CN105977168A - Substrate plastic packaging body thinning method - Google Patents
Substrate plastic packaging body thinning method Download PDFInfo
- Publication number
- CN105977168A CN105977168A CN201610567921.5A CN201610567921A CN105977168A CN 105977168 A CN105977168 A CN 105977168A CN 201610567921 A CN201610567921 A CN 201610567921A CN 105977168 A CN105977168 A CN 105977168A
- Authority
- CN
- China
- Prior art keywords
- thinning
- substrate plastic
- sealed body
- support plate
- plastic packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000004033 plastic Substances 0.000 title abstract description 22
- 238000004806 packaging method and process Methods 0.000 title abstract description 16
- 239000002390 adhesive tape Substances 0.000 claims abstract description 15
- 239000011800 void material Substances 0.000 claims description 11
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 239000005022 packaging material Substances 0.000 description 3
- 239000007943 implant Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to a substrate plastic packaging body thinning method which is characterized by comprising the following steps that (1) a carrier plate with a pierced area arranged in the middle is prepared, and a substrate plastic packaging body can be embedded in the pierced area; (2) the substrate plastic packaging body requiring thinning is prepared; (3) a layer of thinning adhesive tape is adhered at the back surface of the carrier plate, and the substrate plastic packaging body under thinning is arranged in the pierced area of the carrier plate; (4) the carrier plate obtained in the step (3) is fixed on the platform of a wafer thinning machine, and the substrate plastic packaging body is thinned to the required thickness; (5) the carrier plate is taken from the platform after thinning of the step (4); and (6) the thinning adhesive tape and the carrier plate are taken down so that the substrate plastic packaging body of the required thickness is obtained. The thickness of the carrier plate is less than that of the thinned substrate plastic packaging body. According to the substrate plastic packaging body thinning method, the requirements for the thickness of different plastic packaging bodies can be realized without input of die, and the requirements for the thickness of an ultrathin substrate plastic packaging body can be realized.
Description
Technical field
The present invention relates to a kind of substrate plastic-sealed body thining method, belong to technical field of semiconductors.
Background technology
Along with the development of semiconductor technology, the characteristic size of integrated circuit constantly reduces, and the size of ic chip package is also developing towards light, little, thin direction.Affecting chip package size mainly has substrate and two parts of plastic-sealed body at present.The thickness of plastic-sealed body directly affects the thickness requirement of finished product.
The thickness of plastic-sealed body is mainly affected by both sides.The first, mold thickness, in view of the major part putting into the tool put into for semiconductor packages new product of plastic package die, the price of single mould is about hundreds of thousands RMB；Therefore typically encapsulation factory can select one module multiple usages, can develop the mould that can meet multiple product demand, constrains the space of ultra-thin plastic-sealed body exploitation as far as possible.Second, substrate plastic packaging material selects, and substrate plastic packaging material composition is mainly epoxide-resin glue and implant composition, and the particle size of normal implant is between 30um ~ 70um；Product plastic packaging need to ensure the space that chip surface is filled to plastic packaging material flowing between die surface.Therefore plastic-sealed body thickness selects to compare by limitation at present, it is impossible to accomplish the demand of plastic-sealed body slimming.
Summary of the invention
The purpose of this part is summarize some aspects of embodiments of the invention and briefly introduce some preferred embodiments.Make a summary in this part and the description of the present application and denomination of invention may be done a little simplification or omit to avoid making the purpose of this part, specification digest and denomination of invention to obscure, and this simplification or omission cannot be used for limiting the scope of the present invention.
In view of plastic-sealed body present in above-mentioned and/or existing semiconductor packages cannot the problem of slimming, it is proposed that the present invention.
It is an object of the invention to overcome the deficiencies in the prior art, it is provided that a kind of substrate plastic-sealed body thining method, on the one hand can realize being not required to mould and put into the requirement that can realize different plastic-sealed body thickness, on the other hand, the requirement of ultra thin substrate plastic-sealed body thickness can be realized.
The technical scheme provided according to the present invention, described substrate plastic-sealed body thining method, it is characterized in that, comprise the following steps:
(1) preparing the support plate in the middle of with void region, substrate plastic-sealed body can be embedded by void region；
(2) it is ready to need to carry out thinning substrate plastic-sealed body；
(3) attach one layer of thinning adhesive tape at the support plate back side, and will treat that thinning substrate plastic-sealed body is positioned over the void region of support plate；
(4) being fixed on the platform (5) of the thinning machine of wafer by the support plate (1) that step (3) obtains, the abrasive wheel of the thinning machine of wafer is thinned to desired thickness to the substrate plastic-sealed body (4) on support plate (1)；
(5) after step (4) is thinning, support plate is taken off by platform；
(6) thinning adhesive tape and support plate are taken off, obtain the substrate plastic-sealed body of desired thickness.
Further, the size of described void region is more than the size of substrate plastic-sealed body.
Further, after described step irradiates thinning adhesive tape by UV exposure sources, thinning adhesive tape and support plate are taken off.
Further, the thickness of described support plate less than substrate plastic-sealed body thinning after thickness.
The present invention utilizes tradition wafer stripping apparatus, is embedded in support plate by substrate plastic-sealed body by special support plate, carries out substrate plastic-sealed body thinning back side.In the case of cannot not present invention can be implemented in newly-increasedly input plastic package die, different plastic packaging thickness and the requirement of ultra-thin plastic packaging body thickness can be obtained.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme of the embodiment of the present invention, in describing embodiment below, the required accompanying drawing used is briefly described, apparently, accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.Wherein:
Fig. 1 is the schematic diagram of described support plate.
Fig. 2 is the top view of Fig. 1.
Fig. 3 is at support plate, thinning adhesive tape and the position view of substrate plastic-sealed body.
Fig. 4 is the top view of Fig. 3.
Fig. 5 is the schematic diagram that support plate is positioned on the platform of the thinning machine of wafer.
Fig. 6 be substrate plastic-sealed body thinning after by the schematic diagram taken off on platform.
Fig. 7 is the schematic diagram that UV exposure sources irradiates thinning adhesive tape.
Detailed description of the invention
Understandable in order to enable the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with concrete accompanying drawing, the detailed description of the invention of the present invention is further described.
Elaborate a lot of detail in the following description so that fully understanding the present invention, but the present invention can also use other to be different from alternate manner described here carrys out embodiment, those skilled in the art can do similar popularization in the case of intension of the present invention, and therefore the present invention is not limited by following public specific embodiment.
Secondly, the present invention combines schematic diagram and is described in detail, when describing the embodiment of the present invention in detail; for ease of explanation; representing that the profile of device architecture can be disobeyed general ratio and be made partial enlargement, and described schematic diagram is example, it should not limit the scope of protection of the invention at this.Additionally, the three-dimensional space of length, width and the degree of depth should be comprised in implementing to make.
Substrate plastic-sealed body thining method of the present invention, comprises the following steps:
(1) as shown in Figure 1 and Figure 2, preparing the support plate 1 in the middle of with void region 2, void region 2 size is more than the size needing thinning substrate plastic-sealed body；
(2) it is ready to need to carry out thinning substrate plastic-sealed body；
(3) as shown in Figure 3, Figure 4, attach the thinning adhesive tape 3 of a floor height stickiness at support plate 1 back side, and will treat that thinning substrate plastic-sealed body 4 is positioned over the void region 2 of support plate 1；
(4) as shown in Figure 5, the support plate 1 that step (3) obtains is fixed on the platform 5 of the thinning machine of wafer, according to the thining method of the thinning machine of wafer in prior art, the abrasive wheel of the thinning machine of wafer is thinned to desired thickness to the substrate plastic-sealed body (4) on support plate (1)；
(5) as shown in Figure 6, step (4) thinning metacoxal plate plastic-sealed body 4 is obtained desired thickness, support plate 1 is taken off by platform 5；
(6) as it is shown in fig. 7, after irradiating thinning adhesive tape 3 by UV exposure sources, thinning adhesive tape 3 and support plate 1 are taken off, obtains the substrate plastic-sealed body of desired thickness.
The thickness of above-mentioned involved support plate is less than substrate plastic-sealed body thickness after thinning.
The present invention utilizes tradition wafer stripping apparatus, is embedded in support plate by substrate plastic-sealed body by special support plate, carries out substrate plastic-sealed body thinning back side.In the case of cannot not present invention can be implemented in newly-increasedly input plastic package die, different plastic packaging thickness and the requirement of ultra-thin plastic packaging body thickness can be obtained.
It should be noted that, above example is only in order to illustrate technical scheme and unrestricted, although the present invention being described in detail with reference to preferred embodiment, it will be understood by those within the art that, technical scheme can be modified or equivalent, without deviating from the spirit and scope of technical solution of the present invention, it all should be contained in the middle of scope of the presently claimed invention.
Claims (4)
1. a substrate plastic-sealed body thining method, is characterized in that, comprises the following steps:
(1) preparing the support plate (1) in the middle of with void region (2), substrate plastic-sealed body (4) can be embedded by void region (2)；
(2) it is ready to need to carry out thinning substrate plastic-sealed body；
(3) attach one layer of thinning adhesive tape (3) at support plate (1) back side, and will treat that thinning substrate plastic-sealed body (4) is positioned over the void region (2) of support plate (1)；
(4) being fixed on the platform (5) of the thinning machine of wafer by the support plate (1) that step (3) obtains, the abrasive wheel of the thinning machine of wafer is thinned to desired thickness to the substrate plastic-sealed body (4) on support plate (1)；
(5) after step (4) is thinning, support plate (1) is taken off by platform (5)；
(6) thinning adhesive tape (3) and support plate (1) are taken off, obtain the substrate plastic-sealed body of desired thickness.
2. substrate plastic-sealed body thining method as claimed in claim 1, is characterized in that: the size of described void region (2) is more than the size of substrate plastic-sealed body (4).
3. substrate plastic-sealed body thining method as claimed in claim 1, is characterized in that: after irradiating thinning adhesive tape (3) by UV exposure sources in described step, thinning adhesive tape (3) and support plate (1) are taken off.
4. substrate plastic-sealed body thining method as claimed in claim 1, is characterized in that: the thickness of described support plate is less than substrate plastic-sealed body thickness after thinning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610567921.5A CN105977168B (en) | 2016-07-18 | 2016-07-18 | Substrate plastic-sealed body thining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610567921.5A CN105977168B (en) | 2016-07-18 | 2016-07-18 | Substrate plastic-sealed body thining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105977168A true CN105977168A (en) | 2016-09-28 |
| CN105977168B CN105977168B (en) | 2018-09-28 |
Family
ID=56951791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610567921.5A Active CN105977168B (en) | 2016-07-18 | 2016-07-18 | Substrate plastic-sealed body thining method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105977168B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030102575A1 (en) * | 2001-12-05 | 2003-06-05 | Matsushita Electric Industrial Co., Ltd. | Resin-encapsulated semiconductor device and method for manufacturing the same |
| CN1722392A (en) * | 2004-07-13 | 2006-01-18 | 株式会社迪斯科 | Semiconductor Chip Resin Encapsulation Method |
| US20070278653A1 (en) * | 2006-06-01 | 2007-12-06 | Infineon Technologies Ag | Producing Thin Integrated Semiconductor Devices |
| CN102496596A (en) * | 2011-12-27 | 2012-06-13 | 复旦大学 | Wafer bearing structure and preparation method thereof, and wafer thinning method |
| CN103021882A (en) * | 2012-12-09 | 2013-04-03 | 华天科技（西安）有限公司 | Flat package part manufacture process based on grinding plastic package body |
-
2016
- 2016-07-18 CN CN201610567921.5A patent/CN105977168B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030102575A1 (en) * | 2001-12-05 | 2003-06-05 | Matsushita Electric Industrial Co., Ltd. | Resin-encapsulated semiconductor device and method for manufacturing the same |
| CN1722392A (en) * | 2004-07-13 | 2006-01-18 | 株式会社迪斯科 | Semiconductor Chip Resin Encapsulation Method |
| US20070278653A1 (en) * | 2006-06-01 | 2007-12-06 | Infineon Technologies Ag | Producing Thin Integrated Semiconductor Devices |
| CN102496596A (en) * | 2011-12-27 | 2012-06-13 | 复旦大学 | Wafer bearing structure and preparation method thereof, and wafer thinning method |
| CN103021882A (en) * | 2012-12-09 | 2013-04-03 | 华天科技（西安）有限公司 | Flat package part manufacture process based on grinding plastic package body |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105977168B (en) | 2018-09-28 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191202 Address after: Room A107, research building a, high tech think tank center, Nanhai software technology park, Shishan town, Nanhai District, Foshan City, Guangdong Province Patentee after: Guangdong fozhixin microelectronics technology research Co.,Ltd. Address before: 214135 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee before: National Center for Advanced Packaging Co.,Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Thinning method of substrate plastic package Effective date of registration: 20201224 Granted publication date: 20180928 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: Guangdong fozhixin microelectronics technology research Co.,Ltd. Registration number: Y2020980009995 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20180928 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: Guangdong Xinhua Microelectronics Technology Co.,Ltd.|Guangdong fozhixin microelectronics technology research Co.,Ltd. Registration number: Y2020980009995 |