CN105979712B - A kind of opposite sex tower base formula double-sided key board manufacturing method - Google Patents
A kind of opposite sex tower base formula double-sided key board manufacturing method Download PDFInfo
- Publication number
- CN105979712B CN105979712B CN201510957150.6A CN201510957150A CN105979712B CN 105979712 B CN105979712 B CN 105979712B CN 201510957150 A CN201510957150 A CN 201510957150A CN 105979712 B CN105979712 B CN 105979712B
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- China
- Prior art keywords
- bottom copper
- dry film
- etching
- face
- anisotropic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 56
- 239000010949 copper Substances 0.000 claims abstract description 55
- 229910052802 copper Inorganic materials 0.000 claims abstract description 53
- 238000005530 etching Methods 0.000 claims abstract description 24
- 238000012790 confirmation Methods 0.000 claims abstract description 5
- 229910000906 Bronze Inorganic materials 0.000 claims abstract description 4
- 239000010974 bronze Substances 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 7
- 230000006641 stabilisation Effects 0.000 claims 1
- 238000011105 stabilization Methods 0.000 claims 1
- 239000011889 copper foil Substances 0.000 abstract description 3
- 238000004891 communication Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
A kind of opposite sex tower builds formula double-sided key board manufacturing method, comprising the following steps: S1 dry film: the position that needs to thicken on each bottom copper face of keypad first carries out dry film, is attached on the copper face of bottom to generate a kind of stable substance；Bis- bronze medal of S2: after dry film, being electroplated at each position of keypad, forms layer of metal film；S3 dry film: and then cover anisotropic bottom copper face, same sex bottom copper face is made figure；S4 etching: and then the normal negative film etching of thickness of confirmation bottom same sex bottom copper；S5 dry film: and then cover etched same sex bottom copper face, then anisotropic bottom copper face is made into figure；S6 etching: and then confirm the normal negative film etching of anisotropic bottom copper thickness, the present invention can make the difference of printed circuit board front and back sides copper foil, it realizes and formula layout is built to the tower of copper thickness, and it can achieve low-and high-frequency to coexist, suitable for the two-sided of circuit board, and the circuit board in every face is mutually indepedent, and independent communication may be implemented.
Description
Technical field
The present invention relates to circuit board technology fields more particularly to a kind of anisotropic tower to build formula double-sided key board manufacturing method.
Background technique
In the production of printed circuit board, etch process is a wherein indispensable important step, in particular with
The extensive use of the rapid development of microelectric technique, large scale integrated circuit and super large-scale integration, makes printed circuit board
On conductor width and spacing it is smaller and smaller, wiring density and precision are also higher and higher, propose to the precision and tolerance of etching
The quality of the requirement of more Gao Gengyan, etching quality directly influences the quality good or not of printed circuit board.
Printed circuit board identical for copper thickness, generallys use two sides while etching, and can meet the requirements.But
The printed circuit board different for copper thickness, two sides etches be unable to satisfy requirement simultaneously, currently, common mode has: a kind of
Be two sides circuit etching compensation rate it is thicker by copper thickness in order to avoid same compensation, then be etched；Another kind is two
Face is compensated by practical copper thickness production circuit etching, and by adjusting etching pressure when etching, this mode is suitable only for two sides copper
Foil thickness very poor the case where being less than or equal to 1 ounce, however, both modes are adapted to the very wide printing of route spacing
Circuit board can not process the printed circuit board of fine-line, and can not process that two sides copper thickness is very poor to be greater than 1 ounce
Printed circuit board.
Accordingly, it is desirable to provide a kind of new technical solution solves above-mentioned technical problem.
Summary of the invention
The anisotropic tower that above-mentioned technical problem can effectively be solved the object of the present invention is to provide one kind builds formula double-sided key plate system
Make method.
In order to solve the above-mentioned technical problem, the present invention adopts the following technical scheme:
It is described the opposite sex tower build formula double-sided key board manufacturing method the following steps are included:
S1 dry film: the position for needing to thicken on each bottom copper face of keypad first carries out dry film, to generate one kind
Stable substance is attached on the copper face of bottom；
Bis- bronze medal of S2: after dry film, being electroplated at each position of keypad, forms layer of metal film；
S3 dry film: and then cover anisotropic bottom copper face, same sex bottom copper face is made figure；
S4 etching: and then the normal negative film etching of thickness of confirmation bottom same sex bottom copper；
S5 dry film: and then cover etched same sex bottom copper face, then anisotropic bottom copper face is made into figure；
S6 etching: and then confirm the normal negative film etching of anisotropic bottom copper thickness.
Same sex bottom copper is different from the thickness of anisotropic bottom copper.
After adopting the above technical scheme, the present invention has the advantage that
Opposite sex tower of the invention, which builds formula double-sided key board manufacturing method, can make the difference of printed circuit board front and back sides copper foil, real
Formula layout now is built to the tower of copper thickness, and can achieve low-and high-frequency and coexist, suitable for the two-sided of circuit board, and every face
Circuit board is mutually indepedent, and independent communication may be implemented.And may be implemented to the different Cu thickness on same circuit board opposite sex two sides into
Row etching, to meet existing production requirement, while can biggish thickness very poor to two face thicknesses be etched.
Detailed description of the invention
The specific embodiment for building formula double-sided key board manufacturing method to anisotropic tower of the invention with reference to the accompanying drawing is made into one
Step explanation:
Fig. 1 is the production flow diagram that the anisotropic tower of the present invention builds formula double-sided key board manufacturing method；
Fig. 2 is the structural schematic diagram that the anisotropic tower of the present invention shown in Fig. 1 builds formula double-sided key plate.
Specific embodiment
As shown in Figure 1, present invention opposite sex tower builds formula double-sided key board manufacturing method, to disclose a kind of two-sided different Cu thick
The production method of keypad comprising following steps:
S1 dry film: the position for needing to thicken on each bottom copper face of keypad first carries out dry film, to generate one kind
Stable substance is attached on the copper face of bottom；
Bis- bronze medal of S2: after dry film, being electroplated at each position of keypad, forms layer of metal film；
S3 dry film: and then cover anisotropic bottom copper face, same sex bottom copper face is made figure；
S4 etching: and then the normal negative film etching of thickness of confirmation same sex bottom bottom copper；
S5 dry film: and then cover etched same sex bottom copper face, then anisotropic bottom copper face is made into figure；
S6: etching: and then the normal negative film etching of confirmation bottom anisotropic ground copper thickness.
As shown in Fig. 2, the opposite sex tower builds formula double-sided key plate and includes circuit board 1 staggered relatively up and down, is set to institute
State bottom copper 2 and the contact 3 being set on the bottom copper 2 on circuit board 1.The circuit board 1 is in cuboid, 1 water of circuit board
Placing flat, the circuit board 1 are equipped with integrated circuit.The bottom copper 2 is in cylindrical body, and the bottom copper 2 is placed vertically, the bottom copper
2 one end is connect with the circuit board 1, and the bottom copper 2 is electrically connected with the circuit board 1, and the thickness size of the bottom copper 2 is not
Together, the thickness of the bottom copper 2 can according to need setting.The contact 3 is in cylindrical body, and the contact 3 is placed vertically, the touching
Piece 3 is fixedly connected with the bottom copper 2, and the bottom copper 2 is made of conductive material.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those skilled in the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all cover
Within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (2)
1. a kind of opposite sex tower builds formula double-sided key board manufacturing method, it is characterised in that: the opposite sex tower builds formula double-sided key plate system
Make method the following steps are included:
S1 dry film: the position for needing to thicken on each bottom copper face of keypad first carries out dry film, to generate a kind of stabilization
Substance be attached on the copper face of bottom；
Bis- bronze medal of S2: after dry film, being electroplated at each position of keypad, forms layer of metal film；
S3 dry film: and then cover anisotropic bottom copper face, same sex bottom copper face is made figure；
S4 etching: and then the normal negative film etching of thickness of confirmation same sex bottom copper；
S5 dry film: and then cover etched same sex bottom copper face, then anisotropic bottom copper face is made into figure；
S6 etching: and then confirm the normal negative film etching of anisotropic bottom copper thickness.
2. opposite sex tower according to claim 1 builds formula double-sided key board manufacturing method, it is characterised in that: same sex bottom copper
It is different from the thickness of anisotropic bottom copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510957150.6A CN105979712B (en) | 2015-12-18 | 2015-12-18 | A kind of opposite sex tower base formula double-sided key board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510957150.6A CN105979712B (en) | 2015-12-18 | 2015-12-18 | A kind of opposite sex tower base formula double-sided key board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105979712A CN105979712A (en) | 2016-09-28 |
| CN105979712B true CN105979712B (en) | 2019-02-26 |
Family
ID=56988288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510957150.6A Active CN105979712B (en) | 2015-12-18 | 2015-12-18 | A kind of opposite sex tower base formula double-sided key board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105979712B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110366322A (en) * | 2019-07-16 | 2019-10-22 | 深圳市星河电路股份有限公司 | A kind of processing method that copper base processes figure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101188909A (en) * | 2006-11-16 | 2008-05-28 | 比亚迪股份有限公司 | A flexible circuit board and its copper plating method |
| CN103002660A (en) * | 2011-09-13 | 2013-03-27 | 深南电路有限公司 | Circuit board and processing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010109396A (en) * | 2010-02-17 | 2010-05-13 | Ibiden Co Ltd | Method of manufacturing printed circuit board |
-
2015
- 2015-12-18 CN CN201510957150.6A patent/CN105979712B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101188909A (en) * | 2006-11-16 | 2008-05-28 | 比亚迪股份有限公司 | A flexible circuit board and its copper plating method |
| CN103002660A (en) * | 2011-09-13 | 2013-03-27 | 深南电路有限公司 | Circuit board and processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105979712A (en) | 2016-09-28 |
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