CN106076794B - Same-phase close-packed array type ultrasonic transmitting unit - Google Patents

Abstract

The invention belongs to the technical field of ultrasonic emission, and particularly relates to a same-phase close-packed array type ultrasonic emission unit capable of emitting high-intensity and high-directivity ultrasonic waves. The invention consists of an in-phase densely-arranged ultrasonic transducer array and a printed circuit board. According to the requirement, ultrasonic transducers with different physical properties and geometric dimensions are designed, and the transducers are arranged in a close-packed mode and are respectively inserted into a printed circuit board matched with the close-packed array. The ultrasonic signals after power amplification are input to the same-phase close-packed array type ultrasonic transmitting unit, so that the ultrasonic transmitting unit can emit ultrasonic waves with high strength and high directivity. The invention can be used for the directional transmission of sound waves, and can also be used in the fields of ultrasonic suspension, distance measurement, remote control, imaging, emulsification, sterilization, chemical reaction promotion, biological research and the like.

Description

In-phase close-packed array ultrasonic transmitting unit

technical field

The invention belongs to the technical field of ultrasonic emission, and in particular relates to an ultrasonic emission unit of an in-phase close-packed array type.

Background technique

Open transducers generally used for ultrasonic emission, considering the use environment and the need for the protection of the emitter, there is a shell made of metal or non-metal material outside the emitter, and the rear end of the shell is sealed and fixed with the emitter , the front end is provided with a protective net. In order to distinguish the positive and negative electrodes of the signal input of the emitter, a circular boss is used to represent the positive electrode at the connection between the emitter bracket and the electrode. However, when multiple (several to tens of thousands) arrays are used for launching, due to the existence of the shell and the larger diameter of the circular base supporting the vibrating body and the shell, the volume of the array unit increases, and the unit area The ultrasonic emission intensity is reduced and the directionality is weakened. In addition, the non-uniformity of the positive and negative electrodes of the arrayed transducers will also cause the ultrasonic waves emitted by each transducer after the array to be different in phase, resulting in the emitted ultrasonic waves canceling each other out and failing to achieve the expected effect after the array is formed.

SUMMARY OF THE INVENTION

In view of the deficiencies in the above technologies, the purpose of the present invention is to provide a co-phase close-packed array ultrasonic transmitting unit, which reduces the volume of the array unit, increases the ultrasonic emission intensity per unit area, and enhances the directivity.

The co-phase close-packed array ultrasonic transmitting unit provided by the present invention is composed of an co-phase close-packed ultrasonic transducer array 1 and a printed circuit board 2 . See Figure 1, where:

According to the needs of ultrasonic emission frequency, intensity and directivity, ultrasonic transducers with different physical properties and geometric dimensions are designed, and then the transducers in the same phase are arranged in a close-packed manner to form an ultrasonic transducer array 1. Insert it into the printed circuit board matching the close-packed array; the pads on the reverse side of the printed circuit board solder the transducers on the printed circuit board, and the printed circuit connects the dense-packed array ultrasonic transducers in parallel, or forms a close-packed array of ultrasonic transducers. The array ultrasonic transducers are divided into several groups. After each group of transducers are connected in parallel, the groups are connected in series; the power-amplified ultrasonic signals are input to the same-phase close-packed array ultrasonic transmitting unit through wires. It emits high-intensity and high-directivity ultrasonic waves.

In the present invention, the co-phase close-packed ultrasonic transducer array 1 is composed of a single shellless ultrasonic transducer in a close-packed manner, and the co-phase refers to the phase of all the transducers forming the close-packed array ultrasonic transmitting unit Similarly, the number of transducers can be more than 7, up to tens of thousands (such as 100,000), and the plane shape of the array can be hexagon, square, rectangle, ellipse, triangle, etc., or the above several shapes The combination.

In the present invention, a single shellless ultrasonic transducer used to form a close-packed array consists of a horn-shaped resonant sheet 3, a galvanized metal circular plate 4, a circular piezoelectric ceramic sheet 5, a connecting wire 6, a cylindrical pin 7 and The circular base is composed of 8. See Figure 2.

In the present invention, the horn-shaped resonant sheet 3 is bonded to one side of the galvanized metal circular plate 4 with curing glue, and the other side of the galvanized metal circular plate 4 is bonded to the negative electrode of the piezoelectric ceramic sheet 5. The resonant plate 3, the galvanized metal circular plate 4, and the piezoelectric ceramic plate 5 are combined to form the vibrating body of the ultrasonic transducer. The positive and negative electrodes of the vibrating body are the same as the positive and negative electrodes of the circular piezoelectric ceramic plate 5. The poles are respectively connected with two cylindrical pins 7 through connecting wires 6 , and the corresponding positive and negative electrodes are marked near the two cylindrical pins 7 under the circular base 8 . According to the resonant frequency and geometric size of the piezoelectric ceramic sheet 5, as well as the geometric size of the horn-shaped resonant sheet 3 and the galvanized metal circular plate 4, the emission frequency of the ultrasonic transducer is determined. For example, when the diameter of the horn-shaped resonator plate 3 is 6mm to 10mm, the diameter of the galvanized metal disc 4 is 8mm to 12mm, the diameter of the horn-shaped resonator plate 3 is smaller than the diameter of the galvanized metal disc 4, and the diameter of the piezoelectric ceramic plate 5 is smaller than In the case of the diameter of the galvanized metal circular plate 4, different combinations of the horn-shaped resonant plate 3, the galvanized metal circular plate 4 and the piezoelectric ceramic plate 5 can form ultrasonic transducers with different emission frequencies between 15KHz and 60KHz.

In the present invention, all ultrasonic transducers used to form the same close-packed array have the same frequency, the same phase, and the same positive and negative electrodes.

In the present invention, the size of the printed circuit board 2 for installing the close-packed array ultrasonic transducer is determined according to the number of the close-packed array ultrasonic transducer, and the corresponding thickness is one of 1 to 3 mm. The shapes can be hexagons, squares, rectangles, ovals, triangles, etc., or a combination of the above.

The printed circuit board 2 is used to install the same-phase close-packed ultrasonic transducer array 1; the front side of the printed circuit board 2 is marked with a circular silk screen pattern 10, which is used for the insertion of the positive and negative electrodes of the transducer. The diameter of the circular silk screen pattern 10 is equal to The diameter of the circular base 8 of the transducer is the same; each circular silk screen pattern 10 is provided with 2 through holes 9 for the insertion of the 2 cylindrical pins 7 (ie the corresponding positive and negative electrodes) of the ultrasonic transducer There are through holes 11 on the periphery of the printed circuit board 2 for the fixation of the same-phase dense array ultrasonic transmitting unit; the reverse side of the printed circuit board 2 is provided with a printed circuit 14, and the printed circuit 14 makes up the dense array ultrasonic transducer. The positive and negative electrodes are connected in parallel, or the ultrasonic transducers that form a close-packed array are divided into several groups. After each group of transducers is connected in parallel, the groups are connected in series; The silk screen pattern 12 corresponds to the position of the circular silk screen pattern 10 on the front side, and is used to determine the position and positive and negative poles of each transducer from the reverse side of the printed circuit board 2; the cylindrical pins 7 of the transducer and the printed circuit 14 are welded The reverse side is also provided with the input end of the dense array ultrasonic transmitting unit, and the power amplified ultrasonic signal is input to the dense array ultrasonic transmitting unit through the wire, so that it emits high-intensity and high-directivity ultrasonic waves.

In the present invention, in order to meet the needs of the outdoor use environment and prolong the service life of the co-phase close-packed array ultrasonic transmitting unit, the entire co-phase close-packed array ultrasonic transmitting unit is sprayed or coated, and the film should be 10 to 10 thick. 30 micron waterproof insulating film.

The invention can emit high-intensity and high-directivity ultrasonic waves for the directional propagation of sound waves, and can also emit high-intensity and high-directivity ultrasonic waves for ultrasonic suspension, ranging, remote control, imaging, emulsification, sterilization, promotion of chemical reactions, and biological research. of ultrasound.

Description of drawings

FIG. 1 is a structural diagram of the present invention.

FIG. 2 is a structural diagram of a single transducer used to form an in-phase close-packed array ultrasonic transmitting unit in the present invention.

FIG. 3 is a front view of the printed circuit board in the present invention.

FIG. 4 is a reverse view of the printed circuit board in the present invention.

Labels in the figure: 1 is the same-phase densely packed ultrasonic transducer array, 2 is the printed circuit board, 3 is the horn-shaped resonant sheet, 4 is the galvanized metal circular plate, 5 is the circular piezoelectric ceramic sheet, and 6 is the connecting wire , 7 is a cylindrical pin, 8 is a circular base, 9 is a transducer electrode insertion hole, 10 is a circular silk screen pattern marked with a positive sign on the front of the printed circuit board, and 11 is a fixed-phase close-packed array type The through hole of the ultrasonic transmitting unit, 12 is the circular silk screen pattern marked with a positive sign on the reverse side of the printed circuit board, 13 is the pad for welding the transducer electrodes, 14 is the printed circuit connecting the positive and negative electrodes of the transducer, 15 is the same The wire pad of the input signal of the phase dense array ultrasonic transmitting unit.

Detailed ways

According to different application fields and uses, as well as the installation environment and spatial position, determine the transmission frequency, ultrasonic intensity and directivity of the co-phase close-packed array ultrasonic transmitting unit, and then determine the co-phase close-packed array ultrasonic transmitting unit transducer. For all transducers selected into the same transmitting unit, the phase must be consistent. The shape and size of the co-phase close-packed array ultrasonic transmitting unit are then determined by the number of transducers and installation requirements. According to the geometric size and quantity of the selected transducers, the printed circuit board is designed. The printed circuit board can not only fix the transducers, but also connect all the transducers in parallel through the printed circuit, or form a close-packed array. The ultrasonic transducers are divided into several groups. After each group of transducers are connected in parallel, the groups are connected in series. And design the input signal connection point to ensure that the input signal is transmitted to each transducer. Then, all the transducers are placed on the printed circuit board in a close-packed array, and then the positive and negative electrodes of all the transducers and the positive and negative electrodes of the printed circuit are welded through the pads. Finally, spraying or coating is performed on the whole of the co-phase close-packed array ultrasonic transmitting unit. Fix the co-phase close-packed array ultrasonic transmitting unit, input the ultrasonic signal of a certain frequency amplified by the power amplifier, and the co-phase close-packed array ultrasonic transmitting unit works to emit high-intensity and high-directivity ultrasonic waves. The ultrasonic wave can be used for directional propagation of sound waves, or in the fields of ultrasonic suspension, ranging, remote control, imaging, emulsification, sterilization, promotion of chemical reactions and biological research.

Specifically, the co-phase close-packed array ultrasonic transmitting unit provided by the present invention is composed of an co-phase close-packed ultrasonic transducer array 1 and a printed circuit board 2 , see FIG. 1 .

Among them, the co-phase close-packed ultrasonic transducer array 1 is composed of a single shellless ultrasonic transducer (see Figure 2) in a close-packed manner, and the co-phase refers to the phase of all the transducers forming the close-packed array ultrasonic transmitting unit Similarly, the number of transducers can be more than 7, up to tens of thousands (such as 70,000 to 100,000), and the plane shape of the array can be hexagon, square, rectangle, ellipse, triangle, etc., or several of the above. combination of shapes.

Among them, a single caseless ultrasonic transducer is composed of a horn-shaped resonant sheet 3, a galvanized metal circular plate 4, a circular piezoelectric ceramic sheet 5, a connecting wire 6, a cylindrical pin 7 and a circular base 8, see Fig. 2 shown.

The horn-shaped resonant plate 3 is bonded to one side of the galvanized metal circular plate 4 with curing glue, and the other side of the galvanized metal circular plate 4 is bonded to the negative electrode of the piezoelectric ceramic plate 5. The horn-shaped resonant plate 3, The galvanized metal circular plate 4 and the piezoelectric ceramic sheet 5 are combined to form the vibrating body of the ultrasonic transducer. The positive and negative electrodes of the vibrating body are the same as the positive and negative electrodes of the circular piezoelectric ceramic sheet 5, and the positive and negative electrodes are connected by connecting wires. 6 are respectively connected with two cylindrical pins 7, and the corresponding positive and negative electrodes are marked near the two cylindrical pins 7 under the circular base 8. According to the resonant frequency and geometric size of the piezoelectric ceramic sheet 5, as well as the geometric size of the horn-shaped resonant sheet 3 and the galvanized metal circular plate 4, the emission frequency of the ultrasonic transducer is determined. For example, when the diameter of the horn-shaped resonator plate 3 is 6mm to 10mm, the diameter of the galvanized metal plate 4 is 8mm to 12mm, the diameter of the horn-shaped resonator plate 3 is smaller than the diameter of the galvanized metal plate 4, and the diameter of the piezoelectric ceramic plate 5 is smaller than In the case of the diameter of the galvanized metal circular plate 4, different combinations of the horn-shaped resonant plate 3, the galvanized metal circular plate 4 and the piezoelectric ceramic plate 5 can form ultrasonic transducers with different emission frequencies between 15KHz and 60KHz.

The diameter of the circular base 8 should be 1 to 2 mm larger than the diameter of the galvanized metal circular plate 4 to facilitate welding electrodes and installation, and to ensure that the electrodes of the vibrating body are not short-circuited after the array is formed. The connecting wire 6 is a silver-plated copper wire with a diameter of 0.18 to 0.2 mm.

Below the circular base 8 of a single ultrasonic transducer, the length of the two cylindrical pins 7 is 1 to 2 mm longer than the thickness of the printed circuit board 2. The circular base 8 should be a flat surface, and the two There is no boss for distinguishing positive and negative around the cylindrical pin 7, so as to facilitate large-scale welding production after forming an array.

All ultrasonic transducers used to form the same close-packed array have the same frequency, the same phase, and the same positive and negative electrodes.

The size of the printed circuit board 2 is determined according to the number of the close-packed array ultrasonic transducers, and the corresponding thickness is one of 1 to 3 mm. The shapes can be hexagons, squares, rectangles, ovals, triangles, etc., or a combination of the above.

See Figure 3 for the front of the printed circuit board 2. The diameter of the through hole 9 should be 0.1 to 0.2 mm larger than the diameter of the cylindrical pin 7 of the inserted ultrasonic transducer to facilitate the installation of the transducer. The circular silk screen pattern 10 marked with a positive sign is convenient for the transducer to be inserted according to the uniform positive and negative electrodes, and its diameter is the same as that of the circular base 8 of the transducer. The through holes 11 around the printed circuit board 2 are convenient for fixing the same-phase dense array ultrasonic transmitting unit, and the number and aperture of the through holes 11 are determined according to the size and shape of the dense array ultrasonic transmitting unit.

The reverse side of the printed wiring board 2 is shown in FIG. 4 . The circular silk-screen pattern 12 marked with a positive sign corresponds to the circular silk-screen pattern 10 in FIG. 3 , which facilitates determining the position and positive and negative electrodes of each transducer from the reverse side of the printed circuit board 2 . The pads 13 facilitate soldering together the cylindrical pins 7 of the transducer and the printed circuit 14 . The printed circuit 14 connects the positive and negative electrodes of the ultrasonic transducers forming a close-packed array in parallel, or divides the ultrasonic transducers forming a close-packed array into several groups. connected in series. The pad 15 is the input end of the close-packed array ultrasonic transmitting unit, and the power-amplified ultrasonic signal is input to the close-packed array ultrasonic transmitting unit through the wire, so that it emits high-intensity and high-directivity ultrasonic waves.

In order to meet the needs of the outdoor use environment and prolong the service life of the co-phase close-packed array ultrasonic transmitting unit, spray or coating the whole of the co-phase close-packed array ultrasonic transmitting unit, and the film should be waterproof with a thickness of 10 to 30 microns. insulating film.

The present invention is not limited to the above-mentioned embodiments, and other simple modifications and equivalent changes made in any form without departing from the technical essence of the present invention are all included within the scope defined by the claims of the present invention.

Claims (7)

1. An in-phase close-packed array type ultrasonic transmitting unit is characterized by consisting of an in-phase close-packed ultrasonic transducer array and a printed circuit board; wherein:

designing ultrasonic transducers with different physical properties and geometric dimensions according to the requirements of ultrasonic emission frequency, intensity and directivity, then forming an ultrasonic transducer array by the same-phase transducers in a close-packed mode, and respectively inserting each transducer onto a printed circuit board matched with the close-packed array; the transducer is welded on the printed circuit board by a bonding pad on the back surface of the printed circuit board, the close-packed array ultrasonic transducers are connected in parallel by the printed circuit board, or the close-packed array ultrasonic transducers are divided into a plurality of groups by the printed circuit board, and after each group of transducers are connected in parallel, the groups are connected in series; the ultrasonic signals amplified by power are input to the same-phase close-packed array type ultrasonic transmitting unit through a lead, so that the ultrasonic transmitting unit can emit ultrasonic waves with high intensity and high directivity;

the front surface of the printed circuit board is marked with circular silk-screen patterns for inserting the anode and the cathode of the transducer, and the back surface of the printed circuit board is marked with positive circular silk-screen patterns corresponding to the positions of the circular silk-screen patterns on the front surface and used for determining the position of each transducer and the anode and the cathode from the back surface of the printed circuit board;

all ultrasonic transducers used for forming the same close-packed array have the same frequency, the same phase and the same positive and negative poles;

the same-phase close-packed ultrasonic transducer array is formed by single shell-free ultrasonic transducers in a close-packed mode, and the same phase means that the phases of all the transducers forming the close-packed array type ultrasonic transmitting unit are the same.

2. The in-phase close-packed array ultrasonic transmitter unit of claim 1, wherein the number of transducers is 7 or more, and the planar shape of the array is hexagonal, square, rectangular, elliptical or triangular, or a combination thereof.

3. The in-phase close-packed array ultrasonic transmitting unit according to claim 1 or 2, wherein the single shellless ultrasonic transducer used to form the close-packed array is composed of a horn-shaped resonant plate, a galvanized metal circular plate, a circular piezoelectric ceramic plate, a connecting wire, a cylindrical pin and a circular base; wherein:

the horn-shaped resonant piece is bonded to one side of the galvanized metal circular plate by curing adhesive, the other side of the galvanized metal circular plate is bonded to the negative electrode of the piezoelectric ceramic plate, the horn-shaped resonant piece, the galvanized metal circular plate and the piezoelectric ceramic plate are combined to form a vibrating body of the ultrasonic transducer, the positive electrode and the negative electrode of the vibrating body are the same as those of the circular piezoelectric ceramic plate, the positive electrode and the negative electrode of the vibrating body are respectively connected with the two cylindrical contact pins through connecting wires, and the corresponding positive electrode and the corresponding negative electrode are marked near the two cylindrical contact pins below the circular base.

4. The in-phase close-packed array ultrasonic transmitting unit of claim 3, wherein the transmitting frequency of the ultrasonic transducer is determined according to the resonant frequency and the geometric dimensions of the piezoelectric ceramic plate and the geometric dimensions of the horn-shaped resonant plate and the galvanized metal circular plate; under the conditions that the caliber of the horn-shaped resonant plate is 6mm to 10mm, the diameter of the galvanized metal circular plate is 8mm to 12mm, the caliber of the horn-shaped resonant plate is smaller than the diameter of the galvanized metal circular plate, and the diameter of the piezoelectric ceramic plate is smaller than the diameter of the galvanized metal circular plate, the horn-shaped resonant plate, the galvanized metal circular plate and the piezoelectric ceramic plate are combined differently to form the ultrasonic transducer with different transmitting frequencies between 15KHz and 60 KHz.

5. The in-phase close-packed array ultrasonic transmitter unit of claim 1, wherein the printed circuit board is sized according to the number of close-packed array ultrasonic transducers, and the corresponding thickness is one of 1 to 3 mm; the shape is hexagonal, square, rectangular, oval or triangular, or the combination of the shapes.

6. The in-phase close-packed array ultrasonic transmitter unit as claimed in claim 1, 2, 4 or 5, wherein the diameter of the circular silk-screen pattern is the same as the diameter of the circular base of the transducer; each circular silk-screen pattern is provided with 2 through holes for inserting 2 cylindrical contact pins of the ultrasonic transducer, namely corresponding positive and negative electrodes; through holes are formed in the periphery of the printed circuit board and used for fixing the same-phase densely-arranged array type ultrasonic transmitting units; the back of the printed circuit board is provided with a printed circuit, the printed circuit connects the anode and the cathode of the densely-arrayed ultrasonic transducers in a parallel connection mode, or the densely-arrayed ultrasonic transducers are divided into a plurality of groups, and after each group of transducers are connected in parallel, the groups are connected in a series connection mode; a cylindrical contact pin of the transducer is welded with the printed circuit; the reverse side is also provided with an input end of the close-packed array type ultrasonic transmitting unit, and the ultrasonic signals amplified by power are input into the close-packed array type ultrasonic transmitting unit through a lead so as to emit ultrasonic waves with high strength and high directivity.

7. The in-phase close-packed array type ultrasonic transmitter unit according to claim 6, wherein the entire in-phase close-packed array type ultrasonic transmitter unit is coated or plated with a waterproof insulating film having a thickness of 10 to 30 μm.

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