CN106084185A - A kind of dicyandiamide based epoxy resin curing formula - Google Patents
A kind of dicyandiamide based epoxy resin curing formula Download PDFInfo
- Publication number
- CN106084185A CN106084185A CN201610459370.0A CN201610459370A CN106084185A CN 106084185 A CN106084185 A CN 106084185A CN 201610459370 A CN201610459370 A CN 201610459370A CN 106084185 A CN106084185 A CN 106084185A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- parts
- based epoxy
- resin curing
- dicyandiamide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 24
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 title claims abstract description 20
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims abstract description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229960000935 dehydrated alcohol Drugs 0.000 claims abstract description 8
- 150000008301 phosphite esters Chemical class 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 8
- ITZGNPZZAICLKA-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate Chemical compound C1C2OC2CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 ITZGNPZZAICLKA-UHFFFAOYSA-N 0.000 claims 3
- 239000000463 material Substances 0.000 abstract description 3
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a kind of dicyandiamide based epoxy resin curing formula, belong to chemical material field.It is made up of following raw material: TDE 85 type liquid-state epoxy resin 100 120 parts, dimethylaniline modified dicyandiamine 45 58 parts, 2 ethyl 4 Methylimidazole .s 0.5 0.9 parts, phosphite ester 0.3 0.5 parts, dehydrated alcohol 30 50 parts.The dicyandiamide based epoxy resin curing formula of the offer of the present invention, the storage-stable time is permanent, and applied range is suitable for modern industry large-scale production.
Description
Technical field
The present invention relates to chemical material field, be specifically related to a kind of dicyandiamide based epoxy resin curing formula.
Background technology
Dicyandiamide, also known as dicyanodiamine, is the thermal activities latent curing agent the most often used, applies the most widely
In fields such as powdery paints, adhesive monocomponent adhesive, film glue and glass cloth laminated boards.Dicyandiamide and epoxy resin
After mixing, its micropowder is distributed in epoxy resin, and condition of cure is (160-180 DEG C)/(60-20min), storage in room temperature
As long as phase is up to half a year.The curing mechanism of dicyandiamide is more complicated, and in addition to four hydrogen on dicyandiamide can participate in reaction, cyano group also has
There is certain reactivity.
It is the highest that dicyandiamide is used alone as solidification temperature during epoxy curing agent, solidification temperature typically 160-180 DEG C it
Between, many devices and material can not use owing to can not bear such temperature at this temperature, or because production technology
Require and the solidification temperature of one-component epoxy resin must be reduced.The method solving this problem has two kinds, and a kind of method is to add
Enter accelerator, on the premise of the storage period and serviceability of infringement dicyandiamide not too much, reduce its solidification temperature；Another kind side
Method is, by the method for MOLECULE DESIGN, dicyandiamide is carried out chemical modification.
Summary of the invention
For above-mentioned, it is an object of the invention to provide a kind of dicyandiamide based epoxy resin simultaneously using two kinds of solutions
Curing formula.
The concrete technical scheme that the present invention takes is:
A kind of dicyandiamide based epoxy resin curing formula, it is characterised in that by weight, be made up of following raw material: TDE-
85 type liquid-state epoxy resin 100-120 parts, dimethylaniline modified dicyandiamine 45-58 part, 2-ethyl-4 Methylimidazole. 0.5-0.9
Part, phosphite ester 0.3-0.5 part, dehydrated alcohol 30-50 part.
The invention have the advantage that the storage-stable time permanent, applied range, it is suitable for modern industry large-scale production.
Detailed description of the invention
Below presently preferred embodiments of the present invention is described in detail so that advantages and features of the invention can be easier to by
It will be appreciated by those skilled in the art that thus protection scope of the present invention is made apparent clear and definite defining.
Embodiment 1
A kind of dicyandiamide based epoxy resin curing formula, it is characterised in that by weight, be made up of following raw material: TDE-
85 type liquid-state epoxy resins 100 parts, dimethylaniline modified dicyandiamine 45 parts, 2-ethyl-4 Methylimidazole. 0.5 part, phosphite ester
0.3 part, dehydrated alcohol 30 parts.
Embodiment 2
A kind of dicyandiamide based epoxy resin curing formula, it is characterised in that by weight, be made up of following raw material: TDE-
85 type liquid-state epoxy resins 110 parts, dimethylaniline modified dicyandiamine 51.5 parts, 2-ethyl-4 Methylimidazole. 0.7 part, phosphite ester
0.4 part, dehydrated alcohol 40 parts.
Embodiment 3
A kind of dicyandiamide based epoxy resin curing formula, it is characterised in that by weight, be made up of following raw material: TDE-
85 type liquid-state epoxy resins 120 parts, dimethylaniline modified dicyandiamine 58 parts, 2-ethyl-4 Methylimidazole. 0.9 part, phosphite ester
0.5 part, dehydrated alcohol 50 parts.
Claims (3)
1. a dicyandiamide based epoxy resin curing formula, it is characterised in that by weight, be made up of following raw material: TDE-85
Type liquid-state epoxy resin 100-120 part, dimethylaniline modified dicyandiamine 45-58 part, 2-ethyl-4 Methylimidazole. 0.5-0.9 part,
Phosphite ester 0.3-0.5 part, dehydrated alcohol 30-50 part.
Dicyandiamide based epoxy resin curing formula the most according to claim 1, it is characterised in that by weight, by following
Raw material forms: TDE-85 type liquid-state epoxy resin 105-115 part, dimethylaniline modified dicyandiamine 48-55 part, 2-ethyl-4 methyl
Imidazoles 0.6-0.8 part, phosphite ester 0.35-0.45 part, dehydrated alcohol 35-45 part.
Dicyandiamide based epoxy resin curing formula the most according to claim 1, it is characterised in that by weight, by following
Raw material forms: TDE-85 type liquid-state epoxy resin 110 parts, dimethylaniline modified dicyandiamine 51.5 parts, 2-ethyl-4 Methylimidazole.
0.7 part, phosphite ester 0.4 part, dehydrated alcohol 40 parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610459370.0A CN106084185A (en) | 2016-06-22 | 2016-06-22 | A kind of dicyandiamide based epoxy resin curing formula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610459370.0A CN106084185A (en) | 2016-06-22 | 2016-06-22 | A kind of dicyandiamide based epoxy resin curing formula |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106084185A true CN106084185A (en) | 2016-11-09 |
Family
ID=57238136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610459370.0A Pending CN106084185A (en) | 2016-06-22 | 2016-06-22 | A kind of dicyandiamide based epoxy resin curing formula |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106084185A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1546566A (en) * | 2003-12-12 | 2004-11-17 | 无锡市化工研究设计院 | Molding compound for sheet tantalum capacitor |
| CN102585437A (en) * | 2011-12-27 | 2012-07-18 | 广东生益科技股份有限公司 | High heat-resistant epoxy resin composition, adhesive sheet and copper-clad laminate produced using the same |
| CN103979098A (en) * | 2014-05-22 | 2014-08-13 | 航天材料及工艺研究所 | Flame-retardant composite material floor board as well as preparation method thereof |
-
2016
- 2016-06-22 CN CN201610459370.0A patent/CN106084185A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1546566A (en) * | 2003-12-12 | 2004-11-17 | 无锡市化工研究设计院 | Molding compound for sheet tantalum capacitor |
| CN102585437A (en) * | 2011-12-27 | 2012-07-18 | 广东生益科技股份有限公司 | High heat-resistant epoxy resin composition, adhesive sheet and copper-clad laminate produced using the same |
| CN103979098A (en) * | 2014-05-22 | 2014-08-13 | 航天材料及工艺研究所 | Flame-retardant composite material floor board as well as preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 程秀莲等: ""邻甲基苯胺改性双氰胺环氧固化剂的合成及性能研究"", 《粘接》 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161109 |
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| RJ01 | Rejection of invention patent application after publication |