CN105916354B - A kind of power module with cofferdam - Google Patents
A kind of power module with cofferdam Download PDFInfo
- Publication number
- CN105916354B CN105916354B CN201610347491.6A CN201610347491A CN105916354B CN 105916354 B CN105916354 B CN 105916354B CN 201610347491 A CN201610347491 A CN 201610347491A CN 105916354 B CN105916354 B CN 105916354B
- Authority
- CN
- China
- Prior art keywords
- cofferdam
- bottom plate
- circuit board
- electronic component
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003292 glue Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910052755 nonmetal Inorganic materials 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of power modules with cofferdam, including：Bottom plate, set on the cofferdam of bottom plate surrounding, on bottom plate multiple support columns with screw hole, the circuit board being fixed by screws on the support column, set on circuit board electronic component upper and lower surfaces of, the filling lower heat-conducting glue layer for filling full circuit board lower surface in cofferdam and be paved with the upper heat-conducting glue layer that circuit board upper surface is centered around electronic component surrounding.The present invention can be radiated well, and the normal work of protection power source module makes the longer life expectancy of power module.
Description
Technical field
The present invention relates to the power module with cofferdam more particularly to a kind of power modules with cofferdam of good heat dispersion performance
Method.
Background technology
Since the electric drive energy has the advantages that environmentally friendly, energy saving etc. are various, open power module is widely used in
The eco-friendly power sources vehicle such as pure electric automobile, hybrid-electric car and forklift.Since the conversion of electrically driven (operated) energy needs to do work, power
Conversion can make frequency converter（Core is：Electronic component）Heat is generated, with the increase of working time, the heat of frequency converter also needs
Release is conducted, existing power module can not be radiated well so that the power module of electric vehicle temperature in acting
Height is spent, service life is influenced.
Invention content
The present invention proposes a kind of power module with cofferdam to solve above-mentioned the technical problems existing in the prior art,
Including：Bottom plate, set on the cofferdam of bottom plate surrounding, on bottom plate multiple support columns with screw hole, be fixed by screws in it is described
Circuit board on support column is set to circuit board electronic component upper and lower surfaces of, filling fills full circuit board following table in cofferdam
The lower heat-conducting glue layer in face and it is paved with the upper heat-conducting glue layer that circuit board upper surface is centered around electronic component surrounding.
In the technical program, the electronic component of the circuit board lower surface be divided into the electronic component with metal shell and
The electronic component of non-metal shell.
Preferably, the bottom plate is equipped with insulating film corresponding with the electronic component position with metal shell,
The insulating film is equipped with the U-lag being interference fitted with the electronic component with metal shell, the lower heat-conducting glue
Layer is laid on the insulating film and is centered around the U-lag surrounding.
Preferably, the bottom plate is equipped with the frame limited to the electronic component edge of the non-metal shell
Portion, the frame portion area defined is interior to be equipped with the heat conduction mud tactile with the electronic component bottom connection of the non-metal shell
Layer, the lower heat-conducting glue layer are centered around the heat conduction mud layer surrounding.
Preferably, the bottom plate is surrounded by multiple mounting holes, and the cofferdam is recessed inwardly to be formed at the mounting hole
Perpendicular to the curved surface of the bottom plate, make the fixed hole position except the range that cofferdam is surrounded.
The present invention carries out heat conduction using the bottom surface large area fitting of power module, aluminium and aluminium, aluminium and iron, metal and metal it
Between the gap that is borrowed between the filling and heat dissipation of heat-conducting glue/cream come what the open power module in conduction band cofferdam came out
Heat, make the temperature of the open power module with cofferdam be maintained at one can with the level of steady operation, anti-stop-band cofferdam
Electronic device in open power module is damaged because of radiating bad, and is prolonged the service life.Wherein, heat-conducting glue/cream is made
For the increase thermal conducting function of the products such as electronic component, processor, radiator, blind, it is moisture-proof, shockproof the effects that；
Enable the adequately wetting contact surface of the open power module with cofferdam, to which radiating efficiency is more superior very than other class products
It is more.
Description of the drawings
Fig. 1 is the schematic diagram of the bottom plate of tape insulation film of the present invention；
Fig. 2 is the floor diagram of the invention with U-lag and frame portion；
Fig. 3 is the first sectional view after present invention installation；
Fig. 4 is the second sectional view after present invention installation.
Specific implementation mode
The principle of the present invention and structure are described in detail below in conjunction with the accompanying drawings.
As shown in Figures 1 to 4, the power module with cofferdam that one embodiment of the invention provides, which is open
The power module of formula, concrete structure include bottom plate 1, and bottom plate 1 is surrounded by the cofferdam 2 that bottom plate 1 is surrounded by an enclosed environment,
It can be used for filling heat-conducting glue.
It being required according to safety, the conductive metal and component's feet on circuit board 3 to casing distance are 2.0mm or more, because
This is equipped with multiple support columns 4 with screw hole on bottom plate, and circuit board 3 can be fixed by screws on support column 4, these supports
Column 4, can be with the edges of boards of locating circuit board 3 at a distance from cofferdam, in protection device in addition to the height of location and installation circuit board 3
Meanwhile high-voltage breakdown test is had passed through, meet the safety distance of automobile.The upper and lower surface of circuit board 3 is equipped with electronics member device
Part can fill completely upper heat-conducting glue layer in the lower surface of cofferdam interior circuit board, then proceed to encapsulating, be spread in 3 upper surface of circuit board
Completely it is centered around the upper heat-conducting glue layer of electronic component surrounding.
Wherein, the electronic component of 3 lower surface of circuit board is divided into electronic component and non-metal shell with metal shell
Electronic component.It is fixed with insulating film 5 with the electronic component position corresponding with metal shell on bottom plate 1, absolutely
U-lag 9 is set on velum 5, which is interference fitted with the electronic component with metal shell, lower heat-conducting glue layer paving
It is located on insulating film and is centered around U-lag surrounding, conducts heat on the open bottom plate with cofferdam and discharges, make power module
Temperature can be significantly reduced, to which the time of the open power module work with cofferdam can be longer, the service life is also longer.
Multiple frame portions 6 that bottom plate 1 limits the electronic component edge of non-metal shell, these frame portions 6 are enclosed
At the heat conduction mud layer 10 tactile with the electronic component bottom connection of non-metal shell is equipped in region one by one, lower heat-conducting glue layer is enclosed
It is wound on heat conduction mud layer surrounding, the heat-conducting effect of heat conduction mud is better than heat-conducting glue, can be to the electronic component of these not easy heat radiations
Carry out quick conductive, it is ensured that the operating temperature of electronic component is in normal range (NR).
Circuit board under the electronic component that circuit board upper surface has is equipped with through-hole, and bottom plate is equipped with the corresponding circuit board
On through hole be equipped with boss 8, boss is equipped with heat conduction mud layer, and the electronics that heat conduction mud and circuit board upper surface are located at through hole is first
Device is in contact.
Bottom plate is surrounded by multiple mounting holes 7, and cofferdam is recessed inwardly the curved surface to be formed perpendicular to bottom plate at mounting hole, makes
The fixed hole position is except the range that cofferdam is surrounded.In addition, it is feasible side suitably to increase screw fastening in the centre of product
Case, while being also required to cofferdam prevents encapsulating from leaking outside, therefore the installation stud contour with cofferdam, this side can be equipped in cofferdam
Case allows the flatness of large area coating surface to obtain more preferable solution；It can play the role of reinforcing rib with cofferdam, to meet
Answer mechanics, make the open power module with cofferdam in vigorous exercise, remain conceptual positioning fastening, meet so
Safety demand makes product obtain best fixed solution.
Cofferdam can be accumulated liquid glue and solidified in weir internal solid in encapsulating, in the case where meeting heat dissipation for circuit board demand, cofferdam
Height can determine that encapsulating amount number, the Solid Solidification heat-conducting glue filled in cofferdam can on the surface distribute outside heat, can will be hot
Amount is transmitted on bottom plate, is gone to conduct or be discharged by bottom plate, device on the circuit board to make the open power module with cofferdam
Part is not easy to burn, and the performance of power supply is made most preferably to be ensured.
The power module of the present invention can protect temperature excessively high, in AC-DC power source changes circuit, DC-DC power source transformation electricity
Road, when overcurrent, overvoltage driving generate huge heat release control.Wherein：AC-DC power conversions are to belong to charged state, are
By being electrolysed, dissociating, recombine, so that electric energy is converted into chemical energy and be stored in the battery；To power supply generate heat by
Heat-conducting glue is transmitted on the shell of the open power module with cofferdam, and heat is passed to extraneous release by heat conduction shell；DC-DC electricity
Source conversion be to belong to discharge condition, be chemical energy dress be changed to electric energy, electric energy is output to by power supply frequency conversion in circuit, it is vehicle-mounted
When movement, electric energy translates into mechanical energy, and to make power supply generate huge heat, heat is transmitted to band cofferdam by heat-conducting glue
Open power module shell on, heat is passed to extraneous release by heat conduction shell.
Embodiments above is only to the structure illustrated the present invention, and those skilled in the art are in the present invention
Design under can make various deformation and variation, these deformation and variation be included within protection scope of the present invention.
Claims (5)
1. a kind of power module with cofferdam, which is characterized in that including：Bottom plate, set on the cofferdam of bottom plate surrounding, be set to bottom plate on
Multiple support columns with screw hole, are set to circuit board electricity upper and lower surfaces of at the circuit board being fixed by screws on the support column
Sub- component, the filling filling in cofferdam, which expire the lower heat-conducting glue layer of circuit board lower surface and be paved with circuit board upper surface, is centered around electricity
The upper heat-conducting glue layer of sub- component surrounding；
The electronic component of the circuit board lower surface is divided into the electronics of the electronic component with metal shell and non-metal shell
Component；
The bottom plate is equipped with insulating film corresponding with the electronic component position with metal shell, on the insulating film
Equipped with the U-lag being interference fitted with the electronic component with metal shell, the lower heat-conducting glue layer is laid on described
On insulating film and it is centered around the U-lag surrounding.
2. the power module with cofferdam as described in claim 1, which is characterized in that the bottom plate is equipped with to described nonmetallic
The frame portion that the electronic component edge of shell is limited, be equipped in the frame portion area defined with it is described nonmetallic
The tactile heat conduction mud layer of the electronic component bottom connection of shell, the lower heat-conducting glue layer are centered around the heat conduction mud layer surrounding.
3. the power module with cofferdam as described in claim 1, which is characterized in that the bottom plate is equipped on corresponding circuits plate
The boss of through-hole, the boss are equipped with heat conduction mud layer, and the heat conduction mud is located at the electricity of the through hole with circuit board upper surface
Sub- component is in contact.
4. the power module as described in claims 1 to 3 any one claim, which is characterized in that the bottom plate surrounding is set
There are multiple mounting holes, the cofferdam is recessed inwardly the curved surface to be formed perpendicular to the bottom plate at the mounting hole, makes described solid
Determine hole to be located at except the range that cofferdam is surrounded.
5. the power module with cofferdam as claimed in claim 4, which is characterized in that be equipped in the cofferdam contour with cofferdam
Stud is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610347491.6A CN105916354B (en) | 2016-05-24 | 2016-05-24 | A kind of power module with cofferdam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610347491.6A CN105916354B (en) | 2016-05-24 | 2016-05-24 | A kind of power module with cofferdam |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105916354A CN105916354A (en) | 2016-08-31 |
| CN105916354B true CN105916354B (en) | 2018-09-25 |
Family
ID=56741513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610347491.6A Active CN105916354B (en) | 2016-05-24 | 2016-05-24 | A kind of power module with cofferdam |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105916354B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102082906B1 (en) * | 2016-10-10 | 2020-02-28 | 주식회사 엘지화학 | Battery module assembly |
| CN108413360B (en) * | 2018-05-31 | 2024-09-13 | 深圳实现创新科技有限公司 | Protective structure for circuit board of fluorescent lamp |
| CN109348670B (en) * | 2018-09-11 | 2021-05-04 | 陕西千山航空电子有限责任公司 | Power module structure |
| CN109699143A (en) * | 2019-02-15 | 2019-04-30 | 中国科学院高能物理研究所 | Mounting device, electronic component module and spacecraft |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203166744U (en) * | 2013-03-22 | 2013-08-28 | 胜美达电机（香港）有限公司 | power supply module |
| CN204291736U (en) * | 2014-12-31 | 2015-04-22 | 东风汽车公司 | Electrically-controlled component radiator structure |
| TWM506371U (en) * | 2014-04-21 | 2015-08-01 | Yangzhou Hy Technology Dev Co Ltd | Overall structure of integrated heat sink and smart power semiconductor module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201104377Y (en) * | 2007-10-19 | 2008-08-20 | 浩然科技股份有限公司 | Sealed Power Supply |
| CN107591998A (en) * | 2013-11-26 | 2018-01-16 | 台达电子企业管理（上海）有限公司 | Power supply change-over device and its Power convert board component |
-
2016
- 2016-05-24 CN CN201610347491.6A patent/CN105916354B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203166744U (en) * | 2013-03-22 | 2013-08-28 | 胜美达电机（香港）有限公司 | power supply module |
| TWM506371U (en) * | 2014-04-21 | 2015-08-01 | Yangzhou Hy Technology Dev Co Ltd | Overall structure of integrated heat sink and smart power semiconductor module |
| CN204291736U (en) * | 2014-12-31 | 2015-04-22 | 东风汽车公司 | Electrically-controlled component radiator structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105916354A (en) | 2016-08-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000, 5 floor, Fengyun mansion, five road north, Nanshan District science and Technology Park, Shenzhen, Guangdong Patentee after: Shenzhen Vmax Power Co.,Ltd. Address before: 518000, 5 floor, Fengyun mansion, five road north, Nanshan District science and Technology Park, Shenzhen, Guangdong Patentee before: Shenzhen Vmax Power Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP03 | Change of name, title or address |
Address after: 518000 Fengyun Science and Technology Building, No. 5 Industrial Zone, North Ring Road, Nanshan District, Shenzhen City, Guangdong Province, 501 Patentee after: Shenzhen Weimeisi New Energy (Group) Co.,Ltd. Country or region after: China Address before: 518000, 5 floor, Fengyun mansion, five road north, Nanshan District science and Technology Park, Shenzhen, Guangdong Patentee before: Shenzhen Vmax Power Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |