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CN105916802B - 电子功能部件和用于制造电子功能部件的方法 - Google Patents

电子功能部件和用于制造电子功能部件的方法 Download PDF

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Publication number
CN105916802B
CN105916802B CN201580005294.XA CN201580005294A CN105916802B CN 105916802 B CN105916802 B CN 105916802B CN 201580005294 A CN201580005294 A CN 201580005294A CN 105916802 B CN105916802 B CN 105916802B
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electronic
functional layer
component
functional
electronic component
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CN105916802A (zh
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U.沙夫
K.贝绍尔
R.瓦尔
A.库格勒
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Robert Bosch GmbH
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Robert Bosch GmbH
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/40—Shaping or impregnating by compression not applied
    • B29C70/42—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
    • B29C70/46—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
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    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
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    • B81—MICROSTRUCTURAL TECHNOLOGY
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    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
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    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
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    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H05K1/02—Details
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Abstract

本发明实现一种电子功能部件和一种用于电子功能部件的制造方法。电子功能部件包括电子部件（20），其借助三维打印过程嵌入到功能部件中。通过三维打印过程，在此除了包围电子部件之外，也可以进行关于功能部件的成型和机械特性的单独适配。此外，电子部件的电端子（21）以合适的方式被引导到功能部件的表面（30a）上。

Description

电子功能部件和用于制造电子功能部件的方法
技术领域
本发明涉及一种电子功能部件以及其制造方法。
背景技术
为了防止损伤或污染而被嵌入到塑料中的电子部件和电路组是已知的。这样的部件通常利用常见的喷涂、注塑或模制方法来制造。
此外，在最近为了制造三维的器件也已知所谓的三维（3D）打印方法。在此，3D打印机基于三维的数据模型通过连续的添加或涂装材料而产生物品。
德国专利申请DE 10 2011 078 757 A1公开了一种用于基于3D打印机打印三维组件的方法。对此，要打印的部件的模型数据和质量属性以及关于对要使用的3D打印机的要求的证书被保存在可携带的存储介质中。在存储介质和3D打印机的一致的证书的情况下，模型数据被传输给打印机并且通过3D打印机制造所期望的三维组件。
发明内容
本发明在第一方面中实现一种电子功能部件，其具有：基础元件，该基础元件包括电绝缘的载体层；电子部件，该电子部件被布置在基础元件上并且包括电端子；和功能层，该功能层在三维打印过程中在基础元件上被打印并且包括连接元件，该连接元件被设计用于提供电子部件的电端子和功能层的外侧之间的电连接。
本发明根据另一方面实现一种用于制造电子功能部件的方法，该方法具有以下步骤：提供具有电绝缘的载体层的基础元件；将具有电端子的电子部件布置在基础元件上；在基础元件上三维地打印功能层以及将连接元件引入到被打印的功能层中，该连接元件提供电子器件的电端子和功能层的外侧之间的电连接。
发明优点
本发明所基于的思想是，将电子部件借助三维的打印过程集成在功能部件中。通过将电子部件集成到三维打印的元件中并且利用内部中的以及表面上的印制导线结构化元件，因此可以实现MID部件（MID＝Molded Interconnect Device（模制互连器件）＝注塑电路载体）类型中的完全新型的结构形式。通过电子组件与三维打印器件的连接，在此在功能部件中不仅可以实现机械功能而且可以实现电功能。在此，三维打印过程也能够为复杂的三维结构实现特别灵活的制造过程。
因为对于三维打印过程不需要昂贵的工具、诸如注塑模具等，所以也可以成本适宜地制造各个器件或具有少件数的小批量。
此外，三维打印方法也允许功能部件内的电印制导线的复杂的布线。因此也可以特别是实现迄今为止在传统技术中不可能的或仅仅十分昂贵地可能的导线交叉和类似的。
此外，也可以很好地实现电子功能部件利用关键部件、诸如具有很小的端子间距的集成电路或微机电系统等的装配。这允许电子功能部件以很好的过程稳定性和更少的生产成本的制造。
在此，功能部件的基础元件可以包括电绝缘的载体层。特别是，基础元件也已经可以以三维打印方法来制造。在该情况下，通过三维打印过程，基础元件已经可以有针对性地具有相应的几何形状，该几何形状也与功能部件的要实现的结构形式相协调。通过该方式，功能部件的基础元件也可以配备功能。因此基础元件本身也用作功能部件的功能层。
根据一个实施例，电子功能部件还包括接触元件，该接触元件被布置在功能层的外侧上并且与电子器件的电端子和功能层的外侧之间的电连接电连接。通过电子功能部件的外侧上的这样的接触元件，电子功能部件可以提供用于外部端子的电接触部。因此可以实现电子功能部件的特别简单并且安全的接触。
根据一个实施例，基础元件包括导电结构，该导电结构与电子部件的电端子电连接。通过这样的导电结构，电子部件的电端子已经可以在电子功能部件的内部中被接触。因此也可以实现具有很小的端子间距的器件的接触。在此，导电结构能够实现为其他接触提供足够大的连接面。特别是可以通过该导电结构扩展电器件的窄的端子间距，以便实现连接元件的电接触。
根据一个实施例，功能层包括透明塑料和/或光导体，其布置在电子器件和功能层的外侧之间。在此，透明塑料和/或光导体实现电器件和功能层的外侧之间的完全的光学连接。通过这样的透明塑料或光导体能够实现电子器件和周围环境之间的光学连接。因此，一方面可以将光信号从电子器件输出到周围环境中和/或也可以将光学信号从周围环境输送给电子功能部件的内部的电子部件。在此，光导体或透明塑料分别对于相关的光谱是透明的。这特别是也可以包括紫外和红外光。
根据一个实施例，功能层具有通道结构，该通道结构布置在电子器件和功能层的外侧之间。这样的通道结构可以是空腔，该空腔将功能层的外侧与电子器件连接。在此，该通道结构特别是可以由气体和/或流体来通流。通过这样的通道结构，电子器件可以与周围环境中的物质接触并且在此可以检测一个或多个环境参数。
根据一个实施例，电子部件包括传感器。通过这样的传感器可以探测一个或多个环境参数并且提供与探测的参数对应的电信号。因此例如可以探测环境温度、气体或液体的压力、气体浓度、亮度或类似的。
根据一个实施例，电子部件包括微机电系统（MEMS）。这样的MEMS是彼此联合电子和机械组件的器件。通过根据本发明的借助三维打印方法和适合于此的电接触的构造，可以一方面保护MEMS以免由于环境影响等的损伤并且在此同时也实现功能部件的合适的结构化，该功能部件实现MEMS与周围环境的机械相互作用。
根据一个实施例，将另外的元件集成到功能层中，该另外的元件具有相较于功能层提高的导热性和/或提高的刚性。这样的另外的元件例如可以是金属薄膜或金属板。在此，通过集成冷却体形式的器件可以实现电子部件的特别有效的冷却。 此外，这样的器件的提高的刚性实现功能部件的附加的稳定性和以免机械负荷的保护。
根据一个实施例，在用于制造电子功能部件的方法中，用于将连接元件引入到功能层中的步骤包括用于在功能层的外侧和电子部件的电端子之间引入开口的步骤和将所引入的开口利用导电材料填充的步骤。由此，只要没有其他已经在三维打印过程期间进行，就可以提供电子部件和功能层的外侧之间的电连接。
附图说明
本发明的其他优点和实施方式从参考附图的以下描述中得出。
在此：
图1示出根据一个实施例的电子功能部件的示意图；
图2示出根据另一个实施例的电子功能部件的示意图；
图3示出根据又另一个实施例的电子功能部件的示意图；以及
图4示出根据一个实施例的用于制造电子功能部件的方法的流程图的示意图。
具体实施方式
图1示出根据一个实施例的电子功能部件的示意图。电子功能部件在此包括基础元件10、具有电端子21的电子部件20以及功能层30。在电子部件20的端子21和功能层的外侧30a之间提供电连接的连接元件31被引入到功能层30中。外侧30a在此不仅仅限于图1中示出的上侧，而是此外也包括侧面并且必要时也包括底侧上的可自由接近的区域，只要功能层30也延伸到该区域上。
基础元件10是电绝缘的载体层。基础元件10在此例如已经可以借助3D打印方法来制造。通过该方式，基础元件10已经可以精确地适配于所期望的要求并且特别是也适配于在其他过程中要集成的电子部件20。因此例如已经可以在基础元件10中设置提高部、凹部或空腔。
在基础元件10的随后应该施加电子器件20的上侧10a上，此外设置导电结构22。所述导电结构22在此例如可以已经在基础元件10的三维打印过程期间一并集成到基础元件10中。对此，与利用电绝缘的材料打印基础体10并行地，可以附加地打印导电结构22。替代地，用于将导电结构施加到基础元件10上的任意其他方法也是可以的。例如导电结构可以通过沉积过程、冷气体喷雾、喷射涂敷法、导电物质的二维印刷或用于施加导电结构的替代方法来制造。基础体10上的导电结构22在此被适配于电子部件10的端子21，使得电子器件20的端子21和导电结构22之间的电接触是可以的。
随后，电子部件20被施加在具有导电结构22的基础元件10上并且必要时固定电子部件20。在此，也实现电子部件20的电端子21和导电结构22之间的电连接。电接触例如可以借助导电粘结或用于电接触的其他方法来实现。
在电子部件20被施加在基础元件10上并且电子部件20的端子21和导电结构22之间的电连接建立之后，该构造在三维打印过程中被加印并且因此在具有电子部件20的基础元件10之上形成功能层30。通过该三维打印过程，在此形成电子功能部件的最后要实现的几何形状。同时通过功能层30在打印过程期间的合适的结构化和成型也可以构造功能层30的机械功能。该机械功能例如可以包括预先确定的外部几何形状，该几何形状与功能部件的所期望的应用目的相协调。必要时也可以构造活动的或灵活的机械组件。
在功能层30的三维打印过程期间，在此也可以在功能层30中构造开口，所述开口从导电结构22的预先确定的位置延伸直至功能层30的外侧30a。所述开口可以在另外的制造过程中接着利用导电材料、诸如金属或其他导电物质来填充。通过该方式，在导电结构22和功能层30的外侧30a之间形成连接元件31。通过该连接元件31，因此可以实现外侧30a和电子部件20、尤其是电子部件20的电端子21之间的电连接。
如果在功能层30的三维打印过程期间没有开口在导电结构22和功能层的外侧30a之间被构造，则也可以替代地在随后的过程中将这样的开口引入到功能层30中。例如这样的开口可以借助激光钻孔法或类似的引入到功能层30中。在该情况下，这些被引入的开口也可以随后利用导电物质来填充，以便实现导电结构22和功能层的外侧30a之间的电连接。
此外，在其他替代方案中可以的是，已经在三维打印过程期间将其他导电印制导线集成到功能层30中。这些其他的导电印制导线在此同样可以实现导电结构22和功能层30的外侧30a之间的电连接。此外，也可以在功能层30之内实现其他电印制导线。由于三维打印过程的大的灵活性，在此也能够实现导电结构22的各个点之间的连接的、复杂的、三维印制导线引导是可以的。
在功能层30的外侧30a上此外布置有接触元件32，所述接触元件与连接元件31电连接。通过所述接触元件32提供足够大的电接触面，所述电接触面能够实现功能器件的电连接。接触元件32在此可以借助任意的方法施加。例如接触元件32可以借助激光直接结构化（LDS）和随后的电镀来施加。同样可以的是喷射涂敷法、等离子体涂敷法或类似的。也可以在三维打印过程期间已经引入接触元件32。
电子部件20在此可以是任意电子部件。例如电子部件20是集成电路（IC）。在具有很小的端子间距的器件的情况下，在此可以通过导电结构22和/或连接元件31实现该窄的端子间距的扩展，使得在功能层的外侧30a上能够提供具有足够大的端子间距的接触元件32，以便接触电子功能部件。
此外，例如微机电系统（MEMS）也可以作为电子部件20，所述微机电系统除了电子功能之外还提供机械功能。所述MEMS在此足够地通过基础元件10和功能层30来保护以免外部影响。同时，在功能层30的三维打印过程期间也可以的是，将功能层30以合适的方式适配于MEMS的机械功能。
对此，图2示出另一实施例的示意图。电子功能部件2在该图中的构造在此基本上对应于图1中的构造。为了更好的示出，在该图中没有示出电连接31和接触元件32。
在该实施例中的电子功能部件在功能层30中包括电部件20和功能层30的外侧30a之间的光学连接35。该光学连接35例如可以是光导体或透明塑料。该光导体或透明塑料在此可以在三维打印过程期间已经被引入到功能层30中。例如可以将光导体施加在电子部件20上并且随后在功能层30的三维打印过程期间光导体连同打印材料被嵌入到功能层30中。替代地，也可以将透明塑料直接打印到电子部件20上。光导体或透明塑料在此优选地与光的波长相协调，该光应该在电子部件20和周围环境之间交换。例如电子部件20可以是发射光的部件、诸如发光二极管或类似的。替代地，电子部件20也可以是从周围环境接收光并且分析光的部件。例如在此是亮度传感器或相机元件。功能层的外侧30a和部件20之间的光学连接也可以被构造为光学透镜或透镜式的结构，该结构将光从周围环境以合适的方式聚焦到电子部件20上或散射所发射的光。
附加地或替代地，功能层30也可以具有通道结构36。该通道结构36可以是电子部件20和功能层的外侧30a之间的开口。通过这样的通道结构36例如可以将气体或流体输送给电子部件20或从电子部件20旁边过去。电子部件20因此也可以与电子功能部件的周围环境中的物质接触。例如因此可以的是，借助电子功能部件检测气体压力、关于一种或多种预先确定的物质分析从旁边流过的气体或流体或确定物质浓度或确定其他环境参数、诸如温度或类似的。如果需要，则也可以在打印功能层30期间将辅助物质、例如有机物质或类似的嵌入到功能层30中，所述有机物质对于分析气体或流体是必需的。
此外，也可以借助电子部件20通过合适的MEMS将通道结构36中的气体或流体置于运动中并且因此产生流动。
对此所需的通道结构36在此已经可以在功能层30的三维打印过程期间被构造。此外，也可以的是，完全或至少部分地也借助合适的后续方法、诸如激光钻孔或类似的来构造通道结构36。
附加地或替代地，功能层30此外也还可以具有任意其他元件37、38。例如可以将稳定化元件37集成到功能层30中，该稳定化元件相较于功能层30具有提高的刚性。该器件例如可以是由金属或硬塑料制成的板。通过这样的集成到功能层30中的稳定化板37，可以提高功能层30进而整个电子功能部件的稳定性。因此可以保护敏感的电子部件20以免损伤。
替代地，其他元件也可以是相较于功能层30具有提高的导热性的冷却元件38。例如在此可以是金属薄膜、冷却体或类似的。通过具有提高的导热性的冷却元件38，可以实现电子功能部件并且尤其是电子部件20的有效的冷却。
图3示出电子功能部件20的另一替代的实施方式。该电子功能部件在此基本上对应于之前描述的电子功能部件。在该实施方式中的基础元件10在此通过电绝缘的薄膜12形成。在此，在该电绝缘的薄膜12上，与之前的实施例类似地施加导电结构22，该导电结构提供与电子部件20的端子元件21的电连接。电子部件在此例如可以借助倒装芯片安装技术施加在薄膜12上并且与导电结构22连接。薄膜12的用于与电子部件20的端子元件21连接的接触面在此优选地利用贵金属来涂层，以便实现足够好的电连接。用于在电绝缘的薄膜12施加电子部件20的以及将电子部件20与导电结构22接触的替代方法在此同样是可以的。
为了保护之前描述的构造，该构造可以附加地利用未示出的保护薄膜来覆盖。这样准备的具有电子部件20的薄膜12随后可以被施加到之前准备的基础体11上。优选地，薄膜12在此利用合适的模压工具印到基础体11上。基础体11在此例如可以是在三维打印过程中制造的基础体11。基础体11在此可以类似于结合图1描述的基础元件10来制造，其中在该情况下基础体11必须丝毫没有导电结构。导电结构22在根据图3的实施例中已经被施加在薄膜12上。
在将具有电子部件20的薄膜12施加在基础体11上之后，随后类似于之前描述的实施例进行功能层30和连接元件31的另外构造。
除了在之前的实施例中示出的用于将电子部件20施加到基础元件10或基础体11上的平坦的表面10a、11a之外，任意成型的、例如拱形的、弯曲的或结构化的表面此外也是可以的。因此可以进一步优化成型中的灵活性和空间需求。此外，特别是在将可伸展的或能可塑变形的材料用于基础元件10或功能层30的情况下，特别是也可以实现电子功能部件的另外的后续的变形。
图4示出用于制造如本发明的实施例所基于的电子功能部件的方法100的流程图的示意图。
在步骤110中，提供具有电绝缘的载体层的基础元件10。基础元件10随后配备导电结构22，该导电结构适配于电子部件20的端子21。在步骤120中，具有电端子21的电子部件20随后被布置在基础元件10上。随后在步骤130中，功能层30以三维打印方法被印到基础元件10上。在步骤140中，在电子器件20的端子21和功能层30的外侧30a之间提供电连接的连接元件31被引入到所印制的功能层30中。在此，电子器件20的端子21之间的连接也可以间接地通过基础元件10上的导电结构22来实现。
在一种实施方式中，在此在步骤103中的三维打印期间已经可以设置开口，所述开口提供基础元件10上的导电结构22和功能层30的外侧30a之间的连接。在该情况下，连接元件31可以通过利用导电物质填充空腔来构造。
如果在三维打印期间这样的空腔的构造不可以或仅仅部分可以，则这些空腔也可以借助合适的其他的用于构造开口的步骤来实现。例如，这可以通过激光钻孔过程或类似的来实现。在该情况下，所构造的开口随后也利用导电物质来填充。
最后，可以在另外的步骤中在功能层的外侧30a上施加接触元件32，所述接触元件与连接元件31电连接并且为电子功能部件的电端子提供足够大的接触面。
总之，本发明涉及一种电子功能部件和一种用于电子功能部件的制造方法。电子功能部件包括电子部件，该电子部件借助三维打印过程被嵌入到功能部件中。在此，通过三维打印过程，除了包围电子部件之外也可以关于功能部件的成型和机械特性进行单独适配。此外，电子部件的电端子以合适的方式被引导到功能部件的表面上。

Claims (10)

1.电子功能部件，具有：
基础元件（10），其包括电绝缘的载体层；
电子部件（20），其布置在基础元件（10）上并且包括电端子（21）；以及
功能层（30），其在三维打印过程中被印在基础元件（10）上并且连接元件（31）被引入到所述功能层中，所述连接元件被设计用于提供电子部件（20）的电端子（21）和功能层（30）的侧面（30a）之间的电连接，
其中电子部件（20）包括传感器。
2.根据权利要求1所述的电子功能部件，具有接触元件（32），所述接触元件布置在功能层（30）的外侧（30a）上并且与电子部件（20）的电端子（21）和功能层（30）的外侧（30a）之间的电连接（31）电连接。
3.根据权利要求1或2所述的电子功能部件，其中基础元件（10）包括导电结构（22），所述导电结构与电子部件（20）的电端子（21）电连接。
4.根据权利要求1或2所述的电子功能部件，其中功能层（30）包括透明塑料和/或光导体，所述透明塑料和/或光导体被布置在电子部件（20）和功能层（30）的外侧（30a）之间。
5.根据权利要求1或2所述的电子功能部件，其中功能层（30）具有通道结构（36），所述通道结构被布置在电子部件（20）和功能层（30）的外侧（30a）之间。
6.根据权利要求1或2所述的电子功能部件，具有另外的元件（37、38），所述另外的元件被集成到功能层（30）中并且具有相较于功能层提高的导热性和/或提高的刚性。
7.根据权利要求1或2所述的电子功能部件，其中电子部件（20）包括微机电系统MEMS。
8.用于制造电子功能部件的方法（100），具有以下步骤：
提供（110）具有电绝缘的载体层的基础元件（10）；
将具有电端子（21）的电子部件（20）布置（120）在基础元件（10）上；
将功能层（30）三维地印（130）到电绝缘的基础元件（10）上；并且
将连接元件（31）引入（140）到所印制的功能层（30）中，所述连接元件提供电子部件（20）的电端子（21）和功能层（30）的侧面（30a）之间的电连接。
9.根据权利要求8所述的方法（100），其中连接元件（31）的引入（140）包括以下步骤：
在功能层（30）的外侧（30a）和基础元件（10）之间引入开口；并且
利用导电材料填充所引入的开口。
10.根据权利要求8所述的方法（100），其中所述方法被用于制造根据权利要求1至7之一所述的电子功能部件。
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