin 0.4g, saccharin sodium 2.7g, polyacrylamide 22g, diethylhexyl sodium sulfate
12g, sodium sulfite 2g, sodium lauryl sulphate 22g, aluminium polychlorid 22, benzophenone 12g, polyoxyethylene 12g, tri-chlorination
Ammonium 12g, remaining is deionized water.
Beneficial effect: the present invention compared with prior art, has the advantage that plating solution stable in properties, it is possible to protect for a long time
Holding limpid the most turbid, coating crystallization refinement, uniformity is good.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in detail, but protection scope of the present invention is described also simultaneously
Being not limited to the concrete scope of the present embodiment, based on the embodiment in the present invention, those of ordinary skill in the art are not making
The every other embodiment obtained under creative work premise, broadly falls into the scope of protection of the invention.
Embodiment 1
Every kilogram of additive of the present embodiment contain following component: tetren 30g, diethanolamine 1g, pyrovinic acid 20g,
Vanillin 0.1g, saccharin sodium 1g, polyacrylamide 20g, diethylhexyl sodium sulfate 10g, sodium sulfite 1g, lauryl sulphate acid
Sodium 20g, aluminium polychlorid 15g, benzophenone 10g, polyoxyethylene 10g, tri-chlorination ammonium 10g, remaining is deionized water.
Embodiment 2
Every kilogram of additive of the present embodiment contain following component: tetren 60g, diethanolamine 5g, pyrovinic acid 30g,
Vanillin 1g, saccharin sodium 3g, polyacrylamide 30g, diethylhexyl sodium sulfate 20g, sodium sulfite 5g, sodium lauryl sulphate
30g, aluminium polychlorid 25g, benzophenone 20g, polyoxyethylene 20g, tri-chlorination ammonium 20g, remaining is deionized water.
Embodiment 3
Every kilogram of additive of the present embodiment is containing following component: tetren 46g, diethanolamine 3.8g, pyrovinic acid
22g, vanillin 0.6g, saccharin sodium 2.7g, polyacrylamide 26g, diethylhexyl sodium sulfate 19g, sodium sulfite 4g, dodecane
Base sodium sulfate 24g, aluminium polychlorid 19g, benzophenone 14g, polyoxyethylene 14g, tri-chlorination ammonium 14g, remaining is deionization
Water.
Embodiment 4
Every kilogram of additive of the present embodiment is containing following component: tetren 52g, diethanolamine 4.8g, pyrovinic acid
27g, vanillin 0.4g, saccharin sodium 2.7g, polyacrylamide 22g, diethylhexyl sodium sulfate 12g, sodium sulfite 2g, dodecane
Base sodium sulfate 22g, aluminium polychlorid 22, benzophenone 12g, polyoxyethylene 12g, tri-chlorination ammonium 12g, remaining is deionized water.
Claims (5)
1. a high temperature resistant type electroplate liquid additive, it is characterised in that: every kilogram of additive is containing following component: tetren
30-60g, diethanolamine 1-5g, pyrovinic acid 20-30g, vanillin 0.1-1g, saccharin sodium 1-3g, polyacrylamide 20-30g,
Diethylhexyl sodium sulfate 10-20g, sodium sulfite 1-5g, sodium lauryl sulphate 20-30g, aluminium polychlorid 15-25g, two
Benzophenone 10-20g, polyoxyethylene 10-20g, tri-chlorination ammonium 10-20g, remaining is deionized water.
A kind of high temperature resistant type electroplate liquid additive the most according to claim 1, it is characterised in that: under every kilogram of additive contains
Row component: tetren 30g, diethanolamine 1g, pyrovinic acid 20g, vanillin 0.1g, saccharin sodium 1g, polyacrylamide
20g, diethylhexyl sodium sulfate 10g, sodium sulfite 1g, sodium lauryl sulphate 20g, aluminium polychlorid 15g, benzophenone
10g, polyoxyethylene 10g, tri-chlorination ammonium 10g, remaining is deionized water.
A kind of high temperature resistant type electroplate liquid additive the most according to claim 1, it is characterised in that: under every kilogram of additive contains
Row component: tetren 60g, diethanolamine 5g, pyrovinic acid 30g, vanillin 1g, saccharin sodium 3g, polyacrylamide
30g, diethylhexyl sodium sulfate 20g, sodium sulfite 5g, sodium lauryl sulphate 30g, aluminium polychlorid 25g, benzophenone
20g, polyoxyethylene 20g, tri-chlorination ammonium 20g, remaining is deionized water.
A kind of high temperature resistant type electroplate liquid additive the most according to claim 1, it is characterised in that: under every kilogram of additive contains
Row component: tetren 46g, diethanolamine 3.8g, pyrovinic acid 22g, vanillin 0.6g, saccharin sodium 2.7g, polypropylene
Amide 26g, diethylhexyl sodium sulfate 19g, sodium sulfite 4g, sodium lauryl sulphate 24g, aluminium polychlorid 19g, hexichol
Ketone 14g, polyoxyethylene 14g, tri-chlorination ammonium 14g, remaining is deionized water.
A kind of high temperature resistant type electroplate liquid additive the most according to claim 1, it is characterised in that: under every kilogram of additive contains
Row component: tetren 52g, diethanolamine 4.8g, pyrovinic acid 27g, vanillin 0.4g, saccharin sodium 2.7g, polypropylene
Amide 22g, diethylhexyl sodium sulfate 12g, sodium sulfite 2g, sodium lauryl sulphate 22g, aluminium polychlorid 22, hexichol first
Ketone 12g, polyoxyethylene 12g, tri-chlorination ammonium 12g, remaining is deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610653364.9A CN106086948A (en) | 2016-08-11 | 2016-08-11 | A kind of high temperature resistant type electroplate liquid additive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610653364.9A CN106086948A (en) | 2016-08-11 | 2016-08-11 | A kind of high temperature resistant type electroplate liquid additive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106086948A true CN106086948A (en) | 2016-11-09 |
Family
ID=57455402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610653364.9A Pending CN106086948A (en) | 2016-08-11 | 2016-08-11 | A kind of high temperature resistant type electroplate liquid additive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106086948A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110205659A (en) * | 2019-07-17 | 2019-09-06 | 广州三孚新材料科技股份有限公司 | Electrotinning additive and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB191509957A (en) * | 1915-07-08 | 1916-03-30 | Pascal Marino | Improvements in the Preparation of Electrolytes for use in the Electrolytic Deposition of Metals. |
| CN1094765A (en) * | 1994-01-24 | 1994-11-09 | 厦门大学 | Basic plating method for bright Zn-Ni alloy |
| CN101240437A (en) * | 2008-03-20 | 2008-08-13 | 北京航空航天大学 | A method of electroplating zinc-nickel alloy in alkaline plating solution |
| CN101942684A (en) * | 2010-10-09 | 2011-01-12 | 济南德锡科技有限公司 | Alkaline electroplating Zn-Ni alloy additive, electroplating solution and preparation method |
| CN104789998A (en) * | 2015-05-05 | 2015-07-22 | 广东达志环保科技股份有限公司 | Bright-type alkaline cyanide-free galvanization electroplating solution and preparation method |
| CN104988544A (en) * | 2015-06-26 | 2015-10-21 | 吕小方 | Electrolytic tinning annexing agent |
| CN105780070A (en) * | 2016-04-25 | 2016-07-20 | 广州博泉环保材料科技有限公司 | Alkaline zinc-nickel alloy electroplating technology and serial additives thereof |
-
2016
- 2016-08-11 CN CN201610653364.9A patent/CN106086948A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB191509957A (en) * | 1915-07-08 | 1916-03-30 | Pascal Marino | Improvements in the Preparation of Electrolytes for use in the Electrolytic Deposition of Metals. |
| CN1094765A (en) * | 1994-01-24 | 1994-11-09 | 厦门大学 | Basic plating method for bright Zn-Ni alloy |
| CN101240437A (en) * | 2008-03-20 | 2008-08-13 | 北京航空航天大学 | A method of electroplating zinc-nickel alloy in alkaline plating solution |
| CN101942684A (en) * | 2010-10-09 | 2011-01-12 | 济南德锡科技有限公司 | Alkaline electroplating Zn-Ni alloy additive, electroplating solution and preparation method |
| CN104789998A (en) * | 2015-05-05 | 2015-07-22 | 广东达志环保科技股份有限公司 | Bright-type alkaline cyanide-free galvanization electroplating solution and preparation method |
| CN104988544A (en) * | 2015-06-26 | 2015-10-21 | 吕小方 | Electrolytic tinning annexing agent |
| CN105780070A (en) * | 2016-04-25 | 2016-07-20 | 广州博泉环保材料科技有限公司 | Alkaline zinc-nickel alloy electroplating technology and serial additives thereof |
Non-Patent Citations (1)
| Title |
|---|
| 张允诚等主编: "《电镀手册》", 31 January 2007 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110205659A (en) * | 2019-07-17 | 2019-09-06 | 广州三孚新材料科技股份有限公司 | Electrotinning additive and preparation method thereof |
| CN110205659B (en) * | 2019-07-17 | 2020-06-16 | 广州三孚新材料科技股份有限公司 | Electrotinning additive and preparation method thereof |
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Application publication date: 20161109 |
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