CN105983538B - High-yield test sorting machine system - Google Patents
High-yield test sorting machine system Download PDFInfo
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- CN105983538B CN105983538B CN201510043810.XA CN201510043810A CN105983538B CN 105983538 B CN105983538 B CN 105983538B CN 201510043810 A CN201510043810 A CN 201510043810A CN 105983538 B CN105983538 B CN 105983538B
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- 238000012360 testing method Methods 0.000 title claims abstract description 143
- 238000012546 transfer Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims description 13
- 238000010998 test method Methods 0.000 claims 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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Abstract
The invention discloses a test separator, which comprises: a main turntable; a loading platform operated to transfer the electronic components to the functional module of the main turret; an auxiliary turret including a plurality of carrier modules to receive electronic components from the functional modules of the main turret; and a plurality of test platforms disposed along a periphery of the auxiliary turntable; wherein the test platform is operated to receive electronic components from the carrier module for testing while the loading platform concurrently transfers the electronic components to the functional modules of the main turret, so that the effect of the transfer time during a test processing cycle of the test handler is reduced or eliminated.
Description
Technical Field
the present invention relates to a test handler (test handler) for testing electronic components, and more particularly, to a test handler for testing electronic components with high throughput.
Background
In industry, test handlers for electronic components are used for testing already assembled electronic components. In such test handlers, the electronic components are typically fed to a high speed turntable using a vibrating disk feeder (vibratory feeder) or other feeding device. The electronic components are then individually picked up on the turret using a pick head and transferred sequentially to different test stations to complete one or more tests before they are eligible for use.
A test cycle for a test handler typically includes: the time taken to transfer the electronic components to the test platform, and the time taken to test the electronic components. In particular in conventional turntables used in the above-described method, transfer times are necessary and cannot be eliminated, since the transfer and the subsequent testing steps are carried out one after the other in time with respect to each electronic component to be tested. If the test time is long, the system will have to sit idle for a long time until the test is complete and another electronic component may be transferred for testing. This creates a bottleneck that makes it difficult to reduce the cycle time of the overall process. It would be beneficial to reduce or eliminate the effect of transit time throughout the test processing cycle time.
Disclosure of Invention
It is therefore an object of the present invention to seek to provide a test handler system which reduces or eliminates the effects of transfer time during a test processing cycle so as to improve the throughput of the overall system.
In a first aspect, the present invention provides a test handler, comprising: a main turntable; a loading platform operated to transfer the electronic components to the functional module of the main turret; an auxiliary turret including a plurality of carrier modules to receive electronic components from the functional modules of the main turret; and a plurality of test platforms disposed along a periphery of the auxiliary turntable; wherein the test platform is operative to receive electronic components from the carrier module for testing while the loading platform concurrently transfers the electronic components to the functional modules of the main turret.
in a second aspect, the present invention provides a method for testing electronic components using a test handler, the method comprising the steps of: transferring the electronic components from the loading platform to the functional module of the main turntable; transferring electronic components from the functional modules of the main turret to a plurality of carrier modules of the auxiliary turret; and transferring the electronic components to a plurality of test platforms disposed along a periphery of the auxiliary turntable; the electronic components received from the carrier modules are thereafter tested at a plurality of test stations while continuing to transport the electronic components in parallel from the loading station to the functional modules of the main turret.
it will be convenient to hereinafter describe the invention in more detail with reference to the accompanying drawings, in which certain preferred embodiments of the invention are described. The particularity of the drawings and the related description is not to be understood as limiting the invention, the features of which are defined in the claims.
Drawings
An example of a test handler system according to the present invention will now be described with reference to the accompanying drawings, in which.
Fig. 1 is a plan view schematically showing a test handler system according to a first preferred embodiment of the present invention.
fig. 2 is a perspective view of the test handler system of fig. 1.
Fig. 3 is a schematic plan view of a test handler system according to a second preferred embodiment of the present invention.
FIG. 4 is a perspective view of a test handler system illustrating a test platform positioned adjacent an auxiliary rotary turret (auxiliary rotary turret); and (c) and (d).
Fig. 5(a) to 5(d) illustrate a pick-up head of a test platform for transferring electronic components between an auxiliary turret and a test platform according to a preferred embodiment of the present invention.
Detailed Description
FIG. 1 is a schematic plan view of a test handler system 10 according to a first preferred embodiment of the present invention; and figure 2 is a perspective schematic view of the test handler system of figure 1. The test handler system 10 generally includes a main turret 12 and an auxiliary turret 14, the main turret 12 having a plurality of functional modules 13 to receive and process electronic components and the auxiliary turret 14 having a plurality of carrier modules 15 to receive electronic components for testing. The loading platform 16 is designed to transfer electronic components in large quantities towards the functional modules 13 of the main turret 12.
The electronic component loaded on the function module 13 of the main turntable 12 is loaded by the pick-up head on the function module 13, and is moved to the position of the auxiliary turntable 14 by the rotation of the main turntable 12, and thereafter is transferred onto the carrier module 15 of the auxiliary turntable 14. The electronic components transferred onto the auxiliary turret 14 are further moved by rotation of the auxiliary turret 14 to a plurality of test stations 18 where a pick-up head is positioned to pick up electronic components from the auxiliary turret 14 for testing (see below). The test platform 18 is operated to receive electronic components from the carrier module 15 for testing, while the loading platform 16 continues to transport electronic components to the functional modules of the main turret 12. This ensures that the main turret 12 does not need to remain idle while the electronic components are being tested.
The plurality of test platforms 18 should be configured to perform the same type of testing on electronic components in order to significantly increase throughput. Thereafter, the tested electronic components are put back on the auxiliary turntable 14 and transferred to the position of the main turntable 12 by rotation, and then they are transferred to the function module 13 of the main turntable 12.
Finally, the electronic components returned to the main turret 12, which are found to be defective, fall into the reject bin 20, and the electronic components that have passed the test by the test platform 18 are unloaded by the unloading platform 22. Thus, the defective electronic component and the non-defective electronic component are separated.
Fig. 3 is a plan view of a test handler system 30 according to a second preferred embodiment of the present invention. In the second embodiment, first and second auxiliary turntables 32, 34 are provided adjacent to the main turntable 12. The first auxiliary turntable 32 is provided with a first plurality of test platforms 36 about its periphery and the second auxiliary turntable 34 is provided with another or second plurality of test platforms 38 about its periphery. For example, if the testing process is a relatively time consuming process and more test platforms 36, 38 are required to increase the throughput of the test handler system 30, the first plurality of test platforms 36 may perform the same tests as the second plurality of test platforms 38. In this case, the electronic components may be transferred to the first auxiliary turntable 32 or the second auxiliary turntable 34 for testing.
On the other hand, it should also be understood that the first plurality of test platforms 36 may perform different tests than the second plurality of test platforms 38. Therefore, there is flexibility in designing the test platforms 36, 38 according to the needs of the user. In this case, after the electronic components have been transferred to the first auxiliary turret 32 to undergo testing, the electronic components may be transferred to the second auxiliary turret 34 (either directly or through the main turret 12) to undergo different testing.
Fig. 4 is a perspective view of the test handler system 10 illustrating a test platform 18 positioned adjacent to the auxiliary turret 14. For simplicity, only one test platform is indicated with respect to the plurality of test platforms 18 mentioned in fig. 1 and 2. The test platform 18 includes a pair of reciprocating pick-up heads 40 disposed about a rotary drive 42. The pick heads 40 are angularly spaced from each other by 180 degrees so that the rotary drive 42 can rotate the pick heads 40 to alternatively position them over either the carrier module 15 of the auxiliary turntable 14 or the test station 46 of the test platform 18. Also, a vertical drive 44 coupled to each pick-up head 40 lowers the pick-up head 40 to pick up the electronic component at the first location and raises the pick-up head before it is rotated to transfer the electronic component to the second location and lowers the pick-up head 40 to place the electronic component at the second location. Auxiliary turret 14 may continue to receive additional electronic components during testing of other electronic components by transferring the electronic components to a test station 46 spaced from auxiliary turret 14 for testing.
Fig. 5(a) to 5(d) illustrate pick heads 40, 40' of test platform 18 for transferring electronic components between auxiliary turret 14 and test station 46 according to a preferred embodiment of the invention.
in fig. 5(a), the pick head 40 picks up an electronic component from the carrier module 15 of the auxiliary turntable 14. In fig. 5(b), the pick-up heads 40, 40' have been rotated relative to each other by an angle of 180 degrees. The first pick head 40' now places the electronic component on the test station 46 for testing while the second pick head 40 picks up another electronic component from the carrier module 15 of the auxiliary turntable 14.
in fig. 5(c), after the electronic component has been tested and the tested electronic component is picked up by the first pick-up head 40 again, the pick-up heads 40, 40' are rotated by an angle of 180 degrees again with respect to each other. Thereafter, the tested electronic component is placed by the first pick-up head 40 back to the empty carrier module 15 of the auxiliary turntable 14, while the second pick-up head 40' places another electronic component at the test station 46 for testing.
in fig. 5(d), the auxiliary turret 14 has been positioned forward step by step to transfer the next untested electronic component, which has been picked up by the first pick-up head 40, under the idle first pick-up head 40. The pick heads 40, 40' have been rotated 180 degrees relative to each other and the first pick head 40 now places an untested electronic component on the test station 46 for testing. The transfer process described above is repeated for subsequent test cycles.
while the electronic components are being tested, the main turret 12 may continue to load electronic components onto the auxiliary turret 14 with minimal disruption, as loading electronic components onto the auxiliary turret 14 does not require waiting for other electronic components to be tested to be completed. Accordingly, main turret 12 may continue to receive untested electronic components from loading dock 16.
It should be appreciated that the test handler system 10, 30 according to the preferred embodiment of the present invention helps to reduce or eliminate the transfer time in the test cycle, so as to improve the throughput of the test handler system 10, 30. The introduction of one or more auxiliary turrets 14, 32, 34 enables the transfer of electronic components to be completed during a test cycle, thereby avoiding the additional time taken to transfer electronic components beyond the test cycle time, since the required tests on the electronic components can be completed simultaneously and in time in the context of the transfer of other electronic components being transferred.
With the foregoing arrangement, it has been found that the throughput of the system can be increased to over 50% for certain types of electronic components having a predetermined test time variation range, as compared to the throughput of existing test handler systems for the same type of electronic components.
The invention described herein is susceptible to variations, modifications and/or additions and, based on the specific details set forth, it is to be understood that the invention includes all such variations, modifications and/or additions which fall within the spirit and scope of the foregoing description.
Claims (16)
1. a test handler, comprising:
A main turntable;
A loading platform operated to transfer the electronic components to the functional module of the main turret;
an auxiliary turret including a plurality of carrier modules to receive electronic components from the functional modules of the main turret; and
A plurality of test platforms disposed along a periphery of the auxiliary turntable, each test platform further including a pick-up head for transferring electronic components between the carrier module of the auxiliary turntable and a test station of the test platform for testing;
wherein the test platform is operative to receive electronic components from the carrier module of the auxiliary turret for testing while the loading platform concurrently transfers the electronic components to the functional modules of the main turret.
2. The test handler of claim 1, wherein each test platform is configured to perform the same type of test on the electronic component as another test platform.
3. the test handler of claim 1, wherein the pick head comprises a pair of reciprocating pick heads disposed about the rotary drive.
4. The test handler of claim 3, wherein the pick heads are spaced from each other at an angle of 180 degrees and are alternatively disposed above the carrier module or above the test station.
5. The test handler of claim 3, further comprising:
A vertical drive coupled to each pick-up head, the vertical drive configured to lower the pick-up head to pick up the electronic component at a first location and to raise the pick-up head before the pick-up head is rotated to transfer the electronic component to a second location.
6. The test handler of claim 1, further comprising:
A further auxiliary turntable having a further plurality of carrier modules; and
And another plurality of test platforms disposed along a periphery of the other auxiliary turntable to test the electronic components.
7. The test handler of claim 6, wherein the other plurality of carrier modules is configured to receive electronic components from the main turret.
8. The test handler of claim 7, wherein the other plurality of test platforms performs the same type of test on the electronic component as the plurality of test platforms of the auxiliary turret.
9. The test handler of claim 6, wherein the other plurality of carrier modules is configured to receive electronic components from the auxiliary turret.
10. A method for testing electronic components using a test handler, the method comprising the steps of:
Transferring the electronic components from the loading platform to the functional module of the main turntable;
Transferring electronic components from the functional modules of the main turret to a plurality of carrier modules of the auxiliary turret; and
Transferring the electronic components to a plurality of test platforms disposed along a periphery of the auxiliary turntable;
Transferring the electronic components in the carrier module of the auxiliary turntable to corresponding test stations of the test platforms by using pick-up heads included in the plurality of test platforms; the electronic components received from the carrier modules are thereafter tested at the test stations of the plurality of test platforms while continuing to transport the electronic components in parallel from the loading platform to the functional modules of the main turret.
11. a method of testing electronic components as claimed in claim 10, wherein each test platform performs the same type of test on the electronic component as another test platform.
12. The method according to claim 10, further comprising the steps of:
The auxiliary turret continues to receive further electronic components during testing of other electronic components.
13. A method for testing electronic components as claimed in claim 10, the method further comprising the steps of:
Transferring the electronic components to another auxiliary turret including another plurality of carrier modules and another plurality of test platforms disposed at a periphery of the other auxiliary turret; and
The electronic components are tested at the other plurality of test platforms.
14. a method of testing electronic components as claimed in claim 13, wherein the further plurality of carrier modules receives electronic components from the main turret.
15. A method of testing electronic components as claimed in claim 14, wherein the further plurality of test platforms perform the same type of testing on the electronic components as the plurality of test platforms of the auxiliary turntable.
16. A method of testing electronic components as claimed in claim 13, wherein the further plurality of carrier modules receives electronic components from a plurality of carrier modules of the auxiliary turret.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510043810.XA CN105983538B (en) | 2015-01-28 | 2015-01-28 | High-yield test sorting machine system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510043810.XA CN105983538B (en) | 2015-01-28 | 2015-01-28 | High-yield test sorting machine system |
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| Publication Number | Publication Date |
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| CN105983538A CN105983538A (en) | 2016-10-05 |
| CN105983538B true CN105983538B (en) | 2019-12-06 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039298B (en) * | 2016-11-04 | 2019-12-24 | 厦门市三安光电科技有限公司 | Micro-component transfer device, transfer method, manufacturing method, device and electronic device |
| US10996308B2 (en) | 2018-04-17 | 2021-05-04 | Asm Technology Singapore Pte Ltd | Apparatus and method for authentication of electronic device test stations |
| CN113716278B (en) * | 2021-09-10 | 2023-04-25 | 深圳市华腾半导体设备有限公司 | High-efficient carousel conveying system is used in beam split |
| CN118091452B (en) * | 2024-04-28 | 2024-07-12 | 深圳市泰科动力系统有限公司 | Modularized lithium battery test equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TW550771B (en) * | 2000-12-29 | 2003-09-01 | Yient Co Ltd | Apparatus for inspecting surface-mounted chips |
| CN1968876A (en) * | 2004-04-13 | 2007-05-23 | Tdk株式会社 | Chip part conveyance method, its device, appearance inspection method, and its device |
| JP2012228638A (en) * | 2011-04-25 | 2012-11-22 | Young Tek Electronics Corp | Mounted chip test/selection device |
| CN103286076A (en) * | 2012-02-10 | 2013-09-11 | 先进科技新加坡有限公司 | Handling system for testing electronic components |
| CN203830306U (en) * | 2014-05-16 | 2014-09-17 | 歌尔声学股份有限公司 | High-precision precision workpiece detection sorting machine |
-
2015
- 2015-01-28 CN CN201510043810.XA patent/CN105983538B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW550771B (en) * | 2000-12-29 | 2003-09-01 | Yient Co Ltd | Apparatus for inspecting surface-mounted chips |
| CN1968876A (en) * | 2004-04-13 | 2007-05-23 | Tdk株式会社 | Chip part conveyance method, its device, appearance inspection method, and its device |
| JP2012228638A (en) * | 2011-04-25 | 2012-11-22 | Young Tek Electronics Corp | Mounted chip test/selection device |
| CN103286076A (en) * | 2012-02-10 | 2013-09-11 | 先进科技新加坡有限公司 | Handling system for testing electronic components |
| CN203830306U (en) * | 2014-05-16 | 2014-09-17 | 歌尔声学股份有限公司 | High-precision precision workpiece detection sorting machine |
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| CN105983538A (en) | 2016-10-05 |
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