CN105975421A - Splitting and folding type modular instrument bus device - Google Patents

Abstract

The invention discloses a stacked modular instrument bus device, which comprises N instrument sub-modules, N+1 customized bus connectors, a first bus terminal module and a second bus terminal module; N The instrument sub-modules are stacked sequentially through N-1 custom bus connectors, and the two ends are respectively connected to the first bus terminal module and the second bus terminal module through a custom bus connector; each instrument sub-module is connected by a bus A unit is combined with a functional unit. The invention can make all the instrument sub-modules realize building block-style free stacking combination, break away from the shackles of the traditional backboard structure, and be more flexible; each instrument sub-module has an independent and complete instrument structure, and forms a self-contained system; the bus unit of the instrument sub-module and its The functional unit is separated, and an independent single-board design is adopted, which is more conducive to the upgrade of the instrument bus system and saves development time and design costs.

Description

A folded modular instrument bus device

technical field

The invention belongs to the field of measuring instruments, in particular to the field of a modular instrument bus device.

Background technique

With the increasing complexity of test tasks (such as ground simulation test systems for ships, spacecraft, missiles and other equipment and radar test systems, etc.), each test often needs to rely on multiple instruments to work together. Therefore, most of this kind of measurement needs to develop a dedicated test system. However, the currently developed test system has a high degree of customization and poor adaptability. When the test object or even the model of the test object changes, the collaborative combination method and test protocol of the instrument will change. And the software and hardware of the test system need to be re-customized. This not only caused serious waste, but also brought a lot of inconvenience to the testing and maintenance of equipment, seriously affecting the research and development and upgrading of equipment. Therefore, the modular instrument system will surely become the mainstream development direction of scientific instruments in the future.

However, the current modular instrument systems, such as the modular instrument system based on the PXI instrument bus of National Instruments NI, and the modular instrument system based on the VXI instrument bus of Keysight (formerly Agilent) of the United States, basically use the backplane Chassis-style hardware structure. Backplane chassis-type modular instruments have the following disadvantages: the maximum number of modules that can be expanded by the instrument is limited by the backplane card slots. For example, a backplane chassis-type instrument with 10 card slots can only insert 10 instrument modules at most. If there are too many modules, it is necessary to replace the chassis structure or use two instruments to work together; the minimum volume of the instrument is limited by the minimum chassis size, for example, a simple instrument system only needs 2 to 3 instrument modules to complete the test task, but now Some minimum chassis are 10 card slot backplane chassis, then the volume of the instrument system can only be the same as that of the instrument system containing 10 instrument modules, and cannot be further reduced.

Contents of the invention

In order to overcome the disadvantages of poor expandability and low flexibility of existing backboard chassis-type modular instruments, the present invention provides a stacked modular instrument bus device to realize truly flexible configuration of modular instruments.

The object of the present invention is achieved through the following technical solutions: a stacked modular instrument bus device, including N instrument sub-modules, N+1 custom bus connectors, a first bus terminal module and a first Two bus termination modules, the N is a natural number.

The N instrument sub-modules are sequentially connected in series through N-1 customized bus connectors to form an instrument subsystem. One end of the instrument subsystem is connected to the first bus termination module through a customized bus connector, and the other end is connected to the second bus termination module through a customized bus connector. The customized bus connector can be detached from the instrument sub-module, the first bus terminal module and the second bus terminal module, so that the separation and reassembly of the instrument sub-modules can be realized, which is more flexible.

Further: the instrument sub-module includes a bus unit and a functional unit, and the bus unit is connected to the functional unit through a port adapter.

The instrument sub-module bus unit is used to realize the instrument bus function. Usually, the bus unit mainly includes a bus adapter, a port adapter, a bus driver, a power manager, and a bus protocol manager. The bus adapter is mainly used to realize the physical connection of the instrument bus between multiple instrument sub-modules; the port adapter is used for Connect the functional units; the power manager is used to distribute and manage the power transmitted on the instrument bus and realize the power monitoring of the instrument system; the bus protocol manager is used to realize the protocol function of the instrument bus; the bus driver is used to realize the bus adapter and bus protocol management Instrument bus signal connection between instruments. Since the implementation method of the circuit function of the bus unit is not within the protection scope of the patent of the present invention, other parts except the bus adapter and the port adapter will not be described in detail here.

The instrument sub-module functional unit is used to realize the specific circuit function of the instrument sub-module to which it belongs. For example, in addition to the port adapter connected to the bus unit, the functional unit of the power supply instrument sub-module also includes related circuits such as power conversion and power monitoring, while the functional unit of the 485 communication instrument sub-module is not only connected to the bus unit. In addition to the port adapter, it usually includes 485 communication interface socket, 485 interface chip, FPGA, DSP and other related circuits. Since the hardware implementation method of the functional unit is not within the protection scope of the patent of the present invention, other parts except the port adapter will not be described in detail here.

According to the purpose and function of the instrument sub-module bus unit and the instrument sub-module functional unit, it is only necessary to design the corresponding functional units for different instrument sub-modules, and the bus unit can adopt the same design. Therefore, the design of separating the bus unit of the instrument sub-module from the functional unit of the instrument sub-module is more conducive to the development and upgrading of the instrument system.

Further: the port adapter includes a bus unit port adapter and a functional unit port adapter; the bus unit port adapter is located at the edge of the instrument submodule bus unit, and the functional unit port adapter is located at the functional unit of the instrument submodule edge of the unit. The bus unit port adapter and the functional unit port adapter define a pair of pins that are exactly the same board indirect plug-in.

Further: the pin definition of the board indirect plug-in includes power supply and signal, and the signal includes one or more of the following standard interface modes: UART, SPI, asynchronous peripheral parallel interface, synchronous peripheral parallel interface, PCIe, SRIO .

The power in the pin definition of the board indirect plug-in is mainly from the power manager of the bus unit of the instrument sub-module, which is used to provide the total power for the functional units of the instrument sub-module. The signals in the pin definition of the board indirect plug-in are used to realize operations such as data transmission and control performed by the instrument sub-module bus unit on the connected instrument sub-module functional unit. Since the data transmission, control method, and power control and management method are not within the protection scope of the patent of the present invention, no further detailed description will be given here.

Further: the instrument sub-module bus unit includes a bus unit port adapter, a first module bus adapter and a second module bus adapter; the first module bus adapter and the second module bus adapter are respectively located in the The top and bottom layers of the PCB circuit board of the instrument sub-module bus unit.

Further: the first bus termination module includes an instrument housing structure with a handle on the left side and a first termination module circuit board; the first termination module circuit board is located on the left side with The right side of the instrument housing structure of the handle; the second bus termination module includes an instrument housing structure with a handle on the right side and a second termination module circuit board; the second termination module circuit The plate is located on the left side of the instrument case structure with the carrying handle on the right side.

Further: the first termination module circuit board includes a first termination bus adapter; the first termination bus adapter is located on the right side of the first termination module circuit board; the second termination module The circuit board includes a second termination bus adapter; the second termination bus adapter is located on the left side of the second termination module circuit board.

Further: the first modular bus adapter, the second modular bus adapter, the first terminating bus adapter and the second terminating bus adapter have the same structure and definition, and are collectively referred to as bus adapters; The bus adapter includes M surface mount vertical sockets, where M is a natural number.

Further: the M surface mount vertical sockets are arranged in a line; the pin definitions of the M surface mount vertical sockets include instrument bus power and instrument bus signals; the instrument bus power includes multiple voltage amplitudes; The instrument bus signal can be divided into two types according to level standards, namely CAN differential signal and MLVDS differential signal.

Further: the customized bus connector includes K bus connection PCB circuit boards with gold finger structures at both ends, and K is a natural number less than or equal to M. The golden finger structure of the bus connection PCB circuit board is used to be inserted into the socket of the bus adapter to realize electrical connection.

There are mainly three connection modes of the custom bus connector, the first mode is: one end is connected to the first terminal bus adapter, and the other end is connected to the second module bus adapter of the instrument sub-module; the second mode is: one end is connected to a The first module bus adapter of an instrument sub-module, the other end is connected to the second module bus adapter of another instrument sub-module; the third method is: one end is connected to the first module bus adapter of the instrument sub-module, and the other end is connected to the second end Connect the bus adapter.

The instrument sub-module is composed of a bus unit and a functional unit, the instrument sub-module bus unit is used to realize the instrument bus function of the stacked modular instrument system, and the instrument sub-module functional unit is used to realize the corresponding The specific functions of the instrument sub-modules, different instrument sub-modules only have differences in their functional units, and their bus units are basically the same.

Further: the instrument sub-module bus unit includes a bus unit port adapter, a first module bus adapter positioned at the top layer of the bus unit circuit board, a second module bus adapter positioned at the bottom layer of the bus unit circuit board, and bus manager-related The circuit unit of the instrument submodule; the functional unit of the instrument submodule includes a function unit port adapter and a circuit unit for realizing specific functions of the instrument submodule. The bus unit port adapter of the instrument submodule bus unit is connected to the functional unit port adapter of the instrument submodule functional unit to realize the power supply and signal interconnection between the instrument submodule bus unit and the instrument submodule functional unit . The first module bus adapter and the second module bus adapter are connected through PCB via holes, so as to realize the power supply and signal penetration of the stacked modular instrument bus on the bus unit circuit board.

Further: the first bus termination module includes an instrument housing structure with a handle on the left side and a first termination module circuit board; the second bus termination module includes a right side with a handle The instrument case structure and a second termination module circuit board. The first termination module circuit board includes a first termination bus adapter and a corresponding termination circuit unit; the second termination module circuit board includes a second termination bus adapter and a corresponding termination circuit unit. The first termination module circuit board and the second termination module circuit board are used to realize the termination impedance matching of the stacked modular instrument bus; the instrument housing structure with a handle is mainly used to realize The support protection and handling function of the instrument structure.

Further: the customized bus connector is a PCB circuit board with gold fingers at both ends, and the gold fingers can be inserted into the first module bus adapter, the second module bus adapter, the first terminal bus adapter and the second module bus adapter. The bus adapters are connected at both ends to realize the electrical interconnection of the stacked modular instrument bus. The customized bus connector has the ability to transmit high-speed digital signals, and can ensure the signal integrity and power integrity of the stacked modular instrument bus. The surface of the customized bus connector is coated with insulating and wear-resistant resin material to play a protective role.

Further: the first terminal bus adapter is connected to the second module bus adapter of the first instrument submodule through the first customized bus connector; the second module bus adapter of the first instrument submodule is connected to the second module bus adapter through the PCB via hole The first module bus adapter is connected; the first module bus adapter of the first instrument sub-module is connected with the second module bus adapter of the second instrument sub-module through the second customized bus connector; and so on until the Nth instrument sub-module The first module bus adapter of the module is connected to the second terminating bus adapter through the N+1th customized bus connector to form an instrument bus plane perpendicular to the bus unit circuit board, realizing the stacked modularization The power supply and signal of the instrument bus are transmitted among all the instrument sub-module bus units, the circuit board of the first termination module and the circuit board of the second termination module.

Further: the first terminating bus adapter, the second terminating bus adapter, the first modular bus adapter and the second modular bus adapter have exactly the same hardware structure and pin definition, all including M A surface-mounted vertical socket is used to transmit the power and signals of the stacked modular instrument bus, and the M is a natural number. The power supply of the collapsible modular instrument bus has multiple voltage amplitudes, which can be configured according to actual needs, and is derived from an instrument sub-module with power supply function in the collapsible modular instrument system. The signals of the stacked modular instrument bus can be divided into two types according to the level standard, namely CAN differential signal and MLVDS differential signal; wherein the CAN differential signal is mainly used to realize the module management of the stacked modular instrument system , fault diagnosis, etc.; among them, the MLVDS differential signal is mainly used to realize functions such as synchronization, triggering, and data transmission of the modularized instrument system.

Further: the bus manager includes a power manager, a bus driver and a bus protocol manager. The power manager is used to distribute and manage the power of the stacked modular instrument bus and realize power monitoring; the bus protocol manager is used to realize the protocol function of the stacked modular instrument bus; the bus driver Signals for introducing the tiled modular instrument bus to the bus protocol manager.

Further: the bus unit port adapter and the functional unit port adapter each include a board indirect plug-in, and the two are used as a pair. The board-to-board plug-in pin definitions of the bus unit port adapter and the functional unit port adapter are exactly the same, including power supply and signal. The bus unit port adapter and the function unit port adapter are mainly used to connect the bus manager of the instrument sub-module bus unit and the circuit unit of the instrument sub-module function unit.

Further: the power on the bus unit port adapter and the function unit port adapter comes from the power manager in the bus manager of the instrument submodule bus unit, which is mainly used for the power supply of the instrument submodule function unit The circuit unit provides the total power supply. The signals on the bus unit port adapter and the function unit port adapter mainly realize that the circuit unit of the instrument submodule functional unit performs data transmission to the bus protocol manager in the bus manager of the instrument submodule bus unit, Operations such as control and status reading, including the following standard interface methods: UART, SPI, asynchronous peripheral parallel interface, synchronous peripheral parallel interface, PCIe, SRIO, etc., can be selected according to the needs of the sub-module functional units of the instrument .

The beneficial effects of the present invention are: a stacked modular instrument bus device provided by the present invention can enable all instrument sub-modules to realize free stacking and combination of building blocks, breaking away from the shackles of the traditional backboard structure and being more flexible; each instrument The sub-module has an independent and complete instrument structure, forming a self-contained system; the bus unit of the instrument sub-module is separated from the functional unit of the instrument sub-module, and adopts an independent single-board design, which is more conducive to the upgrade of the instrument bus system and saves development time and design costs.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following is a brief introduction to the drawings that need to be used in the description of the embodiments:

Fig. 1 is a system structure diagram of a stacked modular instrument bus device according to an embodiment of the present invention;

Fig. 2 is a schematic diagram of the internal connection of the stacked modular instrument bus device according to the embodiment of the present invention;

FIG. 3 is a partial structural schematic diagram of a stacked modular instrument bus device according to an embodiment of the present invention;

Fig. 4 is the connection schematic diagram of the stacked modular instrument bus device of the embodiment of the present invention;

In the figure, 1-first bus termination module, 2-instrument sub-module, 3-second bus termination module, 4-custom bus connector; 5-instrument sub-module bus unit; 51-bus unit port adapter; 52 - the first module bus adapter; 53 - the second module bus adapter; 54 - the bus unit circuit board; 6 - the instrument sub-module functional unit; 61 - the functional unit port adapter; 7 - the first terminal module circuit board; 71 - the first One end is connected to the bus adapter; 8-the second end is connected to the module circuit board; 81-the second end is connected to the bus adapter;

detailed description

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, other embodiments obtained by persons of ordinary skill in the art without making creative efforts all belong to the protection scope of the present invention.

The present invention provides a stacked modular instrument bus device, which includes N instrument sub-modules 2, N+1 customized bus connectors 4, a first bus termination module 1 and a second bus termination module 3 , the N is a natural number.

As shown in FIG. 1 , the N instrument sub-modules 2 are sequentially connected in series through N-1 customized bus connectors 4 to form an instrument subsystem. One end of the instrument subsystem is connected to the first bus termination module 1 through a customized bus connector 4 , and the other end is connected to the second bus termination module 3 through a customized bus connector 4 . The customized bus connector 4 can be detached from the instrument sub-module 2, the first bus termination module 1 and the second bus termination module 3, so as to realize the separation and reassembly of the instrument sub-modules, which is more flexible.

The instrument sub-module 2 includes a bus unit 5 and a function unit 6, and the bus unit 5 is connected to the function unit 6 through a port adapter.

The port adapters include a bus unit port adapter 51 and a functional unit port adapter 61; the bus unit port adapter 51 is located at the edge of the instrument submodule bus unit 5, and the functional unit port adapter 61 is located at the instrument submodule The edge of the module functional unit 6.

The bus unit port adapter 51 and the functional unit port adapter 61 define exactly the same board-to-board plug-in for a pair of pins. In the embodiment shown in Fig. 2, described bus unit port adapter 51 adopts QFS-078-01-SL-D-RA of SAMTEC Company, and described functional unit port adapter 61 adopts QMS-078-01-SL-D-RA of SAMTEC Company SL-D-RA.

The instrument sub-module bus unit is used to realize the instrument bus function. Usually, the bus unit mainly includes a bus adapter, a port adapter, a bus driver, a power manager, and a bus protocol manager. The bus adapter is mainly used to realize the physical connection of the instrument bus between multiple instrument sub-modules; the port adapter is used for Connect the functional units; the power manager is used to distribute and manage the power transmitted on the instrument bus and realize the power monitoring of the instrument system; the bus protocol manager is used to realize the protocol function of the instrument bus; the bus driver is used to realize the bus adapter and bus protocol management Instrument bus signal connection between instruments. Since the implementation method of the circuit function of the bus unit is not within the protection scope of the patent of the present invention, other parts except the bus adapter and the port adapter will not be described in detail here.

The instrument sub-module functional unit is used to realize the specific circuit function of the instrument sub-module to which it belongs. For example, in addition to the port adapter connected to the bus unit, the functional unit of the power supply instrument sub-module also includes related circuits such as power conversion and power monitoring, while the functional unit of the 485 communication instrument sub-module is not only connected to the bus unit. In addition to the port adapter, it usually includes 485 communication interface socket, 485 interface chip, FPGA, DSP and other related circuits. Since the hardware implementation method of the functional unit is not within the protection scope of the patent of the present invention, other parts except the port adapter will not be described in detail here.

According to the purpose and function of the instrument sub-module bus unit and the instrument sub-module functional unit, it is only necessary to design the corresponding functional units for different instrument sub-modules, and the bus unit can adopt the same design. Therefore, the design of separating the bus unit of the instrument sub-module from the functional unit of the instrument sub-module is more conducive to the development and upgrading of the instrument system.

The pin definitions of the bus unit port adapter 51 and the functional unit port adapter 61 include power and signals. The power mainly comes from the power manager of the bus unit of the instrument sub-module, which is used to provide the total power for the functional unit 6 of the instrument sub-module. The signals include one or more of the following standard interface methods: UART, SPI, asynchronous peripheral parallel interface, synchronous peripheral parallel interface, PCIe, SRIO, used to realize the 5 pairs of instruments connected to the instrument sub-module bus unit The sub-module functional unit 6 performs operations such as data transmission and control. Since the data transmission, control method, and power control and management method are not within the protection scope of the patent of the present invention, no further detailed description will be given here.

As shown in Figure 3, the instrument sub-module bus unit 5 includes a first module bus adapter 52 and a second module bus adapter 53; the first module bus adapter 52 and the second module bus adapter 53 are located at The top layer and the bottom layer of the PCB circuit board of the instrument sub-module bus unit 5 .

As shown in Figure 1, the first bus termination module 1 includes an instrument housing structure with a handle on the left side and a first termination module circuit board 7; the first termination module circuit board 7 is located at The right side of the instrument housing structure with a handle on the left side; the second bus termination module 3 includes an instrument housing structure with a handle on the right side and a second terminal module circuit board 8; The second terminal module circuit board 8 is located on the left side of the instrument housing structure with a handle on the right side.

As shown in FIG. 2, the first termination module circuit board 7 includes a first termination bus adapter 71; the first termination bus adapter 71 is located on the right side of the first termination module circuit board 7; The second termination module circuit board 8 includes a second termination bus adapter 81 ; the second termination bus adapter 81 is located on the left side of the second termination module circuit board 8 .

The first modular bus adapter 52, the second modular bus adapter 53, the first terminating bus adapter 71 and the second terminating bus adapter 81 have the same structure and definition, and are collectively referred to as bus adapters; The bus adapter includes M surface mount vertical sockets, where M is a natural number.

In the embodiment shown in FIG. 2 and FIG. 3 , the bus adapter includes three surface-mounted vertical sockets arranged in a line. The three sockets in the bus adapter adopt the HSEC8-DV series connectors of SAMTEC Company, and the product models are: HSEC8-130-01-L-DV-A, HSEC8-150-01-L-DV-A, HSEC8 -160-01-L-DV-A.

The pin definitions of the bus adapter include instrument bus power and instrument bus signals; the instrument bus power includes multiple voltage amplitudes; the instrument bus signals can be divided into two types according to level standards, which are CAN differential signals and MLVDS differential signals.

The custom bus connector 4 includes K bus connection PCB circuit boards whose two ends are gold finger structures, and the K is a natural number less than or equal to M; the gold finger structure of the bus connection PCB circuit board is used to be inserted into the The electrical connection is made in the socket of the bus adapter described above.

In the embodiment shown in FIG. 1 , FIG. 2 and FIG. 3 , the customized bus connector 4 only includes a bus connection PCB circuit board with golden finger structures at both ends. The thickness of the bus connection PCB circuit board is determined by the socket type on the bus adapter, and is 1.6 mm. The length of the bus connection PCB circuit board is determined by the total length and arrangement of HSEC8-130-01-L-DV-A, HSEC8-150-01-L-DV-A and HSEC8-160-01-L-DV-A Gap decision. The width of the bus connection PCB circuit board is determined by the shell thickness of the two connected instrument sub-modules.

There are mainly three connection modes of the custom bus connector 4, the first mode is: one end is connected to the first terminal bus adapter 71, and the other end is connected to the second module bus adapter 53 of the instrument sub-module; the second mode is: One end is connected to the first module bus adapter 52 of a certain instrument submodule, and the other end is connected to the second module bus adapter 53 of another instrument submodule; mode three is: one end is connected to the first module bus adapter 52 of the instrument submodule, and the other end is connected to the second module bus adapter 53 of another instrument submodule; The second terminal bus adapter 81 is connected.

The connection relationship of the stacked modular instrument bus device will be further described below with the embodiment shown in FIG. 2 and FIG. 3 and the connection schematic diagram shown in FIG. 4 . For a modular instrument system containing N instrument sub-modules, the connection relationship of each part can be described as:

Each instrument sub-module bus unit 5 is connected to a functional unit port adapter 61 of an instrument sub-module functional unit 6 through a bus unit port adapter 51 to form an instrument sub-module.

One end of the first customized bus connector 4 is partially inserted into the vertical socket of the first module bus adapter 52 of the first instrument submodule, and the other end of the gold finger is partially inserted into the second module bus adapter 53 of the second instrument submodule In the vertical socket, the connection between the first instrument sub-module and the second instrument sub-module is realized.

One end of the second customized bus connector 4 is partially inserted into the vertical socket of the first module bus adapter 52 of the second instrument submodule, and the other end of the gold finger is partially inserted into the second module bus adapter 53 of the third instrument submodule In the vertical socket, the connection between the second instrument sub-module and the third instrument sub-module is realized.

By analogy, N-1 custom bus connectors 4 realize the connection of N instrument sub-modules to form an instrument subsystem.

One end of the gold finger of the Nth customized bus connector 4 is partially inserted into the vertical socket of the first terminal bus adapter 71, and the other end of the gold finger is partially inserted into the vertical socket of the second module bus adapter 53 of the first instrument submodule , realize the connection between the instrument subsystem and the first bus termination module 1 .

One end of the gold finger of the N+1 customized bus connector 4 is partially inserted into the vertical socket of the second terminating bus adapter 81, and the other end of the gold finger is partially inserted into the first module bus adapter 52 of the Nth instrument submodule. In the vertical socket, the connection between the instrument subsystem and the second bus termination module 3 is realized.

The contents not described in detail in the description of the present invention belong to the prior art known to those skilled in the art.

Claims (9)

1. a stacked formula modular instrument bus unit, it is characterised in that: it includes that N number of instrument submodule (2), N+1 are individual fixed Bussing connector processed (4), a first bus end connection module (1) and a second bus end connection module (3), described N For natural number；

Described N number of instrument submodule (2) is sequentially connected in series by N-1 customization Bussing connector (4), forms instrument System；

Described instrument subsystem one end is connected, separately with the first bus end connection module (1) by customization Bussing connector (4) One end is connected with the second bus end connection module (3) by customization Bussing connector (4)；

Described instrument submodule (2) includes a bus unit (5) and a functional unit (6)；Described bus unit (5) It is connected with described functional unit (6) by port adapter.

Stacked formula modular instrument bus unit the most according to claim 1, it is characterised in that: described port adapter includes one Individual bus unit port adapter (51) and a functional unit port adapter (61)；Described bus unit port adapter (51) being positioned at the edge of described instrument submodule bus unit (5), described functional unit port adapter (61) is positioned at described The edge of instrument submodule functional unit (6).

Stacked formula modular instrument bus unit the most according to claim 2, it is characterised in that: described bus unit port adaptation Device (51) and described functional unit port adapter (61) are connector between a pair pin definitions identical plate；Described plate Between the pin definitions of connector comprise power supply and signal, described signal include one or more of standard interface mode: UART, SPI, asynchronous peripheral parallel interface, synchronous peripheral parallel interface, PCIe, SRIO.

Stacked formula modular instrument bus unit the most according to claim 1, it is characterised in that: described instrument submodule bus list Unit (5) includes a first module bus adapter (52) and a second module bus adapter (53)；Described first Module bus adapter (52) and described second module bus adapter (53) lay respectively at described instrument submodule bus unit (5) top layer of PCB and bottom.

Stacked formula modular instrument bus unit the most according to claim 1, it is characterised in that: described first bus end connection module (1) include that a left side is with the Instrument shell structure of handle and a first termination module circuit board (7)；Described first end Connection module circuit board (7) is positioned at the right side with the Instrument shell structure of handle, the described left side；Described second bus end connection module (3) Comprise a right side with the Instrument shell structure of handle and a second termination module circuit board (8)；Described second termination mould Block circuit board (8) is positioned at the left side with the Instrument shell structure of handle, the described right side.

Stacked formula modular instrument bus unit the most according to claim 5, it is characterised in that: described first termination module circuit Plate (7) includes a first terminated bus adapter (71)；Described first terminated bus adapter (71) is positioned at described first The right side of termination module circuit board (7)；Described second termination module circuit board (8) includes a second terminated bus adapter (81)；Described second terminated bus adapter (81) is positioned at the left side of the second termination module circuit board (8).

7. according to the stacked formula modular instrument bus unit described in claim 4 or claim 6, it is characterised in that: described first Module bus adapter (52), described second module bus adapter (53), described first terminated bus adapter (71) with And described second terminated bus adapter (81) all includes M surface-mount type vertical socket, described M is natural number.

Stacked formula modular instrument bus unit the most according to claim 7, it is characterised in that: described M surface-mount type is vertical Socket word order；The pin definitions of described M surface-mount type vertical socket includes instrument bus power supply and instrument bus signal；Institute State instrument bus power supply and include multiple voltage amplitude；Described instrument bus signal can be divided into 2 types according to level standard, respectively For CAN differential signal and MLVDS differential signal.

Stacked formula modular instrument bus unit the most according to claim 7, it is characterised in that: described customization Bussing connector (4) Be the bus connection PCB circuit board of golden finger structure including K two ends, described K is the natural number less than or equal to M；Institute The golden finger structure stating bus connection PCB circuit board realizes electrical connection in the socket being inserted into described bus adapter；

The connected mode of described customization Bussing connector (4) mainly has three kinds, and mode one is: it is total that one end connects described first termination Line adapter (71), the other end connects the second module bus adapter (53) of described instrument submodule；Mode two is: one end Connecting the first module bus adapter (52) of a certain instrument submodule, the second module that the other end connects another instrument submodule is total Line adapter (53)；Mode three is: one end connects the first module bus adapter (52) of instrument submodule, and the other end connects Described second terminated bus adapter (81).