CN106009529A - Modified epoxy resin for heat-resistant and easy-to-impregnate circuit board - Google Patents
Modified epoxy resin for heat-resistant and easy-to-impregnate circuit board Download PDFInfo
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- CN106009529A CN106009529A CN201610463528.1A CN201610463528A CN106009529A CN 106009529 A CN106009529 A CN 106009529A CN 201610463528 A CN201610463528 A CN 201610463528A CN 106009529 A CN106009529 A CN 106009529A
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- modified
- epoxy resin
- heat
- bisphenol
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 38
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 38
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 28
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims abstract description 27
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 26
- -1 1-cyanoethyl Chemical group 0.000 claims abstract description 25
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims abstract description 24
- 235000010469 Glycine max Nutrition 0.000 claims abstract description 22
- 244000068988 Glycine max Species 0.000 claims abstract description 22
- 239000000853 adhesive Substances 0.000 claims abstract description 22
- 230000001070 adhesive effect Effects 0.000 claims abstract description 22
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052582 BN Inorganic materials 0.000 claims abstract description 13
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000004642 Polyimide Substances 0.000 claims abstract description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 13
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims abstract description 13
- 150000002460 imidazoles Chemical class 0.000 claims abstract description 13
- 229920001721 polyimide Polymers 0.000 claims abstract description 13
- 150000003512 tertiary amines Chemical class 0.000 claims abstract description 13
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229920006231 aramid fiber Polymers 0.000 claims abstract description 12
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 10
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims abstract description 9
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical class O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims abstract description 4
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims abstract 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims abstract 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract 2
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 36
- 239000004593 Epoxy Substances 0.000 claims description 25
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 23
- 238000005470 impregnation Methods 0.000 claims description 20
- 229940106691 bisphenol a Drugs 0.000 claims description 13
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 claims description 12
- 239000004305 biphenyl Substances 0.000 claims description 12
- 235000012241 calcium silicate Nutrition 0.000 claims description 12
- 229950000845 politef Drugs 0.000 claims description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 9
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 claims description 9
- 241001597008 Nomeidae Species 0.000 claims description 4
- HSRJKNPTNIJEKV-UHFFFAOYSA-N Guaifenesin Chemical compound COC1=CC=CC=C1OCC(O)CO HSRJKNPTNIJEKV-UHFFFAOYSA-N 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 229940058401 polytetrafluoroethylene Drugs 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- 229930185605 Bisphenol Natural products 0.000 abstract description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 2
- CUGZWHZWSVUSBE-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)ethanol Chemical compound OCCOCC1CO1 CUGZWHZWSVUSBE-UHFFFAOYSA-N 0.000 abstract 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical class C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 abstract 1
- 239000005062 Polybutadiene Substances 0.000 abstract 1
- 239000004760 aramid Substances 0.000 abstract 1
- 229910052918 calcium silicate Inorganic materials 0.000 abstract 1
- 239000000378 calcium silicate Substances 0.000 abstract 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 abstract 1
- 229920002857 polybutadiene Polymers 0.000 abstract 1
- 238000003756 stirring Methods 0.000 description 15
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 10
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 150000003440 styrenes Chemical class 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 108010073771 Soybean Proteins Proteins 0.000 description 5
- 150000008064 anhydrides Chemical class 0.000 description 5
- 239000003995 emulsifying agent Substances 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 5
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 5
- 235000010265 sodium sulphite Nutrition 0.000 description 5
- 235000019710 soybean protein Nutrition 0.000 description 5
- 229910021529 ammonia Inorganic materials 0.000 description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 150000001450 anions Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical group ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- VGGRCVDNFAQIKO-UHFFFAOYSA-N formic anhydride Chemical group O=COC=O VGGRCVDNFAQIKO-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 235000019394 potassium persulphate Nutrition 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses modified epoxy resin for a heat-resistant and easy-to-impregnate circuit board. The modified epoxy resin is prepared from raw materials in parts by weight as follows: 12-25 parts of bisphenol AD epoxy resin, 5-15 parts of bisphenol S epoxy resin, 5-15 parts of resorcinol epoxy resin, 20-30 parts of diglycidyl biphenol ether, 15-30 parts of a modified soybean adhesive, 5-12 parts of a 4,4'-methylenebis(phenyl isocyanate) derivative, 0.2-0.6 parts of phthalic anhydride, 0.5-1.2 parts of 1-cyanoethyl substituted imidazole, 0.4-1 part of polybutadiene modified maleic anhydride, 0.4-1.2 parts of methylhexahydrophthalic anhydride, 1-2 parts of tertiary amine, 5-15 parts of polyimide, 5-15 parts of aramid fibers, 10-30 parts of polytetrafluoroethylene, 10-20 parts of calcium silicate, 5-15 parts of beryllium oxide, 5-12 parts of boron nitride, 10-20 parts of crystal silicon micro-powder, 5-10 parts of brominated styrene, 5-15 parts of antimony trioxide and 30-50 parts of ethylene glycol glycidyl ether. The modified epoxy resin is low in viscosity, easy to impregnate, good in mechanical property and excellent in heat resistance.
Description
Technical field
The present invention relates to composition epoxy resin technical field, particularly relate to a kind of heat-resisting easy impregnation wiring board and use
Modified epoxy.
Background technology
Along with electric the whole world fast development, electronic and electrical equipment garbage and electric in have
The harm of poisonous substance confrontation environment is increasingly severe, and in the face of the pressure of protection environment, wiring board material is processed
Journey needs in the face of more harsh reliability test, and along with the development of electronic information technology, electronic devices and components are short
Little frivolous trend requires that the circuit of printed wiring board is finer, wiring density is higher, and the thing followed is then wanted
Board substrate is asked to have more excellent mechanical property and heat resistance.
Summary of the invention
The technical problem existed based on background technology, the present invention proposes a kind of heat-resisting easy impregnation wiring board with changing
Property epoxy resin, viscosity is low, is easily impregnated with, and mechanical property is good, Good Heat-resistance.
The heat-resisting easy impregnation wiring board modified epoxy of one that the present invention proposes, its raw material wraps by weight
Include: bisphenol-A D-ring epoxy resins 12-25 part, bisphenol-s epoxy resin 5-15 part, resorcinol epoxy
Resin 5-15 part, '-biphenyl diphenol diglycidyl ether 20-30 part, modified soybean adhesive 15-30 part, 4,4'-
Methylene two (phenyl isocyanate) derivant 5-12 part, phthalic anhydride 0.2-0.6 part, 1-cyanoethyl
Substituted imidazole 0.5-1.2 part, polybutadiene-modified maleic anhydride 0.4-1 part, methylhexahydrophthaacid acid
Acid anhydride 0.4-1.2 part, tertiary amine 1-2 part, polyimides 5-15 part, aramid fiber 5-15 part, politef 10-30
Part, calcium silicates 10-20 part, beryllium oxide 5-15 part, boron nitride 5-12 part, silicon metal micropowder 10-20 part,
Brominated styrene 5-10 part, antimony trioxide 5-15 part, diglycidyl ether of ethylene glycol 30-50 part.
Preferably, modified soybean adhesive uses following technique to prepare: by weight by cloudy for 0.5-1.5 part from
Sub-emulsifying agent, 0.5-1.5 part initiator potassium persulfate, 40-80 part deionized water mix homogeneously, add 5-15
Part soybean protein, 1.5-2.5 part modified with reduction agent sodium sulfite, stirred under nitrogen atmosphere, add ammonia regulation
System pH continues stirring to 9-9.6, adds 0.5-1.5 part styrene, 1-2 part butyl acrylate room temperature
Stir, heat up and continue stirring, be cooled to room temperature, obtain modified soybean adhesive.
Preferably, bisphenol-A D-ring epoxy resins, bisphenol-s epoxy resin, resorcinol type epoxy, connection
The weight ratio of resorcinol diglycidyl ether is 15-22:8-12:10-13:22-25.
Preferably, phthalic anhydride, 1-cyanoethyl substituted imidazole, polybutadiene-modified maleic anhydride, first
Base hexahydrophthalic anhydride, the weight ratio of tertiary amine are 0.3-0.5:0.8-1:0.5-0.7:0.6-1:
1.2-1.5。
Preferably, polyimides, aramid fiber, politef, calcium silicates, beryllium oxide, boron nitride, crystallization
The weight ratio of silicon powder is 6-10:8-12:20-25:14-17:11-13:6-10:15-17.
Preferably, modified soybean adhesive, the weight ratio of diglycidyl ether of ethylene glycol are 22-25:40-45.
Preferably, brominated styrene, the weight ratio of antimony trioxide are 6-10:11-13.
Preferably, described heat-resisting easy impregnation wiring board modified epoxy, its raw material includes by weight:
Bisphenol-A D-ring epoxy resins 15-22 part, bisphenol-s epoxy resin 8-12 part, resorcinol type epoxy
10-13 part, '-biphenyl diphenol diglycidyl ether 22-25 part, modified soybean adhesive 22-25 part, 4,4'-
Methylene two (phenyl isocyanate) derivant 6-10 part, phthalic anhydride 0.3-0.5 part, 1-cyanoethyl
Substituted imidazole 0.8-1 part, polybutadiene-modified maleic anhydride 0.5-0.7 part, methylhexahydrophthaacid acid
Acid anhydride 0.6-1 part, tertiary amine 1.2-1.5 part, polyimides 6-10 part, aramid fiber 8-12 part, politef
20-25 part, calcium silicates 14-17 part, beryllium oxide 11-13 part, boron nitride 6-10 part, silicon metal micropowder 15-17
Part, brominated styrene 6-10 part, antimony trioxide 11-13 part, diglycidyl ether of ethylene glycol 40-45 part.
Viscosity of the present invention impregnation low, easy, reactive good, the circuit board good reliability manufactured with it, processing
Property and Good Heat-resistance, bisphenol-A D-ring epoxy resins, bisphenol-s epoxy resin, resorcinol asphalt mixtures modified by epoxy resin
Fat, '-biphenyl diphenol diglycidyl ether coordinate the compatibility fabulous, with tertiary amine as accelerator, and through adjacent benzene two
Formic anhydride, 1-cyanoethyl substituted imidazole, polybutadiene-modified maleic anhydride, methylhexahydrophthalic anhydride
After collaborative solidification, glass transition temperature is high, and thermostability is fabulous, and after solidification, crosslink density is moderate, is ensureing firmly
On the premise of degree meets demand, good toughness, excellent in mechanical performance, goods have the thermostability of excellence and resistance to leaching
Weldering property, with diglycidyl ether of ethylene glycol, modified soybean adhesive mating reaction, not only viscosity is low, and mixing
Uniformity is good, and effect of impregnation is good, can be effectively improved system toughness, and polyimides, aramid fiber, polytetrafluoroethyl-ne
Alkene, calcium silicates, beryllium oxide, boron nitride, the dispersion wherein of silicon metal micropowder are the most excellent with effect of impregnation
Different, can effectively reduce the thermal coefficient of expansion of system, improve the through hole reliability of system, thermostability of the present invention,
Humidity resistance is good, good-toughness, and working (machining) efficiency is high；In modified soybean adhesive, due to soybean protein viscosity
Higher, through sodium sulfite treatment, disulfide bonds, strand produces a large amount of active group, with benzene second
Alkene, butyl acrylate anion emulsifier, potassium peroxydisulfate effect under, there is polyreaction and with raw
Becoming partially grafted polymer, goods are ensureing to bond under moderate premise, with bisphenol-A D-ring epoxy resins, bis-phenol
S type epoxy resin, resorcinol type epoxy, '-biphenyl diphenol diglycidyl ether mixing uniformity are fabulous, tough
Property further enhances, and is easily impregnated with, and heat stability is fabulous, low cost, and environmental pollution is little.
Detailed description of the invention
Below, by specific embodiment, technical scheme is described in detail.
Embodiment 1
A kind of heat-resisting easy impregnation wiring board modified epoxy, its raw material includes by weight: bisphenol-A D type
Epoxy resin 12 parts, bisphenol-s epoxy resin 15 parts, resorcinol type epoxy 5 parts, '-biphenyl diphenol
Diglycidyl ether 30 parts, modified soybean adhesive 15 parts, 4,4'-methylene two (phenyl isocyanate) spread out
Biological 12 parts, phthalic anhydride 0.2 part, 1-cyanoethyl substituted imidazole 1.2 parts, polybutadiene-modified horse
Come 0.4 part of anhydride, methylhexahydrophthalic anhydride 1.2 parts, tertiary amine 1 part, polyimides 15 parts, virtue
5 parts of synthetic fibre, politef 30 parts, calcium silicates 10 parts, beryllium oxide 15 parts, boron nitride 5 parts, silicon metal
Micropowder 20 parts, brominated styrene 5 parts, antimony trioxide 15 parts, diglycidyl ether of ethylene glycol 30 parts.
Embodiment 2
A kind of heat-resisting easy impregnation wiring board modified epoxy, its raw material includes by weight: bisphenol-A D type
Epoxy resin 25 parts, bisphenol-s epoxy resin 5 parts, resorcinol type epoxy 15 parts, '-biphenyl diphenol
Diglycidyl ether 20 parts, modified soybean adhesive 30 parts, 4,4'-methylene two (phenyl isocyanate) spread out
Biological 5 parts, phthalic anhydride 0.6 part, 1-cyanoethyl substituted imidazole 0.5 part, polybutadiene-modified horse
Come 1 part of anhydride, methylhexahydrophthalic anhydride 0.4 part, tertiary amine 2 parts, polyimides 5 parts, aramid fiber
15 parts, politef 10 parts, calcium silicates 20 parts, beryllium oxide 5 parts, boron nitride 12 parts, silicon metal is micro-
10 parts of powder, brominated styrene 10 parts, antimony trioxide 5 parts, diglycidyl ether of ethylene glycol 50 parts.
Embodiment 3
A kind of heat-resisting easy impregnation wiring board modified epoxy, its raw material includes by weight: bisphenol-A D type
Epoxy resin 15 parts, bisphenol-s epoxy resin 12 parts, resorcinol type epoxy 10 parts, '-biphenyl diphenol
Diglycidyl ether 25 parts, modified soybean adhesive 22 parts, 4,4'-methylene two (phenyl isocyanate) spread out
Biological 10 parts, phthalic anhydride 0.3 part, 1-cyanoethyl substituted imidazole 1 part, polybutadiene-modified Malaysia
0.5 part of anhydride, methylhexahydrophthalic anhydride 1 part, tertiary amine 1.2 parts, polyimides 10 parts, aramid fiber
8 parts, politef 25 parts, calcium silicates 14 parts, beryllium oxide 13 parts, boron nitride 6 parts, silicon metal is micro-
17 parts of powder, brominated styrene 6 parts, antimony trioxide 13 parts, diglycidyl ether of ethylene glycol 40 parts.
Modified soybean adhesive use following technique prepare: by weight by 1.5 parts of anion emulsifiers, 0.5
Part initiator potassium persulfate, 80 parts of deionized water mix homogeneously, add 5 portions of soybean proteins, 2.5 parts of reduction
Modifying agent sodium sulfite, stirred under nitrogen atmosphere 10min, add ammonia regulation system pH value and continue to 9.6
Stirring 20min, adds 1.5 parts of styrene, 1 part of butyl acrylate stirring room temperature stirs, liter high-temperature
Continue stirring 20min to 70 DEG C, be cooled to room temperature, obtain modified soybean adhesive.
Embodiment 4
A kind of heat-resisting easy impregnation wiring board modified epoxy, its raw material includes by weight: bisphenol-A D type
Epoxy resin 22 parts, bisphenol-s epoxy resin 8 parts, resorcinol type epoxy 13 parts, '-biphenyl diphenol
Diglycidyl ether 22 parts, modified soybean adhesive 25 parts, 4,4'-methylene two (phenyl isocyanate) spread out
Biological 6 parts, phthalic anhydride 0.5 part, 1-cyanoethyl substituted imidazole 0.8 part, polybutadiene-modified horse
Carry out 0.7 part of anhydride, methylhexahydrophthalic anhydride 0.6 part, tertiary amine 1.5 parts, polyimides 6 parts,
Aramid fiber 12 parts, politef 20 parts, calcium silicates 17 parts, beryllium oxide 11 parts, boron nitride 10 parts, knot
Crystal silicon micropowder 15 parts, brominated styrene 10 parts, antimony trioxide 11 parts, diglycidyl ether of ethylene glycol 45 parts.
Modified soybean adhesive use following technique prepare: by weight by 0.5 part of anion emulsifier, 1.5
Part initiator potassium persulfate, 40 parts of deionized water mix homogeneously, add 15 portions of soybean proteins, 1.5 parts of reduction
Modifying agent sodium sulfite, stirred under nitrogen atmosphere 20min, add ammonia regulation system pH value and continue to stir to 9
Mix 40min, add 0.5 part of styrene, 2 parts of butyl acrylate stirring room temperatures stir, and rise high-temperature extremely
60 DEG C are continued stirring 40min, are cooled to room temperature, obtain modified soybean adhesive.
Embodiment 5
A kind of heat-resisting easy impregnation wiring board modified epoxy, its raw material includes by weight: bisphenol-A D type
Epoxy resin 18 parts, bisphenol-s epoxy resin 10 parts, resorcinol type epoxy 12 parts, '-biphenyl diphenol
Diglycidyl ether 23 parts, modified soybean adhesive 23 parts, 4,4'-methylene two (phenyl isocyanate) spread out
Biological 8 parts, phthalic anhydride 0.42 part, 1-cyanoethyl substituted imidazole 0.9 part, polybutadiene-modified horse
Carry out 0.6 part of anhydride, methylhexahydrophthalic anhydride 0.8 part, tertiary amine 1.35 parts, polyimides 8 parts,
Aramid fiber 10 parts, politef 23 parts, calcium silicates 16 parts, beryllium oxide 12 parts, boron nitride 9 parts, knot
Crystal silicon micropowder 16 parts, brominated styrene 8 parts, antimony trioxide 12 parts, diglycidyl ether of ethylene glycol 43 parts.
Modified soybean adhesive use following technique prepare: by weight by 1.4 parts of anion emulsifiers, 1.2
Part initiator potassium persulfate, 60 parts of deionized water mix homogeneously, adds 12 portions of soybean proteins, 1.85 parts and also
Former modifying agent sodium sulfite, stirred under nitrogen atmosphere 16min, add ammonia regulation system pH value and continue to 9.4
Continuous stirring 32min, adds 1.2 parts of styrene, 1.5 parts of butyl acrylate stirring room temperatures stir, rising
Temperature continues stirring 32min to 66 DEG C, is cooled to room temperature, obtains modified soybean adhesive.
The above, the only present invention preferably detailed description of the invention, but protection scope of the present invention not office
Being limited to this, any those familiar with the art is in the technical scope that the invention discloses, according to this
The technical scheme of invention and inventive concept thereof in addition equivalent or change, all should contain the protection in the present invention
Within the scope of.
Claims (7)
1. a heat-resisting easy impregnation wiring board modified epoxy, it is characterised in that its raw material is by weight
Including: bisphenol-A D-ring epoxy resins 12-25 part, bisphenol-s epoxy resin 5-15 part, resorcinol ring
Epoxy resins 5-15 part, '-biphenyl diphenol diglycidyl ether 20-30 part, modified soybean adhesive 15-30 part,
4,4'-methylene two (phenyl isocyanate) derivant 5-12 parts, phthalic anhydride 0.2-0.6 part, 1-
Cyanoethyl substituted imidazole 0.5-1.2 part, polybutadiene-modified maleic anhydride 0.4-1 part, methyl hexahydro neighbour's benzene
Dicarboxylic acid anhydride 0.4-1.2 part, tertiary amine 1-2 part, polyimides 5-15 part, aramid fiber 5-15 part, polytetrafluoro
Ethylene 10-30 part, calcium silicates 10-20 part, beryllium oxide 5-15 part, boron nitride 5-12 part, silicon metal is micro-
Powder 10-20 part, brominated styrene 5-10 part, antimony trioxide 5-15 part, diglycidyl ether of ethylene glycol 30-50
Part.
Heat-resisting easy impregnation wiring board modified epoxy the most according to claim 1, it is characterised in that
Bisphenol-A D-ring epoxy resins, bisphenol-s epoxy resin, resorcinol type epoxy, '-biphenyl diphenol two shrink
The weight ratio of glycerin ether is 15-22:8-12:10-13:22-25.
3. according to the heat-resisting easy impregnation wiring board modified epoxy described in any one of claim 1-3, its
It is characterised by, phthalic anhydride, 1-cyanoethyl substituted imidazole, polybutadiene-modified maleic anhydride, methyl
Hexahydrophthalic anhydride, the weight ratio of tertiary amine are 0.3-0.5:0.8-1:0.5-0.7:0.6-1:1.2-1.5.
4. according to the heat-resisting easy impregnation wiring board modified epoxy described in any one of claim 1-3, its
It is characterised by, polyimides, aramid fiber, politef, calcium silicates, beryllium oxide, boron nitride, silicon metal
The weight ratio of micropowder is 6-10:8-12:20-25:14-17:11-13:6-10:15-17.
5. according to the heat-resisting easy impregnation wiring board modified epoxy described in any one of claim 1-4, its
Being characterised by, modified soybean adhesive, the weight ratio of diglycidyl ether of ethylene glycol are 22-25:40-45.
6. according to the heat-resisting easy impregnation wiring board modified epoxy described in any one of claim 1-5, its
Being characterised by, brominated styrene, the weight ratio of antimony trioxide are 6-10:11-13.
7. according to the heat-resisting easy impregnation wiring board modified epoxy described in any one of claim 1-6, its
Being characterised by, its raw material includes by weight: bisphenol-A D-ring epoxy resins 15-22 part, bisphenol S type epoxy
Resin 8-12 part, resorcinol type epoxy 10-13 part, '-biphenyl diphenol diglycidyl ether 22-25 part,
Modified soybean adhesive 22-25 part, 4,4'-methylene two (phenyl isocyanate) derivant 6-10 parts are adjacent
Phthalate anhydride 0.3-0.5 part, 1-cyanoethyl substituted imidazole 0.8-1 part, polybutadiene-modified maleic anhydride
0.5-0.7 part, methylhexahydrophthalic anhydride 0.6-1 part, tertiary amine 1.2-1.5 part, polyimides 6-10
Part, aramid fiber 8-12 part, politef 20-25 part, calcium silicates 14-17 part, beryllium oxide 11-13 part,
Boron nitride 6-10 part, silicon metal micropowder 15-17 part, brominated styrene 6-10 part, antimony trioxide 11-13
Part, diglycidyl ether of ethylene glycol 40-45 part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610463528.1A CN106009529A (en) | 2016-06-23 | 2016-06-23 | Modified epoxy resin for heat-resistant and easy-to-impregnate circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610463528.1A CN106009529A (en) | 2016-06-23 | 2016-06-23 | Modified epoxy resin for heat-resistant and easy-to-impregnate circuit board |
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| CN106009529A true CN106009529A (en) | 2016-10-12 |
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|---|---|---|---|
| CN201610463528.1A Pending CN106009529A (en) | 2016-06-23 | 2016-06-23 | Modified epoxy resin for heat-resistant and easy-to-impregnate circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108219379A (en) * | 2018-02-06 | 2018-06-29 | 合肥东恒锐电子科技有限公司 | A kind of integrated circuit plate modified epoxy and preparation method thereof |
| CN114479347A (en) * | 2020-10-27 | 2022-05-13 | 合肥杰事杰新材料股份有限公司 | Modified epoxy resin composition and preparation method thereof |
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| CN101910238A (en) * | 2008-01-08 | 2010-12-08 | 陶氏环球技术公司 | Be used for the high Tg epoxy systems that matrix material is used |
| CN101928444A (en) * | 2010-08-20 | 2010-12-29 | 广东生益科技股份有限公司 | Halogen-free thermosetting resin composition, prepreg prepared from halogen-free thermosetting resin composition and metal foil-clad laminated board |
| CN104610909A (en) * | 2015-02-26 | 2015-05-13 | 许丽萍 | Aldehyde-free vegetable protein-based wood adhesive as well as preparation and application methods thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1788053A (en) * | 2003-04-17 | 2006-06-14 | 互应化学工业株式会社 | Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards |
| CN101910238A (en) * | 2008-01-08 | 2010-12-08 | 陶氏环球技术公司 | Be used for the high Tg epoxy systems that matrix material is used |
| CN101928444A (en) * | 2010-08-20 | 2010-12-29 | 广东生益科技股份有限公司 | Halogen-free thermosetting resin composition, prepreg prepared from halogen-free thermosetting resin composition and metal foil-clad laminated board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108219379A (en) * | 2018-02-06 | 2018-06-29 | 合肥东恒锐电子科技有限公司 | A kind of integrated circuit plate modified epoxy and preparation method thereof |
| CN114479347A (en) * | 2020-10-27 | 2022-05-13 | 合肥杰事杰新材料股份有限公司 | Modified epoxy resin composition and preparation method thereof |
| CN114479347B (en) * | 2020-10-27 | 2023-12-12 | 合肥杰事杰新材料股份有限公司 | Modified epoxy resin composition and preparation method thereof |
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Application publication date: 20161012 |