CN105945422B - A kind of ultrafast laser microfabrication system - Google Patents
A kind of ultrafast laser microfabrication system Download PDFInfo
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- CN105945422B CN105945422B CN201610408296.XA CN201610408296A CN105945422B CN 105945422 B CN105945422 B CN 105945422B CN 201610408296 A CN201610408296 A CN 201610408296A CN 105945422 B CN105945422 B CN 105945422B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
This application provides a kind of ultrafast laser microfabrication system, including lathe, the three-dimensional mobile platform being installed on the lathe, the laser transmission module being installed on the lathe, processing head module, and control system, the lathe includes base, and upwardly extend the column to be formed from the base side, the three-dimensional mobile platform includes the Y-axis mobile platform being installed on the base, the X-axis mobile platform being installed on the Y-axis mobile platform, and it is installed on the Z axis mobile platform that the column side is located above the X-axis mobile platform, the X-axis mobile platform is provided with the fixture for clamping processed product.The application can carry out microfabrication to multiple material.
Description
Technical field
The application is related to field of laser processing.
Background technology
Since laser comes out, people began to carry out the research of Reciprocity of Laser ＆ Materials, by more than 50 years
Development, in order to meet different needs, various lasers arise at the historic moment and are widely used in industrial processes and medical field.Swash
Optical wavelength covering is almost infrared to arrive extreme ultraviolet waveband, and pulse width is also reduced to several photoperiods.
Laser Processing there is lot of advantages, such as noncontact procession, it is relatively low to environmental requirement, can process firmly crisp and fine and close material
Material and machining accuracy height etc., favor is enjoyed in field of industrial processing.Continuous and Long Pulse LASER relies primarily on high caused by focusing
Temperature carrys out ablator, and thermal diffusion scope is big, and machining accuracy is limited；Excimer pulsed laser is with its shorter wavelength and pulse width
The Precision Machining of micron order yardstick can be realized, but it needs to use corrosive gas, and also Ultra-Violet Laser is to most of materials
It is opaque, thus use and be above restricted.Currently, the fast-developing of micro-fabrication technology proposes and chosen to processing yardstick and precision
War --- need machining accuracy extending to sub-micron even nanometer scale, and realize 3 D stereo truly it is micro- plus
Work.The all difficulties for being expected to overcome above-mentioned conventional laser process technology to be faced using ultrafast laser micro-processing technology, it can be with
The limitation brought in optics micro-processing method due to diffraction limit to machining accuracy is broken through, and is had the ability directly in transparent material
Portion processes real three-dimensional microstructures.
The content of the invention
Can be on metal, semi-conducting material, transparent hard brittle material, high temperature alloy workpiece in consideration of it, being necessary to provide one kind
Carry out the ultrafast laser microfabrication system of retrofit.
In order to solve the above technical problems, this application provides a kind of ultrafast laser microfabrication system, including lathe, control
System, the three-dimensional mobile platform being installed on the lathe, the laser transmission module being installed on the lathe and it is installed on institute
The processing head module in three-dimensional mobile platform is stated, the lathe includes base and upwardly extends what is formed from the base side
Column, the three-dimensional mobile platform include be installed on the base Y-axis mobile platform, be installed on the Y-axis mobile platform
On X-axis mobile platform and be installed on the Z axis mobile platform that the column side is located above the X-axis mobile platform, it is described
X-axis mobile platform is provided with the fixture for clamping processed product；The laser transmission module includes ultrafast laser, expanded
Device, polarization device, light beam shaping module, optical splitter and optical processing module, the optical processing module are installed on described
On processing head module, the optical processing module includes parallel arrangement of rotary-cut optics module, scanning galvanometer module and multiple beam
Parallel fabrication module, after the ultra-short pulse laser beam that the ultrafast laser exports enters the beam expander, the beam expander will
Transmitted after the processing of ultra-short pulse laser beam to polarization device, the polarization device and linearly polarized light is converted into circular polarization
Conducted after light by the light beam shaping module that the laser beam after processing is defeated to the light beam shaping module, the circularly polarized light
Go out to the optical splitter, the optical splitter and laser beam is divided into after two-way is exported to two optical processing modules product is added
Work.
Preferably, the base is provided with Y-axis guide rail, and the Y-axis mobile platform is slided in the Y-axis guide rail；The Y
Axle mobile platform is provided with X-axis guide rail, and the X-axis mobile platform is slided in the X-axis guide rail；The column is located at the X
The top of axle mobile platform side is provided with Z axis guide rail, and the Z axis mobile platform is slided in the Z axis guide rail.
Preferably, the lathe also including the support on the column and located at the column upper end and is located at institute
State the supporting plate above three-dimensional mobile platform.
Preferably, the Z axis guide rail is between the supporting plate and the X-axis mobile platform, the Z axis mobile platform
Moved along the Z axis guide rail between the supporting plate and the X-axis mobile platform.
Preferably, the laser transmission module is installed on the support and supporting plate on the column.
Preferably, the laser transmission module also includes some speculums and focus lamp, and the speculum is used to change light
The conduction orientation of beam, the focus lamp are installed under the rotary-cut optics module, and the focus lamp for being by laser beam convergence
High-energy-density hot spot.
Preferably, the less laser beam of diameter that the beam expander exports laser passes through two groups of optical elements, extension
For the laser beam being relatively large in diameter, amplification beam diameter is realized, beam divergence angle is reduced, reduces power density to protect optics first
Part, reduce focal beam spot diameter, improve the purpose of machining accuracy.
Preferably, the linear distributing laser-beam transformation of wave that the polarization device exports laser is
Wave is rounded or the laser beam of elliptic systems.
The super block laser assisted microprocessing system of the application is integrated in lathe by the way that three-dimensional mobile platform, laser are transmitted into module
On, make system that there is preferably integrated performance, can be in solid material (semi-conducting material, glass material, metal material ceramics material
Material, polymeric material, nonmetallic materials etc.) and fluent material (organic solution such as gel, aqueous metallic ions, optical resin)
Deng carrying out straight hole, inclined hole, shoulder hole, tapered hole, irregularly-shaped hole, micro-nano structure, bionical on the plane of multiple material, inclined-plane, curved surface
The micro Process such as the preparation on surface, micro-force sensing are learned, possess that drilling, special-shaped cutting, blind slot scanning, lithography, splicing etc. are a variety of to be added
Work function.It can be widely applied to the fine system of each type component in the fields such as semiconductor, electronics, automobile, medical treatment, Aeronautics and Astronautics
Make, relative to conventional laser process thermal diffusion it is serious the characteristics of, there is irreplaceable advantage.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding of the present application, forms the part of the application, this Shen
Schematic description and description please is used to explain the application, does not form the improper restriction to the application.In the accompanying drawings：
Fig. 1 is the stereogram of the application ultrafast laser microfabrication system；
Fig. 2 is the optic path module schematic diagram of the application ultrafast laser microfabrication system；
Fig. 3 is the flow process chart of the application ultrafast laser microfabrication system.
Embodiment
To make the purpose, technical scheme and advantage of the application clearer, below in conjunction with the application specific embodiment and
Technical scheme is clearly and completely described corresponding accompanying drawing.Obviously, described embodiment is only the application one
Section Example, rather than whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Go out under the premise of creative work the every other embodiment obtained, belong to the scope of the application protection.
Below in conjunction with accompanying drawing, the technical scheme that each embodiment of the application provides is described in detail.
Refer to shown in Fig. 1, the application ultrafast laser microfabrication system includes lathe 100, is installed on the lathe 100
On three-dimensional mobile platform 200, the laser transmission module 300 that is installed on the lathe 100 and be installed on described three-dimensional mobile
Processing head module 400 and control system (not shown) on platform 200.
The lathe 100 includes column 101, extends shape from the vertical column 101 of the side bottom of column 101 1 extension
Into base 102, the support 103 located at the opposite side of column 101 and located at the top of the column 101 and be located at the bottom
The supporting plate 104 of the top of seat 102.
The three-dimensional mobile platform 200 include located at the lathe 100 base 102 on Y-axis guide rail 201, can be in institute
State the Y-axis mobile platform 202 moved in Y-axis guide rail 201, the X-axis guide rail 203 located at the upper surface of Y-axis mobile platform 202,
The X-axis mobile platform 204 that can be moved in the X-axis guide rail 203, the Z axis guide rail 205 on the column 101 and can be
The Z axis mobile platform 206 moved in the Z axis guide rail 205.The Z axis guide rail 205 is located at the side of the column 101 and position
Between the supporting plate 104 and the X-axis mobile platform 204, the Z axis mobile platform 206 exists along the Z axis guide rail 205
Moved between the supporting plate 104 and the X-axis mobile platform 204.
The X-axis mobile platform 204 is used as processing platform, which is provided with the fixture 207 for clamping processed product.It is logical
Crossing the three-dimensional mobile platform 200 makes the range of work to be adjusted optimization in the three dimensions in given area.
The position of the support 103 is not limited to the outside of the column 101, can also be located at the top of the column 101.
In one embodiment, the lathe 100 base 102 install additional rotating mechanism so that the processed product about the z axis
Rotate the range of work with lifting system to product.
The three-dimensional mobile platform 200 has very high positioning precision and repetitive positioning accuracy, can by linear electric motors and
Ball-screw drives, and to improve positioning precision, is referred to if necessary equipped with grating scale to detection and localization and adjustment.Three-dimensional is mobile flat
Platform 200 has very high translational speed, can press desired trajectory driving workpiece motion s, realizes the quick mobile and positioning of workpiece.
Further referring to shown in Fig. 2, the laser transmission module 300 is installed on the support 103 and branch of the lathe 100
On fagging 104.The laser transmission module 300 includes ultrafast laser 301, beam expander 302, polarization device 303, reflection
Mirror 304,305,308,311, light beam shaping module 306, optical splitter 307, rotary-cut optics module 309, scanning galvanometer module 312,
Focus lamp 310.The operation principle of the laser transmission module 300 is as follows：The ultrashort pulse that the ultrafast laser 301 exports swashs
After light beam (femtosecond laser) enters the beam expander 302, the beam expander 302 will be transmitted to inclined after the processing of ultra-short pulse laser beam
Linearly polarized light is converted into circularly polarized light by the reforming unit 303 that shakes, circularly polarized light conducted after the reflection via speculum 304,305 to
Light beam shaping module 306 is processed into meet and exports to optical splitter 307, the optical splitter 307 and will swash after particular spatial distribution requires
Light beam is divided into two-way output, is passed through after laser beam is conducted to rotary-cut optics module 309 via speculum 308 all the way by focus lamp 310
Converge and be pivoted the scanning machinings such as realization drilling for high-energy-density hot spot；Another way laser beam conducts via speculum 311
To scanning galvanometer module 312 to carry out X-Y scheme scanning machining.
In one embodiment, the rotary-cut optics module 309, scanning galvanometer module 312 are different optical processing modules, can
To be replaced by other processing modules, can also optionally one of them, if only exist an optical processing module, the light splitting
Device 307 then no longer needs.
The processing head module 400 is installed on the outside of the Z axis mobile platform 206, and the processing head module 400 is used for
The optical processing module of laser transmission module 300 is installed, the processing head module 400 includes rotary-cut optics module 309, simultaneously
Row located at the side of rotary-cut optics module 309 multi-beam parallel processing module 313 and scanning galvanometer module 312 and be located at
The focus lamp 310 of the lower section of rotary-cut optics module 309.The focus lamp 310 is used for being relatively large in diameter laser output
Laser beam is converted into the very high laser spots of diameter very little, energy density.The focus lamp 310 can divide monolithic or multiple-piece to focus on
Mirror, f-theta field lenses, diffraction optics focus lamp etc..The processing head module 400 can also increase other processing modules, and
Be not limited to rotary-cut optics module 309, multi-beam parallel processing module 313 and scanning galvanometer module 312 these three.
The control system is used to make the types of functionality component in laser-processing system according to specific logical order, response
Speed, by a series of relevant action, to realize the method for specific objective.In ultrafast laser machining system, control system
The each functional parameter of ultrafast laser can be carried out and carry out comprehensive and independent control, such as the start and stop of laser, delay, power, repetition
Frequency etc..Control system is controlled processing head module 400 comprehensively, such as scans start and stop, sweep speed, scanning range, scanning
Data, scan position etc..Control system is controlled three-dimensional mobile platform 200 comprehensively, such as moves start and stop, movement velocity, mesh
Cursor position, sequence of motion etc..
The beam expander 302 is used to the less laser beam of diameter of laser output passing through two groups of optical elements, extension
For the laser beam being relatively large in diameter, to be realised in that amplification beam diameter, reduce beam divergence angle, reduce power density to protect light
Element is learned, focal beam spot diameter (reduction diffracting effect) is reduced, improves the purpose of machining accuracy.
The ultrafast laser 301 provides energy source, generation ultra-short pulse laser that can be continual and steady, the ultrashort arteries and veins
The pulse width (pulse duration) of punching is less than 10 psecs；The laser has outstanding beam quality, its beam quality factor
M2 is less than 1.3；The power output of the ultrafast laser 301 can carry out the regulation in the range of maximum nominal power.It is described super
Fast laser 301 exports a kind of laser of wavelength (also known as fundamental frequency light), matches somebody with somebody in increasing or during built-in frequency multiplication module, can export fundamental frequency
The laser of optical wavelength 1/2,1/3 or 1/4 wavelength, the laser of above-mentioned several wavelength can be also exported simultaneously.
The speculum 304,305,308,311 is used for the direction of propagation for changing laser beam, so that laser beam can be according to spy
Fixed path is transmitted, and its quantity and position can be depending on light path layouts.
The optical splitter 307 is mainly used in including the laser of at least two wavelength, or the feelings of at least two processing heads
Shape, its main function are to be combined into the laser beam of different wave length (general different outgoing positions are different) to transmit all the way, or will all the way
Laser is divided into multiple-channel output, so that laser beam is conducted to different processing heads.
The polarization device 303 is that the linear distributing laser-beam transformation of wave for exporting laser is ripple
Dynamic form is rounded or a kind of device of the laser beam of elliptic systems.
The light beam shaping module 306 is can be to the spatial distribution of laser intensity according to the dress for specifically requiring to be modulated
Put.
The optical element of above-mentioned each module is respectively provided with very high damage threshold (bearing power or energy density), optics member
For the material of part using the minimum material of pulse width broadening, such as fused quartz, can be according to particular demands in actual light path system
Above-mentioned one or more modules are chosen, it can be determined in installation site and sequence according to specific demand.If necessary, light
Road transmission module is needed to do sealing protection processing, and also known as light path is protected, and the main purpose of protection is to prevent height caused by laser beam
Can laser overflow the external world caused to damage, and prevent the pollution optic path environment such as dust outside the module, greasy dirt.
The application also includes auxiliary processing module (not shown), and the auxiliary processing module is used for auxiliary laser process
And result, be the particular module with complete function combination.The auxiliary processing module includes：
Auxiliary inflatable device, for being blown in workpiece process to be added, it is divided into coaxial blow and is blown with paraxonic, together
The valve of the metal material of axle air blowing " loudspeaker " shape bottom perforate is completed, and paraxonic is blown and combined by one or more stingy mouths
Complete, blowing action typically enables in process, and the composition of gas can be compressed air, nitrogen and oxygen etc., rise slagging-off,
The effect such as protection, combustion-supporting, can select one or more gases according to demand while blow.If necessary, the built-in air pressure of system, flow
Control system, realize pressure automation regulation.
Dust arrester, caused dust, particle etc. in process are discharged into processing district.
Z-direction range unit, it is installed on the Z axis mobile platform 206, by modes such as laser range sensors, to
Distance between accurate measurement and control processing head module and workpiece to be added.
Paraxonic image detection device, pass through the processing dimension of the camera installed in non-laser transmission path to workpiece, processing
Effect, Working position measure, and the secondary positioning of workpiece can be achieved.
Coaxial image monitoring device, by installing spectroscope on laser emission path, process and processing are stopped
The state of workpiece afterwards is exported by camera in the form of image, and knot is observed workpiece process feature and process to realize
The purpose of fruit preliminary surveying.
Terminal monitoring device, (or there is power attenuation function by position sensor below processing head module
Imaging sensor) receive laser facula, to realize laser spot test and positioning device.
Optical parameter supervising device, by the optical element in laser delivery optics, power, laser beam to laser
Position, the device that is monitored and corrects such as inclination.
Lighting device, for processing floor light, workspace illumination.
The operation principle of the application ultrafast laser microfabrication system is as follows：The ultrafast laser 301 exports super
Short-pulse laser via laser transmit module 300, complete shaping, expand, polarization state conversion etc. processing after conduction to processing head mould
Group 400, the processing head module 400 carry out High-speed Control to laser beam, complete accurate scan, by focus lamp 310 by superelevation
For the focus Voice segment of energy density on workpiece, the processing head module 400 can control laser focal spot according to specific track
Remove material with speed, in whole process the concrete function parameter of each part by the control system according to given technological parameter
Carry out linkage Collaborative Control.When effect laser pulse width, spot separation, spot diameter, light spot energy intensity and material damage
When threshold value meets certain relation, thermal diffusion region is minimum, and the processing of " no fuel factor " can be achieved.
Refer to shown in Fig. 3, the processing method that the ultrafast laser microfabrication system of the application will be introduced：
S101, ultrafast laser microfabrication System self-test.
This step includes the self-test of ultrafast laser 301, such as state, shutter, temperature, electric current, power, repetition rate；Three
Tie up the self-test of mobile platform 200, such as state, back to zero；The self-test of processing head module 400, such as state, initial position, temperature；Auxiliary
Processing module self-test.
S102, laser facula coordinate setting.
This step refers to move to the terminal monitoring device in three-dimensional mobile platform 200 below focus lamp, opens
Laser, laser point coordinates are obtained in terminal monitoring module, coordinate is exported to control system.
S103, workpiece coordinate positioning.
Workpiece is arranged on fixture, moved to below the Z-direction range unit, Z-direction range unit is surveyed to work pieces process face
Amount, coordinate information is obtained, is exported after being converted into system coordinate information to control system.
S104, Working position positioning.
Working position information is inputted into the control system, Working position information and work of the control system according to input
Part coordinate setting information calculates Working position information, and assigns instruction and workpiece is moved into machining position to the three-dimensional mobile platform
Put, prepare processing.
After S105, machined parameters confirm, processing starts.
The control system is chosen according to requirements such as workpiece material, the ranges of work plus technological parameter, and technological parameter is passed
Each module for participating in processing is passed, after each module is ready to complete, starts processing.
S106, process monitoring and judgement.
After processing starts, system is monitored to machining state, and machining state is fed back into control system and judged：
If it is determined that after processing is qualified, processing is completed, by the three-dimensional mobile platform 200；If it is determined that processing is unqualified, then step is jumped to
S104 continues to process, and is scrapped until processing qualified or processing.
It should be understood by those skilled in the art that, embodiments of the invention can be provided as method, system or computer program
Product.Therefore, the present invention can use the reality in terms of complete hardware embodiment, complete software embodiment or combination software and hardware
Apply the form of example.Moreover, the present invention can use the computer for wherein including computer usable program code in one or more
The computer program production that usable storage medium is implemented on (including but is not limited to magnetic disk storage, CD-ROM, optical memory etc.)
The form of product.
It should also be noted that, term " comprising ", "comprising" or its any other variant are intended to nonexcludability
Comprising so that process, method, commodity or equipment including a series of elements not only include those key elements, but also wrapping
Include the other element being not expressly set out, or also include for this process, method, commodity or equipment intrinsic want
Element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that wanted including described
Other identical element also be present in the process of element, method, commodity or equipment.
Embodiments herein is the foregoing is only, is not limited to the application.For those skilled in the art
For, the application can have various modifications and variations.All any modifications made within spirit herein and principle, it is equal
Replace, improve etc., it should be included within the scope of claims hereof.
Claims (8)
1. a kind of ultrafast laser microfabrication system, it is characterised in that including lathe, control system, be installed on the lathe
Three-dimensional mobile platform, be installed on the lathe laser transmission module and be installed in the three-dimensional mobile platform plus
Foreman's module, the lathe include base and upwardly extend the column to be formed, the three-dimensional mobile platform from the base side
Including the Y-axis mobile platform being installed on the base, the X-axis mobile platform being installed on the Y-axis mobile platform and installation
It is located at the Z axis mobile platform above the X-axis mobile platform in the column side, the X-axis mobile platform, which is provided with, to be used for
The fixture of clamping processed product；The laser transmission module includes ultrafast laser, beam expander, polarization device, light beam
Shaping Module, optical splitter and optical processing module, the optical processing module are installed on the processing head module, the optics
Processing module includes parallel arrangement of rotary-cut optics module, scanning galvanometer module and multi-beam parallel processing module, described ultrafast
After the ultra-short pulse laser beam of laser output enters the beam expander, the beam expander will pass after the processing of ultra-short pulse laser beam
Polarization device is transported to, the polarization device is conducted to the beam shaping after linearly polarized light is converted into circularly polarized light
Module, the circularly polarized light export the laser beam after processing to the optical splitter by the light beam shaping module, described point
Laser beam is divided into after two-way is exported to two optical processing modules by light device to be processed to product.
2. ultrafast laser microfabrication system as claimed in claim 1, it is characterised in that the base is provided with Y-axis guide rail,
The Y-axis mobile platform is slided in the Y-axis guide rail；The Y-axis mobile platform is provided with X-axis guide rail, and the X-axis movement is flat
Platform is slided in the X-axis guide rail；The top that the column is located at the X-axis mobile platform side is provided with Z axis guide rail, the Z
Axle mobile platform is slided in the Z axis guide rail.
3. ultrafast laser microfabrication system as claimed in claim 2, it is characterised in that the lathe is also included located at described
Support on column and the supporting plate located at the column upper end and above the three-dimensional mobile platform.
4. ultrafast laser microfabrication system as claimed in claim 3, it is characterised in that the Z axis guide rail is located at the branch
Between fagging and the X-axis mobile platform, the Z axis mobile platform moves along the Z axis guide rail in the supporting plate and the X-axis
Moved between moving platform.
5. ultrafast laser microfabrication system as claimed in claim 3, it is characterised in that the laser transmission module is installed on
On support and supporting plate on the column.
6. ultrafast laser microfabrication system as claimed in claim 1, it is characterised in that the laser transmission module also includes
Some speculums and focus lamp, the speculum are used for the conduction orientation for changing light beam, and the focus lamp is installed on the rotary-cut
Under optics module, it is high-energy-density hot spot that the focus lamp, which is used for laser beam convergence,.
7. ultrafast laser microfabrication system as claimed in claim 1, it is characterised in that the beam expander exports laser
The less laser beam of diameter by two groups of optical elements, expand to the laser beam being relatively large in diameter, realize amplification beam diameter, contracting
Small beam divergence angle, power density is reduced to protect optical element, reduce focal beam spot diameter, improve the purpose of machining accuracy.
8. ultrafast laser microfabrication system as claimed in claim 1, it is characterised in that the polarization device is by laser
The linear distributing laser-beam transformation of wave of device output is wave is rounded or the laser beam of elliptic systems.
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| CN201610408296.XA CN105945422B (en) | 2016-06-12 | 2016-06-12 | A kind of ultrafast laser microfabrication system |
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| CN201610408296.XA CN105945422B (en) | 2016-06-12 | 2016-06-12 | A kind of ultrafast laser microfabrication system |
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