CN106055052A - Water tank water cooling computer case - Google Patents

Abstract

The invention relates to a water-cooled and heat-dissipating computer case, comprising a main case body (1), a fan (10), a hard disk (11), a main board, and various components arranged on the main case body (1). Module; also includes a water reservoir (8), a diversion pipe (12), a spacer (13), a heat sink array (14), a rotating shaft (15), a baffle (16), thermal expansion and contraction thermal gaskets (17), the control module (2), and the first temperature sensor (3), the second temperature sensor (4), the first electric control valve (5), and the second electric control valve respectively connected to the control module (2) The valve (6), the air pump (7), the third electric control valve, and the fourth electric control valve; the above hardware modules are connected to form a water-cooled and heat-dissipating computer case, and the liquid circulation system is used to make the main body (1) inside a In a controllable low-temperature environment, the heat dissipation effect of the internal heat of the main chassis body (1) is improved.

Description

Water-cooled heat-dissipating computer case with water tank

technical field

The invention relates to a water-tank water-cooled and heat-dissipating computer case, which belongs to the technical field of computer hardware.

Background technique

The mainframe of the computer is the brain of the computer. As a part of the computer accessories, the chassis is mainly used to place and fix the computer accessories, and it plays a role of support and protection. With the continuous progress of modern society, the computer has also been With unprecedented popularity, all kinds of computers continue to pour into the market. Even if portable computers such as notebooks enter the market, desktops have always been irreplaceable computer products due to their excellent performance. Development, improvement and innovation are also constantly emerging, such as patent application number: 201310368963.2, which discloses a computer mainframe box, including a box body. The wheels are connected by threads and card slots, and the middle part of the top surface of the box is provided with a handle ring through the rotating shaft. Two lugs and a half-ring handle with hooks at both ends are arranged on the side of the box. The half-ring handle is connected to the box through the ear handles. , this kind of computer case solves the problem that the computer case and the monitor are placed separately during the moving process, and the computer case and the monitor are too heavy and inconvenient to carry. People move computer and use computer and bring great convenience.

Not only that, the patent application number: 201610113499.6 discloses a main computer box to solve the problem that the main computer box in the prior art cannot prevent the phenomenon of "electronic migration". The main box is a cubic structure, forming a first space and a second space isolated from each other; the main box is equipped with an air-conditioning and refrigeration system, and the compressor and condensing device of the system are located in the first space, and the first space and the outside world pass through the system. The condensing device is connected to the outside through its air outlet; the evaporator of the system is located in the second space, and after the host components are installed in the second space, the second space becomes a closed space; the cross-flow fan of the system is located in the main box On the outside, the cross-flow fan corresponds to the evaporator; the temperature difference between the inlet and outlet of the system is less than or equal to 3 degrees Celsius.

It can be seen from the above-mentioned improvements for the computer main box that the existing technology is mostly improved from the structure, providing various conveniences for people's use, but in practical applications, the biggest problem facing the main box is exactly heat dissipation, and this is a permanent There is no end to the problem, how can we continue to make breakthroughs and provide better technical solutions for the heat dissipation of the main computer chassis, which is the best way to improve the performance of the computer. An important means of new energy for computer hosts.

Contents of the invention

The technical problem to be solved by the present invention is to provide a structural improvement for the existing computer mainframe, design and introduce a closed interlayer cavity, and a multi-structure heat dissipation method, based on the liquid in the reservoir for loading the closed interlayer cavity, The water tank water-cooled heat dissipation computer case effectively improves the heat dissipation effect of the communication case.

In order to solve the above-mentioned technical problems, the present invention adopts the following technical solutions: the present invention designs a water-cooled and heat-dissipating computer case, including a main case body, and a power supply module, a fan, a hard disk, a main board arranged in the main case body, and a Each module on the main board; the external power supply of the power module provides power for the fan and hard disk in the main chassis body, the main board, and each module set on the main board; The rotating shaft, the baffle, the thermal expansion and contraction thermal gasket, the control module, and the first temperature sensor, the second temperature sensor, the first electric control valve, the second electric control valve, the air pump, the second temperature sensor respectively connected with the control module The third electric control valve and the fourth electric control valve; the control module is set on the main box body and connected with the power module, and the power module is respectively the first temperature sensor, the second temperature sensor, the first electric control valve, and the second electric control valve through the control module. The second electric control valve, the air pump, the third electric control valve, and the fourth electric control valve supply power; the inner wall of the main box body is provided with a closed interlayer cavity, and the closed interlayer cavity is provided with a cavity water inlet hole and a cavity outlet holes; the reservoir stores liquid with a preset volume, and the reservoir is provided with a water inlet hole, a water outlet hole and an air hole; the water inlet hole on the closed interlayer cavity is connected with the water outlet hole on the reservoir At the same time, the outlet hole of the pool on the reservoir is connected to one end of the diversion tube through the third electric control valve; the outlet hole of the cavity on the closed interlayer cavity is connected to the inlet hole of the pool on the reservoir through a pipeline , at the same time, the water inlet hole on the reservoir is connected to the other end of the diversion pipe through the fourth electric control valve; the air nozzle of the air pump is connected to the air hole on the reservoir, and the first electric control valve is set in the closed interlayer The pipeline between the water inlet hole of the cavity cavity and the water outlet hole of the reservoir pool is used to control the on-off of the pipeline; the second electric control valve is arranged on the water outlet hole of the closed interlayer cavity cavity and the water inlet hole of the reservoir pool The pipe between the holes is used to control the on-off of the pipe; the first temperature sensor is set inside the main box body, and the second temperature sensor is set inside the closed interlayer cavity; the heat sink array is fixedly set above the main board, In addition, each heat sink in the heat sink array is perpendicular to the plane where the main board is located, the air guide tube is coiled on each heat sink in the heat sink array, the partition is arranged on one side of the heat sink array, and the heat sink on this side of the heat sink array faces the partition. The distance between the heat sink and the spacer on this side of the heat sink array is adapted to the width of the hard disk. The hard disk is located below the space between the heat sink array and the spacer. At the top, one side of the baffle is connected to the rotating shaft, and the baffle is located between the heat sink array and the spacer. The cold-shrinkable heat-sensitive gasket is arranged between the heat sink array and the spacer, on the surface of the heat-sink array, and the thermal-expansion and cold-shrink heat-sensitive gasket is located on the rotation path of the baffle; the fan is fixedly arranged on the heat sink array with the top of the septum.

As a preferred technical solution of the present invention: the closed interlayer cavities are distributed and arranged on all inner walls of the main cabinet body except for the cabinet door.

As a preferred technical solution of the present invention: the control module is arranged inside the main chassis body.

As a preferred technical solution of the present invention: the control module is a single-chip microcomputer.

As a preferred technical solution of the present invention: both the first temperature sensor and the second temperature sensor are GWD70 temperature sensors.

Compared with the prior art, a water-cooled and heat-dissipating computer case with a water tank according to the present invention has the following technical effects:

(1) The water tank water-cooled and heat-dissipating computer case designed by the present invention is improved based on the structure of the existing communication case, and the design introduces a closed interlayer cavity. Based on the self-circulation system, the liquid in the reservoir is used to load the closed interlayer cavity. , so that the inside of the main box body is in a controllable low-temperature environment, and the heat dissipation effect of the internal heat of the main box body is improved, and the first temperature sensor and the second temperature sensor are separately arranged inside the main box body and in the closed interlayer cavity The design realizes intelligent control for the flow of liquid in the closed interlayer cavity, and then realizes intelligent temperature control for the water-cooled and heat-dissipating computer case designed for the water tank. The flow of liquid in the pool, through the airflow of the fan, realizes active cooling and cooling, and the design introduces thermal expansion and contraction thermal pads, based on the thermal expansion and contraction thermal thermal pads. The baffle is flexibly controlled to specifically realize the cooling operation in different ways for the hard disk and the main board, effectively ensuring the stability of the work of each module in the main chassis body;

(2) In the water tank water-cooled and heat-dissipating computer case designed by the present invention, for the position of the closed interlayer cavity, it is further designed to be distributed on all the inner walls of the main case body except the box door, so that it is located on the main case body to the greatest extent. The hard disk, motherboard, and modules installed on the motherboard are surrounded by a closed interlayer cavity, which further improves the heat dissipation effect of the hard disk, motherboard, and modules installed on the motherboard, and ensures that the hard disk, motherboard, And the stability of the work of each module set on the motherboard;

(3) In the water tank water-cooled heat dissipation computer case designed by the present invention, the control module is arranged inside the main case body, which can prevent the control module from being damaged by the external environment, and effectively ensure the stability of the design of the intelligent electronic control structure to the greatest extent. Not only that, for the control module, the specific design adopts a single-chip microcomputer, on the one hand, it can be applied to the expansion requirements of the water tank water-cooled and heat-dissipating computer case, on the other hand, the simple control architecture mode can facilitate later maintenance.

Description of drawings

Fig. 1 is the structural representation of the water-cooled and heat-dissipating computer case of the water tank design of the present invention.

Among them, 1. Main box body, 2. Control module, 3. First temperature sensor, 4. Second temperature sensor, 5. First electric control valve, 6. Second electric control valve, 7. Air pump, 8. Storage Pool, 9. Closed interlayer cavity, 10. Fan, 11. Hard disk, 12. Guide pipe, 13. Spacer, 14. Radiator array, 15. Rotating shaft, 16. Baffle, 17. Thermal expansion and cooling shrink thermal gasket.

detailed description

The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

As shown in Fig. 1, the present invention has designed a kind of water tank water-cooled heat-dissipating computer case, comprises main case body 1, and the power supply module that is arranged in main case body 1, fan 10, hard disk 11, main board, and be arranged on main board Each module of the power supply module; the external power supply of the power module supplies power for the fan 10, the hard disk 11, the main board in the main chassis body, and each module arranged on the main board; it also includes a water storage tank 8, a draft tube 12, a spacer 13, a heat dissipation Sheet array 14, rotating shaft 15, baffle plate 16, thermal expansion and contraction heat sensitive gasket 17, control module 2, and the first temperature sensor 3, the second temperature sensor 4, and the first electronic control module respectively connected to the control module 2 The valve 5, the second electric control valve 6, the air pump 7, the third electric control valve, and the fourth electric control valve; the control module 2 is set on the main box body 1 and connected with the power module, and the power module is respectively The first temperature sensor 3, the second temperature sensor 4, the first electric control valve 5, the second electric control valve 6, the air pump 7, the third electric control valve, and the fourth electric control valve supply power; A closed interlayer cavity 9 is provided, and a cavity inlet hole and a cavity outlet hole are arranged on the closed interlayer cavity 9; the reservoir 8 stores a preset volume of liquid, and the reservoir 8 is provided with a pool inlet hole and a pool Water outlet holes and air holes; the cavity water inlet hole on the closed interlayer cavity 9 is connected with the water outlet hole on the reservoir 8 through a pipeline, and at the same time, the water outlet hole on the reservoir 8 is connected through the third electric control valve It is connected with one end of the diversion pipe 12; the cavity water outlet hole on the closed interlayer cavity 9 is connected with the water inlet hole of the water reservoir on the reservoir 8 through a pipeline, and at the same time, the water inlet hole of the water reservoir on the reservoir 8 The fourth electronically controlled valve is connected to the other end of the guide pipe 12; the air nozzle of the air pump 7 is connected to the air hole on the reservoir 8, and the first electronically controlled valve 5 is arranged in the closed interlayer cavity 9 to enter the cavity. On the pipeline between the water hole and the water outlet hole of the reservoir 8, it is used to control the on-off of the pipeline; the second electric control valve 6 is arranged on the water outlet hole of the closed interlayer cavity 9 and the inlet of the reservoir 8 On the pipeline between the water holes, it is used to control the on-off of the pipeline; the first temperature sensor 3 is arranged inside the main chassis body 1, and the second temperature sensor 4 is arranged inside the closed interlayer cavity 9; the heat sink array 14 Fixedly arranged above the main board, and each heat sink in the heat sink array 14 is perpendicular to the plane where the main board is located. And the heat sink on this side of the heat sink array 14 faces the spacer 13, the distance between the heat sink and the spacer 13 on this side of the heat sink array 14 is adapted to the width of the hard disk 11, and the hard disk 11 is located between the heat sink array 14 and the spacer 13. Between the bottom, the rotating shaft 15 is arranged on the top of the heat sink facing the spacer 13 in the heat sink array 14, and one side of the baffle plate 16 is connected with the rotating shaft 15, and the baffle plate 16 is located between the heat sink array 14 and the spacer 13 In between, the baffle plate 16 rotates around the rotating shaft 15 to realize the movable sealing between the heat sink array 14 and the spacer 13, and thermal expansion and contraction of the thermal gasket 17 It is arranged between the heat sink array 14 and the spacer 14, on the surface of the heat sink of the heat sink array 14, and the thermal expansion and contraction thermal pad 17 is located on the rotation path of the baffle plate 16; the fan 10 is fixedly arranged on the heat sink array 14 and the top of the spacer 13. The water-cooled and heat-dissipating computer case designed by the above technical scheme is improved based on the structure of the existing communication case, and the design introduces a closed interlayer cavity 9. Based on the self-circulation system, the liquid in the reservoir 8 is used to target the closed interlayer cavity 9. The loading makes the inside of the main chassis body 1 in a controllable low-temperature environment, improves the heat dissipation effect of the heat inside the main chassis body 1, and by dividing the first temperature in the main chassis body 1 and the closed interlayer cavity 9 The design of the sensor 3 and the second temperature sensor 4 realizes intelligent control for the flow of liquid in the closed interlayer cavity 9, and then realizes intelligent temperature control for the designed water tank water-cooled and heat-dissipating computer case, and at the same time, introduces multi-structure heat dissipation The method is based on the flow of the liquid in the heat sink array 14 and the reservoir 8, and the airflow through the fan 10 to achieve active cooling and cooling, and the design introduces thermal expansion and contraction thermal pads 17, based on thermal expansion and contraction thermal pads The heat-proof and cold-shrink characteristics of the sheet 17 can be flexibly controlled for the baffle 16 at different temperature stages, and specifically realize different heat dissipation operations for the hard disk 11 and the motherboard, effectively ensuring the stability of the work of each module in the main chassis body 1.

Based on the technical solution of the above-mentioned water-cooled and heat-dissipating computer case designed by the water tank, the present invention further designs the following optimal technical solution: for the position of the closed interlayer cavity 9, further design the box door distributed on the main box body 1 On all the inner walls other than the hard disk 11 and the main board in the main chassis body 1, and each module arranged on the main board is surrounded by the closed interlayer cavity 9, further improving the hard disk 11, the main board, and the The heat dissipation effect of each module arranged on the mainboard ensures the stability of the hard disk 11, the mainboard, and the work of each module arranged on the mainboard; in addition, the control module 2 is arranged in the inside of the main chassis body 1, which can avoid The control module 2 is damaged by the external environment, which effectively guarantees the stability of the design of the intelligent electronic control structure to the greatest extent; not only that, for the control module 2, the specific design uses a single-chip microcomputer, on the one hand, it can be applied to the water-cooled heat dissipation computer case in the later stage. Expansion requirements, on the other hand, a concise control architecture model can facilitate later maintenance.

In the actual application process, the water tank water-cooled and heat-dissipating computer case designed by the present invention includes a main case body 1, a power supply module arranged in the main case body 1, a fan 10, a hard disk 11, a main board, and various modules arranged on the main board The external power supply of the power supply module supplies power for the fan 10, the hard disk 11, the main board, and each module arranged on the main board; it also includes a water storage tank 8, a draft tube 12, a spacer 13, and a heat sink array 14 , rotating shaft 15, baffle plate 16, thermal expansion and contraction heat sensitive pad 17, single-chip microcomputer, and the first temperature sensor 3, the second temperature sensor 4, the first electric control valve 5, the second electric control valve respectively connected with the single-chip microcomputer Valve 6, air pump 7, the third electric control valve, the fourth electric control valve; the single-chip microcomputer is arranged on the inside of the main box body 1, and is connected with the power module, and the power module is respectively the first temperature sensor 3 and the second temperature sensor 3 through the single-chip microcomputer. The temperature sensor 4, the first electric control valve 5, the second electric control valve 6, and the air pump 7 supply power; the inner wall of the main box body 1 is provided with closed interlayer cavities 9, and the closed interlayer cavities 9 are distributed in the main engine On all the inner walls of the box body 1 except the box door, a cavity inlet hole and a cavity outlet hole are arranged on the closed interlayer cavity 9; the reservoir 8 stores liquid with a preset volume, and a pool is arranged on the reservoir 8 Inlet hole, pool outlet hole and air hole; The cavity inlet hole on the closed interlayer cavity 9 is connected with the pool outlet hole on the reservoir 8 through pipelines, and meanwhile, the pool outlet hole on the reservoir 8 is passed through The third electric control valve is connected with one end of the diversion pipe 12; the cavity water outlet hole on the closed interlayer cavity 9 is connected with the pool water inlet hole on the water storage tank 8 through the pipeline, and at the same time, on the water storage tank 8 The water inlet hole of the pool is connected to the other end of the diversion pipe 12 through the fourth electric control valve; the air nozzle of the air pump 7 is connected to the air hole on the reservoir 8, and the first electric control valve 5 is set in the closed interlayer cavity On the pipeline between the water inlet hole of the body 9 cavity and the water outlet hole of the reservoir 8, it is used to control the on-off of the pipeline; the second electronic control valve 6 is arranged on the water outlet hole of the closed interlayer cavity 9 cavity and the storage tank. On the pipeline between the water inlet holes of the pool 8, it is used to control the on-off of the pipeline; the first temperature sensor 3 is arranged inside the main chassis body 1, and the second temperature sensor 4 is arranged inside the closed interlayer cavity 9 The heat sink array 14 is fixedly arranged above the main board, and each heat sink in the heat sink array 14 is perpendicular to the plane where the main board is located. 14, and the heat sink on this side of the heat sink array 14 faces the spacer 13, the distance between the heat sink and the spacer 13 on this side of the heat sink array 14 is adapted to the width of the hard disk 11, and the hard disk 11 is located in the heat sink array 14 and the spacer 13, the rotating shaft 15 is arranged on the top of the heat sink facing the spacer 13 in the heat sink array 14, one side of the baffle plate 16 is connected with the rotating shaft 15, and the baffle plate 16 is located in the heat sink array 14 Between the baffle 16 and the spacer 13, the baffle plate 16 rotates around the rotating shaft 15 to realize the connection between the fin array 14 and the spacer 13. Between the active block, thermal expansion and contraction thermal gasket 17 is arranged between the heat sink array 14 and the spacer 14, on the surface of the heat sink of the heat sink array 14, and the thermal expansion and contraction thermal gasket 17 is located in the block On the rotation path of the board 16 ; the fan 10 is fixedly arranged above the heat sink array 14 and the spacer 13 . In the actual application process, in the initial state, the first electronically controlled valve 5 is closed, the second electronically controlled valve 6 is closed, the third electronically controlled valve is closed, and the fourth electronically controlled valve is closed; when the computer case starts to work, the fan 10 starts to work, The first temperature sensor 3 monitors the temperature inside the main box body 1 in real time and uploads it to the single-chip microcomputer. The single-chip microcomputer receives the temperature inside the main box body 1 and judges whether it reaches the preset threshold. Then the single-chip microcomputer controls the first electronically controlled valve 5 and the third electronically controlled valve connected therewith to work for preset time respectively, and opens the gap between the cavity water inlet hole of the closed interlayer cavity 9 and the water outlet hole of the reservoir 8 pipeline, and one end of the water outlet hole of the water reservoir 8 connected to the water reservoir and the diversion pipe 12. At the same time, the single-chip microcomputer controls the work of the air pump 7 connected to it, and inflates the air in the reservoir 8 through the air holes on the reservoir 8. Due to the water storage The inner space of the pool 8 is fixed, so that when the air pump 7 inflates the water storage tank 8, the air pressure in the water storage tank 8 increases continuously, so that the liquid in the water storage tank 8 will flow along the water storage tank 8 under the action of pressure. The water outlet hole of the pool flows into the closed interlayer cavity 9 through the cavity inlet hole of the closed interlayer cavity 9, and the liquid in the reservoir 8 flows into the guide along the water outlet hole of the reservoir 8 under the action of pressure. In the flow pipe 12, when the first electric control valve 5 is opened for a preset time, the first electric control valve 5 and the third electric control valve are automatically closed, and the cavity water inlet hole of the closed interlayer cavity 9 is disconnected. With the pipeline between the water outlet holes of the reservoir 8, and disconnecting the communication between the water outlet holes of the reservoir 8 and one end of the draft tube 12, because the hard disk 11, the main board, and each module arranged on the main board are in the Surrounded by the closed interlayer cavity 9, the liquid in the closed interlayer cavity 9 will provide a relatively low-temperature environment for the hard disk 11, the mainboard, and each module arranged on the mainboard, effectively improving the performance of the hard disk 11 and the mainboard. , and the heat dissipation of each module arranged on the motherboard, at the same time, the air guide tube 12 coiled on each heat sink in the heat sink array 14 can cool down the heat sink array 14, and at the same time, based on the work of the fan 10, the fan 10 The air flow of the air will blow the main board through the heat sink array 14 to realize the heat dissipation of the main board. At this time, the single-chip microcomputer continues to control the work of the air pump 7 connected to it, and sucks air against the inside of the water storage tank 8 until the air pressure inside the water storage tank 8 is the same as that of the outside. The air pressure remains consistent; at the same time, the second temperature sensor 4 arranged in the closed interlayer cavity 9 works in real time to monitor the temperature of the water in the closed interlayer cavity 9, and uploads it to the single-chip microcomputer, because the closed interlayer cavity 9 When the liquid in the hard disk 11, the main board, and each module arranged on the main board are radiating heat, its own temperature will rise thereupon. When the temperature of the liquid in the closed interlayer cavity 9 reaches a preset threshold, Then the single-chip microcomputer controls the second electric control valve 6 and the fourth electric control valve connected to it to work for preset time respectively, and opens the pipeline between the cavity outlet hole of the closed interlayer cavity 9 and the water inlet hole of the reservoir 8 , and connected to the reservoir 8 water inlet holes and diversion At the other end of the pipe 12, the liquid in the closed interlayer cavity 9 will flow into the reservoir 8 through the cavity water outlet hole and the pool inlet hole, and the liquid in the draft tube 12 will also flow into the reservoir 8; through the above process, the liquid flows from the reservoir 8 into the closed interlayer cavity 9 and the guide pipe 12 respectively, and then flows back into the reservoir 8 to form a circulation system, not only for the main chassis body 1 The hard disk 11, the main board, and each module arranged on the main board realize heat dissipation, and the above-mentioned liquid circulation system can avoid waste of resources. While above-mentioned process is carried out, be arranged between the heat sink array 14 and spacer 14, on the heat sink surface of heat sink array 14 thermal expansion and contraction thermal pad 17, due to thermal expansion and cold contraction thermal pad 17 It is located on the rotation path of the baffle 16, and it has the characteristics of thermal expansion and contraction. When the temperature in the main chassis body 1 is low, the thermal expansion and contraction thermal pad 17 is in a shrinking state, and the baffle 16 due to its gravity The reason is that the rotating shaft 15 is rotated against the heat sink of the heat sink array 14, so that the passage between the spacer 13 and the heat sink array 14 is opened, and at this time, the airflow generated by the fan 10 will pass through the heat sink array 14 respectively. The gap in the middle, and the area between the heat sink array 14 and the spacer 13 blow out, one side blows to the motherboard, and the other side blows to the hard disk 11, so as to realize simultaneous heat dissipation for the motherboard and the hard disk 11; correspondingly, when the main chassis body 1 When the temperature rises, the thermal expansion and contraction thermal pad 17 is in an expansion state, then during the expansion process of the thermal expansion and cold contraction thermal pad 17, the thermal expansion and cold contraction thermal pad 17 will give the baffle 16 a thrust, the baffle plate 16 will rotate around the rotating shaft 15 to realize the blocking of the passage between the spacer 13 and the heat sink array 14, and the airflow generated by the fan 10 can only pass through the heat sink array 14 at this time. The slit blows out and blows to the main board, only realizes the heat dissipation for the main board, thus based on different temperature stages, based on the fan 10, different modes of heat dissipation are realized for the main board and the hard disk 11; The above operation process achieves heat dissipation for the hard disk 11, the main board, and each module arranged on the main board, and in the actual application process, the first temperature sensor 3 and the second temperature sensor 4 are designed to use GWD70 temperature sensors.

The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and can also be made without departing from the gist of the present invention within the scope of knowledge possessed by those of ordinary skill in the art. Variations.

Claims (5)

1. a water tank water-cooled radiating type computer case, including mainframe box body (1) and in being arranged on mainframe box body (1) Power module, fan (10), hard disk (11), mainboard, and the modules being arranged on mainboard；Power module external power supply It is powered for the intrinsic fan of mainframe box (10) and hard disk (11), mainboard, and the modules being arranged on mainboard；Its It is characterised by: also include cistern (8), mozzle (12), partition (13), radiation fin array (14), rotating shaft (15), baffle plate (16), temperature-sensitive of expanding with heat and contract with cold pad (17), control module (2), and be connected with control module (2) respectively first temperature pass Sensor (3), the second temperature sensor (4), the first electric control valve (5), the second electric control valve (6), air pump (7), the 3rd electrically-controlled valve Door, the 4th electric control valve；Control module (2) is arranged on mainframe box body (1), and is connected with power module, power module warp Cross control module (2) and be respectively the first temperature sensor (3), the second temperature sensor (4), the first electric control valve (5), the second electricity Control valve (6), air pump (7), the 3rd electric control valve, the 4th electric control valve are powered；Arrange on the inwall of mainframe box body (1) Closed interlayer cavity (9), closed interlayer cavity (9) arranges cavity inlet opening and cavity apopore；Cistern (8) stores The liquid of preset vol, cistern (8) arranges inlet opening, pond, pond apopore and pore；On closed interlayer cavity (9) Cavity inlet opening be connected with the pond apopore on cistern (8) through pipeline, meanwhile, the pond water outlet on cistern (8) Kong Jing tri-electric control valve is connected with one end of mozzle (12)；Cavity apopore on closed interlayer cavity (9) is through pipe Road is connected with the inlet opening, pond on cistern (8), meanwhile, and inlet opening, pond the 4th electric control valve on cistern (8) It is connected with the other end of mozzle (12)；The valve of air pump (7) is connected with the pore on cistern (8), the first electrically-controlled valve Door (5) is arranged on the pipeline between closed interlayer cavity (9) cavity inlet opening and cistern (8) pond apopore, is used for Control the break-make of this pipeline；Second electric control valve (6) is arranged on closed interlayer cavity (9) cavity apopore and cistern (8) On pipeline between inlet opening, pond, for controlling the break-make of this pipeline；First temperature sensor (3) is arranged on mainframe box body (1) inside, it is internal that the second temperature sensor (4) is arranged on closed interlayer cavity (9)；Radiation fin array (14) is fixedly installed Above mainboard, and in radiation fin array (14), each fin is perpendicular with mainboard place plane, and mozzle (12) is coiled in In radiation fin array (14) on each fin, partition (13) is arranged at the side of radiation fin array (14), and radiation fin array (14) fin of this side is towards partition (13), and the spacing between this side fin of radiation fin array (14) and partition (13) is with hard The width of dish (11) adapts, and hard disk (11) is positioned at the lower section between radiation fin array (14) and partition (13), and rotating shaft (15) sets Putting the top of fin towards partition (13) in radiation fin array (14), the side of baffle plate (16) is connected with rotating shaft (15) Connecing, and baffle plate (16) is positioned between radiation fin array (14) and partition (13), baffle plate (16) is that axle rotates with rotating shaft (15), it is achieved For the activity block between radiation fin array (14) and partition (13), temperature-sensitive of expanding with heat and contract with cold pad (17) is arranged on fin battle array Between row (14) and partition (14), in the fin surface of radiation fin array (14), and the temperature-sensitive pad (17) that expands with heat and contract with cold is positioned at On the rotation path of baffle plate (16)；Fan (10) is fixedly installed on the top of radiation fin array (14) and partition (13).

A kind of water tank water-cooled radiating type computer case, it is characterised in that: described closed interlayer cavity Body (9) distribution is arranged on the upper whole inwalls in addition to chamber door of described mainframe box body (1).

A kind of water tank water-cooled radiating type computer case, it is characterised in that: described control module (2) It is arranged on the inside of described mainframe box body (1).

4. according to water tank water-cooled radiating type computer case a kind of described in any one in claims 1 to 3, it is characterised in that: institute Stating control module (2) is single-chip microcomputer.

5. according to water tank water-cooled radiating type computer case a kind of described in any one in claims 1 to 3, it is characterised in that: institute State the first temperature sensor (3), the second temperature sensor (4) is GWD70 type temperature sensor.