CN105957850B - A kind of power module of integrated heat spreader - Google Patents
A kind of power module of integrated heat spreader Download PDFInfo
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- CN105957850B CN105957850B CN201610362582.7A CN201610362582A CN105957850B CN 105957850 B CN105957850 B CN 105957850B CN 201610362582 A CN201610362582 A CN 201610362582A CN 105957850 B CN105957850 B CN 105957850B
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- eliminating medium
- power module
- insulating substrate
- heat
- heat eliminating
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- Computer Hardware Design (AREA)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of power modules of integrated heat spreader, including insulating substrate, the insulating substrate is equipped with chip set, it is characterized in that, radiator base is equipped with below the insulating substrate, the radiator base includes heat eliminating medium entrance and heat eliminating medium outlet, and heat eliminating medium enters inside radiator base from heat eliminating medium entrance and contacts with the bottom of insulating substrate, then is exported and flowed out by heat eliminating medium.The present invention eliminates thermal grease layer by the way that power module is integrated with radiator；Reduce heat-transfer path, heat eliminating medium can directly exchange heat with the metal layer below insulating substrate, eliminate secondary welding layer, backplane level, thermal grease layer and the radiator in conventional mounting structure, not only simplify structure, the thermal resistance of power module is also reduced, the reliability of power module is improved.
Description
Technical field
The present invention relates to power semiconductor modular, especially a kind of power module of integrated heat spreader.
Background technique
Energy-saving and emission-reduction, low carbon development are global problems, and each state all has appreciated that in accordance with natural environment is wanted in development.With
Environmentally protective establishment and propulsion in the world, the development and application prospect of power semiconductor is more wide, has both met the energy in China
The industry Situation of source anxiety is also to build a harmonious society and the requirement of sustainable development.Current semiconductor power cell industry is swift and violent
Development, power density are continuously improved, and the performance and reliability of power module are often closely related with heat dissipation.Traditional power module
Structure mainly includes shell, insulating substrate, bottom plate etc., applies heat-conducting silicone grease in the lower surface of power module bottom plate when use, then
Power module is installed on a heat sink.
However, heat-conducting silicone grease is although relatively thin, but its thermal conductivity is low, thermal resistance is big, and heat-conducting silicone grease is with active time
Increase can gradually dry out, and performance further decreases.Conventional power module structure and mounting means make chip to the heat of radiator
It hinders that larger, efficiency is lower, is unable to satisfy power module miniaturization and the requirement of high-reliability.
Summary of the invention
Goal of the invention：In view of the above-mentioned drawbacks of the prior art, the present invention is intended to provide a kind of can reduce thermal resistance
The power module of integrated heat spreader.
Technical solution：A kind of power module of integrated heat spreader, including insulating substrate, the insulating substrate are equipped with chip
Set, the insulating substrate lower section are equipped with radiator base, and the radiator base includes heat eliminating medium entrance and heat eliminating medium
Outlet, heat eliminating medium enter inside radiator base from heat eliminating medium entrance and contact with the bottom of insulating substrate, then by dissipating
Thermal medium outlet outflow.
Further, the bottom of the insulating substrate is connected with welding layer, is equipped with and divides between welding layer and radiator base
Flowing plate, the flow distribution plate are equipped in the corresponding position of heat eliminating medium entrance and heat eliminating medium outlet line and shunt beam, flow distribution plate
Bottom, which is equipped with, shunts grid group, shunts grid group for flow distribution plate and is separated into multiple shunting zones.
Further, the number of the shunting zone and the number of insulating substrate are identical, and the lower section of each insulating substrate is right
Answer a shunting zone.
Further, the shunting grid group includes that multiple row shunts grid, and multiple row shunts grid and shunts after beam intersects and will each divide
Stream is distinguished and is divided into two radiating areas, and the shunting grid include multiple shunting teeth.
Further, the welding layer is equipped with welding heat release hole in the corresponding position of radiating area, welds the face of heat release hole
Product is not less than the area of radiating area.
Further, the radiator base is equipped with diversion trench in heat eliminating medium entrance and heat eliminating medium exit.
Further, the flow distribution plate bottom is equipped with groove corresponding with diversion trench, and diversion trench is cooperatively formed with groove and led
Runner.
Further, the diversion trench end is connected with and the vertically disposed heat eliminating medium dashpot of diversion trench.
Further, sealing strip is equipped between the radiator base and flow distribution plate.
Further, it is equipped with boss inside the radiator base, boss is placed in radiating area, and the height of boss is no more than
The thickness of flow distribution plate.
Beneficial effect：The present invention eliminates thermal grease layer by the way that power module is integrated with radiator；It reduces
Heat-transfer path, heat eliminating medium can directly exchange heat with the metal layer below insulating substrate, eliminate in heat-transfer path and pacify
Secondary welding layer, backplane level, thermal grease layer and the radiator of dress, not only simplify structure, also reduce the heat of power module
Resistance, improves the reliability of power module.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is explosive view of the invention；
Fig. 3 is the structural schematic diagram of radiator base；
Fig. 4 is the radiator base structural schematic diagram for being equipped with boss；
Fig. 5 is the assembling schematic diagram of flow distribution plate and radiator base；
Fig. 6 (a), Fig. 6 (b) are that heat eliminating medium flows to schematic diagram；
Fig. 7 is power module and radiator schematic bottom view；
Fig. 8 is the power module schematic bottom view for being equipped with flow distribution plate.
Specific embodiment
The technical program is described in detail below by a most preferred embodiment and in conjunction with attached drawing：
As shown in Figure 1 and Figure 2, a kind of power module of integrated heat spreader, including insulating substrate 1, due to power mould of the present invention
Radiator is integrated in block, 1 lower section of power module insulating substrate is easy to make due to the presence of heat eliminating medium pressure when in use
At the deformation of insulating substrate 1 and layer fatigue.In order to avoid the deformation of insulating substrate 1 and the premature fatigue failures of welding layer 3, insulate base
Dielectric ceramic layer in plate 1 preferentially selects the Al with a thickness of 0.63mm or more2O3Perhaps AlN or Si3N4, and for compared with
The insulating substrate 1 of large area, it is proposed that weld 1 subregion of insulating substrate, i.e. the setting of flow distribution plate more than 4 shunts beam 41；The insulation
Substrate 1 is equipped with chip set, and chip set can be Si base igbt chip, Si base FRD chip, be also possible to broad-band gap SiC-
The hybrid combining of MOSFET chip, SiC diode chip for backlight unit or said chip.The bottom of insulating substrate 1 is welded with welding layer
3, chip set, insulating substrate 1 and welding layer 3 are respectively mounted inside the shell, and radiator base 2 is equipped with below the insulating substrate 1,
Radiator base is as shown in figure 3, in order to mitigate weight, radiator base 2 can use aluminum alloy materials；Radiator base 2 with
Shell is interlocked, and the radiator base 2 includes heat eliminating medium entrance 21 and heat eliminating medium outlet 22, and the heat dissipation marked in figure is situated between
Matter entrance 21 and heat eliminating medium outlet 22 can be interchanged, and both sides are identical two holes, be not intended to limit it is specific which be scattered
Thermal medium entrance 21 which be heat eliminating medium outlet 22, specifically with the flow direction of heat eliminating medium depending on；Outside heat eliminating medium entrance 21
The outside of side and heat eliminating medium outlet 22 is mounted on conduit 7, for accessing and picking out heat eliminating medium, radiator base 2 and outer
Be equipped with sealing strip 5 between shell, heat eliminating medium from heat eliminating medium entrance 21 enter the inside of radiator base 2 and with insulating substrate 1
Bottom contact, then by heat eliminating medium outlet 22 flow out, heat eliminating medium can directly with the metal layer of 1 lower surface of insulating substrate into
Row exchanges heat, and the insulating substrate 1 in the present embodiment is insulation copper-clad base plate, and metal layer is layers of copper.
Flow distribution plate 4 is equipped between welding layer 3 and radiator base 2, flow distribution plate 4 is connected with insulating substrate 1 by welding layer 3
It connects, for the ease of the welding of insulating substrate 1 and flow distribution plate 4, flow distribution plate 4 is using fine copper or uses aluminium surface nickel plating or use
AlSiC plating nickel on surface；As shown in figure 8, flow distribution plate 4 exports the corresponding position of 22 lines in heat eliminating medium entrance 21 and heat eliminating medium
Place, which is equipped with, shunts beam 41, and 4 bottom of flow distribution plate, which is equipped with, shunts 42 groups of grid, shunts 42 groups of grid and flow distribution plate 4 is separated into multiple shunting zones,
The number of shunting zone is identical as the number of insulating substrate 1, and the lower section of each insulating substrate 1 corresponds to a shunting zone, shunts grid
42 groups include that multiple row shunts grid 42, and multiple row shunts and each shunting zone is separated into two heat dissipations after grid 42 intersect with shunting beam 41
Area, the shunting grid 42 include multiple shunting teeth.There are three insulating substrates 1 in the present embodiment, in order to enhance heat dissipation effect, each
The corresponding shunting zone of insulating substrate 1 and two radiating areas.
Insulating substrate 1, flow distribution plate 4 are matched with radiator base 2, collectively constitute the runner of liquid cooling heat radiator.Insulate base
The partial metal layers of 1 lower section of plate are connect by welding layer 3 with flow distribution plate 4,41 pairs of beam heat dissipations of shunting grid 42 and shunting of flow distribution plate 4
Medium is shunted, and the heat that chip set generates can be taken out of in time by insulating substrate 1, flow distribution plate 4.
Shunting 42 groups of grid includes that multiple row shunts grid 42, and the shunting grid 42 include multiple shunting teeth, and each column shunts 42 quilt of grid
It shunts beam 41 and is divided into two parts up and down, the number that upper and lower two parts shunt tooth can be identical, can also be corresponding absolutely according to its
The local temperature of edge substrate 1 adjusts the shunting tooth numbers of top and the bottom.
Shunting grid 42 described in each column include 4~12 shunting teeth, and shunting tooth in the present embodiment is cuboid, can also be used
Section is the shunting tooth of inverted trapezoidal or triangle, or the gap setting shunted between tooth is arc-shaped shape.
Welding layer 3 is equipped with welding heat release hole 31 in the corresponding position of radiating area, and the area of welding heat release hole 31 is not less than
The area of radiating area, the effect of welding layer 3 in the present embodiment are welding insulation substrate 1 and flow distribution plate 4, welding region size and
Shape can be designed according to the size of insulating substrate 1, and the present embodiment is it can be seen that welding heat release hole 31 is three days font
Hole, can also be according to the shape of insulating substrate 1 or the Adjusting Shape welding layer 3 of flow distribution plate 4 in practical operation, and welding layer 3 is also
It can play the role of sealing；In order to guarantee that preferable welded seal effect, and reduction chip are built to the thermal resistance of flow distribution plate 4
View is welded using tin cream vacuum technology.
Radiator base 2 is equipped with diversion trench 23 at heat eliminating medium entrance 21 and heat eliminating medium outlet 22.
4 bottom of flow distribution plate is equipped with groove 43 corresponding with diversion trench 23, and diversion trench 23 and groove 43 cooperatively form honeycomb duct,
The heat eliminating medium entrance 21 and heat eliminating medium outlet 22 are round hole, therefore in order to be adapted with round hole, diversion trench 23
It is semi-cylindrical form with groove 43, diversion trench 23 and 43 split of groove form cylindrical honeycomb duct, if heat eliminating medium entrance
21 and heat eliminating medium outlet 22 be not round hole, diversion trench 23 and groove 43 can also be according to heat eliminating medium entrances 21 and heat dissipation Jie
It is elliptical cylinder that matter outlet 22, which is set as other shapes such as cuboid or bottom surface,.
23 end of diversion trench, i.e. diversion trench 23 are not connected to one end of heat eliminating medium entrance 21 or heat eliminating medium outlet 22, even
Be connected to the vertically disposed heat eliminating medium dashpot 24 of diversion trench 23, heat eliminating medium dashpot 24 is cuboid in the present embodiment
Shape, is also possible to semicolumn or section is the other shapes such as the cylinder of ellipse, shunts of length no more than heat eliminating medium of beam 41
Heat eliminating medium dashpot 24 the distance between of the heat eliminating medium dashpot 24 at heat eliminating medium outlet 22 at entrance 21.
Above-mentioned diversion trench 23, groove 43 and diversion channel all have buffer function, and heat eliminating medium can be prevented short-circuit, i.e. heat dissipation is situated between
Matter is flowed out from shortest path, and the imperfect flow in runner affects heat dissipation uniformity；The shunting beam at 4 both ends of flow distribution plate simultaneously
41 can also be directly entered runner to avoid entrance heat eliminating medium, be conducive to the uniformity in flow field, to guarantee there is good dissipate
Thermal effect.
It is equipped with sealing strip 5 between radiator base 2 and flow distribution plate 4, is equipped with chamfering on the inside of the top edge of radiator base 2,
Chamfering in the present embodiment is quadrant shape, also is provided with four at the gap that flow distribution plate 4 and radiator base 2 are interlocked
The chamfering of/mono- circumferential shapes is equipped with sealing strip 5, the sealing strip between the chamfering of radiator base 2 and the chamfering of flow distribution plate 4
5 can be the glue that is sealing adhesive that sealing ring is also possible to injection, and sealing strip 5 is pushed down by shell, by flow distribution plate 4 and radiator base
2 gap sealings fastened, it is ensured that excessive without heat eliminating medium inside radiator；Welding layer 3 welds flow distribution plate 4 and insulating substrate 1
Together, effectively heat eliminating medium is prevented to flow into chip set.
As shown in figure 4, being equipped with boss 6 inside the radiator base 2, boss 6 is placed in radiating area, the height of boss 6
No more than the thickness of flow distribution plate 4, close to heat eliminating medium dashpot 24 boss 6 its close to the side of heat eliminating medium dashpot 24 be
It is vertically arranged, other boss 6 are terrace edge shape, and for easy to process and installation, four angles of the bottom of boss 6 are cut away
One fritter triangle；
The main function of boss 6：One, prevent heat eliminating medium short-circuit, i.e., heat eliminating medium is flowed directly out from nearest path；
Two, it contacts heat eliminating medium preferably with the metal layer of 1 lower section of insulating substrate, increases local velocity, reduces flowing
Boundary layer thickness, to realize preferable heat transfer effect.Therefore, the height of boss 6 determines the local velocity of heat eliminating medium, can be with
For reducing the flow-boundary-layer thickness of heat eliminating medium, increasing local convective heat transfer coefficient, the height of boss 6 is greater than flow distribution plate 4
The thickness for shunting 42 groups of grid, can effectively avoid the laminar condition of heat eliminating medium at this time.The number phase of the number of boss 6 and radiating area
It together, is determined by the number of insulating substrate 1；Boss 6 is structure as a whole with radiator base 2；Or spiral shell is set in boss 6
Boss 6 can be fixed on inside radiator base 2 by hole by bolt；Or boss 6 is fixed on by way of bonding scattered
Inside hot device pedestal 2.
Installation method of the invention：
Firstly, boss 6 is fixed on inside the radiator base 2 by modes such as screws or bonding, it is solid using screw
Periodically, the threaded hole inside the radiator base 2 is blind hole；Then insulation is welded on by insulating substrate 1 and by welding layer 3
The flow distribution plate 4 of 1 lower section of substrate is together on radiator base 2.At this point, flow distribution plate 4, insulating substrate 1, radiator base 2, convex
Platform 6 forms complete flow passage structure.
It is equipped with chamfering on the inside of 2 top edge of radiator base, and at the gap that is interlocked of flow distribution plate 4 and radiator base 2
It also is provided with chamfering, its junction forms slot when fastening, as shown in figure 5, injection is sealing adhesive and glue or places sealing strip 5 in slot,
Shell is installed after sealing, is locked together the radiator base 2, flow distribution plate 4, shell using screw.Finally, being situated between in heat dissipation
The outside of matter entrance 21 and heat eliminating medium outlet 22 outside install conduit, for accessing and picking out heat eliminating medium, as Fig. 6 (a),
Shown in 6 (b), the back side of power module entirety is as shown in Figure 8.
In the description of the present invention, it is to be understood that, term "horizontal", "vertical", "upper", "lower", " width ", " just
The orientation or positional relationship of the instructions such as face ", " back side ", " bottom " be based on the orientation or positional relationship shown in the drawings, be only for
Convenient for the description present invention and simplify description, rather than the equipment of indication or suggestion meaning or element there must be specific side
Position is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
Present invention eliminates secondary welding layer, backplane level, thermal grease layer and the radiators of conventional mounting structure, not only simple
Change structure, also reduced the thermal resistance of power module, improves the reliability of power module.The above is only preferred realities of the invention
Apply mode, it should be pointed out that：For those skilled in the art, without departing from the principle of the present invention,
Several improvements and modifications can also be made, these modifications and embellishments should also be considered as the scope of protection of the present invention.
Claims (10)
1. a kind of power module of integrated heat spreader, including insulating substrate（1）, the insulating substrate（1）It is equipped with chip set,
It is characterized in that, the insulating substrate（1）Lower section is equipped with radiator base（2）, the radiator base（2）Including heat eliminating medium
Entrance（21）It is exported with heat eliminating medium（22）, heat eliminating medium is from heat eliminating medium entrance（21）Into radiator base（2）Inside is simultaneously
With insulating substrate（1）Bottom contact, then by heat eliminating medium outlet（22）Outflow；The insulating substrate（1）Bottom connection
There is welding layer（3）, welding layer（3）With radiator base（2）Between be equipped with flow distribution plate（4）, flow distribution plate（4）Bottom, which is equipped with, shunts grid
Group shunts grid group for flow distribution plate（4）It is separated into multiple shunting zones.
2. a kind of power module of integrated heat spreader according to claim 1, which is characterized in that the flow distribution plate（4）?
Heat eliminating medium entrance（21）It is exported with heat eliminating medium（22）The corresponding position of line, which is equipped with, shunts beam（41）.
3. a kind of power module of integrated heat spreader according to claim 2, which is characterized in that the number of the shunting zone
With insulating substrate（1）Number it is identical, each insulating substrate（1）Lower section all correspond to a shunting zone.
4. a kind of power module of integrated heat spreader according to claim 2, which is characterized in that the shunting grid group includes
Multiple row shunts grid（42）, multiple row shunting grid（42）With shunting beam（41）Each shunting zone is separated into two radiating areas after intersection,
The shunting grid（42）Including multiple shunting teeth.
5. a kind of power module of integrated heat spreader according to claim 2, which is characterized in that the welding layer（3）?
The corresponding position of radiating area is equipped with welding heat release hole（31）, weld heat release hole（31）Area be not less than radiating area area.
6. a kind of power module of integrated heat spreader according to claim 2, which is characterized in that the radiator base
（2）In heat eliminating medium entrance（21）It is exported with heat eliminating medium（22）Place is equipped with diversion trench（23）.
7. a kind of power module of integrated heat spreader according to claim 6, which is characterized in that the flow distribution plate（4）Bottom
Portion is equipped with and diversion trench（23）Corresponding groove（43）, diversion trench（23）With groove（43）Cooperatively form honeycomb duct.
8. a kind of power module of integrated heat spreader according to claim 6, which is characterized in that the diversion trench（23）End
End is connected with and diversion trench（23）Vertically disposed heat eliminating medium dashpot（24）.
9. a kind of power module of integrated heat spreader according to claim 2, which is characterized in that the radiator base
（2）With flow distribution plate（4）Between be equipped with sealing strip（5）.
10. a kind of power module of integrated heat spreader according to claim 2, which is characterized in that the radiator base
（2）Inside is equipped with boss（6）, boss（6）It is placed in radiating area, boss（6）Height be no more than flow distribution plate（4）Thickness.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610362582.7A CN105957850B (en) | 2016-05-26 | 2016-05-26 | A kind of power module of integrated heat spreader |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610362582.7A CN105957850B (en) | 2016-05-26 | 2016-05-26 | A kind of power module of integrated heat spreader |
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| Publication Number | Publication Date |
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| CN105957850A CN105957850A (en) | 2016-09-21 |
| CN105957850B true CN105957850B (en) | 2018-11-30 |
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| CN109742059B (en) * | 2019-01-07 | 2020-09-15 | 常州泰格尔电子材料科技有限公司 | Heat dissipation structure applied to high-power semiconductor module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183561A (en) * | 2013-05-24 | 2014-12-03 | 英飞凌科技股份有限公司 | Power Semiconductor Module with Liquid Cooling |
| CN205789941U (en) * | 2016-05-26 | 2016-12-07 | 扬州国扬电子有限公司 | A kind of power model of integrated heat spreader |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4385358B2 (en) * | 2000-09-20 | 2009-12-16 | 電気化学工業株式会社 | Circuit board cooling structure |
| JP3946018B2 (en) * | 2001-09-18 | 2007-07-18 | 株式会社日立製作所 | Liquid-cooled circuit device |
| JP2005302882A (en) * | 2004-04-08 | 2005-10-27 | Nissan Motor Co Ltd | Semiconductor device |
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2016
- 2016-05-26 CN CN201610362582.7A patent/CN105957850B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183561A (en) * | 2013-05-24 | 2014-12-03 | 英飞凌科技股份有限公司 | Power Semiconductor Module with Liquid Cooling |
| CN205789941U (en) * | 2016-05-26 | 2016-12-07 | 扬州国扬电子有限公司 | A kind of power model of integrated heat spreader |
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