CN105985600A - Sealing sheet and method for producing package - Google Patents
Sealing sheet and method for producing package Download PDFInfo
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- CN105985600A CN105985600A CN201610153248.0A CN201610153248A CN105985600A CN 105985600 A CN105985600 A CN 105985600A CN 201610153248 A CN201610153248 A CN 201610153248A CN 105985600 A CN105985600 A CN 105985600A
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- heat
- curable composition
- acrylic polymer
- inorganic filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/02—Heterophasic composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The present invention provides a sealing sheet that can decrease a warp of a substrate and a method, for producing a package, that can decrease the same warp. The present invention relates to a sealing sheet. The sealing sheet includes a thermosetting composition in a sheet form. The thermosetting composition includes an inorganic filler and residual components. The residual components include an acrylic polymer. The content of the acrylic polymer in the residual components is 65% or more by weight. The content of the inorganic filler in the thermosetting composition is 55% or more by volume. A cured product obtained by curing the thermosetting composition has a storage elastic modulus of 5 * 107 Pa to 5 * 109 Pa at 25 degrees centigrade.
Description
Technical field
The present invention relates to sheet for sealing and packaging body.
Background technology
After known heat cure is 1 × 10 at the tensile modulus of elasticity of 25 DEG C7～1 × 109The sheet of Pa is (referring for example to patent
Document 1).
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2009-91389 publication
Summary of the invention
Invention to solve the technical problem that
As shown in Figure 17, Figure 18, packaging body can be manufactured by the method etc. with following operation, i.e. to having device
Part fixing body 502 and the duplexer 531 of the heat-curable composition 511 of lamellar being configured on device fixing body 502 add
Pressure, forms the Thermocurable combination with substrate 522, the electronic device 523 being installed on substrate 522 and overlay electronic device 523
The operation of the seal 532 of thing 511；The operation etc. that seal 532 is heated.Device fixing body 502 have substrate 522 and
It is installed on the electronic device 523 of substrate 522.
Owing to making heat-curable composition 511 be solidified to form after the operation making heat-curable composition 511 solidify
Solidfied material generation thermal contraction, the most sometimes produce warpage at substrate 522.The warpage of substrate 522 causes conveying bad.
As the technology of the warpage reducing substrate 522, including by improving the inorganic fill in heat-curable composition 511
The content of agent and make the linear expansion coefficient technology close to the linear expansion coefficient of substrate 522 of solidfied material.But, due to by improving
The content of inorganic filler and make the storage elastic modelling quantity of solidfied material increase, the most sometimes produce warpage at substrate 522.
The present invention completes in view of above-mentioned technical problem, its object is to provide the sealing of the warpage that can reduce substrate
With sheet.It addition, the present invention also aims to provide the manufacture method of the packaging body of the warpage that can reduce substrate.
Means for solving the above
The present invention relates to a kind of sheet for sealing.Sheet for sealing possesses heat-curable composition in the form of sheets.Thermocurable group
Compound comprises inorganic filler and remaining composition.Remaining composition comprises acrylic polymer.Acrylic compounds in remaining composition
The content of polymer is more than 65 weight %.The content of the inorganic filler in heat-curable composition is 55 more than volume %.
The solidfied material obtained by making heat-curable composition solidify is 5 × 10 at the storage elastic modelling quantity of 25 DEG C7Pa～5 ×
109Pa。
By making the content of the acrylic polymer in remaining composition be more than 65 weight %, and heat-curable composition
In the content of inorganic filler be 55 more than volume % such that it is able to and realize making what heat-curable composition solidification obtained to consolidate
Compound is 5 × 10 at the storage elastic modelling quantity of 25 DEG C9Below Pa, and the linear expansion coefficient of solidfied material can be made close to substrate
Linear expansion coefficient.Therefore, it is possible to be effectively reduced the warpage of substrate.
The invention still further relates to the manufacture method of packaging body, described manufacture method includes possessing device fixing body and being configured at
The duplexer of the heat-curable composition on device fixing body carries out the operation pressurizeed.Device fixing body possesses substrate and is installed on
The electronic device of substrate.
Accompanying drawing explanation
Fig. 1 is the schematic cross sectional views of the sheet for sealing of embodiment 1.
Fig. 2 is the tem observation image of the section of solidfied material.The part observing image that image is epimere of observing of hypomere is put
Big image.
Fig. 3 is the AFM phase image of the section of solidfied material.In order to represent island structure brightly, to having asphalt mixtures modified by epoxy resin
Fat, phenol resin, acrylic polymer and curing accelerator and do not have filler and pigment heat-curable composition solidification and
The solidfied material obtained is observed.
Fig. 4 is the tem observation image of the section of solidfied material.In order to represent island structure brightly, to having asphalt mixtures modified by epoxy resin
Fat, phenol resin, acrylic polymer and curing accelerator and do not have filler and pigment heat-curable composition solidification and
The solidfied material obtained is observed.
Fig. 5 is the schematic cross sectional views of duplexer etc..
Fig. 6 is the schematic cross sectional views of the operation that duplexer carries out hot pressing.
Fig. 7 is the schematic cross sectional views of structure.
Fig. 8 is the schematic cross sectional views of packaging body.
Fig. 9 is the schematic cross sectional views of SAW filter manufacturing process.
Figure 10 is the schematic cross sectional views of SAW filter manufacturing process.
Figure 11 is the schematic cross sectional views of SAW filter manufacturing process.
Figure 12 is the schematic cross sectional views of SAW filter manufacturing process.
Figure 13 is the schematic cross sectional views of SAW filter manufacturing process.
Figure 14 is the schematic cross sectional views of the sheet for sealing of variation 1.
Figure 15 is the front schematic view of test duplexer.
Figure 16 is the front schematic view of test duplexer.
Figure 17 is the schematic cross sectional views of packaging body manufacturing process.
Figure 18 is the schematic cross sectional views of packaging body manufacturing process.
Symbol description
1 sheet for sealing
2 device fixing bodies
11 heat-curable compositions
12 partitions
13 partitions
22 substrates
23 SAW chip
24 projected electrodes
25 hollow bulbs
26 protection portion
31 duplexers
32 seals
33 structures
34 hollow package bodies
Heating plate on the downside of in the of 41
Heating plate on the upside of in the of 42
302 device fixing bodies
322 substrates
323 electronic devices
326 protection portion
331 duplexers
332 seals
333 structures
334 packaging bodies
Detailed description of the invention
It is exemplified below embodiment the present invention is described in detail, but, the present invention is not merely defined to these
Embodiment.
[embodiment 1]
(sheet for sealing 1)
Sheet for sealing 1 is illustrated.
As it is shown in figure 1, sheet for sealing 1 has heat-curable composition 11 in the form of sheets.Sheet for sealing 1 also has partition
12.Specifically, sheet for sealing 1 possesses partition 12 and the heat-curable composition 11 being configured on partition 12.As partition 12,
Polyethylene terephthalate (PET) film etc. can be enumerated.Partition 12 preferably implemented the partition that the demoulding processes.
Heat-curable composition 11 comprises inorganic filler and remaining composition.
As remaining composition, resinous principle, curing accelerator, pigment etc. can be enumerated.
As resinous principle, acrylic polymer, heat-curing resin etc. can be enumerated.
In heat-curable composition 11, acrylic polymer is preferably made to mix with heat-curing resin.If mixing, then
Do not produce the segregation of the segregation of heat-curing resin, acrylic polymer, therefore can reduce the warpage of substrate.Said
Bright, acrylic polymer and heat-curing resin mix the observation referred to utilizing transmission electron microscope (TEM) to observe
Image is not observed the phase separation structure of acrylic polymer and heat-curing resin.
From the aspect of the favorable dispersibility being readily obtained flexibility and epoxy resin, preferably acrylic polymer.Its
In, more preferably thermoplastic acrylic polymer.
As acrylic polymer, it is not particularly limited, can enumerate that there is carbon number less than 30, especially carbon number 4～18
Straight or branched alkyl acrylic or methacrylic acid ester in the one kind or two or more polymer (third as composition
Olefin(e) acid copolymer) etc..As alkyl, can enumerate such as methyl, ethyl, propyl group, isopropyl, normal-butyl, the tert-butyl group, isobutyl group,
Amyl group, isopentyl, hexyl, heptyl, cyclohexyl, 2-ethylhexyl, octyl group, iso-octyl, nonyl, different nonyl, decyl, isodecyl,
Undecyl, lauryl, tridecyl, myristyl, stearyl, octadecyl or dodecyl etc..
It addition, as other monomers of formation polymer, be not particularly limited, can enumerate such as: acrylic acid, metering system
The various carboxyl group-containing monomers such as acid, carboxy ethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid or .beta.-methylacrylic acid；Horse
Carry out the various anhydride monomers such as anhydride or itaconic anhydride；(methyl) acrylic acid 2-hydroxy methacrylate, (methyl) acrylic acid 2-hydroxy propyl ester,
(methyl) acrylic acid 4-hydroxybutyl, (methyl) acrylic acid own ester of 6-hydroxyl, (methyl) acrylic acid 8-hydroxyl monooctyl ester, (methyl) third
Olefin(e) acid 10-hydroxyl ester in the last of the ten Heavenly stems, (methyl) acrylic acid 12-hydroxylauric ester or acrylic acid (4-Hydroxymethyl-cyclo-hexyl) methyl ester etc. are various
Hydroxyl monomer；Styrene sulfonic acid, allyl sulphonic acid, 2-(methyl) acrylamide-2-methyl propane sulfonic, (methyl) acrylamide
Propane sulfonic acid, (methyl) acrylic acid sulphur propyl ester or (methyl) propane sulfonic acid etc. are various containing sulfonic group monomer；Or 2-hydroxyl
The various phosphorous acid-based monomers such as base ethyl propylene acyl phosphate.Wherein, heat cure is improved from reacting with epoxy resin
From the viewpoint of the viscosity of property compositions 11, preferably comprise carboxyl group-containing monomer, containing glycidyl (epoxy radicals) monomer, hydroxyl
At least one in monomer.
Acrylic polymer preferably has functional group.It is based on being readily formed the reason of island structure, as official
Can base, preferably carboxyl (-COOH), epoxy radicals, hydroxyl, amino, sulfydryl, more preferably carboxyl.
The acid number of acrylic polymer is preferably more than 1mgKOH/g, more preferably more than 3mgKOH/g, the most excellent
Elect more than 10mgKOH/g as.If this acid number is more than 1mgKOH/g, then can reduce local portion, and heat cure can be limited
The flowing of property compositions 11.On the other hand, the acid number of acrylic polymer is preferably below 100mgKOH/g, is more preferably
Below 60mgKOH/g, more preferably below 50mgKOH/g, particularly preferably below 40mgKOH/g.If this acid number is
Below 100mgKOH/g, then can preferably keep the storage stability of heat-curable composition 11.
Being explained, acid number can utilize the neutralization titration of regulation in JIS K 0070-1992 to measure.
The weight average molecular weight of acrylic polymer is preferably more than 400,000, more preferably more than 500,000.If this weight average divides
Son amount is more than 400,000, then the viscosity of acrylic polymer will not be too low, is therefore easily processed.On the other hand, acrylic compounds
The weight average molecular weight of polymer is preferably less than 2,000,000, more preferably less than 1,500,000.If this weight average molecular weight be 2,000,000 with
Under, then the viscosity of acrylic polymer will not be too high, is therefore easily processed.
Be explained, weight average molecular weight be to utilize GPC (gel permeation chromatography) to measure and utilize polystyrene conversion and
Calculated value.
The Tg of acrylic polymer is preferably more than-70 DEG C, more preferably more than-60 DEG C, more preferably-50 DEG C
Above.If this Tg is more than-70 DEG C, then the storage elastic modelling quantity of the heat-curable composition 11 under forming temperature will not mistake
Low, therefore it is easily controlled the flowing of heat-curable composition 11.On the other hand, the Tg of acrylic polymer be preferably 20 DEG C with
Under, more preferably less than 0 DEG C.If this Tg is less than 20 DEG C, then the storage bullet of the heat-curable composition 11 under forming temperature
Property modulus will not be too high, is therefore easily controlled the flowing of heat-curable composition 11.
In this specification, the glass transition temperature of acrylic polymer refers to the theoretical value tried to achieve according to Fox formula.
It addition, as trying to achieve the additive method of glass transition temperature, also include based on utilizing differential scanning calorimetry (DSC)
(DSC) temperature during maximum heat absworption peak measured tries to achieve the method for the glass transition temperature of acrylic polymer.Specifically
For, use differential scanning calorimetry (DSC) " Q-2000 " of company (TA Instruments) to turn with the vitrification than sample to be tested
After sample to be measured is heated 10 minutes by the temperature that temperature (until testing temperature) is high about 50 DEG C, it is cooled to ratio and treats that testing temperature is low by 50
DEG C temperature, carry out pre-treatment, afterwards, heat up with the programming rate of 5 DEG C/min under nitrogen atmosphere, measure heat absorption starting point temperature
Degree, as glass transition temperature.
The content of the acrylic polymer in remaining composition is more than 65 weight %.More than preferably 70 weight %, more
It is preferably more than 75 weight %.On the other hand, the content of the acrylic polymer in remaining composition be preferably 95 weight % with
Under, below more preferably 90 weight %.
As heat-curing resin, it is not particularly limited, preferred epoxy, phenol resin.
As epoxy resin, it is not particularly limited.Such as can use triphenylmethane type epoxy resin, cresol phenol
Aldehyde type epoxy resin, biphenyl type epoxy resin, modified bisphenol A type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy tree
Fat, modified bisphenol F type epoxy resin, dicyclopentadiene-type epoxy resin, phenol novolac type epoxy resin, phenoxy resin
Etc. various epoxy resin.These epoxy resin can be used alone, it is also possible to and use two or more.
From the viewpoint of the reactivity guaranteeing epoxy resin, preferably epoxide equivalent is 150～250, softening point or fusing point
It is 50～130 DEG C, is the epoxy resin of solid-state at room temperature.Wherein, from the viewpoint of reliability, more preferably triphenyl methane type
Epoxy resin, cresol novalac type epoxy resin, biphenyl type epoxy resin.It addition, be based on heat-curable composition
11 give flexible reason, preferably bisphenol f type epoxy resin.
As long as phenol resin occurs the phenol resin of curing reaction between epoxy resin, then it is not particularly limited.Such as may be used
To use phenol linear phenolic resin, phenol aralkyl resin, biphenyl aralkyl resin, dicyclopentadiene-type phenol resin, cresol
Linear phenolic resin, resol etc..These phenol resin can be used alone, it is also possible to and use two or more.
As phenol resin, from the reactivity of epoxy resin from the viewpoint of, be preferably used hydroxyl equivalent be 70～250,
Softening point is the phenol resin of 50～110 DEG C.From the viewpoint of solidification reactivity height, can be suitable for using phenol novolac tree
Fat.It addition, from the viewpoint of reliability, it is also possible to it is suitable for using phenol aralkyl resin, biphenyl aralkyl resin etc
The phenolic resin of agent of low hygroscopicity.
From the viewpoint of solidification reactivity, the mixing ratio of epoxy resin and phenol resin is preferably according to relative to asphalt mixtures modified by epoxy resin
Epoxy radicals 1 equivalent in fat and the mode that makes the total amount of the hydroxyl in phenol resin reach 0.7～1.5 equivalents carry out coordinating, more excellent
Elect 0.9～1.2 equivalents as.
The content of the heat-curing resin in remaining composition be preferably more than 10 weight %, more preferably 15 weight % with
Upper, more preferably more than 17 weight %, more than particularly preferably 20 weight %.On the other hand, the thermosetting in remaining composition
The content of the property changed resin be preferably below below 55 weight %, more preferably 45 weight %, more preferably 30 weight % with
Under, below particularly preferably 25 weight %.
As curing accelerator, as long as the material making the solidification of epoxy resin and phenol resin carry out, then there is no limit especially
Fixed, include, for example 2-methylimidazole (trade name；2MZ), 2-undecyl imidazole (trade name；C11-Z), 2-heptadecyl miaow
Azoles (trade name；C17Z), 1,2-methylimidazole (trade name；1.2DMZ), 2-ethyl-4-methylimidazole (trade name；
2E4MZ), 2-phenylimidazole (trade name；2PZ), 2-phenyl-4-methylimidazole (trade name；2P4MZ), 1-benzyl-2-methyl miaow
Azoles (trade name；1B2MZ), 1-benzyl-2-phenylimidazole (trade name；1B2PZ), 1-cyano ethyl-2-methylimidazole (commodity
Name；2MZ-CN), 1-cyano ethyl-2-undecyl imidazole (trade name；C11Z-CN), 1-cyano ethyl-2-phenylimidazole
Trimellitate (trade name；2PZCNS-PW), 2,4-diaminourea-6-[2 '-methylimidazolyl-(1 ')]-ethyl s-triazine (business
The name of an article；2MZ-A), 2,4-diaminourea-6-[2 '-undecyl imidazole base-(1 ')]-ethyl s-triazine (trade name；C11Z-A)、
2,4-diaminourea-6-[2 '-ethyl-4 '-methylimidazolyl-(1 ')]-ethyl s-triazine (trade name；2E4MZ-A), 2,4-diamino
Base-6-[2 '-methylimidazolyl-(1 ')]-ethyl s-triazine isocyanuric acid adduct (trade name；2MA-OK), 2-phenyl-4,5-
Bishydroxymethyl imidazoles (trade name；2PHZ-PW), 2-phenyl-4-methyl-5-hydroxymethylimidazole (trade name；2P4MHZ-PW)
Deng imidazoles system curing accelerator (being four countries' chemical conversion industry (strain) system).
Wherein, based on solidifying the reason that promotion ability is good, obtain the solidfied material of high Tg, preferably imidazoles system solidification promotes
Agent, more preferably 2-phenyl-4,5-bishydroxymethyl imidazoles, 2,4-diaminourea-6-[2 '-ethyl-4 '-methylimidazolyl-(1 ')]-
Ethyl s-triazine, further preferred 2-phenyl-4,5-bishydroxymethyl imidazoles.
The content of curing accelerator is preferably 0.2 weight portion relative to total amount 100 weight portion of epoxy resin and phenol resin
Above, it is more preferably more than more than 0.5 weight portion, more preferably 0.8 weight portion.The content of curing accelerator is relative to ring
Total amount 100 weight portion of epoxy resins and phenol resin is preferably below below 5 weight portions, more preferably 2 weight portions.
As pigment, it is not particularly limited, white carbon black etc. can be enumerated.
As inorganic filler, such as quartz glass, Talcum, silicon dioxide (fused silica, crystallinity two can be enumerated
Silicon oxide etc.), aluminium oxide, boron nitride, aluminium nitride, carborundum etc..Wherein, it is based on reducing well the reason of thermal coefficient of expansion
By, preferably silicon dioxide.As silicon dioxide, based on the reason that mobility is excellent, preferred molten silicon dioxide, the most spherical
Fused silica.It addition, based on the high reason of thermal conductivity, preferably conducting filler, more preferably aluminium oxide, boron nitride, nitridation
Aluminum.It is explained, as the inorganic filler of inorganic filler, preferably electrical insulating property.
As inorganic filler, it is also possible to and with silicon dioxide, aluminium oxide etc..
The mean diameter of inorganic filler is preferably more than more than 0.5 μm, more preferably 1 μm.If inorganic filler is flat
All particle diameters are more than 0.5 μm, then be readily obtained the flexibility of heat-curable composition 11, flexibility.The mean diameter of filler is preferred
It is below below 30 μm, more preferably 10 μm.If the mean diameter of filler is below 30 μm, then easily filler is carried out height and fill out
Fill.
It is explained, for example, it is possible to by using the sample of arbitrary extracting from overall and using laser diffraction and scattering formula
Particle size distribution device is measured, thus derives mean diameter.
As inorganic filler, the surface that in advance by silane coupler processed is preferably used and processes inorganic filler.By
This, it is possible to increase the inorganic filler wettability to resinous principle, and the dispersibility of inorganic filler can be improved.As nothing
Machine filler, is preferably used surface and processes inorganic filler and the untreated inorganic fill do not anticipated by silane coupler
Agent.
As silane coupler, such as, can be suitable for using the chemical combination with methacryloxy or acryloxy
Thing.Methacryloxy and acryloxy do not react with heat-curing resin.By use, there is methacryloxy
Or the compound of acryloxy is as silane coupler, such that it is able to suppression is reacted with heat-curing resin by silane coupler
Obtained by the rising of MV minium viscosity of heat-curable composition 11.
The compound with methacryloxy or acryloxy the most also has the alkoxyl of carbon number 1～6.As
The alkoxyl of carbon number 1～6, can enumerate methoxyl group, ethyoxyl etc..
As having the compound of methacryloxy or acryloxy, 3-methacryloxypropyl can be enumerated
Methyl dimethoxysilane, 3-methacryloxypropyl trimethoxy silane, 3-methacryloyloxypropyl methyl two
Ethoxysilane, 3-methacryloxypropyl, methacryloxy octyl group trimethoxy silane, first
Base acryloxy octyltri-ethoxysilane etc..Wherein, from the viewpoint of reactivity and cost, preferably 3-methacryl
Epoxide propyl trimethoxy silicane.
In the particle size distribution of inorganic filler, preferably at least there is peak A and peak B.Specifically, preferably in 0.01 μm～
There is peak A and there is peak B in the particle size range of 1 μm～100 μm in the particle size range of 10 μm.Due at the inorganic fill forming peak B
The inorganic filler forming peak A can be filled between agent, therefore inorganic filler can be carried out high filling.
Peak A is more preferably the presence of the particle size range more than 0.1 μm.Peak A is more preferably the presence of the particle size range below 1 μm.
Peak B is more preferably the presence of the particle size range more than 3 μm.Peak B is more preferably the presence of the particle size range below 10 μm.
The peak C etc. in addition to peak A and peak B can be there is in the particle size distribution of inorganic filler.
Being explained, the particle size distribution of inorganic filler can utilize following method to measure.
The assay method of the particle size distribution of inorganic filler
Being thermally cured property compositions 11 is put in crucible, it is applied heat-flash, makes heat-curable composition 11 be ashed.Make institute
The ash obtained is scattered in pure water and carries out 10 minutes ultrasonic Treatment, uses laser diffraction and scattering formula particle size distribution device
(Beckman coulter company system, " LS 13 320 "；Damp process) try to achieve particle size distribution (volume reference).
The content of the inorganic filler in heat-curable composition 11 be 55 more than volume %, more preferably 60 volume % with
Upper, more preferably 70 more than volume %.By improving the content of inorganic filler such that it is able to make the line of solidfied material expand
Coefficient is close to the linear expansion coefficient of substrate.On the other hand, the content of the inorganic filler in heat-curable composition 11 is preferably
85 below volume %, more preferably 80 below volume %.If this content is 85 below volume %, then it is easily formed to lamellar.
The content of inorganic filler can also be that unit illustrates with " weight % ".For typical case, with " weight % "
For unit, the content of silicon dioxide is illustrated.
The proportion of silicon dioxide is usually 2.2g/cm3, therefore the applicable scope of the content (weight %) of silicon dioxide is such as
As shown below.
That is, the content of the silicon dioxide in heat-curable composition 11 is preferably more than 60 weight %, more preferably 70 weights
More than amount more than %, more preferably 80 weight %.On the other hand, the content of the silicon dioxide in heat-curable composition 11
It is preferably below below 90 weight %, more preferably 85 weight %.
The proportion of aluminium oxide is usually 3.9g/cm3, therefore the applicable scope of the content (weight %) of aluminium oxide such as with
Shown in lower.
That is, the content of the aluminium oxide in heat-curable composition 11 is preferably more than 72 weight %, more preferably 80 weights
More than amount more than %, more preferably 87 weight %.On the other hand, the content of the aluminium oxide in heat-curable composition 11 is excellent
Elect below below 95 weight %, more preferably 93 weight % as.
The solidfied material making heat-curable composition 11 solidify and to obtain is 5 × 10 at the storage elastic modelling quantity of 25 DEG C7Pa～5
×109Pa.By making this storage elastic modelling quantity be 5 × 109Below Pa such that it is able to reduction is produced because making solidfied material return to room temperature
Raw stress, and the warpage of substrate can be reduced.It addition, the warpage because being heated at reflux produced substrate can also be reduced.Logical
Crossing and making this storage elastic modelling quantity is 5 × 107More than Pa such that it is able to sealed electronic device well.
Solidfied material is preferably 9 × 10 at the storage elastic modelling quantity of 25 DEG C7More than Pa.On the other hand, solidfied material is at 25 DEG C
Storage elastic modelling quantity is preferably 1 × 109Below Pa, more preferably 5 × 108Below Pa.
Being explained, storage elastic modelling quantity can utilize the method described in embodiment to measure.
The storage elastic modelling quantity of solidfied material can be come by the content etc. of the content of acrylic polymer, inorganic filler
Control.
The glass transition temperature (Tg) of solidfied material is preferably more than 100 DEG C, more preferably more than 120 DEG C.Solidfied material
Tg is preferably less than 200 DEG C, more preferably less than 170 DEG C.
Being explained, Tg can utilize the method described in embodiment to measure.
The Tg of solidfied material can be controlled by crosslink density.Such as can be by using sense radix in the molecule many
Heat-curing resin improves Tg.
Solidfied material the linear expansion coefficient (CTE1) of below Tg be preferably below 20ppm/K, more preferably 17ppm/K with
Under.If this linear expansion coefficient is below 20ppm/K, then can be effectively reduced the warpage of substrate.On the other hand, solidfied material
The lower limit of CTE1 is not particularly limited.Such as, the CTE1 of solidfied material is more than 5ppm/K and 8ppm/K is with first-class.
Being explained, linear expansion coefficient can utilize the method described in embodiment to measure.
The solidfied material making heat-curable composition 11 solidify and to obtain is preferably provided with island structure.
Figure 2 illustrates and solidfied material is utilized transmission electron microscope (TEM) observable observation image.In configuration
In the observation image in the left side of epimere, can confirm that as matrix part (below, also referred to as " extra large on the top observing image
Phase ") saturate part and as the light-colored part of local portion (following, also referred to as " island phase ").It is being configured at epimere
Right side observation image in, observing the top of image it can be identified that to as the saturate part of matrix part and conduct
The light-colored part in local portion.Being explained, circular object is filler.
As in figure 2 it is shown, solidfied material possesses comprises matrix part and the island structure in local portion.Matrix part is more soft than local portion.
Solidfied material possesses the filler being scattered in matrix part.
Being explained, solidfied material such as can be obtained 150 DEG C of heating by being thermally cured property compositions 11 for 1 hour.
The flexibility in matrix part and local portion such as can utilize atomic force microscope (AFM) to know.
In figure 3, light-colored part (part of non-black) is the part that Phase delay is little.The part that Phase delay is little
Adsorptivity low and hard.On the other hand, saturate part is the part that Phase delay is big.The absorption of the part that Phase delay is big
Property is high and soft.
Local portion and the island structure of the matrix part more soft than local portion is comprised, it is thus possible to control owing to being formed
Flowing, and the amount of the heat-curable composition 11 can being lowered in the space between substrate and electronic device.
Matrix part comprises acrylic polymer as main constituent.Local portion comprises heat-curing resin as main constituent.
It is right by the observed result of the AFM to solidfied material and the observed result of transmission electron microscope (TEM) are carried out
According to such that it is able to clear and definite matrix part comprises acrylic polymer as main constituent.And local portion can be specified and comprise thermosetting
The property changed resin is as main constituent.
As reference, figure 4 illustrates the tem observation image of solidfied material used in Fig. 3.Saturate part is low
Luminance area, and for comprise the acrylic polymer part as main constituent.
By adjusting the kind of functional group of acrylic polymer, the content etc. of acrylic polymer, such that it is able to
Obtain being formed the heat-curable composition 11 of the island structure comprising local portion and the matrix part more soft than local portion.
By increasing the content of acrylic polymer, such that it is able to be readily formed the matrix more soft than local portion
Portion.
The maximum particle diameter in local portion is preferably more than more than 0.01 μm, more preferably 0.03 μm, more preferably 0.05 μ
More than m.If the maximum particle diameter in local portion is more than 0.01 μm, then can limit the flowing of heat-curable composition 11.The opposing party
Face, the maximum particle diameter in local portion is preferably below below below 5 μm, more preferably 4 μm, more preferably 3 μm, the most excellent
Elect below below below 1 μm, more preferably 0.8 μm, more preferably 0.5 μm as.If the maximum particle diameter in local portion is 5
Below μm, then can give the effect of thixotropy etc, and the flowing of heat-curable composition 11 can be limited.
The maximum particle diameter in local portion can be controlled by the amount of the functional group of acrylic polymer.Such as, by joining
The acrylic polymer that conjunction official energy base unit weight is many, such that it is able to reduce the maximum particle diameter in local portion.Heat-curing resin and propylene
The maximum particle diameter in the compatibility of acids polymers also local area portion produces impact.But, the functional group's of acrylic polymer
Amount can produce bigger impact.
Being explained, the maximum particle diameter in local portion is at the observation image utilizing transmission electron microscope (TEM) to observe
Distance maximum in the distance between 2 on the profile in middle local portion.The maximum particle diameter in local portion can be by 100 locals
Portion carries out observing obtained measured value and is averaged and calculates.In the presence of the set of multiple local portions or cohesion ground,
Profile continuous print part is processed as a local portion.
The manufacture method of sheet for sealing 1 is not particularly limited, and such as, will be used for being formed the resin of heat-curable composition 11
Deng dissolving, being scattered in, suitable solvent is prepared as varnish, this varnish is coated partition in the way of becoming specific thickness
After forming coated film on 12, coated film is made to be dried under prescribed conditions, such that it is able to obtain sheet for sealing 1.As coating side
Method, is not particularly limited, include, for example roller coat apply, silk screen coating, gravure coating etc..It addition, as drying condition, such as exist
Carry out in the range of baking temperature 70～160 DEG C, drying time 1～30 minutes.It addition, also be adapted for into: different from partition 12
Partition on be coated with varnish and form coated film and make coated film be dried and after forming heat-curable composition 11, at partition 12
The method of upper laminating heat-curable composition 11.As solvent, butanone, ethyl acetate, toluene etc. can be enumerated.
Heat-curable composition 11 is it is also preferred that utilize mixing extrusion to manufacture.Thus, obtain being readily formed into sheet
Shape, space heat-curable composition 11 few, in uniform thickness.The method manufactured as utilizing mixing extrusion to carry out, the most such as
Above-mentioned each composition (such as inorganic filler, acrylic polymer etc.) will be carried out mixing obtained by mixing thing plastic working become
The method of lamellar.By utilizing mixing extrusion to manufacture, such that it is able to inorganic filler to be carried out high filling.
Specifically, by profits such as being thermally cured property resin, curing accelerator, acrylic polymer and inorganic fillers
Carry out melting mixing with the known mixing roll such as mixing roll, adding pressure type kneader, extruder, thus prepare mixing thing, and by institute
The mixing thing plastic working slabbing obtained.As compounding conditions, the upper limit of temperature is preferably less than 140 DEG C, more preferably 130 DEG C
Below.The lower limit of temperature is preferably more than the softening point of above-mentioned each composition, such as more than 30 DEG C, be preferably more than 50 DEG C.Mixed
The time of refining is preferably 1～30 minute.Carry out (under reduced atmosphere) the most at reduced pressure conditions, under reduced pressure it addition, mixing
Pressure be such as 1 × 10-4～0.1kg/cm2。
Mixing thing after melting mixing does not carries out cooling down and directly carrying out plastic working with the condition of high temperature.As plasticity
Processing method, there is no particular restriction, can enumerate flat-plate compressed preparation method, T-shaped mould extrusion molding, screw extrusion, roller rolling process,
The mixing method of roller, inflation extrusion molding, coetrusion, calendaring molding method etc..As plastic working temperature, the most above-mentioned each composition
Softening point more than, if considering the Thermocurable of epoxy resin and formability, the most for example, 40～150 DEG C, be preferably 50～140
DEG C, more preferably 70～120 DEG C.
The thickness of heat-curable composition 11 is not particularly limited, but more than preferably 100 μm, more preferably 150 μm with
On.It addition, the thickness of heat-curable composition 11 is preferably below below 2000 μm, more preferably 1000 μm.
Sheet for sealing 1 is used in order to manufacture packaging body.Packaging body possesses electronic device.As electronic device, can enumerate
Sensor, MEMS (Micro Electro Mechanical Systems, MEMS), SAW (Surface Acoustic
Wave, surface acoustic wave) chip, semiconductor element, capacitor, resistance etc..As sensor, pressure transducer, vibration can be enumerated
Sensor etc..As semiconductor element, semiconductor chip, IC (integrated circuit), transistor etc. can be enumerated.
Packaging body such as possesses substrate, the electronic device being installed on substrate and the protection portion of overlay electronic device.As base
Plate, include, for example printed circuit board (PCB), LTCC (Low Temperature Co-fired Ceramics, LTCC)
Substrate (low-temperature co-fired ceramic substrate), ceramic substrate, silicon substrate, metal basal board etc..Protection portion is by making heat-curable composition
11 solidifications are formed.
As packaging body, hollow package body can be illustrated.In hollow package body, between electronic device and substrate, it is provided with sky
Between.As hollow package body, such as sensor encapsulation, MEMS package body, SAW filter etc. can be enumerated.
As the method using sheet for sealing 1 to manufacture packaging body, such as, have and electronic device is filled in Thermocurable group
The method of compound 11.
(manufacture method of packaging body)
As it is shown in figure 5, the manufacture method of packaging body includes the operation pressurizeing duplexer 331.Duplexer 331 possesses
Device fixing body 302 and the heat-curable composition 11 being configured on device fixing body 302.Duplexer 331 is also equipped with being configured at
Partition 12 on heat-curable composition 11.Device fixing body 302 possesses substrate 322 and is installed on the electronic device of substrate 322
323.The operation pressurizeing duplexer 331 includes that on the downside of utilization, heating plate 341 and upside heating plate 342 are to duplexer 331
Carry out the step pressurizeed.
As shown in Figure 6, by the operation that duplexer 331 is pressurizeed, thus obtain seal 332.Seal 332 has
For substrate 322, it is installed on the electronic device 323 of substrate 322 and the heat-curable composition 11 of overlay electronic device 323.Encapsulation
The manufacture method of body also includes the operation heating seal 332.By the operation that seal 332 is heated, from
And obtain structure 333.
As it is shown in fig. 7, structure 333 possesses substrate 322, the electronic device 323 being installed on substrate 322 and overlay electronic device
The protection portion 326 of part 323.The manufacture method of packaging body also includes splitting structure 333 according to each electronic device 323
Operation.By the operation in units of each electronic device 323, structure 333 split, thus obtain packaging body
334。
As shown in Figure 8, packaging body 334 possesses substrate 322, the electronic device 323 being installed on substrate 322 and overlay electronic device
The protection portion 326 of part 323.
Hereinafter, in the manufacture method of packaging body, the manufacture method enumerating SAW filter is said as representative examples
Bright.
(manufacture method of SAW filter)
As it is shown in figure 9, duplexer 31 is configured between downside heating plate 41 and upside heating plate 42.Duplexer 31 possesses device
Part fixing body 2, the heat-curable composition 11 being configured on device fixing body 2 and be configured on heat-curable composition 11 every
Sheet 12.
Device fixing body 2 possesses substrate 22 and is installed on the SAW chip 23 of substrate 22.Will be formed with regulation comb poles
Piezoquartz utilizes known method to cut so that it is singualtion, it is hereby achieved that SAW chip 23.Use flip-chip
The known device such as jointer, chip jointer, can be fixed on substrate 22 by SAW chip 23.By SAW chip 23 and substrate 22
It is electrically connected via the projected electrodes such as projection 24.It addition, filter at SAW not hinder between SAW chip 23 and substrate 22
The mode of the propagation of the surface acoustic wave on device surface configures hollow bulb 25.Distance between SAW chip 23 and substrate 22 is (below,
The also referred to as width of hollow bulb 25) can suitably set, it is however generally that, it is about 10 μm～100 μm.That is, device fixing body 2
The projected electrode 24 possess substrate 22, being configured on substrate 22 and the SAW chip 23 being configured on projected electrode 24.
As shown in Figure 10, on the downside of use, heating plate 41 and upside heating plate 42, enter duplexer 31 in parallel flat mode
Row hot pressing, forms seal 32.
The temperature of hot pressing is preferably more than 40 DEG C, more preferably more than 50 DEG C, more preferably more than 60 DEG C.If hot pressing
Temperature be more than 40 DEG C, then can seal securely.The temperature of hot pressing is preferably less than 150 DEG C, more preferably 90 DEG C
Below, more preferably less than 80 DEG C.If the temperature of hot pressing is less than 150 DEG C, then will not before being shaped with hot pressing
Excessively carry out curing reaction, therefore can seal securely.
The pressure that duplexer 31 is carried out hot pressing is preferably more than 0.1MPa, more preferably more than 0.5MPa, the most excellent
Elect more than 1MPa as.It addition, the pressure that duplexer 1 is carried out hot pressing is preferably below 10MPa, more preferably below 8MPa.If
This pressure is below 10MPa, then SAW chip 23 will not be produced bigger damage.
The time of hot pressing is preferably more than 0.3 minute, more preferably more than 0.5 minute.It addition, the time of hot pressing is preferably
Less than 10 minutes, more preferably less than 5 minutes.
Hot pressing is preferably carried out under reduced atmosphere.By carrying out hot pressing under reduced atmosphere such that it is able to reduce space, and
And can fill concavo-convex well.As reduced pressure, pressure for example, 0.01kPa～5kPa, preferably 0.1Pa～100Pa.
The seal 32 obtained by duplexer 31 is carried out hot pressing possesses substrate 22, is installed on the SAW core of substrate 22
Sheet 23 and the heat-curable composition 11 of covering SAW chip 23.Seal 32 configures partition 12.
As shown in figure 11, partition 12 is peeled off.
Make heat-curable composition 11 solidify by seal 32 is heated, form structure 33.
Heating-up temperature is preferably more than 100 DEG C, more preferably more than 120 DEG C.On the other hand, the upper limit of heating-up temperature is preferred
It it is less than 200 DEG C, more preferably less than 180 DEG C.It is preferably more than 10 minutes, more preferably more than 30 minutes heat time heating time.Separately
On the one hand, the upper limit of heat time heating time is preferably less than 180 minutes, more preferably less than 120 minutes.Preferably right under pressured atmosphere
Seal 32 heats, and pressure is preferably more than 0.1MPa, more preferably more than 0.5MPa.On the other hand, the upper limit is preferably
Below 10MPa, more preferably below 5MPa.Further preferably seal 32 is under atmospheric pressure heated.
As shown in figure 12, structure 33 possesses substrate 22, the SAW chip 23 being installed on substrate 22 and covers SAW chip 23
Protection portion 26.
As shown in figure 13, structure 33 is made monolithic (cutting), obtains SAW filter 34.SAW filter 34 possesses base
Plate 22, the SAW chip 23 being installed on substrate 22 and the protection portion 26 of covering SAW chip 23.Between SAW chip 23 and substrate 22
It is provided with space.
Projection can be formed in SAW filter 34, be installed on another substrate (not shown) again.SAW filter 34
Installation on substrate can use the known device such as flip-chip bond device, chip jointer.
(variation 1)
As shown in figure 14, the Thermocurable combination that the sheet for sealing 1 of variation 1 possesses partition 12, is configured on partition 12
Thing 11 and the partition 13 being configured on heat-curable composition 11.As partition 13, polyethylene terephthalate can be enumerated
(PET) film etc..Partition 13 preferably implemented the partition that the demoulding processes.
(variation 2)
In variation 2, heat-curable composition 11 possesses the multiple structure comprising multiple layers.
(variation 3)
Duplexer 331 is pressurizeed in parallel flat mode by embodiment 1, but in variation 3, uses layer
Duplexer 331 is pressurizeed by press.
Embodiment
Hereinafter, the embodiment that the present invention is suitable for by illustrative example is described in detail.But, about in this embodiment
The material of record, use level etc., as long as no particularly limitative record, the scope of the present invention not be shall be limited only to the extent by its purport
These embodiments.
[making of Thermocurable sheet]
The composition used to make Thermocurable sheet is illustrated.
Epoxy resin: YSLV-80XY (bisphenol f type epoxy resin, epoxide equivalent: the 200g/ of chemical company of Nippon Steel
Eq., softening point: 80 DEG C)
Phenol resin: LVR-8210DL (novolac type phenolic resin, hydroxyl equivalent: the 104g/ of Qun Rong chemical company
Eq., softening point: 60 DEG C)
Acrylic polymer: HME-2006M (carboxylic acrylate copolymer, the weight average of Gen Shang industrial group
Molecular weight: about 600,000, Tg:-35 DEG C, acid number: 32mgKOH/g)
Inorganic filler 1: the FB-5SDC (spherical silicon dioxide, mean diameter 5 μm) of Denki Kagaku Kogyo kabushiki
The SC220G-SMJ of inorganic filler 2:Admatechs company is (with 3-methacryloxypropyl trimethoxy
Base silane carried out the silicon dioxide of mean diameter 0.5 μm that surface processes.)
White carbon black: the #20 of Mitsubishi Chemical Ind
Curing accelerator: the 2PHZ-PW (2-phenyl-4,5-bishydroxymethyl imidazoles) of chemical conversion industrial group of four countries
According to the match ratio described in table 1, make each composition dissolve, be scattered in as in the butanone of solvent, obtain concentration
The varnish of 90 weight %.The demoulding that this varnish is coated thickness 38 μm after the silicone rubber demoulding processes processes poly-to benzene
On naphthalate film, afterwards so that it is be dried 5 minutes at 110 DEG C.Thus obtain the sheet of thickness 42 μm.By this sheet stacking 5
Sheet, thus obtains the Thermocurable sheet of thickness 210 μm.
[making of solidfied material]
Use heated oven, at 150 DEG C, Thermocurable sheet is heated 1 hour so that it is solidification, thus obtain solidfied material.
[making of observation sample]
In addition to mismatching inorganic filler 1, inorganic filler 2 and white carbon black this point, utilize same with Thermocurable sheet
The method of sample makes observation sheet.Use heated oven, at 150 DEG C, observation sheet is heated 1 hour so that it is solidification, thus
To observation sample.
The reason making observation sample is to observe island structure.Although sea can be confirmed by observing solidfied material
Island structure, but by observation sample is observed, can easily verify that island structure.
[evaluation]
Thermocurable sheet, solidfied material, observation sample have been carried out following evaluation.Show the result in table 1.
(tem observation)
Utilize TEM that the sectility face of Thermocurable sheet is observed, thus confirm the presence or absence being separated.
(solidfied material stores elastic modelling quantity the stretching of 25 DEG C)
Cutting knife is utilized to cut the test film of strip of long 40mm, wide 10mm, thick 200 μm from solidfied material.Use solid viscoelastic
Property determinator (RSAIII, Rheometric Scientific company system) test film is measured-50 DEG C～the storage of 300 DEG C
Hide elastic modelling quantity.Condition determination is set to frequency 1Hz, 10 DEG C/min of programming rate.
(Tg of solidfied material)
Cutting knife is utilized to cut the test film of strip of long 40mm, wide 10mm, thick 200 μm from solidfied material.Use solid viscoelastic
Property determinator (RSAIII, Rheometric Scientific company system) test film is measured-50 DEG C～the storage of 300 DEG C
Hide elastic modelling quantity.Condition determination is set to frequency 1Hz, 10 DEG C/min of programming rate.And then, by calculate tan δ (G " (loss resilience
Modulus)/G ' (storage elastic modelling quantity)) value, thus obtain Tg.
(CTE1)
Long 15mm, wide 5mm, the mensuration sample of thick 200 μm is cut from solidfied material.Mensuration sample is installed on thermo-mechanical analysis
After the film stretching mensuration fixture of device (TMA8310 of company of science), place the temperature provinces of-50 DEG C～300 DEG C,
Under conditions of tensile load 2g, programming rate 5 DEG C/min, the expansion rates of 50 DEG C～70 DEG C calculate CTE1.
(being separated of observation sample)
Utilize TEM that the sectility face of observation sample is observed, thereby confirm that with or without being separated.
(AFM of observation sample observes)
Utilize AFM that the sectility face of observation sample is observed, thus marine facies are confirmed heat-curing resin and propylene
Which in acids polymers is main constituent.Which in heat-curing resin and acrylic polymer island is confirmed mutually
Individual for main constituent.
[evaluation]
Thermocurable sheet is used to carry out following evaluation.Show the result in table 1.
(amount of warpage)
As shown in figure 15, use instantaneous vacuum laminated device (Mikado Technos company system, VS008-1515), will tool
There is aluminum oxide substrate 122 (aluminum oxide substrate of Kyocera, vertical 102mm × horizontal 102mm × thickness 0.2mm) and be configured at oxidation
The test duplexer 91 of Thermocurable sheet on aluminium base 122 111 (vertical 102mm × horizontal 102mm × thickness 0.21mm) 90 DEG C,
Carry out under conditions of 0.2Pa adding hot pressing.After adding hot pressing, use drying machine (STH-120 of ESPEC company), will test
Heat 1 hour at 150 DEG C with duplexer 91, make Thermocurable sheet 111 solidify.After this heating by test with duplexer 91 in room
Temperature (25 DEG C) is placed 1 hour.As shown in figure 16, test duplexer 91 is positioned on desk 201, uses with scale determination test
Distance 301 between angle and the desk 201 of duplexer 91.
(the resin immersion amount in hollow bulb)
Under following engaging condition, the SAW chip with the following specification of aluminum comb poles is installed on ceramic substrate, system
Make to there is ceramic substrate and be installed on the SAW chip installation base plate of SAW chip of ceramic substrate.SAW chip and ceramic substrate it
Between gap width be 20 μm.
<SAW chip>
Chip size: 1.2mm square (thickness 150 μm)
Projection material: Au (highly 20 μm)
Number of lugs: 6 projections
Chip-count: 100 (10 × 10)
<engaging condition>
Device: SUNX (strain) is made
Engaging condition: 200 DEG C, 3N, 1sec, ultrasonic power output 2W
SAW chip installation base plate configures Thermocurable sheet, thus obtains duplexer.In heating pressurization shown below
Under the conditions of, in parallel flat mode, duplexer is carried out vacuum compacting, obtain seal.
<vacuum pressing conditions>
Temperature: 60 DEG C
Plus-pressure: 4MPa
Vacuum: 1.6kPa
Press time: 1 minute
After opening at atmospheric pressure, in air drier, with the condition of 150 DEG C, 1 hour, seal is heated,
To structure.By the boundaries of ceramic substrate Yu protection portion, utilize KEYENCE company system, trade name " digital microscope "
(200 times), measure the immersion amount in resin hollow bulb between SAW chip and ceramic substrate.About resin immersion amount, measure
The maximum of the resin being immersed in hollow bulb from the end of SAW chip arrives distance, and as resin immersion amount.By resin
Immersion amount is that the situation of below 150 μm is judged to "○".Resin immersion amount is judged to "×" more than the situation of 150 μm.
Table 1
Claims (2)
1. a sheet for sealing, it possesses heat-curable composition in the form of sheets,
Described heat-curable composition comprises inorganic filler and remaining composition,
Remaining composition described comprises acrylic polymer,
The content of the described acrylic polymer in remaining composition described is more than 65 weight %,
The content of the described inorganic filler in described heat-curable composition is 55 more than volume %,
The solidfied material obtained by making described heat-curable composition solidify is 5 × 10 at the storage elastic modelling quantity of 25 DEG C7Pa～
5×109Pa。
2. a manufacture method for packaging body, it includes possessing device fixing body and being configured on described device fixing body
The duplexer of lamellar heat-curable composition carries out the operation pressurizeed, and described device fixing body possesses substrate and is installed on described base
The electronic device of plate,
Described heat-curable composition comprises inorganic filler and remaining composition,
Remaining composition described comprises acrylic polymer,
The content of the described acrylic polymer in remaining composition described is more than 65 weight %,
The content of the described inorganic filler in described heat-curable composition is 55 more than volume %,
The solidfied material obtained by making described heat-curable composition solidify is 5 × 10 at the storage elastic modelling quantity of 25 DEG C7Pa～
5×109Pa。
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|---|---|---|---|
| JP2015-056213 | 2015-03-19 | ||
| JP2015056213A JP6497998B2 (en) | 2015-03-19 | 2015-03-19 | Manufacturing method of sealing sheet and package |
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| CN105985600A true CN105985600A (en) | 2016-10-05 |
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| CN201610153248.0A Pending CN105985600A (en) | 2015-03-19 | 2016-03-17 | Sealing sheet and method for producing package |
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| JP (1) | JP6497998B2 (en) |
| CN (1) | CN105985600A (en) |
| SG (1) | SG10201602065VA (en) |
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| JP6533399B2 (en) * | 2015-03-19 | 2019-06-19 | 日東電工株式会社 | Method of manufacturing sealing sheet and package |
| JP6883937B2 (en) * | 2015-03-19 | 2021-06-09 | 日東電工株式会社 | Manufacturing method of sealing sheet and hollow package |
| JP7038575B2 (en) * | 2018-03-08 | 2022-03-18 | 日東電工株式会社 | Sealing sheet |
| JP7461229B2 (en) | 2020-06-17 | 2024-04-03 | 日東電工株式会社 | Sealing resin sheet |
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| CN104425632A (en) * | 2013-08-21 | 2015-03-18 | 佳能株式会社 | Optical apparatus and method of manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5035580B2 (en) * | 2001-06-28 | 2012-09-26 | ナガセケムテックス株式会社 | Surface acoustic wave device and manufacturing method thereof |
| JP2009141020A (en) * | 2007-12-04 | 2009-06-25 | Furukawa Electric Co Ltd:The | Electronic component sealing sheet |
| JP6393092B2 (en) * | 2013-08-07 | 2018-09-19 | 日東電工株式会社 | Hollow type electronic device sealing resin sheet and method for producing hollow type electronic device package |
-
2015
- 2015-03-19 JP JP2015056213A patent/JP6497998B2/en active Active
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2016
- 2016-03-17 CN CN201610153248.0A patent/CN105985600A/en active Pending
- 2016-03-17 SG SG10201602065VA patent/SG10201602065VA/en unknown
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1214545A (en) * | 1997-10-02 | 1999-04-21 | 松下电器产业株式会社 | Semiconductor encapsulation and its manufacture |
| CN101103448A (en) * | 2005-02-21 | 2008-01-09 | 日东电工株式会社 | Manufacturing method for semiconductor device |
| JP2009091389A (en) * | 2007-10-04 | 2009-04-30 | Nitto Denko Corp | Resin composition sheet for sealing hollow device, and hollow device sealed using sheet thereof |
| CN102382586A (en) * | 2010-07-28 | 2012-03-21 | 日东电工株式会社 | Film for flip chip type semiconductor back surface |
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| CN104425632A (en) * | 2013-08-21 | 2015-03-18 | 佳能株式会社 | Optical apparatus and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016175975A (en) | 2016-10-06 |
| SG10201602065VA (en) | 2016-10-28 |
| JP6497998B2 (en) | 2019-04-10 |
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