CN106022325B - Optical fingerprint sensor mould group - Google Patents
Optical fingerprint sensor mould group Download PDFInfo
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- CN106022325B CN106022325B CN201610637766.XA CN201610637766A CN106022325B CN 106022325 B CN106022325 B CN 106022325B CN 201610637766 A CN201610637766 A CN 201610637766A CN 106022325 B CN106022325 B CN 106022325B
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- transparent substrates
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- fingerprint sensor
- backlight
- optical fingerprint
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1341—Sensing with light passing through the finger
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- Optics & Photonics (AREA)
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Abstract
A kind of optical fingerprint sensor mould group, comprising: the first transparent substrates；Second transparent substrates are located at below first transparent substrates；Backlight is located at below first transparent substrates；The backlight is located at the side of second transparent substrates；The optical fingerprint sensor mould group further includes fingerprint sensing layer, and the fingerprint sensing layer is located at second transparent substrates lower surface.The optical fingerprint sensor module performance improves, and is improved using the fingerprint image quality that the optical fingerprint sensor mould group obtains.
Description
Technical field
The present invention relates to optical finger print identification field more particularly to a kind of optical fingerprint sensor mould groups.
Background technique
Fingerprint imaging identification technology is the fingerprint image that human body is collected by fingerprint sensor, then and in system
Existing fingerprint imaging information is compared, and whether carrying out correct judgment, and then realizes the technology of identification.The side used due to it
Just property and the uniqueness of somatic fingerprint, fingerprint identification technology have been widely used in every field.Such as public security bureau, customs
Etc. field of safety check, consumer product areas such as the access control system and PC of building and mobile phone etc..
The implementation of fingerprint imaging identification technology has the multiple technologies such as optical imagery, capacitance imaging, ultrasonic imaging.Relatively
For, optical finger print imaging technique, imaging effect is relatively preferable, and equipment cost is relatively low.
The structure of existing optical fingerprint sensor mould group has much room for improvement, and performance is to be improved.
Summary of the invention
Problems solved by the invention is to provide a kind of optical fingerprint sensor mould group, to improve the optical fingerprint sensor
The performance of mould group, to improve the fingerprint image quality obtained using the optical fingerprint sensor mould group.
To solve the above problems, the present invention provides a kind of optical fingerprint sensor mould group, comprising: the first transparent substrates；The
Two transparent substrates are located at below first transparent substrates；Backlight is located at below first transparent substrates；The backlight
Source is located at the side of second transparent substrates；The optical fingerprint sensor mould group further includes fingerprint sensing layer, the fingerprint
Sensed layer is located at second transparent substrates lower surface.
Optionally, the light that the backlight issues enters the second light transmission base from the side of second transparent substrates
Plate, then enter first transparent substrates from second transparent substrates, and in first transparent substrates upper surface generating unit
Point reflection, reflection light return to after penetrating first transparent substrates into second transparent substrates, then from described the
Two transparent substrates enter the fingerprint sensing layer.
Optionally, the angle of the side of second transparent substrates and second transparent substrates upper surface is on-right angle.
Optionally, first transparent substrates are single layer structure or multilayered structure；First transparent substrates lower surface
With light shield layer, the light that the light shield layer is used to prevent the backlight from issuing is not before entering second transparent substrates
Into first transparent substrates.
Optionally, when first transparent substrates are single layer structure, first transparent substrates upper surface, described first
At least one of which table of transparent substrates lower surface, second transparent substrates upper surface and second transparent substrates lower surface
Face has filter layer；When first transparent substrates are multilayered structure, first transparent substrates include multiple submount, institute
State submount upper surface, the submount lower surface, second transparent substrates upper surface and the second transparent substrates following table
At least one of which surface in face has filter layer.
Optionally, second transparent substrates and the fingerprint sensing layer form optical fingerprint sensor；Alternatively, described
One transparent substrates, second transparent substrates and the fingerprint sensing layer form optical fingerprint sensor.
Optionally, there is collector lens, the collector lens can make the backlight before the light-emitting surface of the backlight
The light in source is converted to directional light or nearly directional light, and the light of the backlight first passes through the collector lens, then reaches described
The side of second transparent substrates.
Optionally, the side that second transparent substrates are used to receive that backlight to emit beam has light antireflection layer, described
The light that light antireflection layer can increase the backlight enters the ratio of second transparent substrates.
Optionally, it is caustic surface, the optically focused that second transparent substrates, which are used to receive the side that backlight emits beam,
The light that the backlight issues is converted to directional light or nearly directional light by face.
Optionally, the caustic surface is inclined-plane, spherical crown surface, ellipsoid crown, conical side surface or pyramid side.
Optionally, the caustic surface has a light antireflection layer, the smooth antireflection layer can increase the light of the backlight into
Enter the ratio of the light transmission medium.
Optionally, the backlight includes more than two LED light, and described two or more than two LED light are equably divided
Cloth is black light, purple light, blue light, green light, sodium yellow, red in the lower section of the protective layer, the light of the LED light
Light, near infrared light or white light.
Compared with prior art, technical solution of the present invention has the advantage that
In technical solution of the present invention, it is located at below the first transparent substrates by the way that the second transparent substrates are arranged, backlight is set
Source is located at below the first transparent substrates, and backlight is located at the side of the second transparent substrates, and fingerprint sensing layer is positioned at described the
Two transparent substrates lower surfaces.The light that this structure issues backlight is anti-by the interface of the first transparent substrates upper surface
When being emitted back towards next, need just reach fingerprint sensing layer also cross the second transparent substrates and the first transparent substrates.At this point, the light
It learns fingerprint sensor mould group and takes full advantage of the thickness of the second transparent substrates itself, therefore do not needing to increase additional transparent substrates
In the case where, it will be able to it is capable of increasing finger print just to the distance between fingerprint sensing layer, expands fingerprint sensing layer and connect
The width of ray regions is received, to improve the fingerprint image quality of optical fingerprint sensor mould group acquisition.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of optical fingerprint sensor mould group；
Fig. 2 is the schematic top plan view of optical fingerprint sensor mould group provided by first embodiment of the invention；
Fig. 3 is optical fingerprint sensor mould group diagrammatic cross-section provided by first embodiment of the invention；
Fig. 4 is optical fingerprint sensor mould group diagrammatic cross-section provided by second embodiment of the invention；
Fig. 5 is optical fingerprint sensor mould group diagrammatic cross-section provided by third embodiment of the invention；
Fig. 6 is optical fingerprint sensor mould group diagrammatic cross-section provided by fourth embodiment of the invention；
Fig. 7 is optical fingerprint sensor mould group diagrammatic cross-section provided by fifth embodiment of the invention.
Specific embodiment
A kind of optical fingerprint sensor mould group is as shown in Figure 1, include protective layer 100, optical fingerprint sensor 110 and backlight
Source 120.Backlight 120 is located at 100 lower section of protective layer, and the directly contact of optical fingerprint sensor 110 is laminated under protective layer 100
Side, optical fingerprint sensor 110 include fingerprint sensing layer 111 and substrate 112.Fingerprint sensing layer 111 is located at table on substrate 112
Face, i.e., fingerprint sensing layer 111 is between substrate 112 and protective layer 100.Backlight 120 is located at optical fingerprint sensor 110
Side.At this point, the incidence angle a that the light that backlight 120 issues is irradiated into protective layer 100 is smaller, and therefore, optical finger print sensing
In device 110, the peak width A that fingerprint sensing layer 111 can receive reflected light is smaller, causes fingerprint sensing layer 111 most of
Region can not apply to fingerprint image acquisition, therefore optical fingerprint sensor module performance shown in Fig. 1 is to be improved, shown in Fig. 1
The collected fingerprint image quality of optical fingerprint sensor mould group is to be improved.
More importantly it is, in order to acquire higher-quality fingerprint image, it is often desirable that reach protective layer in incident ray
It, can be in the first interface (fingerprint valley position and 100 upper surface of protective layer of 100 upper surface of protective layer and air when 100 upper surface
Between have air) be totally reflected, and (fingerprint ridge position can be in 100 upper surface of protective layer and fingerprint tough position
Protective layer upper surface contact) second contact surface be normally carried out refraction and reflection (not being totally reflected), to improve fingerprint not
The contrast of same position (paddy position and ridge position) improves fingerprint image quality.And fingerprint sensor mould group shown in FIG. 1 can not
Above-mentioned first interface is realized there is a situation where total reflection and second contact surface is not totally reflected, therefore, optical finger print shown in Fig. 1 passes
Sensor mould group can not improve fingerprint image quality.
For this purpose, the present invention provides a kind of optical fingerprint sensor mould group, the optical fingerprint sensor mould group includes first
Transparent substrates, the second transparent substrates and fingerprint sensing layer, wherein the second transparent substrates and fingerprint sensing layer belong to fingerprint sensing
The structure of device.By by fingerprint sensor the second transparent substrates and fingerprint sensing layer upper and lower position exchange (this explanation
The upper and lower relation of book is usually to be defined with finger in the top), so that fingerprint sensing layer is located at the second transparent substrates lower surface (logical
Normal fingerprint sensing layer is located at the second transparent substrates upper surface) so that the second transparent substrates in fingerprint sensor also become
Fingerprint reflection light needs the structure passed through.Therefore, in the case where not needing to increase other additional substrates, it will be able to increase
Distance of the one transparent substrates upper surface to fingerprint sensing layer.Optical fingerprint sensor reception light can be expanded by expanding the distance
The width in region, to improve the fingerprint image quality of optical fingerprint sensor mould group acquisition.
To make the above purposes, features and advantages of the invention more obvious and understandable, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
First embodiment of the invention provides a kind of optical fingerprint sensor mould group, incorporated by reference to referring to figs. 2 and 3.Fig. 2 is institute
State the schematic top plan view of optical fingerprint sensor mould group.Fig. 3 is the group of optical fingerprint sensor mould shown in Fig. 2 along DD chain-dotted line cutting
Obtained diagrammatic cross-section.
Fig. 2 and Fig. 3 are please referred to, the optical fingerprint sensor mould group includes the first transparent substrates 200, the second transparent substrates
212, backlight 220 and fingerprint sensing layer 211.Second transparent substrates 212 are located at 200 lower section of the first transparent substrates.Backlight 220
It also is located at 200 lower section of the first transparent substrates.Backlight 220 is located at the side of the second transparent substrates 212.211, fingerprint sensing layer
In 212 lower surface of the second transparent substrates.
In the present embodiment, the second transparent substrates 212 and fingerprint sensing layer 211 form optical fingerprint sensor 210.Optics refers to
Line sensor 210 can be the imaging sensor made with TFT technique based on glass substrate.
In other embodiments, optical fingerprint sensor may include other structures.When optical fingerprint sensor may include
When other structures, the second transparent substrates and fingerprint sensing layer are a part of optical fingerprint sensor, i.e. optical fingerprint sensor
Including the second transparent substrates and fingerprint sensing layer.
It should be noted that optical fingerprint sensor 210 and backlight 220 are shown with dashed graph in Fig. 2, because it
Be actually covered by the first transparent substrates 200.
It should be noted that in overlook direction, the first transparent substrates can not cover backlight in other embodiments.
In the present embodiment, the first transparent substrates 200 are specifically as follows the cover sheet etc. of mobile phone or tablet computer.I.e.
One transparent substrates 200 are not belonging to a portion of optical fingerprint sensor 210, but still belong to the optical fingerprint sensor
A part of mould group.
In the present embodiment, the material of the first transparent substrates 200 can be glass or plastics etc..Second transparent substrates 212
Material may be glass or plastics etc..
Referring to FIG. 3, the light (as shown by the arrow in Figure 3) that backlight 220 issues is from the side of the second transparent substrates 212
Face enters the second transparent substrates 212, and (this process normal daylight has the variation of certain angle, and for simplicity, angle change is not shown
Change), then enter the first transparent substrates 200 (when the first transparent substrates 200 and the second transparent substrates 212 from the second transparent substrates 212
Refractive index difference when, the angle of light can generally also change), and 200 upper surface of the first transparent substrates occur part
Reflection, reflection light return to after penetrating the first transparent substrates 200 into the second transparent substrates 212, then from the second light transmission base
Plate 212 enters fingerprint sensing layer 211.That is, the light that the present embodiment issues backlight 220 is first from the second light transmission base
The side of plate 212 enters the second transparent substrates 212, then enters back into the first transparent substrates 200, and backlight 220 is avoided to issue
Light enters the first transparent substrates 200 before not entering the second transparent substrates 212.
It should be noted that since the side of the second transparent substrates 212 is the plane of incidence of light, so to the smooth of this face
Degree there are certain requirements, to make light uniformly effectively enter the second transparent substrates 212.The side of second transparent substrates 212 can be with
It is right-angle surface, i.e., as shown in figure 3, the side of the second transparent substrates 212 and the upper surface of the second substrate 212 are at right angle.
In other embodiments, the side of the second transparent substrates 212 is also possible to non-straight edged surface, as inclined-plane, this sample prescription
Just this side is processed.In addition, this flank angle can also be adjusted when the side is inclined-plane, so that most of incident
The incident angle of light is incident on the second transparent substrates 212 close to zero degree (i.e. close to vertical incidence), to increase the impingement rate of light.
Referring to FIG. 3,200 lower surface of the first transparent substrates has light shield layer 240, light shield layer 240 is for preventing backlight
220 light issued advance into the first transparent substrates 200 do not enter the second transparent substrates 212.That is, light shield layer
240 for guaranteeing that the light that backlight 220 issues first enters the second transparent substrates 212 from the side of the second transparent substrates 212, so
After enter back into the first transparent substrates 200.Light shield layer 240 can be formed using ink coating, can also use other suitable materials
Material and mode are formed.
It should be noted that in order to guarantee that the light that backlight issues first enters second thoroughly from the side of the second transparent substrates
Photopolymer substrate, then enters back into the first transparent substrates, can also be by controlling the light direction of backlight and going out in other embodiments
Angular range (such as sends out backlight so that light only first can enter the second transparent substrates from the side of the second transparent substrates
Light out only irradiates the side of the second transparent substrates), enter back into the first transparent substrates.
It is above-mentioned " to guarantee that the light that backlight issues first enters the second transparent substrates from the side of the second transparent substrates, then
Enter back into the first transparent substrates ", the purpose is to prevent " light of the first transparent substrates is entered without the second transparent substrates,
It is irradiated to fingerprint sensing layer to be different from reflection angle and the position of ' required light ', fingerprint image is caused to fog ".Wherein,
" required light " refers to the light for entering the second transparent substrates from the side of the second transparent substrates that backlight issues.
In the present embodiment, the first transparent substrates 200 are single layer structure.At this time 200 upper surface of the first transparent substrates, first thoroughly
At least one of which table of 212 lower surface of 200 lower surface of photopolymer substrate, 212 upper surface of the second transparent substrates and the second transparent substrates
Face can have filter layer.The filter layer can be used for filtering environment light or change the first transparent substrates 200 or the second light transmission
The appearance color of substrate 212.
In other embodiments, the first transparent substrates may be multilayered structure.When the first transparent substrates are multilayered structure,
First transparent substrates may include multiple submount, at this point, the submount upper surface, the submount lower surface, second are thoroughly
At least one of which surface of photopolymer substrate upper surface and the second transparent substrates lower surface has filter layer.
In the present embodiment, backlight 220 is located at the left side of optical fingerprint sensor 210.
In other embodiments, backlight can also be located at other sides of optical fingerprint sensor.
In the present embodiment, the position of backlight 220 is higher than or waits higher than fingerprint sensing layer 211, to prevent backlight
220 light issued enter fingerprint sensing layer 211 from the lower surface of fingerprint sensing layer 211.
In other embodiments, light is prevented to be irradiated to its sense from lower surface when fingerprint sensing layer is internally provided with light-shielding structure
When optical element, the position of backlight and fingerprint sensing layer can be lower than.
In conjunction with Fig. 2 and Fig. 3 it is found that when backlight 220 is located at the side of optical fingerprint sensor 210, backlight 220 is sent out
Light out can reach the side of the second transparent substrates 212 by air or vacuum without other solid dielectrics, from
And be conducive to reduce the optical fingerprint sensor modular volume, be conducive to apply to the light that more backlights 220 issue
Fingerprint image acquisition help to obtain better fingerprint image.
In the present embodiment, backlight 220 is point light source, such as can be a LED light.The light of the LED light can be
Black light, purple light, blue light, green light, sodium yellow, red light, near infrared light or white light.
In the present embodiment, the first transparent substrates 200 and the second transparent substrates 212 are directly laminated, and " directly stacking " refers to first
Transparent substrates 200 and the second transparent substrates 212 at least part contact, and can be precisely such as when the two is tlat substrate
Form is laminated shown in Fig. 3.
In other embodiments, it can be the first transparent substrates and the second transparent substrates directly pasted.When " directly pasting ", the
Glue-line lamination adhesive can be passed through between one transparent substrates and the second transparent substrates.Glue-line can be optical adhesive layer, optical adhesive layer
Material specifically can be temperature-sensitive optical adhesive layer, Photosensitive optical glue-line or optical double-sided adhesive tape band.
In optical fingerprint sensor mould group provided by the present embodiment, it is located at first by the second transparent substrates 212 of setting
200 lower section of transparent substrates, setting backlight 220 is located at 200 lower section of the first transparent substrates, and backlight 220 is located at second thoroughly
The side of photopolymer substrate 212, fingerprint sensing layer 211 are located at 212 lower surface of the second transparent substrates.This structure makes backlight
220 light issued are needed when reflecting by the first transparent substrates upper surface also cross 212 He of the second transparent substrates
First transparent substrates 200 can just reach fingerprint sensing layer 211.At this point, the optical fingerprint sensor mould group takes full advantage of
The thickness of two transparent substrates 212 itself, therefore in the case where not needing to increase additional transparent substrates, it will be able to make finger print
It is just capable of increasing to the distance between fingerprint sensing layer 211, expands the width that fingerprint sensing layer 211 receives ray regions, from
And improve the fingerprint image quality of optical fingerprint sensor mould group acquisition.
That is, in the present embodiment, the light that backlight 320 issues first enters the from 212 side of the second transparent substrates
Two transparent substrates 212 enter back into the first transparent substrates 200, at this time incident angle of the light in 200 upper surface of the first transparent substrates
B can be increased accordingly, and expand the width (reception of fingerprint sensing layer 211 ray regions that fingerprint sensing layer 211 receives ray regions
Width be width B, width B is much larger than width A known to comparison diagram 1 and Fig. 3), adopted to improve optical fingerprint sensor mould group
The fingerprint image quality of collection.
Meanwhile in the present embodiment, the light that backlight 220 issues is by after the second transparent substrates 212, entering back into first thoroughly
When photopolymer substrate 200, respective ray of light in 200 upper surface of the first transparent substrates for contact angle formed by the region of fingerprint to be sharp
Angle.At this point, the light of the sending of backlight 220 can (offset refers to that the horizontal direction in Fig. 3 deviates by corresponding offset
Distance) phenomena such as reflection and refraction occur for 200 upper surface of the first transparent substrates and the interface of finger print, and have major part
Effect reflection light, which is irradiated in the photosensitive region of optical fingerprint sensor 210, (to be specifically irradiated to essentially identical from corresponding reflection point
In photosensitive pixel at offset distance), therefore, entire optical fingerprint sensor mould group does not need the knot such as light guide plate and collector lens
Structure, it will be able to realize the identification of fingerprint image, form clearly fingerprint image, and simplify structure, reduce costs.
It is more importantly that, due to switching the position of fingerprint sensing layer 211 and the second transparent substrates 212, will refer to
Line sensed layer 211 is arranged in 212 lower surface of the second transparent substrates, according to geometric optical theory it is found that in Fig. 3, backlight 220
Light itself is adjusted before entering the first transparent substrates 200 by the second transparent substrates 212, and therefore, respective ray of light is saturating first
The incident angle b of 200 upper surface of photopolymer substrate is capable of increasing, and therefore, corresponding incident ray is more easier in the first transparent substrates 200
It can be totally reflected in upper surface and the interface of air, and on the boundary that finger print is contacted with 200 upper surface of the first transparent substrates
The optical phenomenas such as then normally reflected and reflected in face, at this point, different location (i.e. the paddy position and ridge position of finger print image
Set) contrast can be obviously improved, and fingerprint image quality improves.
Second embodiment of the invention provides another optical fingerprint sensor mould group, please refers to Fig. 4.Fig. 4 is the optics
The diagrammatic cross-section of fingerprint sensor mould group.The optical fingerprint sensor mould group includes the first transparent substrates 311, the second light transmission
Substrate 312, backlight and fingerprint sensing layer 313.Second transparent substrates 312 are located at 311 lower section of the first transparent substrates.Backlight
Positioned at 311 lower section of the first transparent substrates.Backlight is located at the side of the second transparent substrates 312.Fingerprint sensing layer 313 is located at second
312 lower surface of transparent substrates.
In the present embodiment, the first transparent substrates 311, the second transparent substrates 312 and fingerprint sensing layer 313 form optical finger print
Sensor (does not mark).It is different from the first embodiment, the first transparent substrates 311 are also one of optical fingerprint sensor
Point.
In the present embodiment, optical fingerprint sensor can be the image sensing made with TFT technique based on glass substrate
Device.
In other embodiments, optical fingerprint sensor may include other structures.When optical fingerprint sensor may include
When other structures, the first transparent substrates, the second transparent substrates and fingerprint sensing layer are a part of optical fingerprint sensor, i.e. light
Learning fingerprint sensor includes the first transparent substrates, the second transparent substrates and fingerprint sensing layer, and can also include other structures.
Turning back to reference Fig. 3, since the emergent light of the point light sources such as LED has certain angle of divergence, when only a LED light is made
For when backlight (such as backlight source 220) (previous embodiment corresponding contents can be referred to), the emergent light of backlight and reflection
Light and directional light difference are larger.That is, the angle for being irradiated to the light of 311 upper surface of the first transparent substrates everywhere have it is larger
Difference, the reflected light for eventually leading to different reflection points are incident on the deviation distance difference of optical fingerprint sensor photosensitive pixel, from
And fingerprint image is made to have distortion.
In order to solve above-mentioned fingerprint image aberration problems, in the present embodiment, the backlight includes four LED light, due to
The reason of plane is shown only shows two LED light therein, respectively LED light 320 and LED light 330 in section shown in Fig. 4.
Four LED light are evenly distributed on the lower section of the first transparent substrates 311, while being evenly distributed on optical fingerprint sensor side, or
Four lamps of person are evenly distributed on four angles of optical fingerprint sensor simultaneously.At this point, although the light that four LED light issue is respective
All may be non-parallel light, but simultaneously utilize this four LED light, may be implemented to it is non-parallel smooth when pattern distortion rectify
Just.Specifically, four LED light can be taken adopts figure (adopt figure in turn and refer to that four lamps chronologically successively carry out adopting figure respectively) in turn
Mode does distortion correction then by image procossing, improves fingerprint image quality, improves fingerprint recognition accuracy.
In the present embodiment, the light of LED light can be black light, purple light, blue light, green light, sodium yellow, red
Light, near infrared light or white light.
In other embodiments, backlight also may include two LED light, and two LED light are evenly distributed on the first light transmission base
The lower section of plate 311.For example, one of LED light is located at optical fingerprint sensor left side, another LED light refers to positioned at optics
Line sensor right edge, is also adopted figure in turn.In other embodiments, backlight may include three or more LED light, three with
Upper LED light is evenly distributed on the lower section of the first transparent substrates 311, is also adopted figure in turn.
In other embodiments, when the vertical view figure of optical fingerprint sensor is regular polygon, in order to enable multiple LED light
It is evenly distributed on the lower section of the first transparent substrates 311, in overlook direction, corresponding multiple LED light can be made to refer to optics
The vertical view centre of figure of line sensor is symmetric points, is centrosymmetric or axisymmetric mode, and optical finger print is evenly distributed on
Sensor perimeter.When being uniformly distributed, spacing between adjacent LED lamp can be made equal.
In the present embodiment, light side is gone out by control LED light 320, LED light 330 and other two LED light not shown
To with light-emitting angle range so that light (as shown by the arrow in Figure 4) only first can enter the from the side of the second transparent substrates
Two transparent substrates (such as the light for issuing backlight only irradiates the sides of the second transparent substrates), enter back into the first light transmission base
Plate.
The structure and advantage of optical fingerprint sensor mould group provided by more the present embodiment can refer to previous embodiment
Corresponding contents.
Third embodiment of the invention provides another optical fingerprint sensor mould group, please refers to Fig. 5.Fig. 5 is the optics
The diagrammatic cross-section of fingerprint sensor mould group.The optical fingerprint sensor mould group includes the first transparent substrates 400, the second light transmission
Substrate 412, backlight 420 and fingerprint sensing layer 411.Second transparent substrates 412 are located at 400 lower section of the first transparent substrates.Backlight
Source 420 also is located at 400 lower section of the first transparent substrates.Backlight 420 is located at the side of the second transparent substrates 412.Fingerprint sensing layer
411 are located at 412 lower surface of the second transparent substrates.
In the present embodiment, the second transparent substrates 412 and fingerprint sensing layer 411 form optical fingerprint sensor 410, i.e., with the
One embodiment is identical, and the first transparent substrates 400 are not belonging to a part of optical fingerprint sensor 410.
In the present embodiment, the second transparent substrates 412, which are used to receive the side that backlight 420 emits beam, has light antireflection layer
430, the light that light antireflection layer 430 can increase backlight 420 enters the ratio of the second transparent substrates 412, to be conducive to
To the fingerprint image being more clear, the performance of the optical fingerprint sensor mould group is improved.
The structure and advantage of optical fingerprint sensor mould group provided by more the present embodiment can refer to previous embodiment
Corresponding contents.
Fourth embodiment of the invention provides another optical fingerprint sensor mould group, please refers to Fig. 6.Fig. 6 is the optics
The diagrammatic cross-section of fingerprint sensor mould group.The optical fingerprint sensor mould group includes the first transparent substrates 500, the second light transmission
Substrate 512, backlight 520 and fingerprint sensing layer 511.Second transparent substrates 512 are located at 500 lower section of the first transparent substrates.Backlight
Source 520 also is located at 500 lower section of the first transparent substrates.Backlight 520 is located at the side of the second transparent substrates 512.Fingerprint sensing layer
511 are located at 512 lower surface of the second transparent substrates.
In the present embodiment, the second transparent substrates 512 and fingerprint sensing layer 511 form optical fingerprint sensor 510, i.e., with the
One embodiment is identical, and the first transparent substrates 500 are not belonging to a part of optical fingerprint sensor 510.
In the present embodiment, there is collector lens 530 before the light-emitting surface of backlight 520, collector lens 530 can make backlight
The light in source 520 is converted to directional light or nearly directional light (the nearly directional light refers to angle difference between light less than 10 degree),
The light of backlight 520 is introduced into collector lens 530, enters back into the second transparent substrates 512.I.e. increase collector lens 530, make into
Penetrating light is parallel or close directional light, to solve the problems, such as that fingerprint image distorts.
The structure and advantage of optical fingerprint sensor mould group provided by more the present embodiment can refer to previous embodiment
Corresponding contents.
Fifth embodiment of the invention provides another optical fingerprint sensor mould group, please refers to Fig. 7.Fig. 7 is the optics
The diagrammatic cross-section of fingerprint sensor mould group.The optical fingerprint sensor mould group includes the first transparent substrates 600, the second light transmission
Substrate 612, backlight 620 and fingerprint sensing layer 611.Second transparent substrates 612 are located at 600 lower section of the first transparent substrates.Backlight
Source 620 also is located at 600 lower section of the first transparent substrates.Backlight 620 is located at the side of the second transparent substrates 612.Fingerprint sensing layer
611 are located at 612 lower surface of the second transparent substrates.
In the present embodiment, the second transparent substrates 612 and fingerprint sensing layer 611 form optical fingerprint sensor 610, i.e., with the
One embodiment is identical, and the first transparent substrates 600 are not belonging to a part of optical fingerprint sensor 610.
In the present embodiment, it is that caustic surface (is not marked that the second transparent substrates 612, which are used to receive the side that backlight emits beam,
Note), the light that backlight issues is converted to directional light or nearly directional light by caustic surface, to improve fingerprint imaging quality.
In the present embodiment, the caustic surface is ellipsoid crown.In other embodiments, caustic surface may be inclined-plane, spherical crown
Face, ellipsoid crown, conical side surface or pyramid side.
It should be noted that caustic surface can have light antireflection layer (please referring to 3rd embodiment), institute in other embodiments
The light of backlight 620 can be increased into the ratio of the second transparent substrates 612 by stating light antireflection layer, to increase fingerprint image letter
Number value.
The structure and advantage of optical fingerprint sensor mould group provided by more the present embodiment can refer to previous embodiment
Corresponding contents.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (11)
1. a kind of optical fingerprint sensor mould group, comprising:
First transparent substrates；
Second transparent substrates are located at below first transparent substrates；
Backlight is located at below first transparent substrates；
It is characterized in that,
The backlight is located at the side of second transparent substrates；
The optical fingerprint sensor mould group further includes optical fingerprint sensor, and the optical fingerprint sensor includes described second
Transparent substrates and fingerprint sensing layer, the fingerprint sensing layer are located at second transparent substrates lower surface, and the optical finger print passes
Sensor is the imaging sensor made based on glass substrate, and the material of second transparent substrates is glass.
2. optical fingerprint sensor mould group as described in claim 1, which is characterized in that the light that the backlight issues is from institute
The side for stating the second transparent substrates enters second transparent substrates, then enters first light transmission from second transparent substrates
Substrate, and part occurs in first transparent substrates upper surface and reflects, reflection light penetrates weight after first transparent substrates
Second transparent substrates are newly backed into, then enter the fingerprint sensing layer from second transparent substrates.
3. optical fingerprint sensor mould group as claimed in claim 2, which is characterized in that the side of second transparent substrates with
The angle of second transparent substrates upper surface is on-right angle.
4. optical fingerprint sensor mould group as claimed in claim 3, which is characterized in that first transparent substrates are single layer knot
Structure or multilayered structure；First transparent substrates lower surface has light shield layer, and the light shield layer is for preventing the backlight
The light of sending advances into first transparent substrates do not enter second transparent substrates.
5. optical fingerprint sensor mould group as claimed in claim 4, which is characterized in that when first transparent substrates are single layer
When structure, first transparent substrates upper surface, first transparent substrates lower surface, second transparent substrates upper surface and
At least one of which surface of second transparent substrates lower surface has filter layer；When first transparent substrates are multilayer knot
When structure, first transparent substrates include multiple submount, the submount upper surface, the submount lower surface, described the
At least one of which surface of two transparent substrates upper surfaces and second transparent substrates lower surface has filter layer.
6. the optical fingerprint sensor mould group as described in claim 1-5 any one, which is characterized in that the backlight goes out
There is collector lens, the collector lens can make the light of the backlight be converted to directional light or close parallel before smooth surface
Light, the light of the backlight first pass through the collector lens, then reach the side of second transparent substrates.
7. the optical fingerprint sensor mould group as described in claim 1-5 any one, which is characterized in that the second light transmission base
Plate, which is used to receive the side that backlight emits beam, has light antireflection layer, and the smooth antireflection layer can increase the light of the backlight
Line enters the ratio of second transparent substrates.
8. the optical fingerprint sensor mould group as described in claim 1-5 any one, which is characterized in that the second light transmission base
It is caustic surface that plate, which is used to receive the side that backlight emits beam, and the caustic surface is converted to the light that the backlight issues
Directional light or nearly directional light.
9. optical fingerprint sensor mould group as claimed in claim 8, which is characterized in that the caustic surface be inclined-plane, spherical crown surface,
Ellipsoid crown, conical side surface or pyramid side.
10. optical fingerprint sensor mould group as claimed in claim 8, which is characterized in that the caustic surface has light antireflection layer,
The light that the smooth antireflection layer can increase the backlight enters the ratio of the light transmission medium.
11. the optical fingerprint sensor mould group as described in claim 1-5 any one, which is characterized in that the backlight packet
More than two LED light are included, described two above LED light are evenly distributed, and the light of the LED light is black light, purple
Light, blue light, green light, sodium yellow, red light, near infrared light or white light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610637766.XA CN106022325B (en) | 2016-08-05 | 2016-08-05 | Optical fingerprint sensor mould group |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610637766.XA CN106022325B (en) | 2016-08-05 | 2016-08-05 | Optical fingerprint sensor mould group |
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| Publication Number | Publication Date |
|---|---|
| CN106022325A CN106022325A (en) | 2016-10-12 |
| CN106022325B true CN106022325B (en) | 2019-08-09 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610637766.XA Active CN106022325B (en) | 2016-08-05 | 2016-08-05 | Optical fingerprint sensor mould group |
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| CN106203408A (en) * | 2016-08-31 | 2016-12-07 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| CN108021845A (en) * | 2016-10-31 | 2018-05-11 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
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| CN106022325A (en) | 2016-10-12 |
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