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CN105990161B - 半导体装置的制造方法 - Google Patents

半导体装置的制造方法 Download PDF

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Publication number
CN105990161B
CN105990161B CN201510098282.8A CN201510098282A CN105990161B CN 105990161 B CN105990161 B CN 105990161B CN 201510098282 A CN201510098282 A CN 201510098282A CN 105990161 B CN105990161 B CN 105990161B
Authority
CN
China
Prior art keywords
resin
tray
distance
mounting substrate
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201510098282.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN105990161A (zh
Inventor
黑勇旗
大久保忠宣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Toshiba Memory Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Memory Corp filed Critical Toshiba Memory Corp
Publication of CN105990161A publication Critical patent/CN105990161A/zh
Application granted granted Critical
Publication of CN105990161B publication Critical patent/CN105990161B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H10W72/0198—
    • H10W72/5445—
    • H10W90/754—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
CN201510098282.8A 2014-09-16 2015-03-05 半导体装置的制造方法 Expired - Fee Related CN105990161B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-187679 2014-09-16
JP2014187679A JP6282564B2 (ja) 2014-09-16 2014-09-16 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
CN105990161A CN105990161A (zh) 2016-10-05
CN105990161B true CN105990161B (zh) 2018-09-21

Family

ID=55796194

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510098282.8A Expired - Fee Related CN105990161B (zh) 2014-09-16 2015-03-05 半导体装置的制造方法

Country Status (3)

Country Link
JP (1) JP6282564B2 (ja)
CN (1) CN105990161B (ja)
TW (1) TWI587408B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025032602A (ja) * 2023-08-28 2025-03-12 アピックヤマダ株式会社 圧縮成形装置及び圧縮成形方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1378254A (zh) * 2001-03-27 2002-11-06 冲电气工业株式会社 晶片、密封装置、金属模和浇口及半导体器件的制造方法
JP2005225067A (ja) * 2004-02-13 2005-08-25 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2006256195A (ja) * 2005-03-18 2006-09-28 Towa Corp 電子部品の圧縮成形方法及び樹脂材料
CN101180170A (zh) * 2005-11-04 2008-05-14 东和株式会社 电子器件的树脂封固成形装置
JP4369901B2 (ja) * 2005-06-22 2009-11-25 住友重機械工業株式会社 封止装置
CN103921384A (zh) * 2008-08-08 2014-07-16 东和株式会社 电子部件的压缩成形方法及模具装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5192749B2 (ja) * 2007-08-10 2013-05-08 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法及び装置
JP5086945B2 (ja) * 2008-09-05 2012-11-28 株式会社東芝 半導体装置の製造方法
US8410619B2 (en) * 2008-12-10 2013-04-02 Sumitomo Bakelite Co., Ltd. Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device
JP2014103176A (ja) * 2012-11-16 2014-06-05 Shin Etsu Chem Co Ltd 支持基材付封止材、封止後半導体素子搭載基板、封止後半導体素子形成ウエハ、半導体装置、及び半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1378254A (zh) * 2001-03-27 2002-11-06 冲电气工业株式会社 晶片、密封装置、金属模和浇口及半导体器件的制造方法
JP2005225067A (ja) * 2004-02-13 2005-08-25 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2006256195A (ja) * 2005-03-18 2006-09-28 Towa Corp 電子部品の圧縮成形方法及び樹脂材料
JP4369901B2 (ja) * 2005-06-22 2009-11-25 住友重機械工業株式会社 封止装置
CN101180170A (zh) * 2005-11-04 2008-05-14 东和株式会社 电子器件的树脂封固成形装置
CN103921384A (zh) * 2008-08-08 2014-07-16 东和株式会社 电子部件的压缩成形方法及模具装置

Also Published As

Publication number Publication date
CN105990161A (zh) 2016-10-05
JP6282564B2 (ja) 2018-02-21
JP2016062961A (ja) 2016-04-25
TWI587408B (zh) 2017-06-11
TW201612993A (en) 2016-04-01

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TA01 Transfer of patent application right

Effective date of registration: 20170814

Address after: Tokyo, Japan

Applicant after: TOSHIBA MEMORY Corp.

Address before: Tokyo, Japan

Applicant before: Toshiba Corp.

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Tokyo

Patentee after: Kaixia Co.,Ltd.

Address before: Tokyo

Patentee before: TOSHIBA MEMORY Corp.

Address after: Tokyo

Patentee after: TOSHIBA MEMORY Corp.

Address before: Tokyo

Patentee before: Pangea Co.,Ltd.

CP01 Change in the name or title of a patent holder
TR01 Transfer of patent right

Effective date of registration: 20220129

Address after: Tokyo

Patentee after: Pangea Co.,Ltd.

Address before: Tokyo

Patentee before: TOSHIBA MEMORY Corp.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180921

CF01 Termination of patent right due to non-payment of annual fee