CN105908157A - Chemical nickel-plating solution and preparation method thereof - Google Patents
Chemical nickel-plating solution and preparation method thereof Download PDFInfo
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- CN105908157A CN105908157A CN201610482587.3A CN201610482587A CN105908157A CN 105908157 A CN105908157 A CN 105908157A CN 201610482587 A CN201610482587 A CN 201610482587A CN 105908157 A CN105908157 A CN 105908157A
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- 239000000126 substance Substances 0.000 title claims abstract description 121
- 238000007747 plating Methods 0.000 title claims abstract description 53
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 204
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 102
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims abstract description 88
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000004310 lactic acid Substances 0.000 claims abstract description 44
- 235000014655 lactic acid Nutrition 0.000 claims abstract description 44
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims abstract description 43
- 239000001632 sodium acetate Substances 0.000 claims abstract description 43
- 235000017281 sodium acetate Nutrition 0.000 claims abstract description 43
- 239000001509 sodium citrate Substances 0.000 claims abstract description 40
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 33
- FTLYMKDSHNWQKD-UHFFFAOYSA-N (2,4,5-trichlorophenyl)boronic acid Chemical class OB(O)C1=CC(Cl)=C(Cl)C=C1Cl FTLYMKDSHNWQKD-UHFFFAOYSA-N 0.000 claims abstract description 22
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims abstract description 22
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims abstract description 22
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims abstract description 22
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims abstract description 22
- QIJRTFXNRTXDIP-UHFFFAOYSA-N (1-carboxy-2-sulfanylethyl)azanium;chloride;hydrate Chemical compound O.Cl.SCC(N)C(O)=O QIJRTFXNRTXDIP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229960001305 cysteine hydrochloride Drugs 0.000 claims abstract description 15
- 235000011083 sodium citrates Nutrition 0.000 claims abstract 3
- 239000007788 liquid Substances 0.000 claims description 75
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 28
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 21
- 229940085605 saccharin sodium Drugs 0.000 claims description 21
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 21
- 235000011152 sodium sulphate Nutrition 0.000 claims description 21
- 229910021529 ammonia Inorganic materials 0.000 claims description 17
- 150000001945 cysteines Chemical class 0.000 claims 2
- BDKZHNJTLHOSDW-UHFFFAOYSA-N [Na].CC(O)=O Chemical compound [Na].CC(O)=O BDKZHNJTLHOSDW-UHFFFAOYSA-N 0.000 claims 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 claims 1
- 238000009713 electroplating Methods 0.000 abstract description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 abstract 1
- 239000000908 ammonium hydroxide Substances 0.000 abstract 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 abstract 1
- 229910000859 α-Fe Inorganic materials 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 17
- 239000012224 working solution Substances 0.000 description 12
- 239000002253 acid Substances 0.000 description 5
- 235000005979 Citrus limon Nutrition 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 229960002433 cysteine Drugs 0.000 description 4
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 description 4
- 235000018417 cysteine Nutrition 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 244000248349 Citrus limon Species 0.000 description 2
- 244000131522 Citrus pyriformis Species 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- -1 cysteine hydrochloric acid Salt Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010129 solution processing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Medicinal Preparation (AREA)
Abstract
The invention relates to the technical field of electroplating, and particularly discloses a chemical nickel-plating solution and a preparation method thereof. According to the chemical nickel-plating solution, the ratio of a chemical nickel solution A to a chemical nickel solution B to water is 1:1:(3-10), and the pH value is adjusted to 3.0-6.0 using ammonium hydroxide or acetic acid. The chemical nickel solution A comprises nickel sulfate, sodium citrate, sodium acetate, lactic acid, sodium dodecyl sulfate and cysteine hydrochloride. The chemical nickel solution B comprises sodium citrate, sodium acetate, sodium hypophosphite, lactic acid and saccharin sodium salt. Compared with an existing chemical nickel-plating solution, the chemical nickel-plating solution can be produced at the temperature of 70-105 DEG C, and can also be used for electronic component nickel plating like ferrite or iron core inductor nickel plating; the plating speed is high and can reach 0.2-1.0 micron per min, and clad layers cannot be diffused easily.
Description
Technical field
The present invention relates to electroless plating technology field, be specifically related to a kind of chemical nickel-plating solution and preparation method thereof.
Background technology
Chemical nickel-plating solution is a kind of dedicated liquid for electronic product electroplating industry, can be used for inductance, resistance,
Capacitor packages silver face carries out chemical nickel plating, and nickel coating is sub-light yellow-white, can increase the soldering resistance of electronic product.
But current chemical nickel-plating solution pH value is 4.5, subacidity, easily spread when high electric current is electroplated,
During plating, electric current is little, and speed is slow, and plating solution processing range is little.Therefore, existing chemical nickel-plating solution uses by office
Limit, further results in plating production efficiency low.
Summary of the invention
The technical problem to be solved is, in order to overcome the above-mentioned deficiency of prior art, it is provided that Yi Zhonghua
Learn nickel plating solution.
Above-mentioned technical problem to be solved by this invention is achieved by the following technical programs:
A kind of chemical nickel-plating solution, comprises the composition of following volume ratio:
Chemical nickel A liquid: chemical nickel B liquid: water=1:1:(3-10), adjust pH value to 3.0-6.0 with ammonia or acetic acid.
Wherein, chemical nickel A liquid comprises the composition of following mass concentration: nickel sulfate 50-400 grams per liter, sodium citrate 2-50
Grams per liter, sodium acetate 2-50 grams per liter, 80% lactic acid 8-200 grams per liter, ten disulfo sodium sulfate 0-150 milligrams/
Liter, cysteine hydrochloride 0-100 mg/litre；Chemical nickel B liquid comprises the composition of following mass concentration: lemon
Lemon acid sodium 10-300 grams per liter, sodium acetate 10-300 grams per liter, sodium hypophosphite 60-600 grams per liter, lactic acid 20-400
Grams per liter, saccharin sodium 2-100 grams per liter.
Preferably, chemical nickel A liquid comprises the composition of following mass concentration: nickel sulfate 100-300 grams per liter, lemon
Lemon acid sodium 5-20 grams per liter, sodium acetate 5-20 grams per liter, 80% lactic acid 20-100 grams per liter, ten disulfo sodium sulfate
20-50 mg/litre, cysteine hydrochloride 10-50 mg/litre；Chemical nickel B liquid comprises following mass concentration
Composition: sodium citrate 50-150 grams per liter, sodium acetate 50-150 grams per liter, sodium hypophosphite 150-400 gram/
Liter, lactic acid 50-200 grams per liter, saccharin sodium 5-50 grams per liter.
It is highly preferred that chemical nickel A liquid comprises the composition of following mass concentration: nickel sulfate 250 grams per liter, Fructus Citri Limoniae
Acid sodium 10 grams per liter, sodium acetate 10 grams per liter, 80% lactic acid 40 grams per liter, ten disulfo sodium sulfate 0-30 milligrams/
Liter, cysteine hydrochloride 0-25 mg/litre；Chemical nickel B liquid comprises the composition of following mass concentration: Fructus Citri Limoniae
Acid sodium 90 grams per liter, sodium acetate 90 grams per liter, sodium hypophosphite 300 grams per liter, lactic acid 100 grams per liter, saccharin sodium
10 grams per liters.
The preparation method of described chemical nickel-plating solution, comprises the steps of:
(1) nickel sulfate, sodium citrate, sodium acetate, 80% lactic acid are dissolved successively in water, more successively
Add ten disulfo sodium sulfate, the cysteine hydrochloride dissolved, be sufficiently mixed and obtain chemical nickel A liquid；
(2) sodium citrate, sodium acetate, sodium hypophosphite, lactic acid, saccharin sodium are added to the water dissolving,
It is sufficiently mixed and uniformly obtains chemical nickel B liquid；
(3) by chemical nickel A liquid, chemical nickel B liquid and water by 1:1:(3-10) be sufficiently mixed, with ammonia or
Acetic acid adjusts pH value to 3.0-6.0.
It is a kind of complete that the chemical nickel-plating solution of the present invention has the advantages that (1) provides compared to existing technology
The chemical nickel-plating solution of new formula；(2) chemical nickel-plating solution described in can be electroplated at 70 DEG C-105 DEG C
Produce, wider and temperature is low than existing chemical nickel-plating solution 90-110 DEG C degree temperature range；(3) chemical plating described in
Nickel solution can be used for electronic component nickel plating, such as: iron oxygen magnetic core inductance nickel plating；(4) with existing chemical nickel plating
Solution is compared, and when chemical nickel-plating solution of the present invention is electroplated, plating speed is fast, reach 0.2-1.0 micron/
Minute；And coating is not easy diffusion.
Detailed description of the invention
The present invention is explained further below in conjunction with specific embodiment, but the present invention is not done any form by embodiment
Restriction.
Embodiment 1
Chemical nickel plating working solution volume ratio is: chemical nickel A liquid: chemical nickel B liquid: pure water=1:1:3；pH
Value: 4.5 (heightening pH value with ammonia, turn down pH value with acetic acid)；Temperature: 80 DEG C；
Chemical nickel A liquid comprises the composition of following mass concentration: nickel sulfate 50 grams per liter, sodium citrate 2 grams per liter,
Sodium acetate 2 grams per liter, 80% lactic acid 8 grams per liter, ten disulfo sodium sulfate 0 mg/litre, cysteine hydrochloride
0 mg/litre；
Chemical nickel B liquid comprises the composition of following mass concentration: sodium citrate 10 grams per liter, sodium acetate 10 grams per liter,
Sodium hypophosphite 60 grams per liter, lactic acid 20 grams per liter, saccharin sodium 2 grams per liter.
Above-mentioned chemical nickel plating working solution preparation method, comprises the steps of:
(1) nickel sulfate, sodium citrate, sodium acetate, 80% lactic acid are dissolved successively in water, more successively
Add ten disulfo sodium sulfate, the cysteine hydrochloride dissolved, be sufficiently mixed and obtain chemical nickel A liquid；
(2) sodium citrate, sodium acetate, sodium hypophosphite, lactic acid, saccharin sodium are added to the water dissolving,
It is sufficiently mixed and uniformly obtains chemical nickel B liquid；
(3) chemical nickel A liquid, chemical nickel B liquid and water are sufficiently mixed by 1:1:3, adjust with ammonia or acetic acid
PH value is to 4.5.
Embodiment 2
Chemical nickel plating working solution volume ratio is: chemical nickel A liquid: chemical nickel B liquid: pure water=1:1:4；pH
Value: 4.6 (heightening pH value with ammonia, turn down pH value with acetic acid)；Temperature: 81 DEG C；
Chemical nickel A liquid comprises the composition of following mass concentration: nickel sulfate 80 grams per liter, sodium citrate 4 grams per liter,
Sodium acetate 4 grams per liter, 80% lactic acid 10 grams per liter, ten disulfo sodium sulfate 5 mg/litre, cysteine hydrochloric acid
Salt 2 mg/litre；
Chemical nickel B liquid comprises the composition of following mass concentration: sodium citrate 30 grams per liter, sodium acetate 30 grams per liter,
Sodium hypophosphite 80 grams per liter, lactic acid 50 grams per liter, saccharin sodium 3 grams per liter.
Above-mentioned chemical nickel plating working solution preparation method, comprises the steps of:
(1) nickel sulfate, sodium citrate, sodium acetate, 80% lactic acid are dissolved successively in water, more successively
Add ten disulfo sodium sulfate, the cysteine hydrochloride dissolved, be sufficiently mixed and obtain chemical nickel A liquid；
(2) sodium citrate, sodium acetate, sodium hypophosphite, lactic acid, saccharin sodium are added to the water dissolving,
It is sufficiently mixed and uniformly obtains chemical nickel B liquid；
(3) chemical nickel A liquid, chemical nickel B liquid and water are sufficiently mixed by 1:1:4, adjust with ammonia or acetic acid
PH value is to 4.6.
Embodiment 3
Chemical nickel plating working solution volume ratio is: chemical nickel A liquid: chemical nickel B liquid: pure water=1:1:5；pH
Value: 4.7 (heightening pH value with ammonia, turn down pH value with acetic acid)；Temperature: 82 DEG C；
Chemical nickel A liquid comprises the composition of following mass concentration: nickel sulfate 100 grams per liter, sodium citrate 5 grams/
Liter, sodium acetate 5 grams per liter, 80% lactic acid 15 grams per liter, ten disulfo sodium sulfate 8 mg/litre, cysteine
Hydrochlorate 3 mg/litre；
Chemical nickel B liquid comprises the composition of following mass concentration: sodium citrate 40 grams per liter, sodium acetate 40 grams per liter,
Sodium hypophosphite 100 grams per liter, lactic acid 60 grams per liter, saccharin sodium 4 grams per liter.
Above-mentioned chemical nickel plating working solution preparation method, comprises the steps of:
(1) nickel sulfate, sodium citrate, sodium acetate, 80% lactic acid are dissolved successively in water, more successively
Add ten disulfo sodium sulfate, the cysteine hydrochloride dissolved, be sufficiently mixed and obtain chemical nickel A liquid；
(2) sodium citrate, sodium acetate, sodium hypophosphite, lactic acid, saccharin sodium are added to the water dissolving,
It is sufficiently mixed and uniformly obtains chemical nickel B liquid；
(3) chemical nickel A liquid, chemical nickel B liquid and water are sufficiently mixed by 1:1:5, adjust with ammonia or acetic acid
PH value is to 4.7.
Embodiment 4
Chemical nickel plating working solution volume ratio is: chemical nickel A liquid: chemical nickel B liquid: pure water=1:1:6；pH
Value: 4.8 (heightening pH value with ammonia, turn down pH value with acetic acid)；Temperature: 84 DEG C；
Chemical nickel A liquid comprises the composition of following mass concentration: nickel sulfate 150 grams per liter, sodium citrate 7 grams/
Liter, sodium acetate 7 grams per liter, 80% lactic acid 20 grams per liter, ten disulfo sodium sulfate 12 mg/litre, cysteine
Hydrochlorate 5 mg/litre；
Chemical nickel B liquid comprises the composition of following mass concentration: sodium citrate 60 grams per liter, sodium acetate 60 grams per liter,
Sodium hypophosphite 150 grams per liter, lactic acid 70 grams per liter, saccharin sodium 6 grams per liter.
Above-mentioned chemical nickel plating working solution preparation method, comprises the steps of:
(1) nickel sulfate, sodium citrate, sodium acetate, 80% lactic acid are dissolved successively in water, more successively
Add ten disulfo sodium sulfate, the cysteine hydrochloride dissolved, be sufficiently mixed and obtain chemical nickel A liquid；
(2) sodium citrate, sodium acetate, sodium hypophosphite, lactic acid, saccharin sodium are added to the water dissolving,
It is sufficiently mixed and uniformly obtains chemical nickel B liquid；
(3) chemical nickel A liquid, chemical nickel B liquid and water are sufficiently mixed by 1:1:6, adjust with ammonia or acetic acid
PH value is to 4.8.
Embodiment 5
Chemical nickel plating working solution volume ratio is: chemical nickel A liquid: chemical nickel B liquid: pure water=1:1:7；pH
Value: 4.9 (heightening pH value with ammonia, turn down pH value with acetic acid)；Temperature: 87 DEG C；
Chemical nickel A liquid comprises the composition of following mass concentration: nickel sulfate 200 grams per liter, sodium citrate 8 grams/
Liter, sodium acetate 8 grams per liter, 80% lactic acid 30 grams per liter, ten disulfo sodium sulfate 20 mg/litre, cysteine
Hydrochlorate 10 mg/litre；
Chemical nickel B liquid comprises the composition of following mass concentration: sodium citrate 80 grams per liter, sodium acetate 80 grams per liter,
Sodium hypophosphite 250 grams per liter, lactic acid 90 grams per liter, saccharin sodium 8 grams per liter.
Above-mentioned chemical nickel plating working solution preparation method, comprises the steps of:
(1) nickel sulfate, sodium citrate, sodium acetate, 80% lactic acid are dissolved successively in water, more successively
Add ten disulfo sodium sulfate, the cysteine hydrochloride dissolved, be sufficiently mixed and obtain chemical nickel A liquid；
(2) sodium citrate, sodium acetate, sodium hypophosphite, lactic acid, saccharin sodium are added to the water dissolving,
It is sufficiently mixed and uniformly obtains chemical nickel B liquid；
(3) chemical nickel A liquid, chemical nickel B liquid and water are sufficiently mixed by 1:1:7, adjust with ammonia or acetic acid
PH value is to 4.9.
Embodiment 6
Chemical nickel plating working solution volume ratio is: chemical nickel A liquid: chemical nickel B liquid: pure water=1:1:8；pH
Value: 5.0 (heightening pH value with ammonia, turn down pH value with acetic acid)；Temperature: 90 DEG C；
Chemical nickel A liquid comprises the composition of following mass concentration: nickel sulfate 250 grams per liter, sodium citrate 10 grams/
Liter, sodium acetate 10 grams per liter, 80% lactic acid 40 grams per liter, ten disulfo sodium sulfate 30 mg/litre, half Guang ammonia
Acid hydrochloride 25 mg/litre；
Chemical nickel B liquid comprises the composition of following mass concentration: sodium citrate 90 grams per liter, sodium acetate 90 grams per liter,
Sodium hypophosphite 300 grams per liter, lactic acid 100 grams per liter, saccharin sodium 10 grams per liter.
Above-mentioned chemical nickel plating working solution preparation method, comprises the steps of:
(1) nickel sulfate, sodium citrate, sodium acetate, 80% lactic acid are dissolved successively in water, more successively
Add ten disulfo sodium sulfate, the cysteine hydrochloride dissolved, be sufficiently mixed and obtain chemical nickel A liquid；
(2) sodium citrate, sodium acetate, sodium hypophosphite, lactic acid, saccharin sodium are added to the water dissolving,
It is sufficiently mixed and uniformly obtains chemical nickel B liquid；
(3) chemical nickel A liquid, chemical nickel B liquid and water are sufficiently mixed by 1:1:8, adjust with ammonia or acetic acid
PH value is to 5.0.
On the chemical nickel-plating solution of the employing embodiment of the present invention 1 and market, existing chemical nickel-plating solution is to CD75
Inductance iron oxygen magnetic core carries out chemical nickel plating contrast, result such as table 1 below, table 2:
CD75 inductance iron oxygen magnetic core chemical nickel plating speed is compared by table 1
CD75 inductance iron oxygen magnetic core chemical nickel plating non-proliferation is compared by table 2
Claims (5)
1. a chemical nickel-plating solution, it is characterised in that chemical nickel-plating solution comprises the composition of following volume ratio:
Chemical nickel A liquid: chemical nickel B liquid: water=1:1:(3-10), adjust pH value to 3.0-6.0 with ammonia or acetic acid；
Described chemical nickel A liquid composition: nickel sulfate, sodium citrate, sodium acetate, lactic acid, ten disulfo sodium sulfate,
Cysteine hydrochloride；Described chemical nickel B liquid composition: sodium citrate, sodium acetate, sodium hypophosphite,
Lactic acid, saccharin sodium.
Chemical nickel-plating solution the most according to claim 1, it is characterised in that described chemical nickel A liquid
Comprise the composition of following mass concentration: nickel sulfate 50-400 grams per liter, sodium citrate 2-50 grams per liter, sodium acetate
2-50 grams per liter, 80% lactic acid 8-200 grams per liter, ten disulfo sodium sulfate 0-150 mg/litre, cysteine salt
Hydrochlorate 0-100 mg/litre；Described chemical nickel B liquid comprises the composition of following mass concentration: sodium citrate
10-300 grams per liter, sodium acetate 10-300 grams per liter, sodium hypophosphite 60-600 grams per liter, lactic acid 20-400 gram/
Liter, saccharin sodium 2-100 grams per liter.
Chemical nickel-plating solution the most according to claim 2, it is characterised in that described chemical nickel A liquid
Comprise the composition of following mass concentration: nickel sulfate 100-300 grams per liter, sodium citrate 5-20 grams per liter, sodium acetate
5-20 grams per liter, 80% lactic acid 20-100 grams per liter, ten disulfo sodium sulfate 20-50 mg/litre, cysteine salt
Hydrochlorate 10-50 mg/litre；Described chemical nickel B liquid comprises the composition of following mass concentration: sodium citrate
50-150 grams per liter, sodium acetate 50-150 grams per liter, sodium hypophosphite 150-400 grams per liter, lactic acid 50-200 gram/
Liter, saccharin sodium 5-50 grams per liter.
Chemical nickel-plating solution the most according to claim 2, it is characterised in that described chemical nickel A liquid
Comprise the composition of following mass concentration: nickel sulfate 250 grams per liter, sodium citrate 10 grams per liter, sodium acetate 10 grams/
Liter, 80% lactic acid 40 grams per liter, ten disulfo sodium sulfate 0-30 mg/litre, cysteine hydrochloride 0-25 milli
Grams per liter；Described chemical nickel B liquid comprises the composition of following mass concentration: sodium citrate 90 grams per liter, acetic acid
Sodium 90 grams per liter, sodium hypophosphite 300 grams per liter, lactic acid 100 grams per liter, saccharin sodium 10 grams per liter.
5. the preparation method of the chemical nickel-plating solution described in any one of Claims 1 to 4, it is characterised in that bag
Containing following steps:
(1) nickel sulfate, sodium citrate, sodium acetate, 80% lactic acid are dissolved successively in water, more successively
Add ten disulfo sodium sulfate, the cysteine hydrochloride dissolved, be sufficiently mixed and obtain chemical nickel A liquid；
(2) sodium citrate, sodium acetate, sodium hypophosphite, lactic acid, saccharin sodium are added to the water dissolving,
It is sufficiently mixed and uniformly obtains chemical nickel B liquid；
(3) by chemical nickel A liquid, chemical nickel B liquid and water by 1:1:(3-10) be sufficiently mixed, with ammonia or
Acetic acid adjusts pH value to 3.0-6.0.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610482587.3A CN105908157A (en) | 2016-06-23 | 2016-06-23 | Chemical nickel-plating solution and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610482587.3A CN105908157A (en) | 2016-06-23 | 2016-06-23 | Chemical nickel-plating solution and preparation method thereof |
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|---|---|
| CN105908157A true CN105908157A (en) | 2016-08-31 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107313034A (en) * | 2017-06-27 | 2017-11-03 | 佛山科学技术学院 | A kind of high phosphorus chemical plating nickel cobalt manganese phosphorus alloy solution for magnesium alloy and preparation method thereof |
| CN108251825A (en) * | 2018-04-12 | 2018-07-06 | 朱玉兰 | It is a kind of to plate the fast iron oxygen magnetic core chemical nickel-plating solution of speed |
| CN109576686A (en) * | 2019-01-11 | 2019-04-05 | 江门市德商科佐科技实业有限公司 | A kind of additive enhancing chemical nickel-plating solution stability |
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| CN114427087A (en) * | 2020-10-29 | 2022-05-03 | 东莞市铧美电子有限公司 | Electroless nickel plating composition for inductance core |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107313034A (en) * | 2017-06-27 | 2017-11-03 | 佛山科学技术学院 | A kind of high phosphorus chemical plating nickel cobalt manganese phosphorus alloy solution for magnesium alloy and preparation method thereof |
| CN108251825A (en) * | 2018-04-12 | 2018-07-06 | 朱玉兰 | It is a kind of to plate the fast iron oxygen magnetic core chemical nickel-plating solution of speed |
| CN109576686A (en) * | 2019-01-11 | 2019-04-05 | 江门市德商科佐科技实业有限公司 | A kind of additive enhancing chemical nickel-plating solution stability |
| CN114427087A (en) * | 2020-10-29 | 2022-05-03 | 东莞市铧美电子有限公司 | Electroless nickel plating composition for inductance core |
| CN112877738A (en) * | 2021-01-11 | 2021-06-01 | 广州市精利表面处理技术有限公司 | Chemical nickel plating solution and preparation method thereof |
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